市場調查報告書
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2030 年存儲設備市場預測 - 按類型、用途、最終用戶和地區分類的全球分析Memory Devices Market Forecasts to 2030 - Global Analysis By Type, Application, End User and By Geography |
據Stratistics MRC預測,2023年全球存儲裝置市場規模將達到1705.1億美元,預計2030年將達到5087.1億美元,年複合成長率為16.9%。
存儲設備,例如電腦存儲器,是用於存儲數位資料的數位電子半導體設備。資料通常存儲在矽積體電路存儲晶片上的金屬氧化物半導體 (MOS) 存儲單元中。矽通常從沙子中開採出來,是這些積體電路的起點。工程師、冶金學家、化學家和物理學家都參與了將矽轉化為存儲晶片的過程。記憶體是在稱為晶圓廠的大型設施中製造的,這些設施具有一些內置的潔淨室條件。即使斷電,資料和資訊也不會丟失或刪除。它可以以很少的電力消耗存儲大量的資料和資訊。
據美國能源部統計,美國大約有300萬個資料中心。
大多數新興國家都專注於數位意識和數位化。作為其中的一部分,許多國家正在積極實施物聯網(IoT)技術。智慧和鏈接設備系統已成為開發物聯網項目的一個重要方面,因為它們促進了日常生活的自動化。解決方案需要大量的半導體存儲器來存儲資訊以及輸入和輸出資料。全球市場可能會受到這些技術在新興國家的快速採用的推動。
半導體存儲裝置正在迅速流行。然而,建立存儲裝置製造設備所需的初始投資過高。晶圓、MOSFET、電晶體和冷卻系統是這些設備中使用的昂貴零件。這直接影響最終產品的售價。此外,建立這些存儲設備的製造設備需要時間,這阻礙了市場的成長。
大多數新興國家正在做出巨大努力,以提高數位素養並實現經濟數位化。存儲設備生產的數位化提高了營運效率並實現自動化。電子行業的快速數字化和自動化以及智慧手機、穿戴式設備和電子設備等技術先進設備中基於記憶體的功能的使用正在推動市場擴張。
記憶體存儲設備和半導體製造商嚴重依賴中國公司,因為他們的大部分原料都來自中國。該國首先受到疫情的重創,限制了當地市場,並導致半導體供應鏈出現問題。疫情影響對市場造成重大影響,導致原料資源緊缺。這方面阻礙了市場的擴展。
COVID-19 大流行對 2020 年上半年的市場研究供應鍊和製造業產生了重大影響。這對全球經濟活動產生了負面影響。各國 COVID-19 病例的增加影響了市場的成長。突然實施的封鎖限制迫使多家製造工廠關閉。此外,多個國家的矽等原料供應鏈也受到干擾。此外,許多政府機構和重要公司已製定政策和計劃來應對 COVID-19 的影響,這將在整個預測期內推動市場成長。
靜態隨機存取存儲器(SRAM)領域預計將出現良好的成長。 SRAM 的運行速度明顯快於 DRAM。 SRAM 功耗較低,用於速度敏感的快取。 SRAM的內容不需要刷新。 SRAM 比 DRAM 更耐輻射。該領域的成長是由低功耗、高速快取和效率推動的。
預計消費電子設備行業在預測期內將出現最快的年複合成長率。存儲卡是一種電子資料存儲設備,通常使用閃存來存儲數位資訊。常見於數位攜帶式電子產品中。您可以通過將卡插入插槽而不是突出的 USB 閃存驅動器來為這些設備添加記憶體。智慧手機和數位相機的普及正在推動這一領域的成長。
由於人工智慧和物聯網的採用不斷增加,預計亞太地區在預測期內將佔據最大的市場佔有率。此外,主要企業正在使用不同的業務方法,這有助於區域市場的擴張。銷售額最高的國家是中國。中國擁有一些世界上最現代化的製造設施。由於個人電腦和工業中最新技術的使用,亞洲市場預計在預測期內將顯著成長。
由於快速變化的技術,預計北美在預測期內將呈現最高的年複合成長率。企業間產生的大量資料催生了對該國更高效處理解決方案的需求。隨著移動和低功耗設備、高階資料中心和大型片上快取的引入,對非易失性、高密度、低能耗存儲器提出了新的高優先級要求。美國在記憶體半導體製造技術,特別是DRAM和3D-NAND方面重新獲得了競爭力。資料中心需求的不斷擴大正在推動該地區記憶體零件的需求。
According to Stratistics MRC, the Global Memory Devices Market is accounted for $170.51 billion in 2023 and is expected to reach $508.71 billion by 2030 growing at a CAGR of 16.9% during the forecast period. Memory devices, such as computer memory, are digital electronic semiconductor devices used for digital data storage. Data is often stored in metal-oxide-semiconductor (MOS) memory cells on a silicon integrated circuit memory chip in such devices. Silicon, which is often mined from sand, is the starting point for these integrated circuits. Engineers, metallurgists, chemists, and physicists are all involved in the process of converting silicon into memory chips. Memory is manufactured in a massive facility known as a fab, which incorporates several clean room conditions. Even when there is no electricity, they do not lose or delete data or information. They can store large quantities of data and information while consuming very little power.
According to the US Department of Energy, there are about 3 million data centers in the United States.
The majority of emerging economies are focusing on digital awareness and digitalization. Many countries are actively implementing Internet of Things (IoT) technology on a big scale as part of the agenda. Smart and linked device systems are an important aspect of developing IoT projects since they encourage automation in everyday life. To store information and input and output data, the solutions require significant amounts of semiconductor memory. The worldwide market will be driven by the rapid adoption of these technologies in emerging economies.
Semiconductor memory devices are quickly gaining popularity. However, the initial investment necessary to establish any memory device manufacturing unit is too expensive. Wafers, MOSFETs, transistors, and cooling systems are among the more costly components used in these devices. This has a direct influence on the final product's selling price. Furthermore, the installation of manufacturing equipment for these memory devices takes time, which is impeding market growth.
The bulk of emerging economies are putting substantial effort into becoming digitally literate and digitizing their economies. Digitalization in memory device production enhances operational efficiency and enables automation. Rapid digitization and automation in the electronics sector, as well as the use of memory-based features in technologically sophisticated devices like as smartphones, wearables, and electronics, are driving market expansion.
Memory storage device and semiconductor makers rely largely on Chinese enterprises since the majority of the materials are sourced from China. The country was first devastated by the epidemic and put limitations on the local market, causing problems in the semiconductor supply chain. The pandemic effect has had a significant impact on the market, resulting in a scarcity of raw resources. This aspect is impeding market expansion.
The global COVID-19 epidemic greatly impacted the supply chain and manufacturing of market research in the first half of 2020. This had a detrimental influence on global economic activity. The increase in COVID-19 instances in various nations has had an impact on market growth. The installation of abrupt lockdown limitations has forced the shutdown of several manufacturing units. Furthermore, the raw material supply chain, such as silicon, has been interrupted in various nations. Furthermore, many government agencies and important businesses are developing policies and plans to address the COVID-19 impact, which will drive market growth throughout the projection period.
The static random access memory (SRAM) segment is estimated to have a lucrative growth. SRAM operates at a considerably quicker rate than DRAM. SRAM consumes less power and is used to provide speed-sensitive caching. The contents of SRAM do not need to be refreshed. SRAMs are more radiation resistant than DRAM. The segment's growth is being fuelled by its low power consumption, cache memory, and efficiency.
The consumer electronics segment is anticipated to witness the fastest CAGR growth during the forecast period. A memory card is an electronic data storage device that commonly uses flash memory to store digital information. These are frequently seen in digital portable electronic gadgets. They enable additional memory to such devices by inserting a card into a socket rather than a protruding USB flash drive. The increased use of smart phones and digital cameras is driving the segment's rise.
Asia Pacific is projected to hold the largest market share during the forecast period owing to increasing adoption of AI and the Internet of Things. Key corporations have also used a variety of business approaches, which has contributed to the area market's expansion. China is the country with the most revenue. China features some of the world's most modern manufacturing facilities. The Asian market is expected to grow considerably during the projected period due to the use of modern technologies in both personal computers and industries.
North America is projected to have the highest CAGR over the forecast period, owing to rapidly changing technologies. High data creation across businesses is generating a demand in the country for more efficient processing solutions. With the introduction of mobile and low-power devices, as well as high-end data centers and massive on-chip caches, a new high-priority requirement emerged: non-volatile, dense, and low-energy-consuming memories. The United States has recovered its competitiveness in memory semiconductor manufacturing technologies, particularly in DRAM and 3D-NAND. The growing demand for data centers is driving up demand for memory components in the region.
Some of the key players profiled in the Memory Devices Market include: IBM Corporation, Intel Corporation, Samsung Electronics Co. Ltd, Cypress Semiconductor Corporation, Micron Technology Inc., Kioxia Corporation, SK Hynix Inc., Nvidia Corporation, ROHM Co. Ltd., Maxim Integrated Products Inc., STMicroelectronics NV, Fujitsu, Broadcom Inc., Toshiba Corporation, Macronix International Co Limited, Taiwan Semiconductor, Sony, LAM Research, Texas Instruments and Silicon Catalyst.
In March 2022, Kioxia Corporation, a provider of memory solutions, announced it would start construction of an advanced new fabrication facility at its Kitakami Plant in Japan for the possible expansion of manufacturing of its proprietary 3D Flash memory BiCSFLASHTM. Construction of this facility is planned to commence in April 2022 and is expected to be completed in 2023.
In December 2021, Micron Technology announced plans for its new memory design center in Midtown Atlanta, the United States, expanding the company's reach into the Southeast United States. Micron aims to establish strong partnerships with many institutions in the region including Georgia Tech, Emory University, Spelman College Morehouse College, and the University of Georgia.
In July 2021, Intel Corporation, a global supplier of advanced processing units and memory storage systems, has partnered with MediaTek, a supplier of processors for smartphones. Through this partnership, the two companies will be able to share a foundry for manufacturing semiconductors and memory storage devices.
In Aug 2019, Samsung announced its 6th generation V-NAND memory with 100 active layers using new circuit design technology. It features 10% lower latencies and consumes 15% lower amount of power when compared to Samsung's previous-generation V-NAND products. This V-NAND also features lower power consumption than its predecessors.
In July 2019, Fujitsu Semiconductor announced the release of the 8Mbit ReRAM MB85AS8MT, which is reportedly the world's largest density as a mass-produced This ReRAM product, suitable for wearable devices, was jointly developed with Panasonic Semiconductor Solutions Co. Limited.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.