市場調查報告書
商品編碼
1182062
SiC 晶圓全球市場研究與預測:晶圓尺寸、應用、最終用戶行業、區域分析,2022-2029 年Global SiC Wafer Market Size study & Forecast, by Wafer Size, Application, End-user Industry, and Regional Analysis, 2022-2029 |
SiC 晶圓是具有極高強度的矽碳半導體化合物。
出色的機械、熱和化學穩定性。 晶圓製造過程涉及將 SiC 固體包轉化為外延或設備就緒的原始晶圓。 主要應用於電源、高頻等領域。 由於對LED照明設備的需求增加和對電動汽車的需求增加等因素,SiC晶圓的市場正在擴大。
根據 2022 Statista 的數據,電子設備的使用在全球範圍內迅速增長。 預計2022年消費電子市場將實現10566.93億美元的市場增長。 據估計,中國是產生最高電子產品銷售額的主要地區,即 2509.11 億美元。 這包括各種耗電設備(例如可穿戴設備和汽車設備)中的 LED 照明。 另一方面,SiC 晶圓在電力電子領域的應用不斷增加,以及全球市場參與者不斷增加的研發活動,為市場創造了有利可圖的機會。 然而,在整個 2022-2029 年的預測期內,散熱、可擴展性以及與封裝相關的芯片和基板供應壓力等限制因素將阻礙市場增長。
全球 SiC 晶圓市場研究考慮的主要區域是亞太地區、北美、歐洲、拉丁美洲和世界其他地區。 由於嚴格的政府監管、對 LED 照明設備的需求增加以及對功率設備的投資等因素,亞太地區被認為是全球創收的關鍵地區。 由於主要參與者的增長和開發活動的增加等因素,預計亞太地區在預測期內將顯著增長。
這項研究的目的是揭示近年來各個細分市場和國家/地區的市場規模,並預測未來幾年的市場規模。 本報告旨在捕捉被調查國家行業的定性和定量方面的情況。
它還提供了關鍵方面的詳細信息,例如決定市場未來增長的驅動因素和挑戰。 此外,它還包含供利益相關者投資的微觀市場潛在機會,以及對主要參與者的競爭格局和產品供應的深入分析。
Global SiC Wafer Market is valued at approximately USD XX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX % over the forecast period 2022-2029. SiC Wafer is a silicon carbon semiconductor compound that is extremely strong. It provides excellent mechanical thermal and chemical stability. The wafering process involves converting a solid puck of SiC into an epi or device-ready prime wafer. It has major applications across power, radio frequency, others. The SiC Wafer market is expanding because of factors such as rising demand for LED lighting devices and increasing demand for electric vehicles.
According to Statista in 2022, the adoption of electronic devices is rising rapidly all over the world. The consumer electronics market is projected to attain market growth of about USD 1,056,693 million by in 2022. China is estimated to be the dominating region in terms of highest revenue generation in electronic devices i.e., USD 250,911 million. It includes LED lights across various power consumption devices such as wearable devices, automotive devices, and so on. Whereas the rising application of Sic Wafers across power electronics and growing R&D activities by market players across the globe create lucrative opportunities for the market. However, limiting Constraints such as Heat Dissipation, Scalability, and Packaging-related Pressure on the Die and Substrate Supply hampers the market growth throughout the forecast period of 2022-2029.
The key regions considered for the Global SiC Wafer Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. The Asia Pacific is considered the dominating region across the globe in terms of revenue generation owing to the factors such as stringent government regulations, increasing demand for LED lighting devices, and investment in power devices. Whereas the Asia Pacific is expected to grow significantly during the forecast period, owing to factors such as increasing growth and development activities by key players in the forecast period.
Major market players included in this report are:
Wolfspeed, Inc.
II-VI Incorporated
Xiamen Powerway Advanced Material Co. Ltd
STMicroelectronics (Norstel AB)
Showa Denko KK
Atecom Technology Co., Ltd.
SK Siltron
SiCrystal GmbH
TankeBlue Co., Ltd.
Semiconductor Wafer Inc.
Recent Developments in the Market:
Global SiC Wafer Market Report Scope:
Historical Data: 2019-2020-2021
Base Year for Estimation: 2021
Forecast period: 2022-2029
Report Coverage: Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered: Wafer Size, Application, End-user Industry Region
Regional Scope: North America; Europe; Asia Pacific; Latin America; Rest of the World
Customization Scope: Free report customization (equivalent up to 8 analyst's working hours) with purchase. Addition or alteration to country, regional & segment scope*
The objective of the study is to define the market sizes of different segments & countries in recent years and to forecast the values for the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within the countries involved in the study.
The report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the market's future growth. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with a detailed analysis of the competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Wafer Size:
2-, 3-, and 4 inches,
6-inch,
8- and 12-inch
By Application:
Power
Radio Frequency (RF)
By End-User:
Telecom & Communications,
Automotive & Electric Vehicles (EVs),
Photovoltaic/Power Supply/Energy Storage,
Industrial (UPS and Motor Drives)
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World
List of tables and figures and dummy in nature, final lists may vary in the final deliverable
List of figures
List of tables and figures and dummy in nature, final lists may vary in the final deliverable