市場調查報告書
商品編碼
1273589
到2028年的物聯網芯片市場預測—產品(處理器、連接IC)、功耗(小於1W、1-3W、3-5W、5-10W、10W)、用戶、地區世界分析IoT Chip Market Forecasts to 2028 - Global Analysis By Product (Processor, Connectivity IC and Other Products), By Power Consumption (Less Than 1 W, 1-3 W, 3-5 W, 5-10 W and More Than 10 W), By End User and By Geography |
根據Stratistics MRC,2022年全球物聯網芯片市場規模將達到5357億美元,預測期內以16.9%的複合年增長率增長,2028年預計將達到1兆3671億美元。
物聯網模塊或芯片通常是指可以安裝在機器、物體或事物上以建立與無線網絡的連接並發送和接收數據的電子設備。 這些設備使用許多協議,例如 NB-IoT、LTE 和 BLE 5.0。 這些設備包含有助於無線傳輸和接收數據的技術,例如傳感器和軟件。 因此,物聯網芯片是嵌入各種產品、機器和其他設備中的小型電子元件。 它是構成整個物聯網機制的重要元素,沒有它,整個系統將無法運行。 物聯網為個人和企業提供了廣泛的可能性。
根據《經濟時報》的一項研究,在印度,蜂窩物聯網模塊芯片組的出貨量正在增長,高通以 42% 的份額領先市場。 該公司擴展了其物聯網芯片組產品組合,目標是為零售、工業和智慧城市等垂直行業提供優質的 4G 和 5G 解決方案。
用於物聯網應用的嵌入式處理器出貨量預計增長速度超過任何其他嵌入式處理領域。 尤其是 32 位 MCU,將用於需要具有更高計算能力的高級實時傳感器的汽車、工業和醫療應用,而基於 MCU 的設備預計將佔據增長的大部分。 開發具有內置無線電功能的專用 MCU 也是公認的趨勢。 傳統的通用 MCU 受到這些專用 MCU 的威脅,這些 MCU 使許多消費和工業設備能夠連接到互聯網。
隨著物聯網在所有最終用途行業(例如可穿戴技術、醫療保健和零售)中的迅速採用,該技術具有巨大的潛力。 然而,對數據安全和隱私的擔憂已成為該領域的重要增長抑制因素。 隨著 IoT 引入最終用戶應用程序,連接設備的數量不斷增加,將生成大量數據。 該系統可能會被網絡犯罪分子入侵,然後濫用這些數據進行間諜活動。 例如,它可用於自動註冊汽車保險、跟蹤健康狀況、監控業務策略的有效性等等。 作為邊緣設備和雲端服務之間的通信層,物聯網網關必須管理大量的物聯網設備和它們之間遷移的數據。
為了提高生產力,世界各國政府都在支持和促進物聯網的研發。 政府部門預計將成為該技術的主要潛在客戶之一。 智能交通管理系統、智能儀表節能以及智能攝像頭安全系統的進步只是物聯網可以帶來重大創新和改進的一些關鍵領域。 新加坡、芬蘭和澳大利亞等政府正在資助新的物聯網研究計劃,以實現未來的智慧城市。
任何物聯網設備都需要更好的電源管理和更低的光功耗。 連接緊張也將是一個主要挑戰,因為需要同時連接數百甚至數千台設備。 例如,一個典型的智能住宅可能有 50-100 個連接的小工具,例如燈、恆溫器和電器,每個都有自己的電源要求。 使用智能電錶等工具可以提高電力線的效率。 一個關鍵挑戰是採用 Wi-Fi 等無線技術的設備的電源管理,這需要相當大的功率。
由於 COVID-19 流行病,全球部署的供應鏈嚴重短缺,市場受到嚴重影響。 由於各國限制個人在世界各地移動的權利,生產也受到阻礙。 更加自動化和復雜的系統對於從大流行中恢復至關重要。 隨著未來物聯網兼容產品市場的擴大,預計全球對物聯網芯片的需求將很高。
由於現場可編程門陣列 (FPGA) 在可穿戴技術中的使用越來越多,邏輯設備部分預計在預測期內將佔據最大份額。 邏輯設備可以提高原型設計和調試能力。 由於其卓越的性能、可編程性和成本效益,預計 FPGA 的採用率會增加。 並且與中央處理器 (CPU) 相比,FPGA 可以更快地實現任何功能。 FPGA 可以在功能上進行修改、更新、重新配置和更改,從而允許它們執行全新的和多樣化的活動。
由於對智能手錶等具有物聯網功能的可穿戴產品的需求不斷增長,預計消費電子領域在整個預測期內將快速增長。 智能家電在語音助手、安全與安保、空氣和水質監測、照明控制和鎖具等家庭自動化應用中的使用不斷增加,預計也將在預測期內推動該細分市場的收入增長。這是一個重要的促進因素。
預計亞太地區將成為預測期內最大的市場,因為包括中國、日本、台灣和印度在內的許多國家/地區正在增加物聯網芯片在智慧城市發展中的使用。 物聯網的部署在很大程度上受到了中國和印度等國家政府對智慧城市項目的積極舉措的影響。 隨著在製造和過程自動化行業中使用量的增加,它也有望推動市場發展。 此外,由於物聯網投資,新加坡和韓國被確定為物聯網芯片部署的重要市場。 根據經濟合作與發展組織的數據,韓國是第一個比其他任何國家都更頻繁地連接到互聯網的重要市場。
隨著亞洲國家越來越多地將物聯網納入其長期上市項目,預計亞太地區將獲得豐厚的市場份額。 例如,中國中央政府選擇了 200 多個地區進行智慧城市倡議評估。 其中包括北京、上海、廣州和杭州。 此外,印度的目標是讓100個城市變得智能,這有望促進汽車行業和智能家居的電子產品銷售。 此外,由於物聯網在 5G 服務中的使用越來越多,市場正在擴大,預計這一趨勢將在預測期內持續。
2022 年 7 月,HT Micron 在巴黎 LoRaWAN 世博會上推出了巴西製造的新型 LoRa 和藍牙物聯網芯片。 iMCP HTLRBL32L 是一個 13x13x1.1mm 系統級封裝,可輕鬆集成和原型設計遠程和短程物聯網解決方案。
2021 年 10 月,三星和英特爾發布了可能支持智能物聯網應用的新半導體產品。 三星宣布已開始批量生產其基於 DDR5(雙倍數據速率 5)標準和 14 納米芯片的最新動態隨機存取存儲器 (RAM) 電路。 這款新產品可處理人工智能 (AI) 和 5G 通信等數據密集型工作負載。
According to Stratistics MRC, the Global IoT Chip Market is accounted for $535.7 billion in 2022 and is expected to reach $1367.1 billion by 2028 growing at a CAGR of 16.9% during the forecast period. IoT modules or chips are commonly referred to as electronic devices placed in machines, objects, and things that are capable of establishing a connection to wireless networks and transmitting and receiving data. These devices use many protocols, including NB-IoT, LTE, and BLE 5.0. These devices include sensors, software, and other technologies that facilitate wireless data sending and receiving. IoT chips are therefore tiny electronic components that are integrated into a variety of products, machines, and other devices. It is a crucial component of the overall IoT mechanism, and its absence will render the entire system ineffective. IoT has provided an array of possibilities for individuals and businesses.
According to Economic Times's survey, cellular IoT module chipset shipments grew in India, and Qualcomm led the market with a 42% share. The company has been broadening its IoT chipset portfolio, targeting premium 4G and 5G solutions for verticals such as retail, industrial, smart cities, and more.
Unit shipments of embedded processors intended for Internet of Things applications are anticipated to increase more rapidly in the future than the rest of the embedded processing sector. A significant portion of that growth is expected to originate from MCU-based devices, particularly 32-bit MCUs, which are becoming more common as a result of their increasing use in automotive, industrial, and medical applications requiring sophisticated real-time sensors with higher computing capabilities. The development of application-specific MCUs with built-in wireless capabilities is another trend that has been recognised. Traditional general-purpose MCUs are at risk from these application-specific MCUs, which enable numerous home appliances and industrial devices to connect to the internet.
Due to the rapid adoption of IoT across all end-use industries, including wearable technology, healthcare, and retail, this technology has enormous potential. Data security and privacy concerns, however, are significant growth inhibitors for the sector. A significant amount of data is being produced as the number of connected devices grows along with the adoption of IoT in end-user applications. Systems can be hacked by cybercriminals, which subsequently exploit the data for espionage. For instance, this information can be used to automatically acquire auto insurance, assess a person's health, monitor the effectiveness of a business's strategies, and more. The IoT gateway must manage a substantial number of IoT devices as well as the data migrated between them in order to operate as a communication layer between edge devices and cloud services.
In order to increase productivity, governments around the world are supporting and promoting IoT research and development. The government sector is predicted to be one of the technology's major potential customers. Smart traffic management systems, energy conservation via smart metres, and security system advancements via smart cameras are just some of the important sectors where IoT can bring about significant innovation and improvements. New IoT research initiatives are being funded by the governments of various nations, including Singapore, Finland, and Australia, in preparation for the creation of smart cities in the future.
Any IoT device must have improved power management and low optical power consumption. Another major challenge would be the connectivity strain, as hundreds or perhaps thousands of devices would need to be connected simultaneously. For instance, a typical smart house may include 50 to 100 linked lights, thermostats, appliances, and other gadgets, each of which has its own power requirements. The electricity line would be made more efficient using tools like smart metres. The key challenge is the power management of devices employing wireless technologies, such as Wi-Fi, which demand considerable power.
Due to severe shortages in the supply chain that developed globally as a result of the COVID-19 epidemic, the market was severely impacted. Production was also hampered by the restrictions that countries imposed on individual rights of movement around the world. To succeed, more automated and sophisticated systems have become essential as the world begins to recover from the pandemic. IoT chips will therefore be in high demand globally as the market for IoT-enabled products is expected to grow in the future.
Due to an increase in the use of Field-Programmable Gate Arrays (FPGAs) in wearable technology, the logic device segment is anticipated to register the largest share throughout the projection period. Improved prototyping and debugging capabilities are made possible by logic devices. Some major aspects that are anticipated to increase the adoption and use of FPGAs include their improved performance, programmability, and cost-efficiency. Additionally, when compared to a central processing unit (CPU), an FPGA can implement any function more quickly. FPGAs are capable of modifying, updating, reconfiguring, and changing functionality to carry out entirely new and diverse activities.
Due to the increased demand for wearables with IoT capabilities, such as smartwatches, the consumer electronics segment is anticipated to grow rapidly throughout the projected period. Additionally, a significant driver anticipated to propel this segment's revenue growth throughout the forecast period is the rising usage of smart appliances for home automation applications including voice assistants, safety & security, air & water quality monitoring, lighting control, and locks.
Due to the increasing use of IoT chips in smart city development across a number of nations, including China, Japan, Taiwan, and India, Asia-Pacific is expected to have the largest market over the projected period. IoT implementation is being significantly influenced by rising government initiatives for smart city projects in nations like China and India. Additionally, rising use in the manufacturing and process automation industries is anticipated to boost market. Moreover, due to investment in IoT, important markets for IoT chip adoption include Singapore and South Korea. South Korea is the first significant market to connect to the Internet more frequently than any other, according to the Organisation for Economic Cooperation and Development.
Because Asian countries are increasingly incorporating IoT into their long-term development projects, the Asia-Pacific region is expected to have lucrative market share. For instance, the central government of China selected more than 200 communities for the evaluation of smart city initiatives. Beijing, Shanghai, Guangzhou, and Hangzhou are among the cities. India's goal of making 100 cities smart is also anticipated to boost electronics sales in the automobile industry and in smart homes. Moreover, the market is expanding as a result of the growing usage of IoT in 5G services, and this trend is expected to continue during the forecast period.
Some of the key players in IoT Chip market include: Silicon Labs, Dialog Semiconductor, Expressif Systems, Gainspan, Nordic semiconductor, TE Connectivity Ltd., STMicroelectronics N.V., Advanced Micro Devices (AMD), Samsung Electronics, NVIDIA Corporation, Huawei Technologies Co., Ltd., Renesas Electronics Corporation, Cypress Semiconductor Corporation, Microchip Technology Inc., Marvell Technology Group Ltd., MediaTek Inc., NXP Semiconductors N.V., Qualcomm Incorporated, Texas Instruments Incorporated and Intel Corporation.
In July 2022, HT Micron introduced the new LoRa and Bluetooth Internet of Things chip made in Brazil at the LoRaWAN World Expo in Paris. The iMCP HTLRBL32L, a system-in-package of 13x13x1.1 mm, enables easy integration and prototyping of long- and short-range solutions for the IoT.
In October 2021, Samsung and Intel have announced new semiconductor products that may support intelligent IoT applications. Samsung announced that it had started mass production of a recent dynamic random access memory (RAM) circuit based on the DDR5 (Double Data Rate 5) standard and 14-nanometer chips. This new product handles data-intensive workloads such as artificial intelligence (AI) and 5G communications.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.