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全球碳化矽晶圓拋光市場（~2028）：按產品類型（拋光粉、拋光墊、鑽石研磨液、膠體二氧化矽懸浮液）、用途、工藝和地區
市場調查報告書
商品編碼
1333999

全球碳化矽晶圓拋光市場（~2028）：按產品類型（拋光粉、拋光墊、鑽石研磨液、膠體二氧化矽懸浮液）、用途、工藝和地區

SiC Wafer Polishing Market by Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions), application, Process, & Region (North America, Europe, APAC, South America, MEA) - Global Forecast 2028
出版日期: | 出版商: MarketsandMarkets | 英文 169 Pages | 訂單完成後即時交付

價格
簡介目錄

SiC晶圓拋光的市場規模預計將從2023年的4億美元成長到2028年的22億美元，預測期內年複合成長率為37.5%。

電力電子、汽車、航太和通訊領域對碳化矽晶圓的需求不斷成長，推動了市場的推進因素。 SiC 晶圓具有高導熱性和寬能隙等優異特性，對於需要更高效率和性能的先進裝置非常重要。此外，再生能源系統和電動車中擴大採用碳化矽基裝置也刺激了對高品質拋光晶圓的需求。

按產品類型分類，鑽石研磨液 SiC 晶圓拋光離心機細分市場預測在預測期內成長最快。金剛石顆粒的硬度和鋒利度可以非常有效地應對 SiC 晶圓的課題，實現精確的材料去除和出色的表面光滑度。隨著對碳化矽電力電子、光電子和高頻裝置的需求持續激增，製造商尋找先進、可靠的拋光解決方案。鑽石研磨液產品透過提供卓越的材料去除率控制和卓越的平坦化來滿足這些需求，提高裝置性能和產量。

按過程分類，化學機械拋光 (CMP) 領域預計將在預測期內實現最高成長。 CMP 結合了化學反應和機械磨損，提供高性能半導體裝置所需的卓越平坦化和表面光滑度。此外，由於它兼容多種SiC基板，並且可以容納更大的晶圓尺寸，因此可以滿足半導體行業先進用途的需求。此外，CMP 能夠有效去除 SiC 晶圓上的划痕和雜質，使其成為製造可靠、高品質裝置的首選方法。

從地區來看，預測亞太地區在預測期內的年複合成長率最高。中國、日本、韓國和台灣等國家在全球半導體製造中發揮著重要作用，是電子和半導體行業的主要中心，使其成為SiC晶圓拋光的主要市場之一。對電力電子、射頻零件和 LED 等 SiC 基裝置的需求不斷成長，推動了對高品質拋光 SiC 晶圓的需求，並推動了拋光市場的擴張。

本報告調查了全球SiC晶圓拋光市場，並提供了市場概況、市場影響因素和市場機會分析、技術和專利趨勢、案例研究、相關法律、市場規模趨勢和預測以及各種分類和總結詳細按地區/主要國家、競爭環境、主要企業概況等進行分析

目錄

第1章 簡介

第2章 調查方法

第3章 執行摘要

第4章 重要考察

第5章 市場概況

  • 市場動態
    • 促進因素
    • 抑制因素
    • 機會
    • 課題
  • 波特五力分析

第6章 行業趨勢

  • 景氣衰退的影響
  • 價值鏈分析
  • 宏觀經濟指標
  • 法律法規
  • 貿易分析
  • 專利分析
  • 影響客戶業務的趨勢/干擾
  • 生態系統/市場地圖
  • 技術分析
  • 主要利益相關者和採購標準

第7章 SiC 晶圓拋光市場：副產品

  • 拋光粉
  • 拋光墊
  • 鑽石研磨液
  • 膠體二氧化矽懸浮液
  • 其他

第8章 SiC 晶圓拋光市場：按過程分類

  • 機械拋光
  • 化學機械拋光（CMP）
  • 電解拋光
  • 化學拋光
  • 等離子輔助拋光
  • 其他

第9章 SiC 晶圓拋光市場：按用途

  • 電力電子
  • 發光二極體（LED）
  • 感測器/檢測器
  • 射頻/微波設備
  • 其他

第10章 碳化矽晶圓拋光市場：按地區分類

  • 歐洲
  • 亞太地區
  • 北美
  • 其他地區

第11章 競爭形勢

  • 主要企業的招聘策略
  • 市場佔有率分析
  • 公司產品足跡分析
  • 企業估值象限
  • 競爭標杆管理
  • 初創企業/小型企業評估象限
  • 競爭格局及趨勢

第12章 公司簡介

  • 主要企業
    • ENTEGRIS
    • SAINT-GOBAIN
    • KEMET INTERNATIONAL LIMITED
    • ILJIN DIAMOND CO., LTD.
    • DUPONT INCORPORATED
    • FUJIBO HOLDINGS, INC.
    • FUJIFILM HOLDINGS AMERICA CORPORATION
    • ENGIS CORPORATION
    • SKC
    • FERRO CORPORATION
    • 3M
    • JSR CORPORATION
  • 其他公司
    • PUREON
    • LAPMASTER WOLTERS
    • LOGITECH LTD.
    • ADVANCED ABRASIVES CORPORATION
    • ALLIED HIGH TECH PRODUCTS
    • ACE NANOCHEM CO., LTD.
    • SHANGHAI XINANNA ELECTRONIC TECHNOLOGY CO., LTD
    • AGC INC.
    • FUJIMI INCORPORATED
    • LAM PLAN SAS
    • NITTA DUPONT INCORPORATED

第13章 附錄

簡介目錄
Product Code: CH 8753

The Sic wafer polishing market is projected to grow from USD 0.4 billion in 2023 to USD 2.2 billion by 2028, at a CAGR of 37.5% from 2023 to 2028. Considering these factors, the increasing demand for SiC wafers in the power electronics, automotive, aerospace, and telecommunications sectors is driving the market expansion. SiC wafers offer exceptional properties like high thermal conductivity and wide bandgap, making them essential for advanced devices that require higher efficiency and performance. Additionally, the growing adoption of SiC-based devices in renewable energy systems and electric vehicles is fueling the demand for high-quality polished wafers.

"By product type, the diamond slurry sic wafer polishing centrifuges segment is estimated to be the fastest-growing segment of the Sic wafer polishing market from 2023 to 2028."

Based on the product type, the Sic wafer polishing market made of diamond slurry sic wafer polishing centrifuge is regarded as one of the greatest product types. The inherent hardness and sharpness of diamond particles make them highly effective in tackling the challenges presented by SiC wafers, resulting in precise material removal and exceptional surface smoothness. As demand for SiC-based power electronics, optoelectronics, and high-frequency devices continues to surge, manufacturers seek advanced and reliable polishing solutions. Diamond slurry products meet these requirements, offering excellent control over material removal rates and superior planarization, leading to enhanced device performance and yield.

"By process, Chemical mechanical polishing process estimated to be the fastest-growing segment of Sic wafer polishing market from 2023 to 2028."

Based on application, the chemical mechanical polishing (CMP) segment is expected to be the most significant in the sic wafer polishing market during the forecast period due to Its unique capacity to give a highly controlled and exact polishing procedure. CMP combines chemical reactions and mechanical abrasion to provide superior planarization and surface smoothness on SiC wafers, both of which are required for high-performance semiconductor devices. Its success is also due to its compatibility with diverse SiC substrate types and its ability to handle larger wafer sizes, answering the semiconductor industry's aspirations for advanced applications. Furthermore, the efficacy of CMP in eliminating flaws and impurities from SiC wafers makes it a preferred method for producing reliable and high-quality devices.

"The Sic wafer polishing market in Asia Pacific region is projected to witness the highest CAGR during the forecast period."

The Asia Pacific region is projected to register the highest CAGR in the Sic wafer polishing market from 2023 to 2028. Asia Pacific is one of the key markets of sic wafer polishing considering these factors, as the region is a major hub for the electronics and semiconductor industries, with countries like China, Japan, South Korea, and Taiwan playing significant roles in global semiconductor production. The growing demand for SiC-based devices, such as power electronics, RF components, and LEDs, is driving the need for high-quality polished SiC wafers, fostering the expansion of the polishing market.

Profile break-up of primary participants for the report:

  • By Company Type: Tier 1 - 35%, Tier 2 - 45%, and Tier 3 - 20%
  • By Designation: C-level Executives - 35%, Directors - 25%, and Others - 40%
  • By Region: North America - 40%, Europe -20%, Asia Pacific - 30% Middle East & Africa-5%, and South America-5%

The Sic wafer polishing market report is dominated by players such as Kemet International (UK), Entegris (US), Iljin Diamond (US), Fujimi Corporation (Japan), Saint-Gobain (US), JSR Corporation (Japan), Engis Corporation (US), Ferro Corporation (US), 3M (US), SKC (South Korea), DuPont Incorporated (US), Fujifilm Holding America Corporation (US), and others.

Research Coverage:

The report defines, segments, and projects the size of the sic wafer polishing based on type, design type, application, and region. It strategically profiles the key players and comprehensively analyzes their market share and core competencies. It also tracks and analyzes competitive developments, such as new product launches, agreements, contracts, partnerships, and acquisitions undertaken by them in the market.

Reasons to Buy the Report:

The report is expected to help the market leaders/new entrants in the market by providing them with the closest approximations of revenue numbers of the sic wafer polishing and their segments. This report is also expected to help stakeholders obtain an improved understanding of the competitive landscape of the market, gain insights to improve the position of their businesses and make suitable go-to-market strategies. It also enables stakeholders to understand the pulse of the market and provides them with information on key market drivers, restraints, challenges, and opportunities.

The report provides insights on the following pointers:

Analysis of key drivers (Growing Consumption of Consumer Electronics, Growing demand for SIC-based power devices, Development of advanced polishing consumables, Adoption of SiC wafers in radio frequency (RF) devices.), restraints (Surface defects and contamination, Long polishing cycle times, Limited supplier base.), opportunities (Growing investments in SiC research and development, Emergence of new applications, Advancements in polishing technologies), and challenges (Complexity Regarding Manufacturing, Intense competition and market consolidation) influencing the growth of the sic wafer polishing market.

  • Product Development/Innovation: Detailed insights on upcoming technologies, research &

development activities in the sic wafer polishing.

  • Market Development: Comprehensive information about sic wafer polishing - the report analyses

the sic wafer polishing across varied regions.

  • Market Diversification: Exhaustive information about new products & services, untapped

geographies, recent developments, and investments in the sic wafer polishing market.

  • Competitive Assessment: In-depth assessment of market shares, growth strategies, and service

offerings of leading players like Kemet International (UK), Entegris (US), Iljin Diamond (US), Fujimi Corporation (Japan), and Saint-Gobain (US). among others in the sic wafer polishing market.

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 STUDY OBJECTIVES
  • 1.2 MARKET DEFINITION
  • 1.3 INCLUSIONS & EXCLUSIONS
  • 1.4 MARKET SCOPE
    • 1.4.1 MARKETS COVERED
    • 1.4.2 REGIONAL SCOPE
    • 1.4.3 YEARS CONSIDERED
  • 1.5 CURRENCY CONSIDERED
  • 1.6 LIMITATIONS
  • 1.7 STAKEHOLDERS

2 RESEARCH METHODOLOGY

  • 2.1 RESEARCH DATA
    • FIGURE 1 SIC WAFER POLISHING MARKET: RESEARCH DESIGN
    • 2.1.1 SECONDARY DATA
      • 2.1.1.1 Key data from secondary sources
    • 2.1.2 PRIMARY DATA
      • 2.1.2.1 Key data from primary sources
    • FIGURE 2 KEY INDUSTRY INSIGHTS
      • 2.1.2.2 Breakdown of primary interviews
    • FIGURE 3 BREAKDOWN OF PRIMARY INTERVIEWS: BY COMPANY TYPE, DESIGNATION, AND REGION
  • 2.2 DATA TRIANGULATION
    • FIGURE 4 DATA TRIANGULATION
  • 2.3 MARKET SIZE ESTIMATION
    • 2.3.1 BOTTOM-UP APPROACH
    • FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
    • 2.3.2 TOP-DOWN APPROACH
    • FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
    • 2.3.3 DEMAND SIDE
    • FIGURE 7 DEMAND-SIDE ANALYSIS
    • FIGURE 8 METRICS CONSIDERED FOR ANALYZING AND ASSESSING DEMAND FOR SIC WAFER POLISHING
      • 2.3.3.1 Research assumptions
    • 2.3.4 FORECAST

3 EXECUTIVE SUMMARY

    • TABLE 1 SIC WAFER POLISHING MARKET: SNAPSHOT
    • FIGURE 9 DIAMOND SLURRIES SEGMENT TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD
    • FIGURE 10 POWER ELECTRONICS SEGMENT TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD
    • FIGURE 11 CHEMICAL MECHANICAL POLISHING (CMP) PROCESS TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD
    • FIGURE 12 ASIA PACIFIC TO LEAD SIC WAFER POLISHING MARKET IN 2023

4 PREMIUM INSIGHTS

  • 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SIC WAFER POLISHING MARKET
    • FIGURE 13 INCREASING AWARENESS OF SUSTAINABLE TECHNOLOGY DRIVING MARKET DURING FORECAST PERIOD
  • 4.2 SIC WAFER POLISHING MARKET: ASIA PACIFIC, BY APPLICATION AND COUNTRY
    • FIGURE 14 CHEMICAL AND CHINA ACCOUNTED FOR SIGNIFICANT SHARE IN 2022
  • 4.3 SIC WAFER POLISHING MARKET, BY PRODUCT
    • FIGURE 15 DIAMOND SLURRIES SEGMENT TO ACCOUNT FOR LARGEST SHARE BY 2028
  • 4.4 SIC WAFER POLISHING MARKET, BY APPLICATION
    • FIGURE 16 POWER ELECTRONICS SEGMENT TO ACCOUNT FOR LARGEST SHARE IN 2028
  • 4.5 SIC WAFER POLISHING MARKET, BY PROCESS
    • FIGURE 17 CHEMICAL MECHANICAL POLISHING SEGMENT TO ACCOUNT FOR LARGEST SHARE IN 2028
  • 4.6 SIC WAFER POLISHING MARKET: REGIONAL ANALYSIS
    • FIGURE 18 ASIA PACIFIC TO ACCOUNT FOR LARGEST SHARE OF SIC WAFER POLISHING MARKET IN 2023

5 MARKET OVERVIEW

  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    • FIGURE 19 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES IN SIC WAFER POLISHING MARKET
    • 5.2.1 DRIVERS
      • 5.2.1.1 Growing consumption of consumer electronics
      • 5.2.1.2 Growing demand for SiC-based power devices
      • 5.2.1.3 Development of advanced polishing consumable
      • 5.2.1.4 Adoption of SiC wafers in radio frequency (RF) devices
    • 5.2.2 RESTRAINTS
      • 5.2.2.1 Surface defects and contamination
      • 5.2.2.2 Long polishing cycle times
      • 5.2.2.3 Limited supplier base
    • 5.2.3 OPPORTUNITIES
      • 5.2.3.1 Growing investments in SiC R&D
      • 5.2.3.2 Emergence of new applications
      • 5.2.3.3 Advancements in polishing technologies
    • 5.2.4 CHALLENGES
      • 5.2.4.1 Complexity regarding manufacturing
      • 5.2.4.2 Intense competition and market consolidation
  • 5.3 PORTER'S FIVE FORCES ANALYSIS
    • TABLE 2 SIC WAFER POLISHING MARKET: PORTER'S FIVE FORCES ANALYSIS
    • FIGURE 20 PORTER'S FIVE FORCES ANALYSIS: SIC WAFER POLISHING MARKET
    • 5.3.1 THREAT OF NEW ENTRANTS
    • 5.3.2 THREATS OF SUBSTITUTES
    • 5.3.3 BARGAINING POWER OF SUPPLIERS
    • 5.3.4 BARGAINING POWER OF BUYERS
    • 5.3.5 INTENSITY OF COMPETITIVE RIVALRY

6 INDUSTRY TRENDS

  • 6.1 RECESSION IMPACT
  • 6.2 VALUE CHAIN ANALYSIS
    • FIGURE 21 VALUE CHAIN FOR SIC WAFER POLISHING MARKET
    • 6.2.1 RAW MATERIAL SUPPLIERS
    • 6.2.2 MANUFACTURERS
    • 6.2.3 DISTRIBUTORS
    • 6.2.4 END USER
  • 6.3 MACROECONOMIC INDICATORS
    • 6.3.1 GDP TRENDS AND FORECASTS OF MAJOR ECONOMIES
    • TABLE 3 GDP TRENDS AND FORECASTS, BY KEY COUNTRY, 2019-2027 (USD MILLION)
  • 6.4 SIC WAFER POLISHING MARKET REGULATIONS
    • 6.4.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 4 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 5 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 6 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • 6.5 TRADE ANALYSIS
    • 6.5.1 EXPORT SCENARIO
    • FIGURE 22 EXPORT SCENARIO FOR HS CODE 381800, BY KEY COUNTRY (2019-2022)
    • 6.5.2 IMPORT SCENARIO
    • FIGURE 23 IMPORT SCENARIO FOR HS CODE 381800, BY KEY COUNTRY, (2019-2022)
  • 6.6 PATENT ANALYSIS
    • 6.6.1 INTRODUCTION
    • 6.6.2 METHODOLOGY
      • 6.6.2.1 Document type
    • TABLE 7 GRANTED PATENTS ACCOUNTED FOR 35% OF TOTAL PATENTS IN LAST 10 YEARS
    • FIGURE 24 PUBLICATION TRENDS OVER LAST TEN YEARS
    • 6.6.3 INSIGHTS
    • 6.6.4 LEGAL STATUS OF PATENTS
    • FIGURE 25 LEGAL STATUS OF PATENTS FIELD FOR SIC WAFER POLISHING MARKET
    • 6.6.5 JURISDICTION ANALYSIS
    • FIGURE 26 TOP JURISDICTION-BY DOCUMENT
    • 6.6.6 ANALYSIS OF TOP APPLICANTS
    • FIGURE 27 TAIWAN SEMICONDUCTOR MFG CO LTD REGISTERED HIGHEST NUMBER OF PATIENTS BETWEEN 2017 AND 2022
  • 6.7 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS' BUSINESSES
    • 6.7.1 REVENUE SHIFTS & NEW REVENUE POCKETS FOR SIC WAFER POLISHING MARKET
    • FIGURE 28 REVENUE SHIFT OF SIC WAFER POLISHING PROVIDERS
  • 6.8 ECOSYSTEM/MARKETMAP
    • TABLE 8 GDP TRENDS AND FORECASTS, BY KEY COUNTRY, 2019-2027
    • FIGURE 29 SIC WAFER POLISHING MARKET: ECOSYSTEM
  • 6.9 TECHNOLOGY ANALYSIS
    • 6.9.1 CHEMICAL MECHANICAL PLANARIZATION (CMP) TECHNOLOGY
    • TABLE 9 ADVANTAGES OF CHEMICAL MECHANICAL PLANARIZATION (CMP) TECHNOLOGY
    • 6.9.2 FIXED ABRASIVE POLISHING (FAP)
    • TABLE 10 ADVANTAGES OF FIXED ABRASIVE POLISHING (FAP) TECHNOLOGY
  • 6.10 KEY STAKEHOLDERS AND BUYING CRITERIA
    • 6.10.1 KEY STAKEHOLDERS IN BUYING PROCESS
    • FIGURE 30 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 4 APPLICATIONS
    • TABLE 11 INFLUENCE OF INSTITUTIONAL BUYERS ON BUYING PROCESS FOR TOP 4 APPLICATIONS
    • 6.10.2 BUYING CRITERIA
    • FIGURE 31 KEY BUYING CRITERIA FOR END-USER INDUSTRIES
    • TABLE 12 KEY BUYING CRITERIA FOR END-USER INDUSTRIES

7 SIC WAFER POLISHING MARKET, BY PRODUCT

  • 7.1 INTRODUCTION
    • FIGURE 32 SIC WAFER POLISHING MARKET, BY PRODUCT, 2022
    • TABLE 13 SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 14 SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
  • 7.2 ABRASIVE POWDER
    • 7.2.1 COMPATIBILITY WITH DIFFERENT POLISHING SYSTEMS AND EQUIPMENT TO DRIVE MARKET
  • 7.3 POLISHING PADS
    • 7.3.1 HIGHLY VERSATILE NATURE TO INCREASE USAGE
  • 7.4 DIAMOND SLURRIES
    • 7.4.1 INCREASING DEMAND FOR HIGH-PERFORMANCE SIC-BASED DEVICES TO DRIVE MARKET
  • 7.5 COLLOIDAL SILICA SUSPENSIONS
    • 7.5.1 COST-EFFECTIVENESS IN SIC WAFER POLISHING PROCESSES TO DRIVE MARKET
  • 7.6 OTHERS
    • 7.6.1 ABRASIVE SLURRIES

8 SIC WAFER POLISHING MARKET, BY PROCESS

  • 8.1 INTRODUCTION
    • FIGURE 33 SIC WAFER POLISHING MARKET, BY PROCESS, 2022
    • TABLE 15 SIC WAFER POLISHING MARKET, BY PROCESS, 2020-2022 (USD MILLION)
    • TABLE 16 SIC WAFER POLISHING MARKET SIZE, BY PROCESS, 2023-2028 (USD MILLION)
  • 8.2 MECHANICAL POLISHING
    • 8.2.1 VERSATILE PROCESS FOR POLISHING COMPLEX SIC WAFERS TO DRIVE MARKET
  • 8.3 CHEMICAL-MECHANICAL POLISHING (CMP)
    • 8.3.1 HIGH DEMAND FOR POLISHING SEMICONDUCTOR DEVICES TO DRIVE MARKET
  • 8.4 ELECTROPOLISHING
    • 8.4.1 CUTTING-EDGE ELECTROPOLISHING ADVANCES TO INCREASE DEMAND
  • 8.5 CHEMICAL POLISHING
    • 8.5.1 RISING DEMAND FOR HIGH-THROUGHPUT SIC POLISHING TO DRIVE MARKET
  • 8.6 PLASMA-ASSISTED POLISHING
    • 8.6.1 HIGHLY EFFICIENT AND EFFECTIVE PROCESS TO DRIVE MARKET
  • 8.7 OTHERS
    • 8.7.1 REACTIVE ION ETCHING (RIE)

9 SIC WAFER POLISHING MARKET, BY APPLICATION

  • 9.1 INTRODUCTION
    • FIGURE 34 SIC WAFER POLISHING MARKET, BY APPLICATION, 2023
    • TABLE 17 SIC WAFER POLISHING MARKET, BY APPLICATION, 2020-2022 (USD MILLION)
    • TABLE 18 SIC WAFER POLISHING MARKET, BY APPLICATION, 2023-2028 (USD MILLION)
  • 9.2 POWER ELECTRONICS
    • 9.2.1 ADVANCED POLISHING TECHNIQUES TO DRIVE MARKET
  • 9.3 LIGHT-EMITTING DIODES (LEDS)
    • 9.3.1 STABLE ILLUMINATION AND INCREASING PRODUCTIVITY TO DRIVE MARKET
  • 9.4 SENSORS AND DETECTORS
    • 9.4.1 SIC POLISHING EMPOWERING GROWTH WITH ADVANCED SENSORS AND DETECTORS TO DRIVE MARKET
  • 9.5 RF AND MICROWAVE DEVICES
    • 9.5.1 ELECTRICAL AND THERMAL PERFORMANCE TO DRIVE MARKET
  • 9.6 OTHERS
    • 9.6.1 SEMICONDUCTOR DEVICES

10 SIC WAFER POLISHING MARKET, BY REGION

  • 10.1 INTRODUCTION
    • FIGURE 35 ASIA PACIFIC TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD
    • TABLE 19 SIC WAFER POLISHING MARKET, BY REGION, 2020-2022 (USD MILLION)
    • TABLE 20 SIC WAFER POLISHING MARKET, BY REGION, 2023-2028 (USD MILLION)
    • TABLE 21 SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 22 SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • TABLE 23 SIC WAFER POLISHING MARKET, BY PROCESS, 2020-2022 (USD MILLION)
    • TABLE 24 SIC WAFER POLISHING MARKET, BY PROCESS, 2023-2028 (USD MILLION)
    • TABLE 25 SIC WAFER POLISHING MARKET, BY APPLICATION, 2020-2022 (USD MILLION)
    • TABLE 26 SIC WAFER POLISHING MARKET, BY APPLICATION, 2023-2028 (USD MILLION)
  • 10.2 EUROPE
    • 10.2.1 RECESSION IMPACT
    • FIGURE 36 EUROPE: SIC WAFER POLISHING MARKET SNAPSHOT
    • TABLE 27 EUROPE: SIC WAFER POLISHING MARKET, BY COUNTRY, 2020-2022 (USD MILLION)
    • TABLE 28 EUROPE: SIC WAFER POLISHING MARKET, BY COUNTRY, 2023-2028 (USD MILLION)
    • TABLE 29 EUROPE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 30 EUROPE: SIC WAFER POLISHING, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.2.2 GERMANY
      • 10.2.2.1 Increasing availability of SiC wafers to drive market
    • TABLE 31 GERMANY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 32 GERMANY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.2.3 ITALY
      • 10.2.3.1 Government initiatives promoting adoption of renewable energy to drive market
    • TABLE 33 ITALY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 34 ITALY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.2.4 FRANCE
      • 10.2.4.1 Growing demand for high-performance electronic devices to drive market
    • TABLE 35 FRANCE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 36 FRANCE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.2.5 SWEDEN
      • 10.2.5.1 Growing importance of cybersecurity for semiconductors to increase market
    • TABLE 37 SWEDEN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 38 SWEDEN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.2.6 REST OF EUROPE
    • TABLE 39 REST OF EUROPE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 40 REST OF EUROPE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
  • 10.3 ASIA PACIFIC
    • 10.3.1 RECESSION IMPACT
    • FIGURE 37 ASIA PACIFIC: SIC WAFER POLISHING MARKET SNAPSHOT
    • TABLE 41 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY COUNTRY, 2020-2022 (USD MILLION)
    • TABLE 42 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY COUNTRY, 2023-2028 (USD MILLION)
    • TABLE 43 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 44 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.3.2 CHINA
      • 10.3.2.1 Increasing demand for SiC wafers in power electronics applications to drive market
    • TABLE 45 CHINA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 46 CHINA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.3.3 JAPAN
      • 10.3.3.1 Growing importance as semiconductors market to drive growth
    • TABLE 47 JAPAN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 48 JAPAN: SIC WAFER POLISHING MARKET, BY PRODUCT 2023-2028 (USD MILLION)
    • 10.3.4 SOUTH KOREA
      • 10.3.4.1 Development of new polishing technologies to drive market
    • TABLE 49 SOUTH KOREA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 50 SOUTH KOREA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.3.5 TAIWAN
      • 10.3.5.1 Efforts to reduce carbon emissions to drive market
    • TABLE 51 TAIWAN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 52 TAIWAN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.3.6 REST OF ASIA PACIFIC
    • TABLE 53 REST OF ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 54 REST OF ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
  • 10.4 NORTH AMERICA
    • 10.4.1 RECESSION IMPACT
    • FIGURE 38 NORTH AMERICA: SIC WAFER POLISHING MARKET SNAPSHOT
    • TABLE 55 NORTH AMERICA: SIC WAFER POLISHING MARKET, BY COUNTRY, 2020-2022 (USD MILLION)
    • TABLE 56 NORTH AMERICA: SIC WAFER POLISHING MARKE, BY COUNTRY, 2023-2028 (USD MILLION)
    • TABLE 57 NORTH AMERICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 58 NORTH AMERICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.4.2 US
      • 10.4.2.1 Rising adoption of SiC-based power devices in renewable energy to hamper market
    • TABLE 59 US: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 60 US: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.4.3 CANADA
      • 10.4.3.1 Growing research activities to drive market
    • TABLE 61 CANADA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 62 CANADA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.4.4 MEXICO
      • 10.4.4.1 Growing telecommunication industry to increase demand
    • TABLE 63 MEXICO: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 64 MEXICO: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
  • 10.5 REST OF WORLD (ROW)
    • TABLE 65 REST OF WORLD: SIC WAFER POLISHING MARKET SIZE, BY COUNTRY, 2020-2022 (USD MILLION)
    • TABLE 66 REST OF WORLD: SIC WAFER POLISHING MARKET, BY COUNTRY, 2023-2028 (USD MILLION)
    • TABLE 67 REST OF WORLD: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 68 REST OF WORLD: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.5.1 BRAZIL
      • 10.5.1.1 Favorable government policies to drive market
    • TABLE 69 BRAZIL: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 70 BRAZIL: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.5.2 SOUTH AFRICA
      • 10.5.2.1 Expanding SiC wafer manufacturing base to drive demand
    • TABLE 71 SOUTH AFRICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 72 SOUTH AFRICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.5.3 REST OF ROW
    • TABLE 73 REST OF ROW: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 74 REST OF ROW: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)

11 COMPETITIVE LANDSCAPE

  • 11.1 INTRODUCTION
  • 11.2 STRATEGIES ADOPTED BY KEY PLAYERS
    • TABLE 75 OVERVIEW OF STRATEGIES ADOPTED BY KEY SIC WAFER POLISHING MARKET
  • 11.3 MARKET SHARE ANALYSIS
    • 11.3.1 RANKING OF KEY MARKET PLAYERS, 2022
    • FIGURE 39 RANKING OF TOP FIVE PLAYERS IN SIC WAFER POLISHING MARKET, 2022
    • 11.3.2 MARKET SHARE OF KEY PLAYERS
    • TABLE 76 SIC WAFER POLISHINGS: DEGREE OF COMPETITION
    • FIGURE 40 SIC WAFER POLISHING MARKET IN 2022
      • 11.3.2.1 Kemet International Limited
      • 11.3.2.2 Entegris
      • 11.3.2.3 Fujimi Incorporated
      • 11.3.2.4 Ferro Corporation
      • 11.3.2.5 Iljin Diamond
  • 11.4 COMPANY PRODUCT FOOTPRINT ANALYSIS
    • TABLE 77 SIC WAFER POLISHING MARKET: KEY COMPANY PROCESS FOOTPRINT
    • TABLE 78 SIC WAFER POLISHING MARKET: KEY COMPANY PRODUCT FOOTPRINT
    • TABLE 79 SIC WAFER POLISHING MARKET: KEY COMPANY APPLICATION FOOTPRINT
    • TABLE 80 SIC WAFER POLISHING MARKET: KEY COMPANY REGION FOOTPRINT
  • 11.5 COMPANY EVALUATION QUADRANT (TIER 1)
    • 11.5.1 STARS
    • 11.5.2 EMERGING LEADERS
    • 11.5.3 PERVASIVE PLAYERS
    • 11.5.4 PARTICIPANTS
    • FIGURE 41 SIC WAFER POLISHING MARKET COMPANY EVALUATION MATRIX, 2022 (TIER 1)
  • 11.6 COMPETITIVE BENCHMARKING
    • TABLE 81 SIC WAFER POLISHING MARKET: DETAILED LIST OF KEY STARTUPS/SMES
    • TABLE 82 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS PROCESS FOOTPRINT
    • TABLE 83 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS PRODUCT FOOTPRINT
    • TABLE 84 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS APPLICATION FOOTPRINT
    • TABLE 85 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS REGION FOOTPRINT
  • 11.7 STARTUP/SME EVALUATION QUADRANT
    • 11.7.1 RESPONSIVE COMPANIES
    • 11.7.2 STARTING BLOCKS
    • 11.7.3 PROGRESSIVE COMPANIES
    • 11.7.4 DYNAMIC COMPANIES
    • FIGURE 42 SIC WAFER POLISHING MARKET STARTUPS/SMES COMPANY EVALUATION MATRIX, 2022
  • 11.8 COMPETITIVE SCENARIOS AND TRENDS
    • 11.8.1 DEALS
    • TABLE 86 SIC WAFER POLISHING MARKET: DEALS (2020-2023)
    • 11.8.2 OTHERS
    • TABLE 87 SIC WAFER POLISHING MARKET: OTHERS (2021-2023)

12 COMPANY PROFILES

  • (Business overview, Products/Services/Solutions offered, Recent developments & MnM View)**
  • 12.1 KEY PLAYERS
    • 12.1.1 ENTEGRIS
    • TABLE 88 ENTEGRIS: COMPANY OVERVIEW
    • FIGURE 43 ENTEGRIS: COMPANY SNAPSHOT
    • TABLE 89 ENTEGRIS: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • TABLE 90 ENTEGRIS: DEALS
    • 12.1.2 SAINT-GOBAIN
    • TABLE 91 SAINT-GOBAIN: COMPANY OVERVIEW
    • TABLE 92 SAINT-GOBAIN: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.3 KEMET INTERNATIONAL LIMITED
    • TABLE 93 KEMET INTERNATIONAL LIMITED: COMPANY OVERVIEW
    • TABLE 94 KEMET INTERNATIONAL LIMITED: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.4 ILJIN DIAMOND CO., LTD.
    • TABLE 95 ILJIN DIAMOND CO., LTD.: COMPANY OVERVIEW
    • TABLE 96 ILJIN DIAMOND CO., LTD: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.5 DUPONT INCORPORATED
    • TABLE 97 DUPONT INCORPORATED: COMPANY OVERVIEW
    • FIGURE 44 DUPONT: COMPANY SNAPSHOT
    • TABLE 98 DUPONT INCORPORATED: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.6 FUJIBO HOLDINGS, INC.
    • TABLE 99 FUJIBO HOLDINGS, INC.: COMPANY OVERVIEW
    • FIGURE 45 FUJIBO HOLDING, INC.: COMPANY SNAPSHOT
    • TABLE 100 FUJIBO HOLDINGS, INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.7 FUJIFILM HOLDINGS AMERICA CORPORATION
    • TABLE 101 FUJIFILM HOLDINGS AMERICA CORPORATION: COMPANY OVERVIEW
    • TABLE 102 FUJIFILM HOLDINGS AMERICA CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • TABLE 103 FUJIFILM HOLDINGS AMERICA CORPORATION: OTHERS
    • TABLE 104 FUJIFILM HOLDINGS AMERICA CORPORATION: DEALS
    • 12.1.8 ENGIS CORPORATION
    • TABLE 105 ENGIS CORPORATION: COMPANY OVERVIEW
    • TABLE 106 ENGIS CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.9 SKC
    • TABLE 107 SKC: COMPANY OVERVIEW
    • FIGURE 46 SKC: COMPANY SNAPSHOT
    • TABLE 108 SKC: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • TABLE 109 SKC: DEALS
    • TABLE 110 SKC: OTHERS
    • 12.1.10 FERRO CORPORATION
    • TABLE 111 FERRO CORPORATION: COMPANY OVERVIEW
    • TABLE 112 FERRO CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.11 3M
    • TABLE 113 3M: COMPANY OVERVIEW
    • FIGURE 47 3M: COMPANY SNAPSHOT
    • TABLE 114 3M: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.12 JSR CORPORATION
    • TABLE 115 JSR CORPORATION: COMPANY OVERVIEW
    • FIGURE 48 JSR CORPORATION: COMPANY SNAPSHOT
    • TABLE 116 JSR CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED
  • *Details on Business overview, Products/Services/Solutions offered, Recent developments & MnM View might not be captured in case of unlisted companies.
  • 12.2 OTHER PLAYERS
    • 12.2.1 PUREON
    • TABLE 117 PUREON: COMPANY OVERVIEW
    • 12.2.2 LAPMASTER WOLTERS
    • TABLE 118 LAPMASTER WOLTERS: COMPANY OVERVIEW
    • 12.2.3 LOGITECH LTD.
    • TABLE 119 LOGITECH LTD.: COMPANY OVERVIEW
    • 12.2.4 ADVANCED ABRASIVES CORPORATION
    • TABLE 120 ADVANCED ABRASIVES CORPORATION: COMPANY OVERVIEW
    • 12.2.5 ALLIED HIGH TECH PRODUCTS
    • TABLE 121 ALLIED HIGH TECH PRODUCTS: COMPANY OVERVIEW
    • 12.2.6 ACE NANOCHEM CO., LTD.
    • TABLE 122 ACE NANOCHEM CO., LTD.: COMPANY OVERVIEW
    • 12.2.7 SHANGHAI XINANNA ELECTRONIC TECHNOLOGY CO., LTD
    • TABLE 123 SHANGHAI XINANNA ELECTRONIC TECHNOLOGY CO., LTD: COMPANY OVERVIEW
    • 12.2.8 AGC INC.
    • TABLE 124 AGC INC.: COMPANY OVERVIEW
    • 12.2.9 FUJIMI INCORPORATED
    • TABLE 125 FUJIMI INCORPORATED: COMPANY OVERVIEW
    • 12.2.10 LAM PLAN SAS
    • TABLE 126 LAM PLAN SAS: COMPANY OVERVIEW
    • 12.2.11 NITTA DUPONT INCORPORATED
    • TABLE 127 NITTA DUPONT INCORPORATED: COMPANY OVERVIEW

13 APPENDIX

  • 13.1 DISCUSSION GUIDE
  • 13.2 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 13.3 CUSTOMIZATION OPTIONS
  • 13.4 RELATED REPORTS
  • 13.5 AUTHOR DETAILS