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市場調查報告書
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1418459

晶片邦定機設備市場報告：2030 年趨勢、預測與競爭分析

Die Bonder Equipment Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

晶片黏合機設備趨勢和預測

預計到 2030 年，全球貼片機設備市場將達到 8.333 億美元，2024 年至 2030 年複合年成長率為 3.0%。該市場的主要驅動力是，由於半導體 IC 設計的複雜性不斷增加，堆疊晶粒技術在物聯網(IoT) 設備中的使用越來越多，對微型電子元件的需求不斷增加，以及用於無線應用的高品質半導體IC。需求的擴大。全球貼片機設備市場的未來前景廣闊，家用電子電器、汽車、工業、通訊、醫療保健、航太和國防市場充滿機會。

晶片接合機設備市場洞察

根據Lucintel的預測，由於全自動晶片焊接機具有大規模組裝和封裝、提高精度以及自動化組裝和封裝等優勢特點，預計在預測期內將出現最高成長。

由於平板電腦和智慧型手機的需求不斷成長以及製造商的豐富，預計亞太地區在預測期內將出現最高的成長。

常問問題

Q1.市場規模有多大？

A1. 到 2030 年，全球貼片機設備市場預計將達到 8.333 億美元。

Q2.市場成長預測如何？

A2. 2024年至2030年，全球貼片機設備市場預計將以3.0%的複合年成長率成長。

Q3.影響市場成長的主要促進因素有哪些？

A3. 該市場的主要驅動力是物聯網 (IoT) 設備中擴大使用堆疊晶粒技術、對微型電子元件的需求不斷增加，以及由於半導體IC 設計的複雜性不斷增加而提高無線應用的質量。半導體積體電路正在不斷擴大。

Q4.市場的主要細分市場是什麼？

A4. 全球貼片機設備市場的未來充滿希望，家用電子電器、汽車、工業、通訊、醫療保健、航太和國防市場都有機遇。

Q5. 市場上主要企業有哪些？

A5. 生產貼片機設備的主要企業如下。

  • BE Semiconductor Industries
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Mycronic
  • Palomar Technologies
  • West*Bond
  • MicroAssembly Technologies

Q6.未來最大的細分市場是什麼？

A6.根據Lucintel的預測，由於大規模組裝和封裝、精度提高以及自動化組裝和封裝等有利特徵，全自動晶片黏合機預計將在預測期內實現最高成長。

Q7. 未來五年預計哪個地區將成為最大的市場？

A7.由於平板電腦和智慧型手機的需求不斷成長以及該地區製造商數量眾多，預計亞太地區將在預測期內實現最高成長。

Q8. 可以客製化報告嗎？

A8. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章全球晶片邦定機設備市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球貼片機設備市場趨勢（2018-2023）與預測（2024-2030）
  • 按類型分類的全球晶片邦定機設備市場
    • 手動固晶機
    • 半自動固晶機
    • 全自動固晶機
  • 按鍵合技術分類的全球晶片鍵合機設備市場
    • 環氧樹脂
    • 共晶
    • 軟質焊料
    • 其他
  • 按設備分類的全球晶片黏合機設備市場
    • 光電子學
    • 微機電系統及微機電系統
    • 功率元件
  • 全球貼片機設備市場（按應用）
    • 家用電器
    • 車
    • 工業的
    • 電訊
    • 衛生保健
    • 航太和國防
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球晶片黏合機設備市場（按地區）
  • 北美貼片機設備市場
  • 歐洲貼片機設備市場
  • 亞太晶片黏合機設備市場
  • 其他地區固晶機設備市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 全球晶片邦定機設備市場成長機會（按類型）
    • 鍵合技術的全球晶片鍵合機設備市場成長機會
    • 全球晶片鍵合機設備市場成長機會（按設備）
    • 全球晶片邦定機設備市場成長機會（按應用）
    • 全球晶片定機設備市場成長機會（按地區）
  • 全球貼片機設備市場新趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球貼片機設備市場的產能
    • 全球貼片機設備市場的合併、收購與合資企業
    • 認證和許可

第7章主要企業概況

  • BE Semiconductor Industries
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Mycronic
  • Palomar Technologies
  • West*Bond
  • MicroAssembly Technologies
簡介目錄

Die Bonder Equipment Trends and Forecast

The future of the global die bonder equipment market looks promising with opportunities in the consumer electronic, automotive, industrial, telecommunication, healthcare, and aerospace & defense markets. The global die bonder equipment market is expected to reach an estimated $833.3 million by 2030 with a CAGR of 3.0% from 2024 to 2030. The major drivers for this market are increasing use of stacked die technology in Internet of Things (IoT) devices, growing demand for tiny electronic components, need for high-quality semiconductor ICs for wireless applications is expanding along with the complexity of semiconductor IC designs.

A more than 150-page report is developed to help in your business decisions.

Die Bonder Equipment by Segment

The study includes a forecast for the global die bonder equipment by type, bonding technique, device, application, and region.

Die Bonder Equipment Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Manual Die Bonders
  • Semiautomatic Die Bonders
  • Fully Automatic Die Bonders

Die Bonder Equipment Market by Bonding Technique [Shipment Analysis by Value from 2018 to 2030]:

  • Epoxy
  • Eutectic
  • Soft Solder
  • Others

Die Bonder Equipment Market by Device [Shipment Analysis by Value from 2018 to 2030]:

  • Optoelectronics
  • MEMS and MOEMS
  • Power Devices

Die Bonder Equipment Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Consumer Electronics
  • Automotive
  • Industrial
  • Telecommunications
  • Healthcare
  • Aerospace & Defense
  • Others

Die Bonder Equipment Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Die Bonder Equipment Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies die bonder equipment companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the die bonder equipment companies profiled in this report include-

  • BE Semiconductor Industries
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Mycronic
  • Palomar Technologies
  • West*Bond
  • MicroAssembly Technologies

Die Bonder Equipment Market Insights

Lucintel forecasts that fully automatic die bonders is expected to witness the highest growth over the forecast period due to its advantageous characteristics such as, large-scale assembly and packaging, precision enhancement, and automated assembly and packaging.

APAC is expected to witness highest growth over the forecast period due to growing need for tablets and smartphones as well as the region's abundance of manufacturers.

Features of the Global Die Bonder Equipment Market

Market Size Estimates: Die bonder equipment market size estimation in terms of value ($M).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Die bonder equipment market size by bonding technique, device, application, and region in terms of value ($M).

Regional Analysis: Die bonder equipment market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, bonding technique, device, application, and regions for the die bonder equipment market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the die bonder equipment market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the die bonder equipment market size?

Answer: The global die bonder equipment market is expected to reach an estimated $833.3 million by 2030.

Q2. What is the growth forecast for die bonder equipment market?

Answer: The global die bonder equipment market is expected to grow with a CAGR of 3.0% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the die bonder equipment market?

Answer: The major drivers for this market are increasing use of stacked die technology in Internet of Things (IoT) devices, growing demand for tiny electronic components, need for high-quality semiconductor ICs for wireless applications is expanding along with the complexity of semiconductor IC designs.

Q4. What are the major segments for die bonder equipment market?

Answer: The future of the global die bonder equipment market looks promising with opportunities in the consumer electronic, automotive, industrial, telecommunication, healthcare, and aerospace & defense markets.

Q5. Who are the key die bonder equipment market companies?

Answer: Some of the key die bonder equipment companies are as follows.

  • BE Semiconductor Industries
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Mycronic
  • Palomar Technologies
  • West*Bond
  • MicroAssembly Technologies

Q6. Which die bonder equipment market segment will be the largest in future?

Answer: Lucintel forecasts that fully automatic die bonders is expected to witness the highest growth over the forecast period due to its advantageous characteristics such as, large-scale assembly and packaging, precision enhancement, and automated assembly and packaging.

Q7. In die bonder equipment market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to growing need for tablets and smartphones as well as the region's abundance of manufacturers.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the die bonder equipment market by type (manual die bonders, semiautomatic die bonders, and fully automatic die bonders), bonding technique (epoxy, eutectic, soft solder, and others), device (optoelectronics, MEMS and MOEMS, and power devices), application (consumer electronics, automotive, industrial, telecommunications, healthcare, aerospace & defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Die Bonder Equipment Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Die Bonder Equipment Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Die Bonder Equipment Market by Type
    • 3.3.1: Manual Die Bonders
    • 3.3.2: Semiautomatic Die Bonders
    • 3.3.3: Fully Automatic Die Bonders
  • 3.4: Global Die Bonder Equipment Market by Bonding Technique
    • 3.4.1: Epoxy
    • 3.4.2: Eutectic
    • 3.4.3: Soft Solder
    • 3.4.4: Others
  • 3.5: Global Die Bonder Equipment Market by Device
    • 3.5.1: Optoelectronics
    • 3.5.2: MEMS and MOEMS
    • 3.5.3: Power Devices
  • 3.6: Global Die Bonder Equipment Market by Application
    • 3.6.1: Consumer Electronics
    • 3.6.2: Automotive
    • 3.6.3: Industrial
    • 3.6.4: Telecommunications
    • 3.6.5: Healthcare
    • 3.6.6: Aerospace & Defense
    • 3.6.7: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Die Bonder Equipment Market by Region
  • 4.2: North American Die Bonder Equipment Market
    • 4.2.2: North American Die Bonder Equipment Market by Application: Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace & Defense, and Others
  • 4.3: European Die Bonder Equipment Market
    • 4.3.1: European Die Bonder Equipment Market by Type: Manual Die Bonders, Semiautomatic Die Bonders, and Fully Automatic Die Bonders
    • 4.3.2: European Die Bonder Equipment Market by Application: Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace & Defense, and Others
  • 4.4: APAC Die Bonder Equipment Market
    • 4.4.1: APAC Die Bonder Equipment Market by Type: Manual Die Bonders, Semiautomatic Die Bonders, and Fully Automatic Die Bonders
    • 4.4.2: APAC Die Bonder Equipment Market by Application: Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace & Defense, and Others
  • 4.5: ROW Die Bonder Equipment Market
    • 4.5.1: ROW Die Bonder Equipment Market by Type: Manual Die Bonders, Semiautomatic Die Bonders, and Fully Automatic Die Bonders
    • 4.5.2: ROW Die Bonder Equipment Market by Application: Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace & Defense, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Die Bonder Equipment Market by Type
    • 6.1.2: Growth Opportunities for the Global Die Bonder Equipment Market by Bonding Technique
    • 6.1.3: Growth Opportunities for the Global Die Bonder Equipment Market by Device
    • 6.1.4: Growth Opportunities for the Global Die Bonder Equipment Market by Application
    • 6.1.5: Growth Opportunities for the Global Die Bonder Equipment Market by Region
  • 6.2: Emerging Trends in the Global Die Bonder Equipment Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Die Bonder Equipment Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Die Bonder Equipment Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: BE Semiconductor Industries
  • 7.2: ASM Pacific Technology
  • 7.3: Kulicke & Soffa
  • 7.4: Mycronic
  • 7.5: Palomar Technologies
  • 7.6: West*Bond
  • 7.7: MicroAssembly Technologies