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1418043

半導體鍵合設備市場報告：2030 年趨勢、預測與競爭分析

Semiconductor Bonding Equipment Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

半導體鍵合設備的趨勢與預測

全球半導體鍵結設備市場預計到 2030 年將達到 11 億美元，2024 年至 2030 年複合年成長率為 10.8%。該市場的主要驅動力是對具有更小尺寸、更高處理能力和更高效率的半導體裝置的需求不斷成長，半導體製造商、汽車、醫療保健和工業對研發活動的投資不斷增加，以及半導體晶片在工業領域的日益採用。各行業。全球半導體鍵合設備市場的未來可能包括先進封裝、功率 IC 和功率分離式元件、光子元件、MEMS 感測器和致動器、工程基板以及 CMOS 影像感測器市場的機會。

半導體鍵合設備市場洞察

Lucintel 預測，混合鍵合設備預計將在預測期內實現最高成長，因為與傳統方法相比，它提供了卓越的電氣和熱性能。

由於國內主要供應商的策略投資以及該地區成熟的半導體產業，預計亞太地區在預測期內將出現最高成長。

常問問題

Q1.市場規模有多大？

A1. 到2030年，全球半導體鍵結設備市場預計將達到11億美元。

Q2.市場成長預測如何？

A2. 2024年至2030年，全球半導體鍵結設備市場預計將以10.8%的複合年成長率成長。

Q3.影響市場成長的主要促進因素有哪些？

A3. 該市場的主要促進因素是對具有較小佔地面積、更高處理能力和更高效率的半導體裝置的需求不斷成長，半導體製造商、汽車和醫療保健領域對研發活動的投資增加，半導體晶片在各種領域的採用越來越多工業等產業。

Q4.市場的主要細分市場是什麼？

A4. 全球半導體鍵合設備市場的未來前景廣闊，先進封裝、功率 IC 和功率分離式元件、光子元件、MEM 感測器和致動器、工程基板和 CMOS 影像感測器市場充滿機會。

Q5.市場上主要企業有哪些？

A5. 半導體鍵結設備的主要企業如下。

  • EV Group
  • ASMPT Semiconductor Solutions
  • MRSI Systems
  • WestBond
  • Panasonic Industry
  • Palomar Technologies
  • Dr. Tresky
  • BE Semiconductor Industries
  • Fasford Technology
  • Kulicke and Soffa Industries

Q6.未來最大的細分市場是什麼？

A6.Lucintel 預測，由於混合鍵合設備與傳統方法相比具有卓越的電氣和熱性能，預計在預測期內將實現最高成長。

Q7. 未來五年預計哪個地區將成為最大的市場？

由於國內主要供應商的策略投資以及該地區成熟的半導體產業，A7.APAC預計將在預測期內實現最高成長。

Q8. 可以客製化報告嗎？

A8. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章全球半導體鍵結設備市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球半導體鍵結設備市場趨勢（2018-2023）與預測（2024-2030）
  • 全球半導體鍵合設備市場，按類型
    • 永久性黏合裝置
    • 臨時固定裝置
    • 混合連接設備
  • 全球半導體鍵合設備市場（按應用）
    • 先進封裝
    • 功率IC和功率分離式元件
    • 光子裝置
    • MEMS 感測器和致動器
    • 加工基板
    • CMOS影像感測器

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球半導體鍵結設備市場（按地區）
  • 北美半導體鍵結設備市場
  • 歐洲半導體鍵結設備市場
  • 亞太半導體鍵合設備市場
  • 其他地區半導體鍵結設備市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 全球半導體鍵結設備市場成長機會（按類型）
    • 全球半導體鍵結設備市場成長機會（按應用）
    • 全球半導體鍵結設備市場成長機會（按地區）
  • 全球半導體鍵結設備市場新趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球半導體鍵結設備市場產能
    • 全球半導體鍵合設備市場的併購和合資企業
    • 認證和許可

第7章主要企業概況

  • EV Group
  • ASMPT Semiconductor Solutions
  • MRSI Systems
  • WestBond
  • Panasonic Industry
  • Palomar Technologies
  • Dr. Tresky
  • BE Semiconductor Industries
  • Fasford Technology
  • Kulicke and Soffa Industries
簡介目錄

Semiconductor Bonding Equipment Trends and Forecast

The future of the global semiconductor bonding equipment market looks promising with opportunities in the advanced packaging, power IC and power discrete, photonic device, MEMs sensors and actuators, engineered substrates, CMOS image sensor markets. The global semiconductor bonding equipment market is expected to reach an estimated $1.1 billion by 2030 with a CAGR of 10.8% from 2024 to 2030. The major drivers for this market are growing need for semiconductor devices with reduced footprints, more processing power, and improved efficiency, increasing investments in research and development activities by semiconductor manufacturers, as well as, rising adoption of semiconductor chips in various industries, including automotive, healthcare, and industrial.

A more than 150-page report is developed to help in your business decisions.

Semiconductor Bonding Equipment by Segment

The study includes a forecast for the global semiconductor bonding equipment by type, application, and region.

Semiconductor Bonding Equipment Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Permanent Bonding Equipment
  • Temporary Bonding Equipment
  • Hybrid Bonding Equipment

Semiconductor Bonding Equipment Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Advanced Packaging
  • Power IC and Power Discrete
  • Photonic Devices
  • MEMS Sensors and Actuators
  • Engineered Substrates
  • CMOS Image Sensors

Semiconductor Bonding Equipment Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Semiconductor Bonding Equipment Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor bonding equipment companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor bonding equipment companies profiled in this report include-

  • EV Group
  • ASMPT Semiconductor Solutions
  • MRSI Systems
  • WestBond
  • Panasonic Industry
  • Palomar Technologies
  • Dr. Tresky
  • BE Semiconductor Industries
  • Fasford Technology
  • Kulicke and Soffa Industries

Semiconductor Bonding Equipment Market Insights

Lucintel forecasts that hybrid bonding equipment is expected to witness the highest growth over the forecast period because it can deliver superior electrical and thermal performance compared to traditional methods.

APAC is expected to witness highest growth over the forecast period due to strategic investments by key domestic suppliers and the well-established semiconductor sector in the region.

Features of the Global Semiconductor Bonding Equipment Market

Market Size Estimates: Semiconductor bonding equipment market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Semiconductor bonding equipment market size by type, application, and region in terms of value ($B).

Regional Analysis: Semiconductor bonding equipment market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the semiconductor bonding equipment market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the semiconductor bonding equipment market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the semiconductor bonding equipment market size?

Answer: The global semiconductor bonding equipment market is expected to reach an estimated $1.1 billion by 2030.

Q2. What is the growth forecast for semiconductor bonding equipment market?

Answer: The global semiconductor bonding equipment market is expected to grow with a CAGR of 10.8% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the semiconductor bonding equipment market?

Answer: The major drivers for this market are growing need for semiconductor devices with reduced footprints, more processing power, and improved efficiency, increasing investments in research and development activities by semiconductor manufacturers, as well as, rising adoption of semiconductor chips in various industries, including automotive, healthcare, and industrial.

Q4. What are the major segments for semiconductor bonding equipment market?

Answer: The future of the global semiconductor bonding equipment market looks promising with opportunities in the advanced packaging, power IC and power discrete, photonic device, MEMs sensors and actuators, engineered substrates, CMOS image sensor markets.

Q5. Who are the key semiconductor bonding equipment market companies?

Answer: Some of the key semiconductor bonding equipment companies are as follows.

  • EV Group
  • ASMPT Semiconductor Solutions
  • MRSI Systems
  • WestBond
  • Panasonic Industry
  • Palomar Technologies
  • Dr. Tresky
  • BE Semiconductor Industries
  • Fasford Technology
  • Kulicke and Soffa Industries

Q6. Which semiconductor bonding equipment market segment will be the largest in future?

Answer: Lucintel forecasts that hybrid bonding equipment is expected to witness the highest growth over the forecast period because it can deliver superior electrical and thermal performance compared to traditional methods.

Q7. In semiconductor bonding equipment market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to strategic investments by key domestic suppliers and the well-established semiconductor sector in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the semiconductor bonding equipment market by type (permanent bonding equipment, temporary bonding equipment, and hybrid bonding equipment), application (advanced packaging, power IC and power discrete, photonic devices, MEMS sensors and actuators, engineered substrates, and CMOS image sensors), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Semiconductor Bonding Equipment Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Semiconductor Bonding Equipment Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Semiconductor Bonding Equipment Market by Type
    • 3.3.1: Permanent Bonding Equipment
    • 3.3.2: Temporary Bonding Equipment
    • 3.3.3: Hybrid Bonding Equipment
  • 3.4: Global Semiconductor Bonding Equipment Market by Application
    • 3.4.1: Advanced Packaging
    • 3.4.2: Power IC and Power Discrete
    • 3.4.3: Photonic Devices
    • 3.4.4: MEMS Sensors and Actuators
    • 3.4.5: Engineered Substrates
    • 3.4.6: CMOS Image Sensors

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Semiconductor Bonding Equipment Market by Region
  • 4.2: North American Semiconductor Bonding Equipment Market
    • 4.2.2: North American Semiconductor Bonding Equipment Market by Application: Advanced Packaging, Power IC and Power Discrete, Photonic Devices, MEMS Sensors and Actuators, Engineered Substrates, and CMOS Image Sensors
  • 4.3: European Semiconductor Bonding Equipment Market
    • 4.3.1: European Semiconductor Bonding Equipment Market by Type: Permanent Bonding Equipment, Temporary Bonding Equipment, and Hybrid Bonding Equipment
    • 4.3.2: European Semiconductor Bonding Equipment Market by Application: Advanced Packaging, Power IC and Power Discrete, Photonic Devices, MEMS Sensors and Actuators, Engineered Substrates, and CMOS Image Sensors
  • 4.4: APAC Semiconductor Bonding Equipment Market
    • 4.4.1: APAC Semiconductor Bonding Equipment Market by Type: Permanent Bonding Equipment, Temporary Bonding Equipment, and Hybrid Bonding Equipment
    • 4.4.2: APAC Semiconductor Bonding Equipment Market by Application: Advanced Packaging, Power IC and Power Discrete, Photonic Devices, MEMS Sensors and Actuators, Engineered Substrates, and CMOS Image Sensors
  • 4.5: ROW Semiconductor Bonding Equipment Market
    • 4.5.1: ROW Semiconductor Bonding Equipment Market by Type: Permanent Bonding Equipment, Temporary Bonding Equipment, and Hybrid Bonding Equipment
    • 4.5.2: ROW Semiconductor Bonding Equipment Market by Application: Advanced Packaging, Power IC and Power Discrete, Photonic Devices, MEMS Sensors and Actuators, Engineered Substrates, and CMOS Image Sensors

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Semiconductor Bonding Equipment Market by Type
    • 6.1.2: Growth Opportunities for the Global Semiconductor Bonding Equipment Market by Application
    • 6.1.3: Growth Opportunities for the Global Semiconductor Bonding Equipment Market by Region
  • 6.2: Emerging Trends in the Global Semiconductor Bonding Equipment Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Semiconductor Bonding Equipment Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Semiconductor Bonding Equipment Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: EV Group
  • 7.2: ASMPT Semiconductor Solutions
  • 7.3: MRSI Systems
  • 7.4: WestBond
  • 7.5: Panasonic Industry
  • 7.6: Palomar Technologies
  • 7.7: Dr. Tresky
  • 7.8: BE Semiconductor Industries
  • 7.9: Fasford Technology
  • 7.10: Kulicke and Soffa Industries