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市場調查報告書
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1231383

先進電子產品包裝的全球市場

Advanced Electronic Packaging

出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 78 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

先進電子產品包裝的全球市場到2030年將達到132億美元

在COVID-19後改變的商務環境中,2022年68億美元和預測的先進電子產品包裝的全球市場,2030年之前達到132億美元規模,在2022年~2030年預計將以年複合成長率8.8%增長。本報告所分析之市場區隔之一的晶圓層級的晶片規模包裝將記錄年複合成長率8.1%,到分析期間結束時達到75億美元。考慮疫情後的復甦,TSV(Through Silicon Via)包裝領域今後8年的年複合成長率將修正為9.7%。

美國市場估算為是18億美元,中國則將以年複合成長率12.3%成長。

美國的先進電子產品包裝市場在2022年估算為18億美元。作為世界第2大經濟大國的中國,在2022年~2030預計將以年複合成長率12.3%成長,2030年達到30億美元的市場規模。其他熱門的地區市場有日本和加拿大,在2022年~2030年預計將各以5%和7%的速度成長。在歐洲市場中,德國預計將以年複合成長率約6.2%成長。

調查對像企業範例

  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Fujitsu Ltd.
  • Hitachi Ltd.
  • Ibiden Co., Ltd.
  • Infineon Technologies AG
  • Intel Corporation
  • Micron Technology, Inc.
  • Microsemi Corporation
  • Molex LLC
  • NXP Semiconductors NV
  • Orient Semiconductor Electronics Ltd.
  • Samsung Electronics Co., Ltd.
  • Semiconductor Manufacturing International Corporation(SMIC)
  • Semtech Corporation
  • STATS ChipPAC Pte., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd.(TSMC)
  • Texas Instruments, Inc.
  • Thomas & Betts Corporation
  • Toshiba America Electronic Components, Inc.
  • TSI Group Ltd.

目錄

第1章 調查手法

第2章 摘要整理

  • 市場概要
  • 主要企業
  • 市場趨勢與推動因素
  • 全球市場預測

第3章 市場分析

  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 西班牙
  • 俄羅斯
  • 其他歐洲
  • 亞太地區
  • 澳洲
  • 印度
  • 韓國
  • 其他亞太地區
  • 南美
  • 阿根廷
  • 巴西
  • 墨西哥
  • 其他南美國家
  • 中東
  • 伊朗
  • 以色列
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 其他中東
  • 非洲

第4章 競爭

簡介目錄
Product Code: MCP-1203

What`s New for 2023?

»Special coverage on Russia-Ukraine war; global inflation; easing of "zero-Covid" policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.

»Global competitiveness and key competitor percentage market shares

» Market presence across multiple geographies - Strong/Active/Niche/Trivial

»Online interactive peer-to-peer collaborative bespoke updates

»Access to our digital archives and MarketGlass Research Platform

»Complimentary updates for one year

Looking Ahead to 2023

The global economy is at a critical crossroads with a number of interlocking challenges and crises running in parallel. The uncertainty around how Russia`s war on Ukraine will play out this year and the war`s role in creating global instability means that the trouble on the inflation front is not over yet. Food and fuel inflation will remain a persistent economic problem. Higher retail inflation will impact consumer confidence and spending. As governments combat inflation by raising interest rates, new job creation will slowdown and impact economic activity and growth. Lower capital expenditure is in the offing as companies go slow on investments, held back by inflation worries and weaker demand. With slower growth and high inflation, developed markets seem primed to enter into a recession. Fears of new COVID outbreaks and China's already uncertain post-pandemic path poses a real risk of the world experiencing more acute supply chain pain and manufacturing disruptions this year. Volatile financial markets, growing trade tensions, stricter regulatory environment and pressure to mainstream climate change into economic decisions will compound the complexity of challenges faced. Year 2023 is expected to be tough year for most markets, investors and consumers. Nevertheless, there is always opportunity for businesses and their leaders who can chart a path forward with resilience and adaptability.

Global Advanced Electronic Packaging Market to Reach $13.2 Billion by 2030

In the changed post COVID-19 business landscape, the global market for Advanced Electronic Packaging estimated at US$6.8 Billion in the year 2022, is projected to reach a revised size of US$13.2 Billion by 2030, growing at aCAGR of 8.8% over the period 2022-2030. Wafer-Level Chip-Scale Packaging, one of the segments analyzed in the report, is projected to record 8.1% CAGR and reach US$7.5 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the Through Silicon Via (TSV) Packaging segment is readjusted to a revised 9.7% CAGR for the next 8-year period.

The U.S. Market is Estimated at $1.8 Billion, While China is Forecast to Grow at 12.3% CAGR

The Advanced Electronic Packaging market in the U.S. is estimated at US$1.8 Billion in the year 2022. China, the world`s second largest economy, is forecast to reach a projected market size of US$3 Billion by the year 2030 trailing a CAGR of 12.3% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5% and 7% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 6.2% CAGR.

Select Competitors (Total 38 Featured):

  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Fujitsu Ltd.
  • Hitachi Ltd.
  • Ibiden Co., Ltd.
  • Infineon Technologies AG
  • Intel Corporation
  • Micron Technology, Inc.
  • Microsemi Corporation
  • Molex LLC
  • NXP Semiconductors NV
  • Orient Semiconductor Electronics Ltd.
  • Samsung Electronics Co., Ltd.
  • Semiconductor Manufacturing International Corporation (SMIC)
  • Semtech Corporation
  • STATS ChipPAC Pte., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
  • Texas Instruments, Inc.
  • Thomas & Betts Corporation
  • Toshiba America Electronic Components, Inc.
  • TSI Group Ltd.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Advanced Electronic Packaging - Global Key Competitors Percentage Market Share in 2022 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
    • Impact of Covid-19 and a Looming Global Recession
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 2: World 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2023 & 2030
    • TABLE 3: World Recent Past, Current & Future Analysis for Wafer-Level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 4: World 8-Year Perspective for Wafer-Level Chip-Scale Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Through Silicon via (Tsv) Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 6: World 8-Year Perspective for Through Silicon via (Tsv) Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
    • TABLE 7: World Advanced Electronic Packaging Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2023 (E)
    • TABLE 8: USA Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 9: USA 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • CANADA
    • TABLE 10: Canada Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 11: Canada 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • JAPAN
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2023 (E)
    • TABLE 12: Japan Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 13: Japan 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • CHINA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2023 (E)
    • TABLE 14: China Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 15: China 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • EUROPE
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)
    • TABLE 16: Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 17: Europe 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2023 & 2030
    • TABLE 18: Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 19: Europe 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • FRANCE
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2023 (E)
    • TABLE 20: France Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 21: France 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • GERMANY
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2023 (E)
    • TABLE 22: Germany Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 23: Germany 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • ITALY
    • TABLE 24: Italy Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 25: Italy 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • UNITED KINGDOM
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2023 (E)
    • TABLE 26: UK Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 27: UK 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • SPAIN
    • TABLE 28: Spain Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 29: Spain 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • RUSSIA
    • TABLE 30: Russia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 31: Russia 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • REST OF EUROPE
    • TABLE 32: Rest of Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 33: Rest of Europe 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • ASIA-PACIFIC
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2023 (E)
    • TABLE 34: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 35: Asia-Pacific 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2023 & 2030
    • TABLE 36: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 37: Asia-Pacific 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • AUSTRALIA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2023 (E)
    • TABLE 38: Australia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 39: Australia 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • INDIA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2023 (E)
    • TABLE 40: India Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 41: India 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • SOUTH KOREA
    • TABLE 42: South Korea Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 43: South Korea 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 44: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 45: Rest of Asia-Pacific 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • LATIN AMERICA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2023 (E)
    • TABLE 46: Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 47: Latin America 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2023 & 2030
    • TABLE 48: Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 49: Latin America 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • ARGENTINA
    • TABLE 50: Argentina Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 51: Argentina 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • BRAZIL
    • TABLE 52: Brazil Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 53: Brazil 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • MEXICO
    • TABLE 54: Mexico Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 55: Mexico 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • REST OF LATIN AMERICA
    • TABLE 56: Rest of Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 57: Rest of Latin America 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • MIDDLE EAST
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2023 (E)
    • TABLE 58: Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
    • TABLE 59: Middle East 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2023 & 2030
    • TABLE 60: Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 61: Middle East 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • IRAN
    • TABLE 62: Iran Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 63: Iran 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • ISRAEL
    • TABLE 64: Israel Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 65: Israel 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • SAUDI ARABIA
    • TABLE 66: Saudi Arabia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 67: Saudi Arabia 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • UNITED ARAB EMIRATES
    • TABLE 68: UAE Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 69: UAE 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • REST OF MIDDLE EAST
    • TABLE 70: Rest of Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 71: Rest of Middle East 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
  • AFRICA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2023 (E)
    • TABLE 72: Africa Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
    • TABLE 73: Africa 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

IV. COMPETITION