混合鍵合技術對於先進封裝的發展至關重要

利用chiplet結合2.5D和3D先進封裝技術將成為高端芯片必然的發展趨勢之一，以按照摩爾定律不斷提高芯片的計算性能。我確信這一點將要。 然而，現有的微凸塊鍵合技術阻礙了高端芯片的全部性能，需要被混合鍵合所取代。 本報告分析了chiplet設計和先進封裝技術的發展趨勢，探討了未來高端芯片發展對混合鍵合技術的需求和發展動力。

TRI涵蓋廣泛的主題，包括半導體、電信、物聯網、汽車系統、人工智能、新興技術應用以及主要區域市場（美國、歐洲、日本、韓國、中國）的最新趨勢、台灣等）我們是一家一直致力於這個主題的研究公司。 成立於1996年，2015年併入集邦諮詢旗下。 TRI的服務因對新興科技行業和區域發展趨勢的準確理解而受到各類組織的高度評價。

本報告提供了 TRI 對混合鍵合發展趨勢的看法。

目錄

第一章摩爾定律延續 - Chiplet 設計和先進封裝技術相結合成為主流

第 2 章混合鍵合的重要結果

第 3 章高端 CIS 和 CPU 產品的混合鍵合產能預計將繼續擴大：凸點鍵合對芯片堆疊的優勢

第 4 章 TRI 的觀點

The utilization of chiplets paired with 2.5D and 3D advanced packaging technology is bound to become one of the inevitable development trends of high-end chips in order to allow a continuous elevation of computing performance for chips according to the Moore's Law. With that being said, the existing micro-bump bonding technology that could impede high-end chips from fully exerting their performance would have to be replaced by hybrid bonding. This report analyzes development trends of chiplet design and advanced packaging technology on the one hand, and probes into the necessity and development momentum of the hybrid bonding technology on future development of high-end chips on the other hand.

TABLE OF CONTENTS

1. Continuation of Moore's Law - Chiplet Designs Paired with Advanced Packaging Technology to Become Mainstream

2. Hybrid Bonding Exhibits Significant

3. Hybrid Bonding Content Expected to Climb Continuously for High-End CIS and CPU ProductsAdvantages over Bump Bonding Pertaining to Chip Stacking

4. TRI's View