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市場調查報告書
商品編碼
1418410

晶粒邦定機市場報告：2030 年趨勢、預測與競爭分析

Die Bonding Machine Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

晶粒國定機的趨勢與預測

預計到 2030 年，全球晶粒機市場將達到 17 億美元，2024 年至 2030 年複合年成長率為 5.5%。該市場的主要促進因素是對半導體裝置的需求不斷成長、先進封裝技術的日益採用以及電子裝置小型化趨勢的增強。全球晶粒機市場的未來性充滿希望，消費性電子、汽車、通訊、航太和國防以及醫療市場充滿機會。

晶粒邦定機市場洞察

Lucintel 預測，全自動預計將在預測期內實現最高成長。

在這個市場中，由於智慧型手機、平板電腦、筆記型電腦和其他小工具等家用電器的普及不斷提高，家用電器預計將經歷最高的成長。

由於其強大的電子製造基礎，特別是在中國和韓國，亞太地區在預測期內可能仍然是最大的地區。

常問問題

Q1.市場規模有多大？

A1. 到2030年，全球晶粒機市場預計將達到17億美元。

Q2.市場成長預測如何？

A2. 2024年至2030年，全球晶粒機市場預計將以5.5%的複合年成長率成長。

Q3.影響市場成長的主要促進因素有哪些？

A3. 該市場的主要驅動力是對半導體裝置的需求不斷成長、先進封裝技術的日益採用以及電子裝置小型化趨勢的增強。

Q4.市場的主要細分市場是什麼？

A4.晶粒機市場的未來前景廣闊，消費性電子、汽車、通訊、航太和國防、醫療市場都有機遇。

Q5.市場上主要企業有哪些？

A5. 生產晶粒機的主要企業如下。

  • Besi
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Palomar Technologies
  • Shinkawa
  • DIAS Automation
  • Toray Engineering
  • Panasonic
  • West-Bond
  • Hybond

Q6.未來最大的細分市場是什麼？

A6.Lucintel預測全自動將在預測期內達到最高成長。

Q7. 未來五年預計哪個地區將成為最大的市場？

A7.亞太地區由於其強大的電子製造基礎，特別是在中國和韓國，在預測期內將繼續成為最大的地區。

Q8. 可以客製化報告嗎？

A8. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章全球晶粒邦定機市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球晶粒機市場趨勢（2018-2023）與預測（2024-2030）
  • 按類型分類的全球晶粒邦定機市場
    • 全自動
    • 半自動
    • 手動的
  • 全球晶粒定機市場（按組件）
    • 控制器
    • 自動販賣機
    • 塗膠工具
    • 拾取工具
    • 相機
  • 按最終用途分類的全球晶粒定機市場
    • 家用電器
    • 車
    • 電訊
    • 航太和國防
    • 藥品
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球晶粒定機市場（按地區）
  • 北美晶粒晶機市場
  • 歐洲晶粒晶機市場
  • 亞太晶片晶粒定機市場
  • 其他地區晶粒晶機市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 按類型分類的全球晶粒邦定機市場成長機會
    • 全球晶粒鍵合機市場成長機會（按組件）
    • 全球晶粒鍵合機市場成長機會（按最終用途）
    • 按地區分類的全球晶粒邦定機市場成長機會
  • 全球晶粒晶機市場新趨勢
  • 戰略分析
    • 新產品開發
    • 全球晶粒機市場產能擴張
    • 全球晶粒機市場的合併、收購與合資企業
    • 認證和許可

第7章主要企業概況

  • Besi
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Palomar Technologies
  • Shinkawa
  • DIAS Automation
  • Toray Engineering
  • Panasonic
  • West-Bond
  • Hybond
簡介目錄

Die Bonding Machine Trends and Forecast

The future of the global die bonding machine market looks promising with opportunities in the consumer electronic, automotive, telecommunication, aerospace & defense, and medical markets. The global die bonding machine market is expected to reach an estimated $1.7 billion by 2030 with a CAGR of 5.5% from 2024 to 2030. The major drivers for this market are growing demand for semiconductor devices, increasing adoption of advanced packaging technologies, and risng trend of miniaturization in electronic devices.

A more than 150-page report is developed to help in your business decisions.

Die Bonding Machine by Segment

The study includes a forecast for the global die bonding machine by type, component, end use, and region.

Die Bonding Machine Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Fully Automatic
  • Semi-Automatic
  • Manual

Die Bonding Machine Market by Component [Shipment Analysis by Value from 2018 to 2030]:

  • Controllers
  • Dispensers
  • Bonding Tools
  • Pick-Up Tools
  • Cameras

Die Bonding Machine Market by End Use [Shipment Analysis by Value from 2018 to 2030]:

  • Consumer Electronics
  • Automotive
  • Telecommunications
  • Aerospace & Defense
  • Medical
  • Others

Die Bonding Machine Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Die Bonding Machine Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies die bonding machine companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the die bonding machine companies profiled in this report include-

  • Besi
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Palomar Technologies
  • Shinkawa
  • DIAS Automation
  • Toray Engineering
  • Panasonic
  • West-Bond
  • Hybond

Die Bonding Machine Market Insights

Lucintel forecasts that fully automatic is expected to witness the highest growth over the forecast period.

Within this market, consumer electronic is expected to witness the highest growth due to growing adoption of consumer electronics such as smartphones, tablets, laptops, and other gadgets.

APAC will remain the largest region over the forecast period due to the region's strong electronics manufacturing base, particularly in China and South Korea.

Features of the Global Die Bonding Machine Market

Market Size Estimates: Die bonding machine market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Die bonding machine market size by type, component, end use, and region in terms of value ($B).

Regional Analysis: Die bonding machine market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, components, end uses, and regions for the die bonding machine market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the die bonding machine market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the die bonding machine market size?

Answer: The global die bonding machine market is expected to reach an estimated $1.7 billion by 2030.

Q2. What is the growth forecast for die bonding machine market?

Answer: The global die bonding machine market is expected to grow with a CAGR of 5.5% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the die bonding machine market?

Answer: The major drivers for this market are growing demand for semiconductor devices, increasing adoption of advanced packaging technologies, and risng trend of miniaturization in electronic devices.

Q4. What are the major segments for die bonding machine market?

Answer: The future of the die bonding machine market looks promising with opportunities in the consumer electronic, automotive, telecommunication, aerospace & defense, and medical markets.

Q5. Who are the key die bonding machine market companies?

Answer: Some of the key die bonding machine companies are as follows.

  • Besi
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Palomar Technologies
  • Shinkawa
  • DIAS Automation
  • Toray Engineering
  • Panasonic
  • West-Bond
  • Hybond

Q6. Which die bonding machine market segment will be the largest in future?

Answer: Lucintel forecasts that fully automatic is expected to witness the highest growth over the forecast period.

Q7. In die bonding machine market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period due to the region's strong electronics manufacturing base, particularly in China and South Korea.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the die bonding machine market by type (fully automatic, semi-automatic, and manual), component (controllers, dispensers, bonding tools, pick-up tools, and cameras), end use (consumer electronics, automotive, telecommunications, aerospace & defense, medical, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Die Bonding Machine Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Die Bonding Machine Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Die Bonding Machine Market by Type
    • 3.3.1: Fully Automatic
    • 3.3.2: Semi-Automatic
    • 3.3.3: Manual
  • 3.4: Global Die Bonding Machine Market by Component
    • 3.4.1: Controllers
    • 3.4.2: Dispensers
    • 3.4.3: Bonding Tools
    • 3.4.4: Pick-Up Tools
    • 3.4.5: Cameras
  • 3.5: Global Die Bonding Machine Market by End Use
    • 3.5.1: Consumer Electronics
    • 3.5.2: Automotive
    • 3.5.3: Telecommunications
    • 3.5.4: Aerospace & Defense
    • 3.5.5: Medical
    • 3.5.6: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Die Bonding Machine Market by Region
  • 4.2: North American Die Bonding Machine Market
    • 4.2.2: North American Die Bonding Machine Market by End Use: Consumer Electronics, Automotive, Telecommunications, Aerospace & Defense, Medical, and Others
  • 4.3: European Die Bonding Machine Market
    • 4.3.1: European Die Bonding Machine Market by Type: Fully Automatic, Semi-Automatic, and Manual
    • 4.3.2: European Die Bonding Machine Market by End Use: Consumer Electronics, Automotive, Telecommunications, Aerospace & Defense, Medical, and Others
  • 4.4: APAC Die Bonding Machine Market
    • 4.4.1: APAC Die Bonding Machine Market by Type: Fully Automatic, Semi-Automatic, and Manual
    • 4.4.2: APAC Die Bonding Machine Market by End Use: Consumer Electronics, Automotive, Telecommunications, Aerospace & Defense, Medical, and Others
  • 4.5: ROW Die Bonding Machine Market
    • 4.5.1: ROW Die Bonding Machine Market by Type: Fully Automatic, Semi-Automatic, and Manual
    • 4.5.2: ROW Die Bonding Machine Market by End Use: Consumer Electronics, Automotive, Telecommunications, Aerospace & Defense, Medical, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Die Bonding Machine Market by Type
    • 6.1.2: Growth Opportunities for the Global Die Bonding Machine Market by Component
    • 6.1.3: Growth Opportunities for the Global Die Bonding Machine Market by End Use
    • 6.1.4: Growth Opportunities for the Global Die Bonding Machine Market by Region
  • 6.2: Emerging Trends in the Global Die Bonding Machine Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Die Bonding Machine Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Die Bonding Machine Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Besi
  • 7.2: ASM Pacific Technology
  • 7.3: Kulicke & Soffa
  • 7.4: Palomar Technologies
  • 7.5: Shinkawa
  • 7.6: DIAS Automation
  • 7.7: Toray Engineering
  • 7.8: Panasonic
  • 7.9: West-Bond
  • 7.10: Hybond