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商品編碼

1361812

全球抗輻射電子市場報告

Global Radiation Hardened Electronics Market Report

出版日期: 2023年10月01日 | 出版商:

Value Market Research | 英文 190 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄圖表

預計到 2030 年，全球抗輻射電子市場的市場規模將從 2022 年的 250 萬美元達到近 369 萬美元，2023 年至 2030 年研究期間的年複合成長率為 5%。

抗輻射電子產品是指電子元件。它由電路、電阻器、電晶體、電容器、二極體、單板電腦 CPU、封裝和產品組成，主要用於工業中，以保護設備免受極高的輻射。抗輻射電子產品在保護電子設備免受外太空有害輻射造成的物理損壞和故障方面發揮著至關重要的作用。它們設計用於承受輻射和 -55°C 至 125°C 的極端溫度。

市場動態：

對通訊衛星不斷成長的需求和不斷增加的監控推動了抗輻射電子產品市場的發展。商業太空計畫數量的增加和電子輻射暴露系統的日益採用是促進市場成長的其他主要因素。此外，太空探索計畫和長途通訊的不斷增加也推動了衛星中使用的抗輻射電子產品的需求增加。推動市場成長的其他主要因素是各種技術進步，例如開發高可靠性積體電路和改進現場可程式閘陣列（FPGA）技術，這將推動市場成長。然而，抗輻射電子產品的高維護成本可能會在評估期間阻礙其市場成長。

研究報告涵蓋波特五力模型、市場吸引力分析和價值鏈分析。這些工具有助於清晰地了解行業結構並評估全球範圍內的競爭吸引力。此外，這些工具也對全球抗輻射電子產品市場的各個細分市場進行了包容性評估。抗輻射電子產業的成長和趨勢為這項研究提供了整體方法。

區域分析：

本節涵蓋區域前景，重點介紹北美、歐洲、亞太地區、拉丁美洲以及中東和非洲的抗輻射電子市場當前和未來的需求。此外，該報告重點關注所有主要地區各個應用領域的需求、估計和預測。

該研究報告還涵蓋了市場主要參與者的全面概況以及對全球競爭格局的深入了解。抗輻射電子市場的主要參與者包括Microchip Technology Inc.（美國）、BAE Systems（英國）、瑞薩電子公司（日本）、英飛凌科技股份公司（德國）、義法半導體（瑞士）、賽靈思公司（美國）、德州儀器公司（美國）、霍尼韋爾國際公司（美國）、Teledyne Technologies Inc.（美國）和 TTM Technologies, Inc.（美國）。本節包含競爭格局的整體視圖，包括各種策略發展，例如關鍵併購、未來產能、合作夥伴關係、財務概況、合作、新產品開發、新產品發布和其他發展。

如果您有任何客製化要求，請寫信給我們。我們的研究團隊可以根據您的需求提供客製化報告。

簡介 - 市場動態
市場促進因素
市場限制
機會
產業動態
波特五力分析
市場吸引力分析
- 按組件分類的市場吸引力分析
- 按製造技術進行的市場吸引力分析
- 市場吸引力分析：按產品類型
- 市場吸引力分析：依應用分類
- 市場吸引力分析：按地區

第 4 章：價值鏈分析

價值鏈分析
原料分析
- 原料清單
- 原料廠商清單
- 主要原物料價格走勢
潛在買家名單
行銷管道
- 直效行銷
- 間接行銷
- 行銷通路發展趨勢

第 5 章：COVID-19 爆發的影響分析

第 6 章：全球抗輻射電子市場分析：依組件分類

按組件概述
歷史和預測數據
按成分分析
混合訊號 IC
處理器和控制器
記憶
能源管理

第 7 章：全球抗輻射電子市場分析：依製造技術分類

按製造技術概述
歷史和預測數據
依製造技術分析
抗輻射設計 (RHBD)
輻射硬化製程 (RHBP)

第 8 章：全球抗輻射電子市場分析：依產品類型

概述：按產品類型
歷史和預測數據
分析：依產品類型
商業現貨 (COTS)
客製化

第 9 章：全球抗輻射電子市場分析：依應用分類

概述：按應用
歷史和預測數據
分析：按應用
空間
航太與國防
核電廠
醫療的
其他

第 10 章：全球抗輻射電子市場分析：依地理位置

區域展望
介紹
北美銷售分析
- 概述、歷史和預測銷售分析
- 北美按細分市場銷售分析
- 北美按國家銷售分析
- 美國銷售分析
- 加拿大銷售分析
- 墨西哥銷售分析
歐洲銷售分析
- 概述、歷史和預測銷售分析
- 歐洲按細分市場銷售分析
- 歐洲按國家銷售分析
- 英國銷售分析
- 法國銷售分析
- 德國銷售分析
- 義大利銷售分析
- 俄羅斯銷售分析
- 歐洲其他地區銷售分析
亞太地區銷售分析
- 概述、歷史和預測銷售分析
- 亞太地區按細分市場銷售分析
- 亞太地區國家/地區銷售分析
- 中國銷售分析
- 印度銷售分析
- 日本銷售分析
- 韓國銷售分析
- 澳洲銷售分析
- 亞太地區其他地區銷售分析
拉丁美洲銷售分析
- 概述、歷史和預測銷售分析
- 拉丁美洲按細分市場銷售分析
- 拉丁美洲按國家銷售分析
- 巴西銷售分析
- 阿根廷銷售分析
- 秘魯銷售分析
- 智利銷售分析
- 拉丁美洲其他地區銷售分析
中東和非洲銷售分析
- 概述、歷史和預測銷售分析
- 中東和非洲按細分市場銷售分析
- 中東和非洲國家銷售分析
- 沙烏地阿拉伯銷售分析
- 阿拉伯聯合大公國銷售分析
- 以色列銷售分析
- 南非銷售分析
- 中東其他地區和非洲銷售分析

第 11 章：抗輻射電子公司的競爭格局

抗輻射電子市場競爭
夥伴關係/協作/協議
併購
新產品發布
其他發展

第 12 章：公司簡介

頂尖公司股票分析
市場集中度
Microchip Technology Inc. (US)

公司簡介
公司收入
產品
最近的發展

BAE Systems (UK)

公司簡介
公司收入
產品
最近的發展

Renesas Electronics Corporation (Japan)

公司簡介
公司收入
產品
最近的發展

Infineon Technologies AG (Germany)

公司簡介
公司收入
產品
最近的發展

STMicroelectronics (Switzerland)

公司簡介
公司收入
產品
最近的發展

Xilinx Inc. (US)

公司簡介
公司收入
產品
最近的發展

Texas Instruments Incorporated (US)

公司簡介
公司收入
產品
最近的發展

Honeywell International Inc. (US)

公司簡介
公司收入
產品
最近的發展

Teledyne Technologies Inc. (US)

公司簡介
公司收入
產品
最近的發展

TTM Technologies Inc. (US).

公司簡介
公司收入
產品
最近的發展

注意 - 在公司概況中，財務詳細資訊和近期發展視情況而定，或者如果是私人公司，則可能不包括在內

簡介目錄圖表

Product Code: VMR11218590

The global demand for Radiation Hardened Electronics Market is presumed to reach the market size of nearly USD 3.69 MN by 2030 from USD 2.5 MN in 2022 with a CAGR of 5% under the study period 2023 - 2030.

Radiation hardened electronics refers to electronic components. It consists of circuits, resistors, transistors, capacitors, diodes, single-board computer CPUs, packages, and products primarily used in industries to protect devices from extremely high radiation exposure. The radiation hardened electronics play a crucial role in protecting electronic equipment from physical damage and failure caused by harmful radiation in outer space. They are designed to withstand radiation and extreme temperatures ranging from -55°C to 125°C.

MARKET DYNAMICS:

The market for radiation hardened electronics is driven by growing demand for communication satellites and increasing surveillance. The increasing number of commercial space programs and growing adoption of electronics radiation exposure systems are other major factors contributing to market growth. Moreover, increased demand for radiation-hardened electronics used in satellites has been driven by rising space exploration programmes and long-distance communication. Other major factors fuelling market growth are various technological advancements, such as developing highly reliable integrated circuits and improving field-programmable gate array (FPGA) technology, which will boost the market. However, the high maintenance cost of radiation hardened electronics may hamper its market growth during the assessment period.

The research report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of radiation hardened electronics. The growth and trends of radiation hardened electronics industry provide a holistic approach to this study.

MARKET SEGMENTATION:

This section of the radiation hardened electronics market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.

By Component

Mixed Signal ICs
Processors & Controllers
Memory
Power Management

By Manufacturing Technique

Radiation-Hardening by Design (RHBD)
Radiation-Hardening by Process (RHBP)

By Product Type

Commercial-off-the-Shelf (COTS)
Custom Made

By Application

Space
Aerospace & Defense
Nuclear Power Plant
Medical
Others

REGIONAL ANALYSIS:

This section covers the regional outlook, which accentuates current and future demand for the Radiation Hardened Electronics market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the radiation hardened electronics market include Microchip Technology Inc. (US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), Xilinx, Inc. (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.

In case you have any custom requirements, do write to us. Our research team can offer a customized report as per your need.

1 . PREFACE

1.1. Report Description
- 1.1.1. Objective
- 1.1.2. Target Audience
- 1.1.3. Unique Selling Proposition (USP) & offerings
1.2. Research Scope
1.3. Research Methodology
- 1.3.1. Market Research Process
- 1.3.2. Market Research Methodology

2 . EXECUTIVE SUMMARY

2.1. Highlights of Market
2.2. Global Market Snapshot

3 . RADIATION HARDENED ELECTRONICS - INDUSTRY ANALYSIS

3.1. Introduction - Market Dynamics
3.2. Market Drivers
3.3. Market Restraints
3.4. Opportunities
3.5. Industry Trends
3.6. Porter's Five Force Analysis
3.7. Market Attractiveness Analysis
- 3.7.1 Market Attractiveness Analysis By Component
- 3.7.2 Market Attractiveness Analysis By Manufacturing Technique
- 3.7.3 Market Attractiveness Analysis By Product Type
- 3.7.4 Market Attractiveness Analysis By Application
- 3.7.5 Market Attractiveness Analysis By Region

4 . VALUE CHAIN ANALYSIS

4.1. Value Chain Analysis
4.2. Raw Material Analysis
- 4.2.1. List of Raw Materials
- 4.2.2. Raw Material Manufactures List
- 4.2.3. Price Trend of Key Raw Materials
4.3. List of Potential Buyers
4.4. Marketing Channel
- 4.4.1. Direct Marketing
- 4.4.2. Indirect Marketing
- 4.4.3. Marketing Channel Development Trend

5 . IMPACT ANALYSIS OF COVID-19 OUTBREAK

6 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY COMPONENT

6.1 Overview by Component
6.2 Historical and Forecast Data
6.3 Analysis by Component
6.4 Mixed Signal ICs Historic and Forecast Sales by Regions
6.5 Processors & Controllers Historic and Forecast Sales by Regions
6.6 Memory Historic and Forecast Sales by Regions
6.7 Power Management Historic and Forecast Sales by Regions

7 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY MANUFACTURING TECHNIQUE

7.1 Overview by Manufacturing Technique
7.2 Historical and Forecast Data
7.3 Analysis by Manufacturing Technique
7.4 Radiation-Hardening Design (RHBD) Historic and Forecast Sales by Regions
7.5 Radiation-Hardening Process (RHBP) Historic and Forecast Sales by Regions

8 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY PRODUCT TYPE

8.1 Overview by Product Type
8.2 Historical and Forecast Data
8.3 Analysis by Product Type
8.4 Commercial-off-the-Shelf (COTS) Historic and Forecast Sales by Regions
8.5 Custom Made Historic and Forecast Sales by Regions

9 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY APPLICATION

9.1 Overview by Application
9.2 Historical and Forecast Data
9.3 Analysis by Application
9.4 Space Historic and Forecast Sales by Regions
9.5 Aerospace & Defense Historic and Forecast Sales by Regions
9.6 Nuclear Power Plant Historic and Forecast Sales by Regions
9.7 Medical Historic and Forecast Sales by Regions
9.8 Others Historic and Forecast Sales by Regions

10 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY GEOGRAPHY

10.1. Regional Outlook
10.2. Introduction
10.3. North America Sales Analysis
- 10.3.1. Overview, Historic and Forecast Sales Analysis
- 10.3.2. North America By Segment Sales Analysis
- 10.3.3. North America By Country Sales Analysis
- 10.3.4. United State Sales Analysis
- 10.3.5. Canada Sales Analysis
- 10.3.6. Mexico Sales Analysis
10.4. Europe Sales Analysis
- 10.4.1. Overview, Historic and Forecast Sales Analysis
- 10.4.2. Europe by Segment Sales Analysis
- 10.4.3. Europe by Country Sales Analysis
- 10.4.4. United Kingdom Sales Analysis
- 10.4.5. France Sales Analysis
- 10.4.6. Germany Sales Analysis
- 10.4.7. Italy Sales Analysis
- 10.4.8. Russia Sales Analysis
- 10.4.9. Rest Of Europe Sales Analysis
10.5. Asia Pacific Sales Analysis
- 10.5.1. Overview, Historic and Forecast Sales Analysis
- 10.5.2. Asia Pacific by Segment Sales Analysis
- 10.5.3. Asia Pacific by Country Sales Analysis
- 10.5.4. China Sales Analysis
- 10.5.5. India Sales Analysis
- 10.5.6. Japan Sales Analysis
- 10.5.7. South Korea Sales Analysis
- 10.5.8. Australia Sales Analysis
- 10.5.9. Rest Of Asia Pacific Sales Analysis
10.6. Latin America Sales Analysis
- 10.6.1. Overview, Historic and Forecast Sales Analysis
- 10.6.2. Latin America by Segment Sales Analysis
- 10.6.3. Latin America by Country Sales Analysis
- 10.6.4. Brazil Sales Analysis
- 10.6.5. Argentina Sales Analysis
- 10.6.6. Peru Sales Analysis
- 10.6.7. Chile Sales Analysis
- 10.6.8. Rest of Latin America Sales Analysis
10.7. Middle East & Africa Sales Analysis
- 10.7.1. Overview, Historic and Forecast Sales Analysis
- 10.7.2. Middle East & Africa by Segment Sales Analysis
- 10.7.3. Middle East & Africa by Country Sales Analysis
- 10.7.4. Saudi Arabia Sales Analysis
- 10.7.5. UAE Sales Analysis
- 10.7.6. Israel Sales Analysis
- 10.7.7. South Africa Sales Analysis
- 10.7.8. Rest Of Middle East And Africa Sales Analysis

11 . COMPETITIVE LANDSCAPE OF THE RADIATION HARDENED ELECTRONICS COMPANIES

11.1. Radiation Hardened Electronics Market Competition
11.2. Partnership/Collaboration/Agreement
11.3. Merger And Acquisitions
11.4. New Product Launch
11.5. Other Developments

12 . COMPANY PROFILES OF RADIATION HARDENED ELECTRONICS INDUSTRY

12.1. Top Company Share Analysis
12.2. Market Concentration Rate
12.3. Microchip Technology Inc. (US)
- 12.3.1. Company Overview
- 12.3.2. Company Revenue
- 12.3.3. Products
- 12.3.4. Recent Developments
12.4. BAE Systems (UK)
- 12.4.1. Company Overview
- 12.4.2. Company Revenue
- 12.4.3. Products
- 12.4.4. Recent Developments
12.5. Renesas Electronics Corporation (Japan)
- 12.5.1. Company Overview
- 12.5.2. Company Revenue
- 12.5.3. Products
- 12.5.4. Recent Developments
12.6. Infineon Technologies AG (Germany)
- 12.6.1. Company Overview
- 12.6.2. Company Revenue
- 12.6.3. Products
- 12.6.4. Recent Developments
12.7. STMicroelectronics (Switzerland)
- 12.7.1. Company Overview
- 12.7.2. Company Revenue
- 12.7.3. Products
- 12.7.4. Recent Developments
12.8. Xilinx Inc. (US)
- 12.8.1. Company Overview
- 12.8.2. Company Revenue
- 12.8.3. Products
- 12.8.4. Recent Developments
12.9. Texas Instruments Incorporated (US)
- 12.9.1. Company Overview
- 12.9.2. Company Revenue
- 12.9.3. Products
- 12.9.4. Recent Developments
12.10. Honeywell International Inc. (US)
- 12.10.1. Company Overview
- 12.10.2. Company Revenue
- 12.10.3. Products
- 12.10.4. Recent Developments
12.11. Teledyne Technologies Inc. (US)
- 12.11.1. Company Overview
- 12.11.2. Company Revenue
- 12.11.3. Products
- 12.11.4. Recent Developments
12.12. TTM Technologies Inc. (US).
- 12.12.1. Company Overview
- 12.12.2. Company Revenue
- 12.12.3. Products
- 12.12.4. Recent Developments