2.5D 和 3D 半導體封裝 - 市場佔有率分析、產業趨勢與統計、成長預測（2024 - 2029）

2.5D & 3D Semiconductor Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)

出版日期: 2024年02月15日 | 出版商:

Mordor Intelligence | 英文 126 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2024年2.5D和3D半導體封裝市場規模預計為99.1億美元，預計到2029年將達到182.8億美元，在預測期內（2024-2029年）CAGR為13.03%。

主要亮點

2.5D 和 3D 是在同一封裝內包含多個 IC 的封裝方法。在 2.5D 結構中，兩個或多個主動半導體晶片並排放置在矽中介層上，以實現極高的晶片間互連密度。在 3D 結構中，主動晶片透過晶片堆疊進行整合，以實現最短的互連和最小的封裝尺寸。近年來，2.5D和3D因其實現極高封裝密度和高能源效率的優點而成為理想的晶片組整合平台。
高效能運算、資料中心網路和自動駕駛汽車正在推動所研究市場的採用率，以及從技術角度來看的演變。如今的趨勢是在雲端、邊緣運算和設備層面擁有大量的運算資源。
此外，由於技術突破帶來的電子產品尺寸縮小等趨勢以及對具有更高頻寬和功率效率的消費性電子產品的需求不斷成長，所研究的市場一直在擴大。透過利用動態熱管理、高速資料管理、低功耗、高儲存容量等特性，用於半導體晶片先進封裝的 3DIC 和 2.5D TSV 互連可改善使用者體驗。這是其消費性電子應用市場擴張的關鍵驅動力之一。
半導體 IC 設計的高初始投資和不斷增加的複雜性是所研究市場的限制因素。設計人員必須克服嚴峻的技術和組織課題，才能獲得 2.5D/3D 封裝的優勢並獲得競爭優勢。
COVID-19大流行造成的全球半導體短缺促使廠商專注於提高產能。例如，中芯國際宣布了雄心勃勃的計劃，透過在多個城市建設新的晶片製造工廠，到 2025 年將產能加倍，其中包括 2021 年 9 月宣佈在上海自貿區建立新工廠。半導體產能的這種成長可能有利於所研究的市場。

2.5D & 3D半導體封裝市場趨勢

各行業半導體裝置消費不斷成長，推動市場發展

數位化的不斷發展、遠端工作和遠端操作的趨勢日益增強，以及消費者對電子產品的需求不斷增加，引發了對能夠實現各種新功能的先進半導體設備的需求。隨著對半導體裝置的需求不斷增強，先進的封裝技術提供了當今數位化世界所需的外形尺寸和處理能力。
例如，根據半導體產業協會的數據，2022年8月，全球半導體產業銷售額為474億美元，比2021年8月的473億美元總額小幅成長0.1%。
2.5D 和 3D 封裝技術因其眾多優勢而在半導體產業迅速普及。例如，半導體晶片的 3D 整合提供了一種靈活的方法，透過整合不同的技術，如混合訊號和射頻 (RF) 元件、記憶體和邏輯電路、光電裝置來執行異構片上系統 (SoC) 設計。等到3D 積體電路(IC) 的不同晶片上。
消費性電子產品是半導體供應商最重要的最終用戶產業之一。智慧型手機產業的成長、智慧型裝置和穿戴式裝置的日益普及，以及消費性物聯網設備在智慧家庭等應用中的滲透率不斷上升，正在推動半導體設備的成長，從而對市場產生積極影響。
此外，由於5G商業化在全球範圍內的快速成長，預計5G相關設備將湧入全球市場，包括網路基礎設施、網路設備、節點和行動終端。例如，愛立信表示，智慧型手機用戶預計將從 2021 年的 62.59 億戶增至 2027 年的 78.4 億戶。
此外，不斷增加的資料中心擴建以及電動車和自動駕駛汽車的使用增加也增加了對先進半導體的需求，進一步支持了所研究市場的成長。例如，根據 IEA 的數據，2021 年電動車 (EV) 銷量比前一年加倍，達到 660 萬輛的新紀錄。此外，到 2021 年，全球汽車銷量的近 10% 是電動車。隨著功率半導體裝置成為此類汽車的關鍵元件，近年來該領域對這些裝置的需求顯著成長。
這些趨勢描繪了不同最終用戶產業對半導體裝置的巨大需求。隨著半導體封裝製程在半導體製造和設計中發揮關鍵作用，半導體裝置消耗的不斷成長將同時增加對半導體封裝解決方案的需求。

中國佔有重要的市場佔有率

先進技術一直為各種消費性電子產品、醫療設備、電信和通訊設備以及汽車等的發展做出了貢獻。隨著5G服務在該國的推出，對智慧型手機等的需求不斷增加。
據工業和資訊化部 (MIIT) 稱，中國的目標是到 2022 年安裝 200 萬個 5G 基地台，以擴展該國的下一代行動網路。根據工信部的數據，中國大陸目前已安裝 142.5 萬個 5G 基地台，支援全國超過 5 億的 5G 用戶，使其成為全球最廣泛的網路。該地區5G的不斷普及預計也將促進對5G設備的需求，從而增加中國對2.5D和3D半導體封裝的需求。
同樣，根據中國資訊通訊研究院（CAICT）的數據，2021年中國相容5G網路的智慧型手機出貨量成長63.5%，達到2.66億部。此外，5G智慧型手機出貨量佔國內出貨量的75.9 %，高於全球平均40.7%。到2022年7月，5G智慧型手機將佔中國所有手機出貨量的74%。截至2022年7月，5G智慧型手機總出貨量為1.24億台，中國推出121款新5G手機型號。這些趨勢將加速國內對2.5D和3D半導體封裝解決方案的需求。
隨著2.5D和3D半導體封裝解決方案的需求不斷增加，許多公司一直在市場上進行各種活動。主要廠商在該國的投資將推動 2.5D 和 3D 半導體封裝市場的發展。
2022年10月，台積電在2022開放創新平台生態系統論壇上推出開放創新平台（OIP）3DFabric聯盟。新的台積電3DFabric 聯盟將是台積電的第六個OIP 聯盟，也是半導體產業中的第一個此類聯盟，旨在與各個合作夥伴合作，加速3D IC 生態系統的準備和創新，並為半導體提供全方位的一流服務和解決方案設計、基板技術、記憶體模組、測試、封裝和製造。

2.5D & 3D半導體封裝產業概況

2.5D 和 3D 半導體封裝市場適度分散，其中包括日月光集團、Amkor Technology Inc.、英特爾公司、三星電子和 Siliconware Precision Industries 等各種重要參與者。主要參與者不斷努力在市場上進行合作、併購、收購、創新和投資，以維持其市場地位。

2022 年 8 月，英特爾展示了最新的架構和封裝突破，可實現 2.5D 和 3D 基於區塊的晶片設計，開創了晶片製造技術及其重要性的新時代。英特爾的系統代工廠模型具有改進的封裝。該公司計劃到 2030 年將封裝上的電晶體數量從 1,000 億個增加到 1 兆個。

2022 年 6 月，日月光集團宣布推出 VIPack，這是一個先進的封裝平台，旨在實現垂直整合的封裝解決方案。 VIPack 代表了 ASE 的下一代 3D 異質整合架構，可擴展設計規則並提供超高密度和效能。

額外的好處：

Excel 格式的市場估算 (ME) 表
3 個月的分析師支持

Key Highlights

2.5D and 3D are packaging methodologies for including multiple IC inside the same package. In a 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer to achieve extremely high die-to-die interconnect density. In a 3D structure, active chips are integrated by die stacking for the shortest interconnect and smallest package footprint. In recent years, 2.5D and 3D have gained momentum as ideal chipset integration platforms due to their merits in achieving extremely high packaging density and high energy efficiency.
High-performance computing, data center networking, and autonomous vehicles are pushing the adoption rates for the studied market, along with its evolution from a technology point of view. Today, the trend is to have enormous computing resources at the cloud, edge computing, and device levels.
Further, the studied market has been expanding due to trends like the downsizing of electronic items brought on by technological breakthroughs and growing demand for consumer electronics with higher bandwidth and power efficiency. By utilizing dynamic heat management, high-speed data management, low power consumption, high memory capability, and other features, 3DIC and 2.5D TSV interconnect for advanced packaging in semiconductor chips refine the user experience. This serves as one of the key driving forces behind the market expansion of its consumer electronic applications.
High initial investment and increasing complexity of semiconductor IC designs act as restraining factors for the studied market. The designers must overcome serious technical and organizational challenges before capturing the benefits of 2.5D/3D packaging and achieving a competitive edge.
The worldwide semiconductor shortage caused by the COVID-19 pandemic prompted players to focus on increasing production capacity. For instance, the Semiconductor Manufacturing International Corp (SMIC) announced aggressive plans to double its production capacity by 2025, by constructing new chip fabrication plants in various cities, including a September 2021 announcement to establish a new factory in Shanghai's free trade zone. Such an increase in semiconductor production capacities is likely to benefit the studied market.

2.5D & 3D Semiconductor Packaging Market Trends

Growing Consumption of Semiconductor Devices Across Industries to Drive the Market

Rising digitization, increasing trends of remote work and remote operations, and increasing consumer demand for electronics have sparked the need for advanced semiconductor devices that enable various new capabilities. As the demands for semiconductor devices intensify consistently, advanced packaging techniques provide the form factor and processing power required for today's digitized world.
For instance, according to the Semiconductor Industry Association, during August 2022, global semiconductor industry sales were USD 47.4 billion, a slight increase of 0.1% over the August 2021 total of USD 47.3 billion.
2.5D and 3D packaging technology is quickly gaining popularity in the semiconductor industry owing to its numerous benefits. For instance, 3D integration of semiconductor chips provides a flexible way to carry out the heterogeneous system-on-chip (SoC) design by integrating disparate technologies, such as mixed signal and radio frequency (RF) components, memory and logic circuits, optoelectronic devices, etc., onto different dies of a 3D integrated circuit (IC).
Consumer electronics is one of semiconductor vendors' most prominent end-user industries. Growth in the smartphone industry, increasing adoption of smart devices and wearables, and rising penetration of consumer IoT devices in applications like intelligent homes are driving the growth of semiconductor devices, thereby positively impacting the market.
Further, owing to the soaring growth pushed by 5G commercialization around the world, 5G-relevant devices are expected to flood global markets, including network infrastructure, networking equipment, nodes, and mobile terminals. For instance, according to Ericsson, smartphone subscription is expected to reach 7,840 million in 2027, from 6,259 million in 2021.
Moreover, rising data center build-outs and the increasing use of electric and autonomous vehicles have also increased the demand for advanced semiconductors, further supporting the studied market's growth. For instance, as per IEA, sales of electric vehicles (EVs) doubled in 2021 from the previous year to reach a new record of 6.6 million. Also, nearly 10% of global car sales were electric in 2021. With power semiconductor devices forming a key element in such vehicles, the demand for these devices has witnessed remarkable growth from this segment in recent years.
Such trends depict the huge demand for semiconductor devices across different end-user industries. With the semiconductor packaging process playing a critical role in semiconductor manufacturing and design, the rising consumption of semiconductor devices will increase the demand for semiconductor packaging solutions simultaneously.

China Holds Significant Market Share

Advancing technologies have been contributing to the development of various consumer electronics, medical devices, telecom and communication devices, and automotives, among others. With the launch of 5G services in the country, the demand for smartphones, among other things, has been increasing.
According to the Ministry of Industry and Information Technology (MIIT), China aims to have 2 million installed 5G base stations in 2022 to expand the country's next-generation mobile network. The Chinese mainland currently has 1.425 million installed 5G base stations that support more than 500 million 5G users nationwide, making it the most extensive network in the world, as per MIIT. The growing implementation of 5G in the region is also expected to promote the demand for 5G-enabled devices, thereby increasing the need for 2.5D and 3D semiconductor packaging in China.
Similarly, as per the China Academy of Information and Communications (CAICT), China's shipments of smartphones compatible with 5G networks rose by 63.5% to 266 million in 2021. Further, 5G smartphone shipments accounted for 75.9% of domestic shipments, higher than a global average of 40.7%. By July 2022, 5G smartphones would have accounted for 74% of all mobile phone shipments in China. The total number of 5G smartphone shipments by July 2022 was 124 million units, and China introduced 121 new 5G mobile phone models. Such trends will accelerate the demand for 2.5D and 3D semiconductor packaging solutions in the country.
With the increasing demand for 2.5D and 3D semiconductor packaging solutions, many companies have been carrying out various activities in the market. Major players' investments in the country are set to fuel the 2.5D & 3D semiconductor packaging market.
In October 2022, TSMC launched its Open Innovation Platform (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum. The new TSMC 3DFabric Alliance would be TSMC's sixth OIP Alliance and the first of its kind in the semiconductor industry for collaborating with various partners to accelerate 3D IC ecosystem readiness and innovation, with a full spectrum of best-in-class services and solutions for semiconductor design, substrate technology, memory modules, testing, packaging, and manufacturing.

2.5D & 3D Semiconductor Packaging Industry Overview

The 2.5D & 3D semiconductor packaging market is moderately fragmented, with the presence of various significant players like ASE Group, Amkor Technology Inc., Intel Corporation, Samsung Electronics Co. Ltd, and Siliconware Precision Industries Co. Ltd., among others. The key players are continuously making efforts for partnerships, mergers, acquisitions, innovations, and investments in the market to retain their market positions.

In August 2022, Intel showcased the most recent architectural and packaging breakthroughs that enable 2.5D and 3D tile-based chip designs, ushering in a new era in chipmaking technologies and their significance. Intel's system foundry model features improved packaging. The company intends to increase the number of transistors on a package from 100 billion to 1 trillion by 2030.

In June 2022, ASE Group announced VIPack, an advanced packaging platform designed to enable vertically integrated packaging solutions. The VIPack represents ASE's next-generation 3D heterogeneous integration architecture that expands design rules and delivers ultra-high density and performance.

Additional Benefits:

The market estimate (ME) sheet in Excel format
3 months of analyst support

1 INTRODUCTION

1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

4.1 Market Overview
4.2 Industry Attractiveness - Porter's Five Forces Analysis
- 4.2.1 Bargaining Power of Suppliers
- 4.2.2 Bargaining Power of Buyers
- 4.2.3 Threat of New Entrants
- 4.2.4 Threat of Substitutes
- 4.2.5 Intensity of Competitive Rivalry
4.3 Value Chain Analysis
4.4 Assessment of the Impact of COVID-19 on the Market

5 MARKET DYNAMICS

5.1 Market Drivers
- 5.1.1 Growing Consumption of Semiconductor Devices Across Several Industries
- 5.1.2 Increasing Demand for Compact, High Functionality Electronic Devices
5.2 Market Restraints
- 5.2.1 High Initial Investment and Increasing Complexity of Semiconductor IC Designs
5.3 Opportunities
- 5.3.1 Growing Adoption of High-End Computing, Servers, and Data Centers

6 MARKET SEGMENTATION

6.1 By Packaging Technology
- 6.1.1 3D
- 6.1.2 2.5D
- 6.1.3 3D Wafer-level Chip-scale Packaging (WLCSP) - Qualitative Analysis
6.2 By End-User Industry
- 6.2.1 Consumer Electronics
- 6.2.2 Medical Devices
- 6.2.3 Communications and Telecom
- 6.2.4 Automotive
- 6.2.5 Other End-User Industries
6.3 By Geography
- 6.3.1 United States
- 6.3.2 China
- 6.3.3 Taiwan
- 6.3.4 Korea
- 6.3.5 Japan
- 6.3.6 Rest of the World
- 6.3.7 Europe

7 COMPETITIVE LANDSCAPE

7.1 Company Profiles
- 7.1.1 ASE Group
- 7.1.2 Amkor Technology Inc.
- 7.1.3 Intel Corporation
- 7.1.4 Samsung Electronics Co. Ltd
- 7.1.5 Siliconware Precision Industries Co. Ltd (SPIL)
- 7.1.6 Powertech Technology Inc.
- 7.1.7 Jiangsu Changjiang Electronics Technology Co. Ltd.
- 7.1.8 TSMC Limited
- 7.1.9 GlobalFoundries Inc.
- 7.1.10 Tezzaron Semiconductor Corp.