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半導體鍵結市場 - 2018-2028 年全球產業規模、佔有率、趨勢、機會與預測，按類型、製程類型、鍵結技術、按應用、按競爭進行細分。

Semiconductor Bonding Market - Global Industry Size, Share, Trends, Opportunity, and Forecast Segmented, By Type, By Process Type, By Bonding Technology, By Application By Region, By Competition 2018-2028.
出版日期: | 出版商: TechSci Research | 英文 182 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2022 年全球半導體鍵結市場價值為 8.79 億美元，預計在預測期內將強勁成長，到 2028 年CAGR為 3.6%。上一年半導體鍵合設備市場價值為 4.9282 億美元，預計預測期內達91879 萬美元。由於對具有更高效率、處理能力和更小占地面積的半導體晶片的需求不斷成長，半導體鍵合設備正在尋找應用，從而推動了預測期內的市場需求。

數位化對生活和商業的影響帶動了半導體市場的繁榮。這導致政府制定了支援 5G 部署的計劃。例如，歐盟委員會建立了公私合作夥伴關係來開發和研究 5G 技術。

隨著未來十年晶片需求的激增，預計到2030 年，全球半導體產業將成為兆美元的產業。這種成長很大程度上得益於在半導體製造、材料和研究方面大力投資的公司和國家，以確保穩定的發展。供應晶片和專業知識，以支持以數據為中心的行業的成長。

市場概況
預測期 2024-2028
2022 年市場規模 8.79 億美元
2028 年市場規模 109658萬美元
2023-2028 年CAGR 3.6%
成長最快的細分市場 晶圓接合機
最大的市場 亞太

儘管全球疫情大流行並導致經濟低迷，但在各類晶片（尤其是成熟節點開發的晶片）需求激增的推動下，半導體產業仍保持韌性，2020年營收成長6.5%，達到4,400億美元大關。半導體元件廣泛應用於大多數消費性電子產品。中國不僅是各種消費性電子產品的最大消費國和生產國之一，而且還透過出口多種主要用於生產製成品的投入品來滿足廣泛的國家需求。 COVID-19引發的封鎖的開始產生了對工作和教育連續性的基本需求，導致對筆記型電腦和個人電腦等計算設備的需求增加，因此，半導體鍵合設備市場的需求激增。

目錄

第 1 章：產品概述

  • 市場定義
  • 市場範圍
  • 涵蓋的市場
  • 研究年份
  • 主要市場區隔

第 2 章：研究方法

  • 研究目的
  • 基線方法
  • 主要產業夥伴
  • 主要協會和二手資料來源
  • 預測方法
  • 數據三角測量與驗證
  • 假設和限制

第 3 章：執行摘要

第 4 章：客戶之聲

第 5 章：全球半導體鍵結市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按類型（晶片接合機、晶圓接合機、覆晶接合機）
    • 依製程類型（晶片到晶片鍵合、晶片到晶圓鍵合、晶圓到晶圓鍵合）
    • 依接合技術分類（晶片接合技術、晶圓接合技術）
    • 按應用（RF 裝置、MEMS 和感測器、CMOS 影像感測器、LED、3D NAND）
    • 按地區
  • 按公司分類 (2022)
  • 市場地圖

第 6 章：北美半導體鍵結市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按類型
    • 依工藝類型
    • 透過黏合技術
    • 按應用
    • 按國家/地區
  • 北美：國家分析
    • 美國
    • 加拿大
    • 墨西哥

第 7 章：亞太地區半導體鍵結市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按類型
    • 依工藝類型
    • 透過黏合技術
    • 按應用
    • 按國家/地區
  • 亞太地區：國家分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 印尼

第 8 章：歐洲半導體鍵結市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按類型
    • 依工藝類型
    • 透過黏合技術
    • 按應用
    • 按國家/地區
  • 歐洲：國家分析
    • 德國
    • 英國
    • 法國
    • 俄羅斯
    • 西班牙

第 9 章：南美洲半導體債券市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按類型
    • 依工藝類型
    • 透過黏合技術
    • 按應用
    • 按國家/地區
  • 南美洲：國家分析
    • 巴西
    • 阿根廷

第 10 章：中東和非洲半導體鍵結市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按類型
    • 依工藝類型
    • 透過黏合技術
    • 按應用
    • 按國家/地區
  • 中東和非洲：國家分析
    • 沙烏地阿拉伯
    • 南非
    • 阿拉伯聯合大公國
    • 以色列
    • 埃及

第 11 章：市場動態

  • 促進要素
  • 挑戰

第 12 章：市場趨勢與發展

第 13 章：公司簡介

  • 巴斯夫公司。
    • Business Overview
    • Key Revenue and Financials (If Available)
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 銦公司。
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 英特爾公司。
    • Business Overview
    • Key Revenue and Financials (If Available)
    • Recent Developments
    • Key Personnel
    • Key Product/Services.
  • 日立化成株式會社
    • Business Overview
    • Key Revenue and Financials (If Available)
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 京瓷公司
    • Business Overview
    • Key Revenue and Financials (If Available)
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 漢高股份公司 KGAA。
    • Business Overview
    • Key Revenue and Financials (If Available)
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 日亞化學株式會社
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 英特爾公司和 UTAC 控股有限公司
    • Business Overview
    • Key Revenue and Financials (If Available)
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 國際量子外延有限公司。
    • Business Overview
    • Key Revenue and Financials (If Available)
    • Recent Developments
    • Key Personnel
    • Key Product/Service

第 14 章：策略建議

第 15 章：關於我們與免責聲明

簡介目錄
Product Code: 20670

Global Semiconductor Bonding Market was valued at USD 879 Million in 2022 and is anticipated to project robust growth in the forecast period with a CAGR of 3.6% through 2028. The semiconductor bonding equipment market was valued at USD 492.82 million in the previous year and is expected to reach USD 918.79 million over the forecast period. Semiconductor bonding equipment is finding applications due to the rising demand for semiconductor chips with higher efficiency, processing power, and smaller footprints, driving the demand for the market during the forecast period.

The impact of digitalization on lives and businesses has led to a boom in the semiconductor markets. This has resulted in government programs supporting the deployment of 5G. For instance, the European Commission established a public-private partnership to develop and research 5G technology.

With chip demand set to surge over the coming decade, the global semiconductor industry is expected to become a trillion-dollar industry by 2030. This growth is largely favored by companies and countries investing heavily in semiconductor manufacturing, materials, and research to guarantee a steady supply of chips and know-how to support growth across data-centric industries.

Market Overview
Forecast Period2024-2028
Market Size 2022USD 879 Million
Market Size 2028USD 1096.58 Million
CAGR 2023-20283.6%
Fastest Growing SegmentWafer Bonder
Largest MarketAsia-Pacific

Despite the global pandemic and resulting economic downturn, the semiconductor industry remained resilient, with revenue growth of 6.5% to reach the USD 440 billion mark in 2020, driven by a spike in demand for all types of chips, especially those developed at mature nodes. Semiconductor components are widely deployed in most consumer electronics products. China is not only one of the largest consumers and producers of various consumer electronics products but also caters to a broad range of countries by exporting several input supplies that are essentially used to produce finished goods. The onset of the COVID-19-induced lockdown created a basic need for continuity of work and education, resulting in an increase in demand for computing devices such as laptops and PCs, and consequently, the semiconductor bonding equipment market experienced a surge in demand.

When a product requires the bonding of two dies or wafers, several methods might be used, with the bonding process selected being the primary driver for the cost of ownership of bonding. The high cost of ownership associated with some bonding processes might restrict market growth.

Key Market Drivers

Growing Semiconductors Demand

The demand for Semiconductor Bonding is also anticipated to increase as the semiconductor industry's miniaturization trend gains traction. This is because manufacturing advanced node ICs, heterogeneous integration, and 3D memory architectures requires more processing steps, which leads to a rise in the consumption of wafer fabrication and packaging materials. For instance, a firm located in the UK called Pragmatic Semiconductor Ltd. revealed in December 2022 that it had collected USD 35 million from investors to create a novel method for manufacturing chips. The business owns a chip fabrication plant (also known as a fab) where flexible processors are produced. In particular, silicon is not present in the CPUs. A flexible processor called PlasticArm that uses metal-oxide transistors integrated on a plastic substrate was also presented by Pragmatic and Arm Ltd. the previous year.

Additionally, STMicroelectronics and French Semiconductor Bonding supplier Soitec announced in December 2022 over the following 18 months, they had reached the next stage of their collaboration on Silicon Carbide (SiC) substrates, with STMicroelectronics planning to qualify the SiC substrate technology from Soitec. The goal of this collaboration was for STMicroelectronics to utilise Soitec's SmartSiC technology for their upcoming 200mm substrate manufacturing, supporting the company's business for manufacturing devices and modules. Scale manufacturing is anticipated soon. More and more chips that enhance the power management of electric cars are currently being produced using the material SiC. The market for Semiconductor Bonding in Europe is anticipated to increase rapidly over the course of the projected period because of rising investments in the latest technologies.

Additionally, the search for novel semiconductors that fit the requirements for photovoltaic devices has been prompted by the desire for low-cost, highly effective solar cells. Economic, ecological, chemical, and electrical qualities must be taken into consideration for large-scale applications. These include plentiful resources, ease of manufacture, particularly with thin-film technologies, long-term stability, and non-toxicity. All these criteria are satisfied by the transition metal dichalcogenides (TMDC) MoS2 and WS2, which have attracted a lot of interest recently. Moreover, the ongoing development of logic devices is currently driven by PPAC (Power Performance Area Cost) scaling and 3D integration issues, but significant advancements in the fabrication of wide bandgap materials are still required for the improvement of transport properties or for the improved thermal management of future power devices.

Rising Demand of Consumer Electronics

Consumer electronics represents one of the most significant end-user industries for the market. As such, the rising demand for consumer electronics, partly driven by the increasing adoption of the Internet of Things (IoT), unlocks new growth opportunities for the market. The internet of things (IoT) is a network of actual physical things and gadgets, such thermostats, refrigerators, and other things, that can be managed remotely. The use of the Internet of Things (IoT) is continuously increasing due to the expansion of high-speed connections, rising cloud usage, and growing applications of data processing and analytics. According to Ericsson Europe is a large IoT consumer. Although the region's IoT adoption is currently led by Germany, the United Kingdom, and the Netherlands, Eastern European nations. The Centre for the Promotion of Imports from Developing Countries (CBI) also estimates that European Internet of Things spending will reach USD 197.41 billion in 2021 and register double-digit growth through 2025. The increasing use of the Internet of Things is fueling demand for linked consumer electronics products. Since, people are adopting IoT in Consumer Electronics the demand of Semiconductor is increasing, due to which the requirement of Semiconductor Bonding is growing rapidly in the forecast period.

Key Market Challenges

Environmental Regulations & Economic Volatility

The semiconductor industry is highly globalized and relies on complex supply chains. Any disruptions in the supply chain, such as natural disasters, geopolitical tensions, or the COVID-19 pandemic, can lead to material shortages, increased lead times, and higher costs. As semiconductor manufacturing processes become more advanced, the materials used must meet increasingly stringent requirements. Developing materials that can meet these technical demands can be challenging and require significant research and development. The semiconductor industry is cost-sensitive, and manufacturers are constantly looking for ways to reduce production costs. This can put pressure on material suppliers to provide high-quality materials at competitive prices. The semiconductor manufacturing process often involves the use of hazardous materials and chemicals. Stringent environmental regulations and the need to minimize the environmental impact of production can create challenges for both material suppliers and semiconductor manufacturers. The semiconductor market is subject to economic cycles that can impact demand. During economic downturns, demand for electronic devices can decrease, affecting the demand for Semiconductor Bonding.

Intellectual Property Protection

Developing new materials requires significant investment in research and development. Protecting intellectual property and preventing unauthorized copying or use of proprietary materials is an ongoing challenge. As semiconductor technology advances, there is a constant push for miniaturization and scaling. This requires materials that can maintain their performance and reliability at smaller scales, which can be technically challenging. The semiconductor industry evolves quickly, with new technologies and processes frequently emerging. Material suppliers must stay ahead of these changes to provide materials that are compatible with the latest manufacturing methods. The Semiconductor Bonding market is highly competitive, with numerous companies vying for market share. This competition can lead to pricing pressures and the need for constant innovation. Semiconductor manufacturing involves intricate processes with tight tolerances. Materials must be consistent in quality and performance to ensure the yield of high-quality semiconductor devices.

Key Market Trends

Environmental Regulations & Economic Volatility

The semiconductor industry is highly globalized and relies on complex supply chains. Any disruptions in the supply chain, such as natural disasters, geopolitical tensions, or the COVID-19 pandemic, can lead to material shortages, increased lead times, and higher costs. As semiconductor manufacturing processes become more advanced, the materials used must meet increasingly stringent requirements. Developing materials that can meet these technical demands can be challenging and require significant research and development. The semiconductor industry is cost-sensitive, and manufacturers are constantly looking for ways to reduce production costs. This can put pressure on material suppliers to provide high-quality materials at competitive prices. The semiconductor manufacturing process often involves the use of hazardous materials and chemicals. Stringent environmental regulations and the need to minimize the environmental impact of production can create challenges for both material suppliers and semiconductor manufacturers. The semiconductor market is subject to economic cycles that can impact demand. During economic downturns, demand for electronic devices can decrease, affecting the demand for Semiconductor Bonding.

Intellectual Property Protection

Developing new materials requires significant investment in research and development. Protecting intellectual property and preventing unauthorized copying or use of proprietary materials is an ongoing challenge. As semiconductor technology advances, there is a constant push for miniaturization and scaling. This requires materials that can maintain their performance and reliability at smaller scales, which can be technically challenging. The semiconductor industry evolves quickly, with new technologies and processes frequently emerging. Material suppliers must stay ahead of these changes to provide materials that are compatible with the latest manufacturing methods. The Semiconductor Bonding market is highly competitive, with numerous companies vying for market share. This competition can lead to pricing pressures and the need for constant innovation. Semiconductor manufacturing involves intricate processes with tight tolerances. Materials must be consistent in quality and performance to ensure the yield of high-quality semiconductor devices.

Segmental Insights

Type Insights

The wafer bonder segment dominated the market, in terms of revenue, in 2022, and is expected to follow the same trend during the forecast period. The wafer bonder segment accounted for the largest share of the market in 2021.The demand for wafer bonders is high due to the increasing need for stable joining and bonding of two substrates in industrial applications. Wafer bonding is one of the fastest solutions to fabricate multiple III-V lasers on Si material in a parallel system. The growing demand for consumer electronic devices such as smartphones, smart wearables, smart lighting, and other RF devices is one of the major factors generating new opportunities for market vendors for wafer semiconductor bonding applications. The market is segmented on the basis of type, application, and geography. Based on type, the semiconductor bonding market size is segmented into die bonder, wafer bonder, and flip chip bonder. Based on application, the semiconductor bonding market analysis is categorized into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. Based on geography, the semiconductor bonding market size is primarily segmented into North America, Europe, Asia Pacific (APAC), the Middle East & Africa (MEA), and South America. In 2021, APAC held the largest semiconductor bonding market share and is expected to retain its dominance during the forecast period. The region is also expected to register the highest CAGR in the global semiconductor bonding market during the forecast period.

Regional Insights

The Asia Pacific region is a significant player in the market and is expected to experience considerable growth over the forecast period, thanks to strategic investments by key domestic suppliers and the well-established semiconductor sector. According to SIA, the Asia-Pacific semiconductor market is set to be more than three times the size of the Americas market over the next four years as chip consumption continues to rise.

This growth is expected to be fueled by some of the largest semiconductor companies located in the region, as well as growing investments to support the semiconductor industry infrastructure across nations like China, India, and Vietnam. In addition, well-known domestic vendors and government agencies are making significant technological investments in offering next-generation semiconductor bonding solutions, such as hybrid bonding, which is expected to increase market demand.

For example, Adeia, the recently launched brand for the intellectual property (IP) licensing business of Xperi Holding Corporation, and LAPIS Technology Co., Ltd., a subsidiary of the ROHM Group, announced an agreement in May 2022 that includes a technology transfer of Adeia's DBI Ultra die-to-wafer hybrid bonding know-how to support the development and deployment of the technology into LAPIS's product line. The agreement also includes a license to Adeia's underlying hybrid bonding patent portfolio.

China is predicted to overtake the United States as the world's top powerhouse in the semiconductor industry based on its expanding domestic chip demand. According to the Semiconductor Industry Association, the semiconductor market will double in size to reach more than USD 1 trillion by 2030, with China contributing over 60% of that increase. This exponential growth is expected to increase demand for semiconductor bonding equipment.

Furthermore, in December 2022, China announced a support program worth more than CNY 1 trillion (USD 143 billion) for its semiconductor industry, significantly advancing chip self-sufficiency and retaliating against American efforts to obstruct its technological development. Most of the financial assistance would be used to finance the purchases of local semiconductor equipment by Chinese enterprises, which is expected to support regional market demand.

Key Market Players

BASF SE.

Indium Corporation.

Intel Corporation.

Hitachi Chemical Co. Ltd.

KYOCERA Corporation

Henkel AG & Company KGAA.

Nichia Corporation

Intel Corporation and UTAC Holdings Ltd

International Quantum Epitaxy PLC

Report Scope:

In this report, the Global Semiconductor Bonding Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Global Semiconductor Bonding Market, By Type:

  • Die Bonder
  • Wafer Bonder
  • Flip Chip Bonder

Global Semiconductor Bonding Market, By Process Type:

  • Die To Die Bonding
  • Die To Wafer Bonding
  • Wafer To Wafer Bonding

Global Semiconductor Bonding Market, By Bonding Technology:

  • Die Bonding Technology
  • Wafer Bonding Technology

Global Semiconductor Bonding Market, By Application:

  • RF Devices
  • Mems and Sensors
  • CMOS Image Sensors
  • LED
  • 3D NAND

Global Semiconductor Bonding Market, By Region:

  • North America
  • United States
  • Canada
  • Mexico
  • Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Indonesia
  • Europe
  • Germany
  • United Kingdom
  • France
  • Russia
  • Spain
  • South America
  • Brazil
  • Argentina
  • Middle East & Africa
  • Saudi Arabia
  • South Africa
  • Egypt
  • UAE
  • Israel

Competitive Landscape

  • Company Profiles: Detailed analysis of the major companies presents in the Global Semiconductor Bonding Market.

Available Customizations:

  • Global Semiconductor Bonding Market report with the given market data, Tech Sci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
  • 1.3. Markets Covered
  • 1.4. Years Considered for Study
  • 1.5. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

4. Voice of Customers

5. Global Semiconductor Bonding Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Type (Die Bonder, Wafer Bonder, Flip Chip Bonder)
    • 5.2.2. By Process Type (Die To Die Bonding, Die To Wafer Bonding, Wafer To Wafer Bonding)
    • 5.2.3. By Bonding Technology (Die Bonding Technology, Wafer Bonding Technology)
    • 5.2.4. By Application (RF Devices, Mems and Sensors, CMOS Image Sensors, LED, 3D NAND)
    • 5.2.5. By Region
  • 5.3. By Company (2022)
  • 5.4. Market Map

6. North America Semiconductor Bonding Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Type
    • 6.2.2. By Process Type
    • 6.2.3. By Bonding Technology
    • 6.2.4. By Application
    • 6.2.5. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Semiconductor Bonding Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Type
        • 6.3.1.2.2. By Process Type
        • 6.3.1.2.3. By Bonding Technology
        • 6.3.1.2.4. By Application
    • 6.3.2. Canada Semiconductor Bonding Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Type
        • 6.3.2.2.2. By Process Type
        • 6.3.2.2.3. By Bonding Technology
        • 6.3.2.2.4. By Application
    • 6.3.3. Mexico Semiconductor Bonding Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Type
        • 6.3.3.2.2. By Process Type
        • 6.3.3.2.3. By Bonding Technology
        • 6.3.3.2.4. By Application

7. Asia-Pacific Semiconductor Bonding Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Type
    • 7.2.2. By Process Type
    • 7.2.3. By Bonding Technology
    • 7.2.4. By Application
    • 7.2.5. By Country
  • 7.3. Asia-Pacific: Country Analysis
    • 7.3.1. China Semiconductor Bonding Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Type
        • 7.3.1.2.2. By Process Type
        • 7.3.1.2.3. By Bonding Technology
        • 7.3.1.2.4. By Application
    • 7.3.2. India Semiconductor Bonding Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Type
        • 7.3.2.2.2. By Process Type
        • 7.3.2.2.3. By Bonding Technology
        • 7.3.2.2.4. By Application
    • 7.3.3. Japan Semiconductor Bonding Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Type
        • 7.3.3.2.2. By Process Type
        • 7.3.3.2.3. By Bonding Technology
        • 7.3.3.2.4. By Application
    • 7.3.4. South Korea Semiconductor Bonding Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Type
        • 7.3.4.2.2. By Process Type
        • 7.3.4.2.3. By Bonding Technology
        • 7.3.4.2.4. By Application
    • 7.3.5. Indonesia Semiconductor Bonding Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Type
        • 7.3.5.1.2. By Process Type
        • 7.3.5.1.3. By Bonding Technology
        • 7.3.5.1.4. By Application

8. Europe Semiconductor Bonding Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Type
    • 8.2.2. By Process Type
    • 8.2.3. By Bonding Technology
    • 8.2.4. By Application
    • 8.2.5. By Country
  • 8.3. Europe: Country Analysis
    • 8.3.1. Germany Semiconductor Bonding Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Type
        • 8.3.1.2.2. By Process Type
        • 8.3.1.2.3. By Bonding Technology
        • 8.3.1.2.4. By Application
    • 8.3.2. United Kingdom Semiconductor Bonding Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Type
        • 8.3.2.2.2. By Process Type
        • 8.3.2.2.3. By Bonding Technology
        • 8.3.2.2.4. By Application
    • 8.3.3. France Semiconductor Bonding Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Type
        • 8.3.3.2.2. By Process Type
        • 8.3.3.2.3. By Bonding Technology
        • 8.3.3.2.4. By Application
    • 8.3.4. Russia Semiconductor Bonding Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Type
        • 8.3.4.2.2. By Process Type
        • 8.3.4.2.3. By Bonding Technology
        • 8.3.4.2.4. By Application
    • 8.3.5. Spain Semiconductor Bonding Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Type
        • 8.3.5.2.2. By Process Type
        • 8.3.5.2.3. By Bonding Technology
        • 8.3.5.2.4. By Application

9. South America Semiconductor Bonding Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Type
    • 9.2.2. By Process Type
    • 9.2.3. By Bonding Technology
    • 9.2.4. By Application
    • 9.2.5. By Country
  • 9.3. South America: Country Analysis
    • 9.3.1. Brazil Semiconductor Bonding Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Type
        • 9.3.1.2.2. By Process Type
        • 9.3.1.2.3. By Bonding Technology
        • 9.3.1.2.4. By Application
    • 9.3.2. Argentina Semiconductor Bonding Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Type
        • 9.3.2.2.2. By Process Type
        • 9.3.2.2.3. By Bonding Technology
        • 9.3.2.2.4. By Application

10. Middle East & Africa Semiconductor Bonding Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Type
    • 10.2.2. By Process Type
    • 10.2.3. By Bonding Technology
    • 10.2.4. By Application
    • 10.2.5. By Country
  • 10.3. Middle East & Africa: Country Analysis
    • 10.3.1. Saudi Arabia Semiconductor Bonding Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Type
        • 10.3.1.2.2. By Process Type
        • 10.3.1.2.3. By Bonding Technology
        • 10.3.1.2.4. By Application
    • 10.3.2. South Africa Semiconductor Bonding Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Type
        • 10.3.2.2.2. By Process Type
        • 10.3.2.2.3. By Bonding Technology
        • 10.3.2.2.4. By Application
    • 10.3.3. UAE Semiconductor Bonding Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Type
        • 10.3.3.2.2. By Process Type
        • 10.3.3.2.3. By Bonding Technology
        • 10.3.3.2.4. By Application
    • 10.3.4. Israel Semiconductor Bonding Market Outlook
      • 10.3.4.1. Market Size & Forecast
        • 10.3.4.1.1. By Value
      • 10.3.4.2. Market Share & Forecast
        • 10.3.4.2.1. By Type
        • 10.3.4.2.2. By Process Type
        • 10.3.4.2.3. By Bonding Technology
        • 10.3.4.2.4. By Application
    • 10.3.5. Egypt Semiconductor Bonding Market Outlook
      • 10.3.5.1. Market Size & Forecast
        • 10.3.5.1.1. By Value
      • 10.3.5.2. Market Share & Forecast
        • 10.3.5.2.1. By Type
        • 10.3.5.2.2. By Process Type
        • 10.3.5.2.3. By Bonding Technology
        • 10.3.5.2.4. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenge

12. Market Trends & Developments

13. Company Profiles

  • 13.1. BASF SE.
    • 13.1.1. Business Overview
    • 13.1.2. Key Revenue and Financials (If Available)
    • 13.1.3. Recent Developments
    • 13.1.4. Key Personnel
    • 13.1.5. Key Product/Services
  • 13.2. Indium Corporation.
    • 13.2.1. Business Overview
    • 13.2.2. Key Revenue and Financials
    • 13.2.3. Recent Developments
    • 13.2.4. Key Personnel
    • 13.2.5. Key Product/Services
  • 13.3. Intel Corporation.
    • 13.3.1. Business Overview
    • 13.3.2. Key Revenue and Financials (If Available)
    • 13.3.3. Recent Developments
    • 13.3.4. Key Personnel
    • 13.3.5. Key Product/Services.
  • 13.4. Hitachi Chemical Co. Ltd.
    • 13.4.1. Business Overview
    • 13.4.2. Key Revenue and Financials (If Available)
    • 13.4.3. Recent Developments
    • 13.4.4. Key Personnel
    • 13.4.5. Key Product/Services
  • 13.5. KYOCERA Corporation
    • 13.5.1. Business Overview
    • 13.5.2. Key Revenue and Financials (If Available)
    • 13.5.3. Recent Developments
    • 13.5.4. Key Personnel
    • 13.5.5. Key Product/Services
  • 13.6. Henkel AG & Company KGAA.
    • 13.6.1. Business Overview
    • 13.6.2. Key Revenue and Financials (If Available)
    • 13.6.3. Recent Developments
    • 13.6.4. Key Personnel
    • 13.6.5. Key Product/Services
  • 13.7. Nichia Corporation
    • 13.7.1. Business Overview
    • 13.7.2. Key Revenue and Financials
    • 13.7.3. Recent Developments
    • 13.7.4. Key Personnel
    • 13.7.5. Key Product/Services
  • 13.8. Intel Corporation and UTAC Holdings Ltd
    • 13.8.1. Business Overview
    • 13.8.2. Key Revenue and Financials (If Available)
    • 13.8.3. Recent Developments
    • 13.8.4. Key Personnel
    • 13.8.5. Key Product/Services
  • 13.9. International Quantum Epitaxy PLC.
    • 13.9.1. Business Overview
    • 13.9.2. Key Revenue and Financials (If Available)
    • 13.9.3. Recent Developments
    • 13.9.4. Key Personnel
    • 13.9.5. Key Product/Service

14. Strategic Recommendations

15. About Us & Disclaimer