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市場調查報告書
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1418039

嵌入式晶片封裝市場報告：2030 年趨勢、預測與競爭分析

Embedded Chip Packaging Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

嵌入式晶片封裝趨勢與預測

預計2024年至2030年全球嵌入式晶片封裝市場將以20.7%的複合年成長率成長。該市場的主要驅動力是半導體封裝的持續進步，例如扇出晶圓級封裝 (FOWLP)、系統級封裝(SiP)、3D 封裝、異構整合、穿戴式裝置和智慧型手機。需求不斷成長物聯網、汽車電子等各領域的更薄、更小的電子設備，以及提高客戶對提高電子設備的效用和性能的期望。全球嵌入式晶片封裝市場的未來充滿希望，小型封裝和系統內建市場蘊藏著機會。

嵌入式晶片封裝細分領域

該研究包括按類型、應用和地區分類的全球嵌入式晶片封裝的預測。

按類型分類的嵌入式晶片封裝市場（2018-2030 年出貨分析（按金額））

  • 單晶片
  • 多晶片
  • MEMS
  • 被動元件
  • 其他

嵌入式晶片封裝市場：依應用分類（2018年至2030年出貨金額）

  • 小包裝
  • 系統內側
  • 其他

嵌入式晶片封裝市場：依地區分類（2018-2030年出貨收益分析）

  • 北美洲
  • 歐洲
  • 亞太地區
  • 世界其他地區

嵌入式晶片封裝

Lucintel 預測，單晶片預計將在預測期內實現最高成長，因為與多晶片和其他複雜配置相比，它提供了更簡單、更經濟的封裝解決方案。

亞太地區是一個不斷成長的市場，蘋果、三星和華為等主要電子製造商在該地區（尤其是中國）擁有大型生產基地，對整合晶片等尖端封裝選項有強烈需求。見證預測期內的最高成長。

常問問題

Q1.市場成長預測如何？

A1. 2024年至2030年，全球嵌入式晶片封裝市場預計將以20.7%的複合年成長率成長。

Q2.影響市場成長的主要促進因素有哪些？

A2. 此市場的主要驅動力是半導體封裝的持續進步，例如扇出晶圓級封裝 (FOWLP)、系統級封裝(SiP)、3D 封裝、異構整合、穿戴式裝置對更薄、更小的電子產品的需求不斷增加智慧型手機、物聯網和汽車電子等各個領域的設備，以及客戶對提高電子設備的效用和效能的期望越來越高。

Q3.市場的主要細分市場有哪些？

A3. 全球嵌入式晶片封裝市場前景廣闊，小型封裝與系統內建市場蘊藏機會。

Q4.市場上主要企業有哪些？

A4.主要嵌入式晶片封裝公司如下。

  • ASE
  • ATS
  • GE
  • Shinko
  • Taiyo Yuden
  • TDK
  • Wurth Elektronik
  • Texas Instruments
  • Siemens
  • Infineon

Q5.未來最大的細分市場是什麼？

A5.Lucintel 預計單晶片在預測期內將實現最高成長，因為與多晶片和其他複雜配置相比，封裝提供了更簡單、更經濟的解決方案。

Q6. 未來五年預計哪個地區將成為最大的市場？

預計 A6.APAC 在預測期內將出現最高成長。這是因為蘋果、三星和華為等主要電子製造商在該地區（尤其是中國）擁有大型生產基地，並且對整合晶片等尖端封裝選項有強烈需求。

Q7. 可以客製化報告嗎？

A7. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章全球嵌入式晶片封裝市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球嵌入式晶片封裝市場趨勢（2018-2023）與預測（2024-2030）
  • 全球嵌入式晶片封裝市場（按類型）
    • 單晶片
    • 多晶片
    • MEMS
    • 被動元件
    • 其他
  • 全球嵌入式晶片封裝市場（按應用）
    • 小包裝
    • 系統內側
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球嵌入式晶片封裝市場區域分佈
  • 北美嵌入式晶片封裝市場
  • 歐洲嵌入式晶片封裝市場
  • 亞太嵌入式晶片封裝市場
  • 其他地區嵌入式晶片封裝市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 全球嵌入式晶片封裝市場成長機會（按類型）
    • 全球嵌入式晶片封裝市場成長機會（按應用）
    • 全球嵌入式晶片封裝市場按地區成長機會
  • 全球嵌入式晶片封裝市場的新興趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球嵌入式晶片封裝市場產能
    • 全球嵌入式晶片封裝市場的併購與合資
    • 認證和許可

第7章主要企業概況

  • ASE
  • ATS
  • GE
  • Shinko
  • Taiyo Yuden
  • TDK
  • Wurth Elektronik
  • Texas Instruments
  • Siemens
  • Infineon
簡介目錄

Embedded Chip Packaging Trends and Forecast

The future of the global embedded chip packaging market looks promising with opportunities in the tiny package and system-in-boards markets. The global embedded chip packaging market is expected to grow with a CAGR of 20.7% from 2024 to 2030. The major drivers for this market are continuous advancements in semiconductor packaging, include fan-out wafer-level packaging (FOWLP), system-in-package (SiP), 3D packaging, and heterogeneous integration, growing demand for thinner and smaller electronics across a variety of sectors, including wearables, smartphones, Internet of Things, and automotive electronics, as well as, increasing expectations from customers for improved usefulness and performance in electronic devices.

A more than 150-page report is developed to help in your business decisions.

Embedded Chip Packaging by Segment

The study includes a forecast for the global embedded chip packaging by type, application, and region.

Embedded Chip Packaging Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Single Chip
  • Multichip
  • MEMS
  • Passive Components
  • Others

Embedded Chip Packaging Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Tiny Package
  • System-In-Boards
  • Others

Embedded Chip Packaging Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Embedded Chip Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies embedded chip packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the embedded chip packaging companies profiled in this report include-

  • ASE
  • ATS
  • GE
  • Shinko
  • Taiyo Yuden
  • TDK
  • Wurth Elektronik
  • Texas Instruments
  • Siemens
  • Infineon

Embedded Chip Packaging

Lucintel forecasts that single chip is expected to witness highest growth over the forecast period because the packages offer a simpler and more economical solution compared to multi-chip or other complex configurations.

APAC is expected to witness highest growth over the forecast period because the major manufacturers of electronics, like Apple, Samsung, and Huawei, have substantial production bases in the region, especially in China, owing to strong need for cutting-edge packaging options like integrated chips.

Features of the Global Embedded Chip Packaging Market

Market Size Estimates: Embedded chip packaging market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Embedded chip packaging market size by type, application, and region in terms of value ($B).

Regional Analysis: Embedded chip packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the embedded chip packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the embedded chip packaging market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast for embedded chip packaging market?

Answer: The global embedded chip packaging market is expected to grow with a CAGR of 20.7% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the embedded chip packaging market?

Answer: The major drivers for this market are continuous advancements in semiconductor packaging, include fan-out wafer-level packaging (FOWLP), system-in-package (SiP), 3D packaging, and heterogeneous integration, growing demand for thinner and smaller electronics across a variety of sectors, including wearables, smartphones, Internet of Things, and automotive electronics, as well as, increasing expectations from customers for improved usefulness and performance in electronic devices.

Q3. What are the major segments for embedded chip packaging market?

Answer: The future of the global embedded chip packaging market looks promising with opportunities in the tiny package and system-in-boards markets.

Q4. Who are the key embedded chip packaging market companies?

Answer: Some of the key embedded chip packaging companies are as follows.

  • ASE
  • ATS
  • GE
  • Shinko
  • Taiyo Yuden
  • TDK
  • Wurth Elektronik
  • Texas Instruments
  • Siemens
  • Infineon

Q5. Which embedded chip packaging market segment will be the largest in future?

Answer: Lucintel forecasts that single chip is expected to witness highest growth over the forecast period because the packages offer a simpler and more economical solution compared to multi-chip or other complex configurations.

Q6. In embedded chip packaging market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period because the major manufacturers of electronics, like Apple, Samsung, and Huawei, have substantial production bases in the region, especially in China, owing to strong need for cutting-edge packaging options like integrated chips.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the embedded chip packaging market by type (single chip, multichip, mems, passive components, and others), application (tiny package, system-in-boards, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Embedded Chip Packaging Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Embedded Chip Packaging Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Embedded Chip Packaging Market by Type
    • 3.3.1: Single Chip
    • 3.3.2: Multichip
    • 3.3.3: MEMS
    • 3.3.4: Passive Components
    • 3.3.5: Others
  • 3.4: Global Embedded Chip Packaging Market by Application
    • 3.4.1: Tiny Package
    • 3.4.2: System-In-Boards
    • 3.4.3: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Embedded Chip Packaging Market by Region
  • 4.2: North American Embedded Chip Packaging Market
    • 4.2.2: North American Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others
  • 4.3: European Embedded Chip Packaging Market
    • 4.3.1: European Embedded Chip Packaging Market by Type: Single Chip, Multichip, MEMS, Passive Components, and Others
    • 4.3.2: European Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others
  • 4.4: APAC Embedded Chip Packaging Market
    • 4.4.1: APAC Embedded Chip Packaging Market by Type: Single Chip, Multichip, MEMS, Passive Components, and Others
    • 4.4.2: APAC Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others
  • 4.5: ROW Embedded Chip Packaging Market
    • 4.5.1: ROW Embedded Chip Packaging Market by Type: Single Chip, Multichip, MEMS, Passive Components, and Others
    • 4.5.2: ROW Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Embedded Chip Packaging Market by Type
    • 6.1.2: Growth Opportunities for the Global Embedded Chip Packaging Market by Application
    • 6.1.3: Growth Opportunities for the Global Embedded Chip Packaging Market by Region
  • 6.2: Emerging Trends in the Global Embedded Chip Packaging Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Embedded Chip Packaging Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Embedded Chip Packaging Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: ASE
  • 7.2: ATS
  • 7.3: GE
  • 7.4: Shinko
  • 7.5: Taiyo Yuden
  • 7.6: TDK
  • 7.7: Wurth Elektronik
  • 7.8: Texas Instruments
  • 7.9: Siemens
  • 7.10: Infineon