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1418046

先進半導體封裝市場報告：2030 年趨勢、預測與競爭分析

Advanced Semiconductor Packaging Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

先進半導體封裝趨勢與預測

全球先進半導體封裝市場預計到 2030 年將達到 474 億美元，2024 年至 2030 年年複合成長率為 7.6%。該市場的主要驅動力是電子設備普及的不斷提高、對晶圓級封裝的日益關注以及對半導體封裝技術的投資和研發不斷成長。全球先進半導體封裝市場的未來前景看好，汽車、航太和國防、醫療設備和消費性電子產業市場充滿機會。

先進半導體封裝市場洞察

Lucintel 預測，由於卓越的電氣性能、高連接器密度和小外形尺寸，扇出晶圓級封裝在預測期內仍將是最大的細分市場。

由於對創新封裝技術的需求不斷增加，汽車和消費性電子產業市場的快速發展和擴張，以及5G、人工智慧和物聯網等新興技術的崛起，亞太地區將在預測期內繼續成為最大的細分市場。那。

常問問題

Q1.市場規模有多大？

A1. 到2030年，全球先進半導體封裝市場預計將達到474億美元。

Q2.市場成長預測如何？

A2. 2024年至2030年，全球先進半導體封裝市場預計將以7.6%的年複合成長率成長。

Q3.影響市場成長的主要促進因素有哪些？

A3. 該市場的主要驅動力是電子設備的日益普及、對晶圓級封裝的日益關注以及半導體封裝技術的投資和研發的擴大。

Q4.市場的主要細分市場是什麼？

A4. 全球先進半導體封裝市場前景廣闊，汽車、航太和國防、醫療設備和消費性電子產業市場充滿機會。

Q5.市場上主要企業有哪些？

A5. 先進半導體封裝的主要企業如下。

  • Advanced Semiconductor Engineering
  • Intel
  • Advanced Micro Devices
  • Amkor Technology
  • Hitachi Chemical
  • Jiangsu Changjiang Electronics Technology
  • Infineon
  • Kyocera
  • Sumitomo Chemical
  • China Wafer Level CSP

Q6.未來最大的細分市場是什麼？

A6.Lucintel 預測，由於扇出晶圓級封裝具有卓越的電氣性能、高連接器密度和小外形尺寸，因此在預測期內仍將是最大的細分市場。

Q7. 未來五年預計哪個地區將成為最大的市場？

A7.由於對創新封裝技術的需求不斷增加，汽車和消費性電子產業市場的快速發展和擴大，以及5G、人工智慧和物聯網等新興技術的崛起，亞太地區在預測期內仍將是最大的細分市場。

Q8. 可以客製化報告嗎？

A8. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章全球先進半導體封裝市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球先進半導體封裝市場趨勢（2018-2023）與預測（2024-2030）
  • 全球先進半導體封裝市場（按類型）
    • 扇出晶圓級封裝
    • 5D/3D
    • 扇入式晶圓級封裝
    • 覆晶
  • 全球先進半導體封裝市場（依應用）
    • 車
    • 航太和國防
    • 醫療設備
    • 家用電器
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球先進半導體封裝市場區域分佈
  • 北美先進半導體封裝市場
  • 歐洲先進半導體封裝市場
  • 亞太先進半導體封裝市場
  • 其他地區先進半導體封裝市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 全球先進半導體封裝市場成長機會（按類型）
    • 全球先進半導體封裝市場成長機會（按應用）
    • 全球先進半導體封裝市場成長機會（按地區）
  • 全球先進半導體封裝市場新趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球先進半導體封裝市場產能
    • 全球先進半導體封裝市場的合併、收購與合資
    • 認證和許可

第7章主要企業概況

  • Advanced Semiconductor Engineering
  • Intel
  • Advanced Micro Devices
  • Amkor Technology
  • Hitachi Chemical
  • Jiangsu Changjiang Electronics Technology
  • Infineon
  • Kyocera
  • Sumitomo Chemical
  • China Wafer Level CSP
簡介目錄

Advanced Semiconductor Packaging Trends and Forecast

The future of the global advanced semiconductor packaging market looks promising with opportunities in the automotive, aerospace and defence, medical device, and consumer electronics markets. The global advanced semiconductor packaging market is expected to reach an estimated $47.4 billion by 2030 with a CAGR of 7.6% from 2024 to 2030. The major drivers for this market are rising adoption of electronic devices, increasing focus on wafer-level packages, as well as, growing investments and R&D in semiconductor packaging technologies.

A more than 150-page report is developed to help in your business decisions.

Advanced Semiconductor Packaging by Segment

The study includes a forecast for the global advanced semiconductor packaging by type, application, and region.

Advanced Semiconductor Packaging Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Fan-Out Wafer Level Package
  • 5D/3D
  • Fan-In Wafer Level Package
  • Flip Chip

Advanced Semiconductor Packaging Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Automotive
  • Aerospace and Defence
  • Medical Devices
  • Consumer Electronics
  • Others

Advanced Semiconductor Packaging Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Advanced Semiconductor Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies advanced semiconductor packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the advanced semiconductor packaging companies profiled in this report include-

  • Advanced Semiconductor Engineering
  • Intel
  • Advanced Micro Devices
  • Amkor Technology
  • Hitachi Chemical
  • Jiangsu Changjiang Electronics Technology
  • Infineon
  • Kyocera
  • Sumitomo Chemical
  • China Wafer Level CSP

Advanced Semiconductor Packaging Market Insights

Lucintel forecasts that fan-out wafer level package will remain the largest segment over the forecast period due to its superior electrical performance, high connector density, and small form factor.

APAC will remain the largest segment over the forecast period due to region's increasing demand for innovative packaging technologies, rapid developments and expansion of automotive, and consumer electronics industries, as well as the rise of emerging technologies like 5G, AI, and IoT.

Features of the Global Advanced Semiconductor Packaging Market

Market Size Estimates: Advanced semiconductor packaging market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Advanced semiconductor packaging market size by type, application, and region in terms of value ($B).

Regional Analysis: Advanced semiconductor packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the advanced semiconductor packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the advanced semiconductor packaging market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the advanced semiconductor packaging market size?

Answer: The global advanced semiconductor packaging market is expected to reach an estimated $47.4 billion by 2030.

Q2. What is the growth forecast for advanced semiconductor packaging market?

Answer: The global advanced semiconductor packaging market is expected to grow with a CAGR of 7.6% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the advanced semiconductor packaging market?

Answer: The major drivers for this market are rising adoption of electronic devices, increasing focus on wafer-level packages, as well as, growing investments and R&D in semiconductor packaging technologies.

Q4. What are the major segments for advanced semiconductor packaging market?

Answer: The future of the global advanced semiconductor packaging market looks promising with opportunities in the automotive, aerospace and defence, medical device, and consumer electronics markets.

Q5. Who are the key advanced semiconductor packaging market companies?

Answer: Some of the key advanced semiconductor packaging companies are as follows.

  • Advanced Semiconductor Engineering
  • Intel
  • Advanced Micro Devices
  • Amkor Technology
  • Hitachi Chemical
  • Jiangsu Changjiang Electronics Technology
  • Infineon
  • Kyocera
  • Sumitomo Chemical
  • China Wafer Level CSP

Q6. Which advanced semiconductor packaging market segment will be the largest in future?

Answer: Lucintel forecasts that fan-out wafer level package will remain the largest segment over the forecast period due to its superior electrical performance, high connector density, and small form factor.

Q7. In advanced semiconductor packaging market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest segment over the forecast period due to region's increasing demand for innovative packaging technologies, rapid developments and expansion of automotive, and consumer electronics industries, as well as the rise of emerging technologies like 5G, AI, and IoT.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the advanced semiconductor packaging market by type (fan-out wafer level package , 5D/3D, fan-in wafer level package , and flip chip), application (automotive, aerospace and defence, medical devices, consumer electronics, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Advanced Semiconductor Packaging Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Advanced Semiconductor Packaging Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Advanced Semiconductor Packaging Market by Type
    • 3.3.1: Fan-out Wafer Level Package
    • 3.3.2: 5D/3D
    • 3.3.3: Fan-in Wafer Level Package
    • 3.3.4: Flip Chip
  • 3.4: Global Advanced Semiconductor Packaging Market by Application
    • 3.4.1: Automotive
    • 3.4.2: Aerospace and Defence
    • 3.4.3: Medical Devices
    • 3.4.4: Consumer Electronics
    • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Advanced Semiconductor Packaging Market by Region
  • 4.2: North American Advanced Semiconductor Packaging Market
    • 4.2.2: North American Advanced Semiconductor Packaging Market by Application: Automotive, Aerospace and Defence, Medical Devices, Consumer Electronics, and Others
  • 4.3: European Advanced Semiconductor Packaging Market
    • 4.3.1: European Advanced Semiconductor Packaging Market by Type: Fan-out Wafer Level Package , 5D/3D, Fan-in Wafer Level Package , and Flip Chip
    • 4.3.2: European Advanced Semiconductor Packaging Market by Application: Automotive, Aerospace and Defence, Medical Devices, Consumer Electronics, and Others
  • 4.4: APAC Advanced Semiconductor Packaging Market
    • 4.4.1: APAC Advanced Semiconductor Packaging Market by Type: Fan-out Wafer Level Package , 5D/3D, Fan-in Wafer Level Package , and Flip Chip
    • 4.4.2: APAC Advanced Semiconductor Packaging Market by Application: Automotive, Aerospace and Defence, Medical Devices, Consumer Electronics, and Others
  • 4.5: ROW Advanced Semiconductor Packaging Market
    • 4.5.1: ROW Advanced Semiconductor Packaging Market by Type: Fan-out Wafer Level Package , 5D/3D, Fan-in Wafer Level Package , and Flip Chip
    • 4.5.2: ROW Advanced Semiconductor Packaging Market by Application: Automotive, Aerospace and Defence, Medical Devices, Consumer Electronics, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Advanced Semiconductor Packaging Market by Type
    • 6.1.2: Growth Opportunities for the Global Advanced Semiconductor Packaging Market by Application
    • 6.1.3: Growth Opportunities for the Global Advanced Semiconductor Packaging Market by Region
  • 6.2: Emerging Trends in the Global Advanced Semiconductor Packaging Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Advanced Semiconductor Packaging Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Advanced Semiconductor Packaging Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Advanced Semiconductor Engineering
  • 7.2: Intel
  • 7.3: Advanced Micro Devices
  • 7.4: Amkor Technology
  • 7.5: Hitachi Chemical
  • 7.6: Jiangsu Changjiang Electronics Technology
  • 7.7: Infineon
  • 7.8: Kyocera
  • 7.9: Sumitomo Chemical
  • 7.10: China Wafer Level CSP