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市場調查報告書
商品編碼
1427223

全球半導體封裝市場規模、佔有率、成長分析（按材料、按應用）- 2023-2030 年產業預測

Global Semiconductor Packaging Market Size, Share, Growth Analysis, By Material(Organic Packaging, Organic Packaging), By Application(Consumer Electronics, Automotive) - Industry Forecast 2023-2030
出版日期: | 出版商: SkyQuest | 英文 157 Pages | 商品交期: 3-5個工作天內

價格
簡介目錄

在預測期間（2024-2031年），全球半導體封裝市場規模預計為269億美元，從2023年的286.5億美元成長到2031年的474.9億美元，預計複合年成長率為6.52 %。

半導體封裝市場受到人工智慧（AI）、機器學習（ML）和物聯網（IoT）最尖端科技廣泛採用的推動，並且正在向消費性電子、汽車、工業、醫療保健等領域，在半導體裝置需求快速成長的推動下，取得了顯著的成長。這些進步要求半導體裝置具有更高的處理能力和儲存容量。半導體封裝在保持整體性能的同時降低封裝成本，在增加半導體產品價值方面發揮關鍵作用。該技術越來越受到虛擬產品中使用的高性能晶片的青睞，各公司正在探索石墨烯和氧化錫等創新材料來製造晶片，市場正在不斷成長，預計將有進一步的創新。由於各個最終用戶行業的需求不斷成長，以及利用封裝來提高電子系統的性能、可靠性和成本效率，推動了半導體行業的全球擴張，該市場正在快速成長，是主要促進因素。整合度、能源效率和產品特性的持續改善進一步加速了這一市場的擴張。

採用自上而下和自下而上的方法來估計和檢驗全球半導體封裝市場的規模，並估計其他各個相關子市場的規模。用於估計市場規模的調查方法包括以下細節：透過二次研究確定市場的主要企業，並透過初步和二次研究確定每個地區的市場佔有率。整個過程包括研究主要企業的年度和財務報告以及廣泛的採訪，以獲得執行長、副總裁、董事和行銷負責人等行業領導者的重要見解。所有股份比率和細分均使用二手資訊確定並使用主要資訊檢驗。本研究涵蓋的所有可能影響市場的參數都經過了考慮、詳細研究、初步研究檢驗和分析，以獲得最終的定量和定性資料。

半導體封裝全球細分市場分析

全球半導體封裝市場根據材料、應用和地區進行細分。依材料分類，市場分為有機封裝和化合物半導體封裝。依材料分類，市場分為家電、汽車、工業、醫療保健等。依地區分類，分為北美、歐洲、亞太地區、中東/非洲、拉丁美洲。

全球半導體封裝市場促進因素

對越來越小的電子設備（例如智慧型手機、穿戴式裝置和物聯網設備）的需求推動了先進半導體封裝方法的發展，以減少尺寸和重量，同時提高功能和性能。這就是我的目標。這些創新的封裝技術可以更輕鬆地將多種功能和組件整合到更小的空間中，從而促進更精簡、更有效率的電子產品的發展。

全球半導體封裝市場的限制因素

半導體封裝市場面臨一個重大障礙：成本。先進封裝技術的整合需要複雜的程序、專用機械和優質材料，這增加了製造成本。此外，對先進封裝技術和設備的持續大量投資給製造商帶來了財務障礙。此外，市場競爭和客戶主導的價格限制進一步限制了報酬率並阻礙了先進封裝解決方案的普及。

全球半導體封裝市場趨勢

隨著資料密集型應用變得越來越普及，對提供高速和高頻寬功能的半導體封裝解決方案的需求不斷增加。覆晶、晶圓級晶片級封裝 (WLCSP) 和疊層封裝 (PoP) 等封裝創新可實現更快的資料傳輸、最大限度地減少訊號損失並提高整體電氣性能。改進正在進行中。

目錄

  • 執行摘要
  • 調查方法
  • 母市場分析
  • 主要市場考察
    • 技術分析
    • 價格分析
    • 供應鏈分析
    • 價值鏈分析
    • 市場生態系統
    • 智慧財產權分析
    • 貿易分析
    • Start-Ups分析
    • 原料分析
    • 創新矩陣
    • 研發線產品分析
    • 總體經濟指標
    • 主要投資分析
    • 關鍵成功因素
    • 競爭程度
  • 市場動態及展望
    • 市場動態
      • 促進因素
      • 機會
      • 抑制因素
      • 任務
    • 監管形勢
    • 波特的分析
    • 對未來中斷的特殊考慮
  • 全球半導體封裝市場：依材料分類
    • 市場概況
    • 有機包裝
    • 化合物半導體封裝
  • 全球半導體封裝市場：依應用分類
    • 市場概況
    • 家用電器
    • 車
    • 產業
    • 衛生保健
    • 其他
  • 全球半導體封裝市場規模：依地區分類
    • 市場概況
    • 北美洲
      • 美國
      • 加拿大
    • 歐洲
      • 德國
      • 西班牙
      • 法國
      • 英國
      • 其他歐洲國家地區
    • 亞太地區
      • 中國
      • 印度
      • 日本
      • 韓國
      • 其他亞太地區
    • 拉丁美洲
      • 巴西
      • 其他拉丁美洲地區
    • 中東和非洲 (MEA)
      • 海灣合作理事會國家
      • 南非
      • 其他中東/非洲地區
  • 競爭形勢
    • 前5名企業對比
    • 主要企業市場定位（2021年）
    • 主要市場參與者所採取的策略
    • 關鍵成功策略
    • 近期市集活動
    • 主要企業市場佔有率（2021年）
  • 主要企業簡介
    • ASE Technology Holding Co., Ltd.（Taiwan）
    • Amkor Technology, Inc.（United States）
    • Siliconware Precision Industries Co., Ltd.（Taiwan）
    • Powertech Technology Inc.（Taiwan）
    • STATS ChipPAC Pte. Ltd.（Singapore）
    • Samsung Electronics Co., Ltd.（South Korea）
    • UTAC Holdings Ltd.（Singapore）
    • ChipMOS Technologies Inc.（Taiwan）
    • Intel Corporation（United States）
    • Advanced Semiconductor Engineering, Inc.（Taiwan）
    • Siliconware Precision Industries Co., Ltd.（Taiwan）
    • Jiangsu Changjiang Electronics Technology（China）
    • Powertech Technology Inc.（Taiwan）
    • Amkor Technology, Inc.（United States）
    • STATS ChipPAC Pte. Ltd.（Singapore）
    • Samsung Electronics Co., Ltd.（South Korea）
    • Tongfu Microelectronics Co., Ltd.（China）
    • Unisem Group（Malaysia）
    • Nepes Corporation（South Korea）
簡介目錄
Product Code: SQMIG45O2022

Global Semiconductor Packaging Market size was valued at USD 26.90 billion in 2022 and is poised to grow from USD 28.65 billion in 2023 to USD 47.49 billion by 2031, growing at a CAGR of 6.52% during the forecast period (2024-2031).

The semiconductor packaging market is witnessing significant growth driven by the surging demand for semiconductor devices across diverse sectors like consumer electronics, automotive, industrial, and healthcare, propelled by the widespread adoption of cutting-edge technologies such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT). These advancements necessitate semiconductor devices with heightened processing power and memory capacity. Semiconductor packaging plays a crucial role in enhancing semiconductor product value by maintaining overall performance while reducing package costs. This technology is increasingly favored for high-performance chips utilized in virtual products, with companies exploring innovative materials like graphene and tin oxide for chip creation, promising further market innovation. The global expansion of the semiconductor industry, spurred by growing demand across various end-user industries and the utilization of packaging to boost electronics system performance, reliability, and cost-effectiveness, is a key driver behind the market's rapid growth. Continuous enhancements in integration, energy efficiency, and product characteristics further contribute to this accelerated market expansion.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Semiconductor Packaging Market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Semiconductor Packaging Market Segmental Analysis

Global Semiconductor Packaging Market is segmented on the basis of material, application and region. By material, the market is segmented into organic packaging, compound semiconductor packaging. By application, market is segmented into consumer electronics, automotive, industrial, healthcare, others. By region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.

Drivers of the Global Semiconductor Packaging Market

The push for advanced semiconductor packaging methods stems from the need for increasingly compact electronic devices such as smartphones, wearables, and IoT gadgets, aiming to enhance functionality and performance while simultaneously reducing size and weight. These innovative packaging techniques facilitate the consolidation of multiple functions and components within a smaller space, thus driving the evolution towards more streamlined and efficient electronic products.

Restraints in the Global Semiconductor Packaging Market

The semiconductor packaging market faces a notable obstacle in the form of cost, where the integration of advanced packaging technologies brings forth intricate procedures, specialized machinery, and premium-grade materials, thereby escalating manufacturing expenses. Additionally, the ongoing requirement for substantial investment in advanced packaging technologies and equipment presents financial hurdles for manufacturers. Furthermore, market rivalry and customer-driven price constraints further constrain profit margins and hinder the widespread adoption of advanced packaging solutions.

Market Trends of the Global Semiconductor Packaging Market

As data-intensive applications become increasingly prevalent, there is an escalating demand for semiconductor packaging solutions that offer both high-speed and high-bandwidth capabilities. Innovations in packaging methods such as flip-chip, wafer-level chip-scale packaging (WLCSP), and package-on-package (PoP) are facilitating faster data transmission, minimizing signal losses, and improving overall electrical performance.

Table of Contents

  • Executive Summary
    • Market Overview
    • Wheel of Fortune
  • Research Methodology
    • Information Procurement
    • Secondary & Primary Data Sources
    • Market Size Estimation
    • Market Assumptions & Limitations
  • Parent Market Analysis
    • Market Overview
    • Market Size
    • Market Dynamics
      • Drivers
      • Opportunities
      • Restraints
      • Challenges
  • Key Market Insights
    • Technology Analysis
    • Pricing Analysis
    • Supply Chain Analysis
    • Value Chain Analysis
    • Ecosystem of the Market
    • IP Analysis
    • Trade Analysis
    • Startup Analysis
    • Raw Material Analysis
    • Innovation Matrix
    • Pipeline Product Analysis
    • Macroeconomic Indicators
    • Top Investment Analysis
    • Key Success Factor
    • Degree of Competition
  • Market Dynamics & Outlook
    • Market Dynamics
      • Drivers
      • Opportunities
      • Restraints
      • Challenges
    • Regulatory Landscape
    • Porters Analysis
      • Competitive rivalry
      • Threat of Substitute Products
      • Bargaining Power of Buyers
      • Threat of New Entrants
      • Bargaining Power of Suppliers
    • Skyquest Special Insights on Future Disruptions
      • Political Impact
      • Economic Impact
      • Social Impact
      • Technical Impact
      • Environmental Impact
      • Legal Impact
  • Global Semiconductor Packaging Market by Material
    • Market Overview
    • Organic Packaging
    • Organic Packaging
    • Compound Semiconductor Packaging
  • Global Semiconductor Packaging Market by Application
    • Market Overview
    • Consumer Electronics
    • Automotive
    • Industrial
    • Healthcare
    • Others
  • Global Semiconductor Packaging Market Size by Region
    • Market Overview
    • North America
      • USA
      • Canada
    • Europe
      • Germany
      • Spain
      • France
      • UK
      • Rest of Europe
    • Asia Pacific
      • China
      • India
      • Japan
      • South Korea
      • Rest of Asia-Pacific
    • Latin America
      • Brazil
      • Rest of Latin America
    • Middle East & Africa (MEA)
      • GCC Countries
      • South Africa
      • Rest of MEA
  • Competitive Landscape
    • Top 5 Player Comparison
    • Market Positioning of Key Players, 2021
    • Strategies Adopted by Key Market Players
    • Top Winning Strategies
      • By Development
      • By Company
      • By Year
    • Recent Activities in the Market
    • Key Companies Market Share (%), 2021
  • Key Company Profiles
    • ASE Technology Holding Co., Ltd. (Taiwan)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Amkor Technology, Inc. (United States)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Siliconware Precision Industries Co., Ltd. (Taiwan)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Powertech Technology Inc. (Taiwan)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • STATS ChipPAC Pte. Ltd. (Singapore)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Samsung Electronics Co., Ltd. (South Korea)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • UTAC Holdings Ltd. (Singapore)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • ChipMOS Technologies Inc. (Taiwan)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Intel Corporation (United States)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Advanced Semiconductor Engineering, Inc. (Taiwan)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Siliconware Precision Industries Co., Ltd. (Taiwan)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Jiangsu Changjiang Electronics Technology (China)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Powertech Technology Inc. (Taiwan)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Amkor Technology, Inc. (United States)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • STATS ChipPAC Pte. Ltd. (Singapore)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Samsung Electronics Co., Ltd. (South Korea)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Tongfu Microelectronics Co., Ltd. (China)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Unisem Group (Malaysia)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Nepes Corporation (South Korea)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments