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全球耐輻射電子市場：市場規模、市場份額、趨勢分析、機會和預測：按產品類型、組件、製造技術、材料、應用、地區2018-2028
市場調查報告書
商品編碼
1147255

全球耐輻射電子市場：市場規模、市場份額、趨勢分析、機會和預測：按產品類型、組件、製造技術、材料、應用、地區2018-2028

Radiation Hardened Electronics Market - Global Size, Share, Trend Analysis, Opportunity and Forecast Report, 2018-2028, Segmented By Product Type, By Component, By Manufacturing Technique, By Material, By Application, By Region
出版日期: | 出版商: Blueweave Consulting | 英文 114 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

全球抗輻射電子市場規模預計將從 2021 年的 17.8 億美元增至 2028 年的約 25.3 億美元，在預測期內以 5.3% 的複合年增長率增長。半導體行業的擴張、對空間組件的需求增加以及對用於情報、監視和偵察 (ISR) 活動的通信衛星的需求不斷增長，正在推動市場擴張。此外，產品在電源管理製造領域的廣泛採用也對市場產生了積極影響。

本報告研究了全球抗輻射電子產品市場，並提供了全面的信息，包括市場概況、市場分析和公司簡介。

內容

第一章研究框架

第 2 章執行摘要

第 3 章全球耐輻射電子市場洞察

  • 應用價值鏈分析
  • DROC 分析
    • 驅動程序
      • 對商業衛星的需求不斷增長
      • 情報、監視和偵察 (ISR) 行動的興起
      • 擴大半導體部門
    • 約束因素
      • 創建實際測試環境的難度
      • 開發設計成本高
    • 機會
      • 全球太空任務增加
      • 對衛星商業組件的需求不斷增長
      • 軍事應用的興起
    • 任務
      • 高端消費者的定制需求
  • 技術進步/近期發展
  • 監管框架
  • 波特五力分析
    • 供應商的議價能力
    • 買家的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭強度

第 4 章全球耐輻射電子市場概述

  • 市場規模和價值預測（2018-2028 年）
    • 按金額（十億美元）
  • 市場份額和預測
    • 按產品類型
      • 商業產品
      • 定制產品
    • 按組件
      • 混合信號 IC
      • 處理器和控制器
      • 內存
      • 電源管理
    • 按製造技術
      • 設計輻射硬度 (RHBD)
      • 不同工藝的抗輻射性 (RHBP)
    • 按材料
      • 矽
      • 氫化非晶矽
      • 碳化矽
      • 氮化鎵
      • 砷化鎵
      • 其他
    • 按用途
      • 宇宙
      • 航空航天和國防
      • 核電站
      • 醫藥
      • 其他
    • 按地區
      • 北美
      • 歐洲
      • 亞太地區
      • 拉丁美洲
      • 中東和非洲

第 5 章北美耐輻射電子市場

    • 市場規模和價值預測（2018-2028 年）
    • 按金額（十億美元）
  • 市場份額和預測
    • 按產品類型
    • 按組件
    • 按製造技術
    • 按材料
    • 按用途
    • 按國家/地區
      • 美國
      • 加拿大

第 6 章歐洲耐輻射電子市場

  • 市場規模和價值預測（2018-2028 年）
    • 按金額（十億美元）
  • 市場份額和預測
    • 按產品類型
    • 按組件
    • 按製造技術
    • 按材料
    • 按用途
    • 按國家/地區
      • 德國
      • 英國
      • 意大利
      • 法國
      • 西班牙
      • 荷蘭
      • 比利時
      • 北歐國家
      • 其他歐洲
    • 亞太耐輻射電子市場
  • 市場規模和價值預測（2018-2028 年）
    • 按金額（十億美元）
  • 市場份額和預測
    • 按產品類型
    • 按組件
    • 按製造技術
    • 按材料
    • 按用途
    • 按國家/地區
      • 中國
      • 印度
      • 日本
      • 韓國
      • 澳大利亞和新西蘭
      • 印度尼西亞
      • 馬來西亞
      • 新加坡
      • 菲律賓
      • 越南
      • 其他亞太地區

第 7 章。拉丁美洲的耐輻射電子市場

  • 市場規模和價值預測（2018-2028 年）
    • 按金額（十億美元）
  • 市場份額和預測
    • 按產品類型
    • 按組件
    • 按製造技術
    • 按材料
    • 按用途
    • 按國家/地區
      • 巴西
      • 墨西哥
      • 阿根廷
      • 秘魯
      • 哥倫比亞
      • 其他拉丁美洲

第 8 章。中東和非洲的抗輻射電子市場

  • 市場規模和價值預測（2018-2028 年）
    • 按金額（十億美元）
  • 市場份額和預測
    • 按產品類型
    • 按組件
    • 按製造技術
    • 按材料
    • 按用途
    • 按國家/地區
      • 沙特阿拉伯
      • 阿拉伯聯合酋長國
      • 卡塔爾
      • 科威特
      • 伊朗
      • 南非
      • 尼日利亞
      • 肯尼亞
      • 埃及
      • 摩洛哥
      • 阿爾及利亞
      • 其他中東

第 9 章競爭格局

  • 主要公司及其產品列表
  • 全球耐輻射電子公司市場份額分析（2021 年）
  • 競爭基準：按運行參數
  • 重大戰略發展（合併、收購、合作夥伴關係等）

第 10 章 COVID-19 對全球耐輻射電子市場的影響

第 11 章公司簡介（公司簡介、財務矩陣、競爭格局、關鍵人才、主要競爭對手、聯繫人、SWOT、戰略展望）

  • Microchip Technology Inc.
  • BAE Systems
  • Renesas Electronics Corporation
  • Infineon Technologies AG
  • STMicroelectronics
  • Xilinx, Inc.
  • Texas Instruments Incorporated
  • Honeywell International Inc.
  • Teledyne Technologies Inc.
  • TTM Technologies, Inc.
  • Cobham Limited
  • Analog Devices, Inc
  • Data Devices Corporation
  • 3D Plus（France）, Mercury Systems, Inc.
  • PCB Piezotronics, Inc
  • Vorago（US）, Micropac Industries, Inc
  • GSI technology, Inc
  • Everspin Technologies Inc
  • Semiconductor Components Industries, LLC
  • 其他

第 12 章關鍵戰略建議

第十三章研究方法

簡介目錄
Product Code: BWC22405

Global Radiation Hardened Electronics Market to Grow at a CAGR of 5.3%, during Forecast Period

Global Radiation Hardened Electronics Market is flourishing owing to the expanding semiconductor sector and rising demand for commercial-off-the-shelf space components.

A recent study conducted by the strategic consulting and market research firm, BlueWeave Consulting, revealed that the Global Radiation Hardened Electronics Market was worth USD 1.78 billion in the year 2021. The market is projected to grow at a CAGR of 5.3%, earning revenues of around USD 2.53 billion by the end of 2028. The Global Radiation Hardened Electronics Market is booming because of the growing number of space missions and exploratory activities. In line with this, the rising demand for communication satellites for intelligence, surveillance, and reconnaissance (ISR) operations is driving market expansion. Radiation-hardened electronics are critical for preventing physical damage and failure caused by harmful radiation in space. Furthermore, widespread product adoption for power management device manufacturing is having a positive impact on the market. These electronics are also used in the production of diodes, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs) for a variety of defense and military applications. The low production and high maintenance costs for radiation-hardened electronics, however, are anticipated to impede market revenue growth over the forecast period.

Growing Market for Commercial Satellites

The need for low-cost satellite communication for a range of uses, including agriculture surveillance, television content and cell phone connectivity, and military surveillance and monitoring, is driving up demand for small satellites. These commercial satellites have a lifespan of 15-20 years and are frequently launched into geosynchronous orbits for the best coverage. As more communication satellites orbit the earth, the demand for radiation-hardened electronics systems has grown. The New Space entrepreneurs, including OneWeb, SpaceX, Amazon, and Telesat, intend to launch a mega constellation of thousands of low-earth orbit satellites in the upcoming years to enhance the global connectivity network.

Challenge: Customised Demands from Affluent Customers

Custom radiation-hardened products with high integration, efficiency, and compact features are preferred by space agencies. The businesses are embracing several innovations, which involve investing a sizable amount of time, money, and R&D. Additionally, the need to adapt the design process based on the specific requirements of the end user causes long development cycles for radiation-hardened components. Further, it is anticipated that a lack of lab time will impact the supply of customized product lines for the certification of radiation-hardened chipsets.

Segmental Coverage

Global Radiation Hardened Electronics Market - By Material

Based on material, the Global Radiation Hardened Electronics Market is segmented into Silicon, Hydrogenated amorphous silicon, Silicon carbide, Gallium nitride, Gallium arsenide, and others. Among these, Silicon is expected to grow significantly during the forecast period. Silicon-based electronic components are chosen for innovative solutions that aid both strategic and space missions, resulting in significant market growth. The segment is growing due to manufacturers' increased interest in developing critical microelectronic equipment, such as microprocessors, that are more reliable in hostile environments, such as space and military field deployments. All these factors boost the growth of the Global Radiation Hardened Electronics Market during the forecast period (2022-2028).

Impact of COVID-19 on Global Radiation Hardened Electronics Market

COVID-19 has had a sizable impact on the value chain as well as the demand for radiation-hardened electronics in various end-use industries. The use of radiation-hardened electronic components in satellite construction has been significantly influenced by COVID-19. This market is characterized by low production volumes, high levels of specialization, and few suppliers. Furthermore, COVID-19 has resulted in supply chain interruptions, extended lead times for raw material and component shipments, postponed contract execution, and lockdowns in several countries, particularly in the European region, where the third phase of the lockdown took place in the first quarter of 2021. The industry also relies on outside silicon foundries and back-end subcontractors for some of its manufacturing tasks.

Competitive Landscape

The leading market players in the Global Radiation Hardened Electronics Market are Microchip Technology Inc., BAE Systems, Renesas Electronics Corporation, Infineon Technologies AG, STMicroelectronics, Xilinx, Inc., Texas Instruments Incorporated, Honeywell International Inc., Teledyne Technologies Inc., TTM Technologies, Inc., Cobham Limited, Analog Devices, Inc, Data Devices Corporation, 3D Plus (France), Mercury Systems, Inc., PCB Piezotronics, Inc, Vorago (US), Micropac Industries, Inc, GSI Technology, Inc, Everspin Technologies Inc, Semiconductor Components Industries, LLC, and other prominent players. The Global Radiation Hardened Electronics Market is highly fragmented with the presence of several manufacturing companies in the country. The market leaders retain their supremacy by spending on research and development, incorporating cutting-edge technology into their goods, and releasing upgraded items for customers. Various tactics, including strategic alliances, agreements, mergers, and partnerships, are used.

The in-depth analysis of the report provides information about growth potential, upcoming trends, and statistics of the Global Radiation Hardened Electronics Market. It also highlights the factors driving forecasts of total market size. The report promises to provide recent technology trends in the Global Radiation Hardened Electronics Market and industry insights to help decision-makers make sound strategic decisions. Furthermore, the report also analyzes the growth drivers, challenges, and competitive dynamics of the market.

Table of Contents

1. Research Framework

  • 1.1. Research Objective
  • 1.2. Type Overview
  • 1.3. Market Segmentation

2. Executive Summary

3. Global Radiation Hardened Electronics Market Insights

  • 3.1. Application Value Chain Analysis
  • 3.2. DROC Analysis
    • 3.2.1. Growth Drivers
      • 3.2.1.1. Increasing Demand in Commercial Satellites
      • 3.2.1.2. Rise in the intelligence, surveillance, and reconnaissance (ISR) operations
      • 3.2.1.3. Expanding semiconductor sector
    • 3.2.2. Restraints
      • 3.2.2.1. Difficulties in creating real testing environment
      • 3.2.2.2. High costs of development and designing
    • 3.2.3. Opportunities
      • 3.2.3.1. Increasing space missions globally
      • 3.2.3.2. Rising Demand for Commercial-Off-The-Shelf Components in Space Satellites
      • 3.2.3.3. Rising Military Applications
    • 3.2.4. Challenge
      • 3.2.4.1. Customized requirements from high-end consumers
  • 3.3. Technological Advancements/Recent Developments
  • 3.4. Regulatory Framework
  • 3.5. Porter's Five Forces Analysis
    • 3.5.1. Bargaining Power of Suppliers
    • 3.5.2. Bargaining Power of Buyers
    • 3.5.3. Threat of New Entrants
    • 3.5.4. Threat of Substitutes
    • 3.5.5. Intensity of Rivalry

4. Global Radiation Hardened Electronics Market Overview

  • 4.1. Market Size & Forecast by Value, 2018-2028
    • 4.1.1. By Value (USD Billion)
  • 4.2. Market Share & Forecast
    • 4.2.1. By Product Type
      • 4.2.1.1. Commercial-off-the-Shelf (COTS)
      • 4.2.1.2. Custom Made
    • 4.2.2. By Component
      • 4.2.2.1. Mixed Signal ICs
      • 4.2.2.2. Processors & Controllers
      • 4.2.2.3. Memory
      • 4.2.2.4. Power Management
    • 4.2.3. By Manufacturing Technique
      • 4.2.3.1. Radiation-Hardening by Design (RHBD)
      • 4.2.3.2. Radiation-Hardening by Process (RHBP)
    • 4.2.4. By Material
      • 4.2.4.1. Silicon
      • 4.2.4.2. Hydrogenated amorphous silicon
      • 4.2.4.3. Silicon carbide
      • 4.2.4.4. Gallium nitride
      • 4.2.4.5. Gallium arsenide
      • 4.2.4.6. Others
    • 4.2.5. By Application
      • 4.2.5.1. Space
      • 4.2.5.2. Aerospace & Defense
      • 4.2.5.3. Nuclear Power Plant
      • 4.2.5.4. Medical
      • 4.2.5.5. Others
    • 4.2.6. By Region
      • 4.2.6.1. North America
      • 4.2.6.2. Europe
      • 4.2.6.3. Asia Pacific
      • 4.2.6.4. Latin America
      • 4.2.6.5. Middle East and Africa

5. North America Radiation Hardened Electronics Market

    • 5.1.1. Market Size & Forecast by Value, 2018-2028
    • 5.1.2. By Value (USD Billion)
  • 5.2. Market Share & Forecast
    • 5.2.1. By Product Type
    • 5.2.2. By Component
    • 5.2.3. By Manufacturing Technique
    • 5.2.4. By Material
    • 5.2.5. By Application
    • 5.2.6. By Country
      • 5.2.6.1. US
      • 5.2.6.1.1. By Product Type
      • 5.2.6.1.2. By Component
      • 5.2.6.1.3. By Manufacturing Technique
      • 5.2.6.1.4. By Material
      • 5.2.6.1.5. By Application
      • 5.2.6.2. Canada
      • 5.2.6.2.1. By Product Type
      • 5.2.6.2.2. By Component
      • 5.2.6.2.3. By Manufacturing Technique
      • 5.2.6.2.4. By Material
      • 5.2.6.2.5. By Application

6. Europe Radiation Hardened Electronics Market

  • 6.1. Market Size & Forecast by Value, 2018-2028
    • 6.1.1. By Value (USD Billion)
  • 6.2. Market Share & Forecast
    • 6.2.1. By Product Type
    • 6.2.2. By Component
    • 6.2.3. By Manufacturing Technique
    • 6.2.4. By Material
    • 6.2.5. By Application
    • 6.2.6. By Country
      • 6.2.6.1. Germany
      • 6.2.6.1.1. By Product Type
      • 6.2.6.1.2. By Component
      • 6.2.6.1.3. By Manufacturing Technique
      • 6.2.6.1.4. By Material
      • 6.2.6.1.5. By Application
      • 6.2.6.2. UK
      • 6.2.6.2.1. By Product Type
      • 6.2.6.2.2. By Component
      • 6.2.6.2.3. By Manufacturing Technique
      • 6.2.6.2.4. By Material
      • 6.2.6.2.5. By Application
      • 6.2.6.2.6.
      • 6.2.6.3. Italy
      • 6.2.6.3.1. By Product Type
      • 6.2.6.3.2. By Component
      • 6.2.6.3.3. By Manufacturing Technique
      • 6.2.6.3.4. By Material
      • 6.2.6.3.5. By Application
      • 6.2.6.4. France
      • 6.2.6.4.1. By Product Type
      • 6.2.6.4.2. By Component
      • 6.2.6.4.3. By Manufacturing Technique
      • 6.2.6.4.4. By Material
      • 6.2.6.4.5. By Application
      • 6.2.6.5. Spain
      • 6.2.6.5.1. By Product Type
      • 6.2.6.5.2. By Component
      • 6.2.6.5.3. By Manufacturing Technique
      • 6.2.6.5.4. By Material
      • 6.2.6.5.5. By Application
      • 6.2.6.6. The Netherlands
      • 6.2.6.6.1. By Product Type
      • 6.2.6.6.2. By Component
      • 6.2.6.6.3. By Manufacturing Technique
      • 6.2.6.6.4. By Material
      • 6.2.6.6.5. By Application
      • 6.2.6.7. Belgium
      • 6.2.6.7.1. By Product Type
      • 6.2.6.7.2. By Component
      • 6.2.6.7.3. By Manufacturing Technique
      • 6.2.6.7.4. By Material
      • 6.2.6.7.5. By Application
      • 6.2.6.8. NORDIC Countries
      • 6.2.6.8.1. By Product Type
      • 6.2.6.8.2. By Component
      • 6.2.6.8.3. By Manufacturing Technique
      • 6.2.6.8.4. By Material
      • 6.2.6.8.5. By Application
      • 6.2.6.9. Rest of Europe
      • 6.2.6.9.1. By Product Type
      • 6.2.6.9.2. By Component
      • 6.2.6.9.3. By Manufacturing Technique
      • 6.2.6.9.4. By Material
      • 6.2.6.9.5. By Application
    • 6.2.7. Asia Pacific Radiation Hardened Electronics Market
  • 6.3. Market Size & Forecast by Value, 2018-2028
    • 6.3.1. By Value (USD Billion)
  • 6.4. Market Share & Forecast
    • 6.4.1. By Product Type
    • 6.4.2. By Component
    • 6.4.3. By Manufacturing Technique
    • 6.4.4. By Material
    • 6.4.5. By Application
    • 6.4.6. By Country
      • 6.4.6.1. China
      • 6.4.6.1.1. By Product Type
      • 6.4.6.1.2. By Component
      • 6.4.6.1.3. By Manufacturing Technique
      • 6.4.6.1.4. By Material
      • 6.4.6.1.5. By Application
      • 6.4.6.2. India
      • 6.4.6.2.1. By Product Type
      • 6.4.6.2.2. By Component
      • 6.4.6.2.3. By Manufacturing Technique
      • 6.4.6.2.4. By Material
      • 6.4.6.2.5. By Application
      • 6.4.6.2.6.
      • 6.4.6.3. Japan
      • 6.4.6.3.1. By Product Type
      • 6.4.6.3.2. By Component
      • 6.4.6.3.3. By Manufacturing Technique
      • 6.4.6.3.4. By Material
      • 6.4.6.3.5. By Application
      • 6.4.6.4. South Korea
      • 6.4.6.4.1. By Product Type
      • 6.4.6.4.2. By Component
      • 6.4.6.4.3. By Manufacturing Technique
      • 6.4.6.4.4. By Material
      • 6.4.6.4.5. By Application
      • 6.4.6.5. Australia & New Zealand
      • 6.4.6.5.1. By Product Type
      • 6.4.6.5.2. By Component
      • 6.4.6.5.3. By Manufacturing Technique
      • 6.4.6.5.4. By Material
      • 6.4.6.5.5. By Application
      • 6.4.6.6. Indonesia
      • 6.4.6.6.1. By Product Type
      • 6.4.6.6.2. By Component
      • 6.4.6.6.3. By Manufacturing Technique
      • 6.4.6.6.4. By Material
      • 6.4.6.6.5. By Application
      • 6.4.6.7. Malaysia
      • 6.4.6.7.1. By Product Type
      • 6.4.6.7.2. By Component
      • 6.4.6.7.3. By Manufacturing Technique
      • 6.4.6.7.4. By Material
      • 6.4.6.7.5. By Application
      • 6.4.6.8. Singapore
      • 6.4.6.8.1. By Product Type
      • 6.4.6.8.2. By Component
      • 6.4.6.8.3. By Manufacturing Technique
      • 6.4.6.8.4. By Material
      • 6.4.6.8.5. By Application
      • 6.4.6.9. Philippines
      • 6.4.6.9.1. By Product Type
      • 6.4.6.9.2. By Component
      • 6.4.6.9.3. By Manufacturing Technique
      • 6.4.6.9.4. By Material
      • 6.4.6.9.5. By Application
      • 6.4.6.10. Vietnam
      • 6.4.6.10.1. By Product Type
      • 6.4.6.10.2. By Component
      • 6.4.6.10.3. By Manufacturing Technique
      • 6.4.6.10.4. By Material
      • 6.4.6.10.5. By Application
      • 6.4.6.11. Rest of Asia Pacific
      • 6.4.6.11.1. By Product Type
      • 6.4.6.11.2. By Component
      • 6.4.6.11.3. By Manufacturing Technique
      • 6.4.6.11.4. By Material
      • 6.4.6.11.5. By Application

7. Latin America Radiation Hardened Electronics Market

  • 7.1. Market Size & Forecast by Value, 2018-2028
    • 7.1.1. By Value (USD Billion)
  • 7.2. Market Share & Forecast
    • 7.2.1. By Product Type
    • 7.2.2. By Component
    • 7.2.3. By Manufacturing Technique
    • 7.2.4. By Material
    • 7.2.5. By Application
    • 7.2.6. By Country
      • 7.2.6.1. Brazil
      • 7.2.6.1.1. By Product Type
      • 7.2.6.1.2. By Component
      • 7.2.6.1.3. By Manufacturing Technique
      • 7.2.6.1.4. By Material
      • 7.2.6.1.5. By Application
      • 7.2.6.2. Mexico
      • 7.2.6.2.1. By Product Type
      • 7.2.6.2.2. By Component
      • 7.2.6.2.3. By Manufacturing Technique
      • 7.2.6.2.4. By Material
      • 7.2.6.2.5. By Application
      • 7.2.6.3. Argentina
      • 7.2.6.3.1. By Product Type
      • 7.2.6.3.2. By Component
      • 7.2.6.3.3. By Manufacturing Technique
      • 7.2.6.3.4. By Material
      • 7.2.6.3.5. By Application
      • 7.2.6.3.6.
      • 7.2.6.4. Peru
      • 7.2.6.4.1. By Product Type
      • 7.2.6.4.2. By Component
      • 7.2.6.4.3. By Manufacturing Technique
      • 7.2.6.4.4. By Material
      • 7.2.6.4.5. By Application
      • 7.2.6.5. Colombia
      • 7.2.6.5.1. By Product Type
      • 7.2.6.5.2. By Component
      • 7.2.6.5.3. By Manufacturing Technique
      • 7.2.6.5.4. By Material
      • 7.2.6.5.5. By Application
      • 7.2.6.6. Rest of Latin America
      • 7.2.6.6.1. By Product Type
      • 7.2.6.6.2. By Component
      • 7.2.6.6.3. By Manufacturing Technique
      • 7.2.6.6.4. By Material
      • 7.2.6.6.5. By Application

8. Middle East & Africa Radiation Hardened Electronics Market

  • 8.1. Market Size & Forecast by Value, 2018-2028
    • 8.1.1. By Value (USD Billion)
  • 8.2. Market Share & Forecast
    • 8.2.1. By Product Type
    • 8.2.2. By Component
    • 8.2.3. By Manufacturing Technique
    • 8.2.4. By Material
    • 8.2.5. By Application
    • 8.2.6. By Country
      • 8.2.6.1. Saudi Arabia
      • 8.2.6.1.1. By Product Type
      • 8.2.6.1.2. By Component
      • 8.2.6.1.3. By Manufacturing Technique
      • 8.2.6.1.4. By Material
      • 8.2.6.1.5. By Application
      • 8.2.6.2. UAE
      • 8.2.6.2.1. By Product Type
      • 8.2.6.2.2. By Component
      • 8.2.6.2.3. By Manufacturing Technique
      • 8.2.6.2.4. By Material
      • 8.2.6.2.5. By Application
      • 8.2.6.3. Qatar
      • 8.2.6.3.1. By Product Type
      • 8.2.6.3.2. By Component
      • 8.2.6.3.3. By Manufacturing Technique
      • 8.2.6.3.4. By Material
      • 8.2.6.3.5. By Application
      • 8.2.6.4. Kuwait
      • 8.2.6.4.1. By Product Type
      • 8.2.6.4.2. By Component
      • 8.2.6.4.3. By Manufacturing Technique
      • 8.2.6.4.4. By Material
      • 8.2.6.4.5. By Application
      • 8.2.6.4.6.
      • 8.2.6.5. Iran
      • 8.2.6.5.1. By Product Type
      • 8.2.6.5.2. By Component
      • 8.2.6.5.3. By Manufacturing Technique
      • 8.2.6.5.4. By Material
      • 8.2.6.5.5. By Application
      • 8.2.6.6. South Africa
      • 8.2.6.6.1. By Product Type
      • 8.2.6.6.2. By Component
      • 8.2.6.6.3. By Manufacturing Technique
      • 8.2.6.6.4. By Material
      • 8.2.6.6.5. By Application
      • 8.2.6.6.6.
      • 8.2.6.7. Nigeria
      • 8.2.6.7.1. By Product Type
      • 8.2.6.7.2. By Component
      • 8.2.6.7.3. By Manufacturing Technique
      • 8.2.6.7.4. By Material
      • 8.2.6.7.5. By Application
      • 8.2.6.7.6.
      • 8.2.6.8. Kenya
      • 8.2.6.8.1. By Product Type
      • 8.2.6.8.2. By Component
      • 8.2.6.8.3. By Manufacturing Technique
      • 8.2.6.8.4. By Material
      • 8.2.6.8.5. By Application
      • 8.2.6.9. Egypt
      • 8.2.6.9.1. By Product Type
      • 8.2.6.9.2. By Component
      • 8.2.6.9.3. By Manufacturing Technique
      • 8.2.6.9.4. By Material
      • 8.2.6.9.5. By Application
      • 8.2.6.10. Morocco
      • 8.2.6.10.1. By Product Type
      • 8.2.6.10.2. By Component
      • 8.2.6.10.3. By Manufacturing Technique
      • 8.2.6.10.4. By Material
      • 8.2.6.10.5. By Application
      • 8.2.6.11. Algeria
      • 8.2.6.11.1. By Product Type
      • 8.2.6.11.2. By Component
      • 8.2.6.11.3. By Manufacturing Technique
      • 8.2.6.11.4. By Material
      • 8.2.6.11.5. By Application
      • 8.2.6.12. Rest of Middle East & Africa
      • 8.2.6.12.1. By Product Type
      • 8.2.6.12.2. By Component
      • 8.2.6.12.3. By Manufacturing Technique
      • 8.2.6.12.4. By Material
      • 8.2.6.12.5. By Application

9. Competitive Landscape

  • 9.1. List of Key Players and Their Offerings
  • 9.2. Global Radiation Hardened Electronics Company Market Share Analysis, 2021
  • 9.3. Competitive Benchmarking, By Operating Parameters
  • 9.4. Key Strategic Developments (Mergers, Acquisitions, Partnerships, etc.)

10. Impact of Covid-19 on Global Radiation Hardened Electronics Market

11. Company Profile (Company Overview, Financial Matrix, Competitive Landscape, Key Personnel, Key Competitors, Contact Address, SWOT, and Strategic Outlook)

  • 11.1. Microchip Technology Inc.
  • 11.2. BAE Systems
  • 11.3. Renesas Electronics Corporation
  • 11.4. Infineon Technologies AG
  • 11.5. STMicroelectronics
  • 11.6. Xilinx, Inc.
  • 11.7. Texas Instruments Incorporated
  • 11.8. Honeywell International Inc.
  • 11.9. Teledyne Technologies Inc.
  • 11.10. TTM Technologies, Inc.
  • 11.11. Cobham Limited
  • 11.12. Analog Devices, Inc
  • 11.13. Data Devices Corporation
  • 11.14. 3D Plus (France), Mercury Systems, Inc.
  • 11.15. PCB Piezotronics, Inc
  • 11.16. Vorago (US), Micropac Industries, Inc
  • 11.17. GSI technology, Inc
  • 11.18. Everspin Technologies Inc
  • 11.19. Semiconductor Components Industries, LLC
  • 11.20. Other Prominent Players

12. Key Strategic Recommendations

13. Research Methodology

  • 13.1. Qualitative Research
    • 13.1.1. Primary & Secondary Research
  • 13.2. Quantitative Research
  • 13.3. Market Breakdown & Data Triangulation
    • 13.3.1. Secondary Research
    • 13.3.2. Primary Research
  • 13.4. Breakdown of Primary Research Respondents, By Region
  • 13.5. Assumptions & Limitations