市場調查報告書
商品編碼
1415569
全球嵌入式非揮發性記憶體 (eNVM) 市場評估:按產品類型、按應用、按最終用途行業、按地區、機會、預測 (2017-2031)Embedded Non-Volatile Memory Market Assessment By Product Type, By Application, By End-use Industry, By Region, Opportunities and Forecast, 2017-2031F |
預計2023年全球嵌入式非揮發性記憶體(eNVM)市場規模將達15.3億美元,2031年將達59.1億美元,2024-2031年預測期間複合年增長率為18.4%。在消費性電子、汽車和工業等行業需求不斷增長的推動下,嵌入式非揮發性記憶體 (eNVM) 市場呈現顯著成長。對更小、更節能設備的需求不斷增長,推動了先進嵌入式非揮發性記憶體 (eNVM) 技術的採用,該技術可提供更高的速度、耐用性和可擴展性。以數據為中心的應用程式的激增和連接設備數量的不斷增加正在推動嵌入式非揮發性記憶體(eNVM)市場的發展。此外,汽車產業越來越依賴 eNVM 來實現關鍵功能,包括 ADAS(高級駕駛輔助系統),這也推動了這一成長軌跡。總體而言,多種因素正在為嵌入式非揮發性記憶體(eNVM)市場的持續擴張創造有利的環境。
嵌入式非揮發性記憶體市場的成長與快速成長的物聯網格局一致,根據 "2023 年春季物聯網狀況" 報告,預計到 2023 年,活躍端點將達到 167 億個。儘管成長速度較 2022 年略有放緩,但仍在上升,預計到 2027 年物聯網連線數將達到 290 億個。嵌入式非揮發性記憶體 (eNVM) 市場正受益於物聯網的擴展,因為它在為互聯設備提供可靠且節能的記憶體解決方案方面發揮著至關重要的作用。此外,嵌入式非揮發性記憶體 (eNVM) 市場得到了 eNVM 技術進步的支持,滿足了物聯網應用的需求。全球不確定性和地緣政治因素繼續限制晶片供應。嵌入式非揮發性記憶體市場的持續成長得益於其在不斷發展的物聯網生態系統中的關鍵作用。
例如,eMemory於2023年4月透露,其NeoFuse OTP已通過台積電N5製程認證。NeoFuse OTP是一款嵌入式OTP NVM IP解決方案,具有低功耗、高可靠性、強安全性。
由於智慧型手機和穿戴式裝置等消費性電子產品的需求不斷增長,嵌入式非揮發性記憶體(eNVM)市場呈現顯著成長。對可靠且節能的小型高效能記憶體解決方案的需求推動了這種快速成長。隨著消費性電子產品的複雜性和功能不斷增長,eNVM 提供更快的存取時間和更大的儲存容量的要求變得至關重要。其無縫整合不僅改善了用戶體驗,而且使 eNVM 成為推動消費性電子產業創新和技術進步的基本要素。對 eNVM 的日益依賴證實了它在塑造現代電子領域中的重要角色。
例如,2023年3月,eMemory和UMC在UMC的22nm超低功耗製程上認證了eMemory的8Mb RRAM IP,增強了UMC針對物聯網和行動應用的嵌入式記憶體產品。兩家公司正在合作,利用 UMC 的 22nm 0.8V/2.5V RRAM 平台,為汽車產業開發創新的 RRAM 解決方案。
連接裝置的激增是支援嵌入式非揮發性記憶體(eNVM)市場擴張的關鍵驅動力。這一趨勢正在推動對可靠、高效能非揮發性記憶體解決方案的需求。隨著從物聯網應用到工業自動化等各個領域互連設備數量的不斷增加,eNVM 的重要性對於有效的資料儲存和檢索變得至關重要。eNVM 以其可靠性和高效的資料管理而聞名,可確保這些互聯生態系統內的無縫通訊和最佳功能。嵌入式非揮發性記憶體 (eNVM) 市場呈現顯著成長,這表明 eNVM 在確保互連設備的彈性功能方面發揮關鍵作用。
本報告研究分析了全球嵌入式非揮發性記憶體(eNVM)市場,提供市場規模和預測、市場動態、主要參與者趨勢和前景。
Global embedded non-volatile memory market size was valued at USD 1.53 billion in 2023, expected to reach USD 5.91 billion in 2031, with a CAGR of 18.4% for the forecast period between 2024 and 2031. The embedded non-volatile memory market is witnessing substantial growth, propelled by escalating demand in sectors like consumer electronics, automotive, and industrial. The increasing need for more compact and energy-efficient devices is a key driver, boosting the adoption of advanced embedded non-volatile memory (eNVM) technologies with improved speed, endurance, and scalability. The embedded non-volatile memory market expands as the number of connected devices continues to rise, along with the surge in data-centric applications. Moreover, the automotive industry's increasing reliance on eNVM for crucial functions, including advanced driver-assistance systems, adds momentum to this growth trajectory. Overall, a convergence of factors is creating a favorable environment for the ongoing expansion of the embedded non-volatile memory market.
According to "State of IoT-Spring 2023" report, the growth of the embedded non-volatile memory market aligns with the burgeoning IoT landscape, which is projected to reach 16.7 billion active endpoints in 2023. Despite a slight dip in growth compared to 2022, the trajectory remains upward, with an anticipated 29 billion IoT connections by 2027. The embedded non-volatile memory market benefits from IoT's expansion due to its integral role in providing reliable, energy-efficient memory solutions for connected devices. Furthermore, the embedded non-volatile memory market is sustained by technological advancements in eNVM, addressing the demands of IoT applications. The chip supply constraints persist due to global uncertainties and geopolitical factors; the embedded non-volatile memory market's sustained growth is supported by its critical role in the evolving IoT ecosystem.
For instance, in April 2023, eMemory revealed that its NeoFuse security-enhanced one-time programmable (OTP) was validated on the TSMC N5 process. NeoFuse OTP is an embedded one-time programmable NVM IP solution with low power consumption, high reliability, and strong security.
The embedded non-volatile memory market experiences substantial growth due to heightened demand in consumer electronics, such as smartphones and wearables. This surge is underpinned by the necessity for compact, high-performing memory solutions that deliver both reliability and energy efficiency. The requirement for eNVM, offering faster access times and expanded storage capacity, becomes pivotal as consumer electronic devices advance in complexity and features. Its seamless integration not only enhances user experience but also positions eNVM as a fundamental element driving innovation and technological advancement in the consumer electronics industry. The increasing reliance on eNVM underscores its critical role in shaping the landscape of contemporary electronic devices.
For instance, in March 2023, eMemory and UMC qualified eMemory's 8Mb Resistive Random Access Memory (RRAM) IP on UMC's 22nm ultra-low-power process, strengthening UMC's embedded memory offerings for IoT and mobile applications. The two companies were collaboratively working on innovative RRAM solutions tailored for the automotive sector, leveraging UMC's 22nm 0.8V/2.5V RRAM platform.
The growing prevalence of connected devices is a pivotal driver behind the expanding embedded non-volatile memory market. This trend intensifies the demand for trustworthy and high-performance non-volatile memory solutions. With a rising number of interconnected devices across diverse sectors, from IoT applications to industrial automation, the significance of eNVM becomes crucial for effective data storage and retrieval. eNVM, known for its reliability and efficient data management, ensures seamless communication and optimal functionality within these connected ecosystems. The embedded non-volatile memory market is experiencing significant growth, highlighting the critical role of eNVM in ensuring the resilient functioning of interconnected devices, which is representative of the developing landscape of modern technology.
For example, in November 2022, eMemory Technology Inc. partnered with Renesas Electronics Corporation to create a 5V OTP IP utilizing TSMC's 130nm BCD Plus process tailored for automotive applications. This collaboration extends their previous work on diverse IPs for TSMC's BCD platforms, particularly in power management ICs.
The increasing demand for smaller, energy-efficient devices is a key catalyst for expanding the embedded non-volatile memory market. In response to the prevailing emphasis on compact and power-efficient solutions, there is a notable surge in the adoption of eNVM solutions. These memory solutions effectively balance reduced form factors and dependable data storage, aligning with the evolving requirements of modern electronic devices. The pursuit of enhanced portability and extended battery life, particularly in wearables, IoT devices, and mobile gadgets, underscores the essential nature of eNVM. Consequently, the embedded non-volatile memory market gains prominence, driven by the pivotal role that compact eNVM solutions play in satisfying the demands of the energy-conscious landscape for consumer electronics.
For instance, in September 2023, GlobalFoundries revealed developments to its industry-leading 22FDX (22nm FD-SOI) platform, including introducing several new features and enhancements. These improvements are a strategic response to the increased need for improved power economy and top-tier performance in IoT and automotive applications.
Asia-Pacific's dominance in the embedded non-volatile memory market stems from its status as a semiconductor manufacturing hub, hosting major industry players and cutting-edge fabrication facilities. The region's rapid technological advancements and significant investments in research and development position it as a leader in eNVM innovation. Robust demand for consumer electronics, automotive applications, and the widespread adoption of IoT devices further drive the embedded non-volatile memory market's growth. Supported by favorable government initiatives, a skilled labor pool, and a dynamic market ecosystem, Asia-Pacific solidifies its dominant role in the ever-evolving landscape of embedded non-volatile memory.
For instance, in August 2023, Fujitsu Semiconductor Memory Solution Limited, headquartered in Japan, unveiled the release of "MB85RC512LY," an I2C-interface 512Kbit FeRAM with the highest density among Fujitsu's automotive-grade FeRAM products with an I2C interface.
Government initiatives drive revenue growth in the embedded non-volatile memory market. Governments are making substantial investments in semiconductor research and development across the globe. Programs like the United States Chip and Science Act (2022) and the European Union Chips Act (2022) serve as catalysts, fostering innovation and supporting domestic semiconductor manufacturing. These initiatives provide financial incentives for companies like TSMC and Samsung, encouraging substantial investments in new chip production capacity. By aligning policies with the needs of the semiconductor industry, governments create a conducive environment for technological progress. This proactive approach ensures that the embedded non-volatile memory market thrives within a robust and forward-looking ecosystem, ultimately leading to significant revenue growth.
For instance, in December 2023, The CHIPS and Science Act sought to restore United States semiconductor prominence. After dwindling to over 10% of global production, the Act propels planned investments exceeding USD 230 billion. This initiative fortifies national security, secures supply chains, and elevates American competitiveness in semiconductors and electronics.
The embedded non-volatile memory market witnessed distinct phases of impact during the COVID-19 pandemic. Initially, disruptions in the semiconductor supply chain caused shortages and production delays. However, the industry adapted to remote work, fostering increased digitization and heightened demand for eNVM in devices like IoT applications. In the post-pandemic era, the embedded non-volatile memory experienced a rebound, driven by accelerated digital transformation initiatives. The focus on smart devices and technologies in the aftermath of COVID-19 amplified the need for reliable eNVM solutions, establishing the embedded non-volatile memory market as a crucial player in the evolving semiconductor landscape, poised for substantial growth.
The Russia-Ukraine war introduced complexities to the embedded non-volatile memory market. Geopolitical tensions disrupt the semiconductor industry and eNVM production, leading to supply chain challenges. Rising costs of raw materials and logistics, coupled with geopolitical uncertainties, impact manufacturing, and embedded non-volatile memory market stability. Companies may reconsider production locations and logistics strategies, influencing embedded non-volatile memory market dynamics. Economic repercussions and currency fluctuations add to the challenges. Indirectly, affected regions may experience fluctuations in demand, contributing to embedded non-volatile memory market instability. In navigating these uncertainties, stakeholders in the embedded non-volatile memory market must prioritize strategic adaptation and contingency planning to mitigate the impacts of this geopolitical conflict on production and market dynamics.
In the competitive landscape of the embedded non-volatile memory market, key players such as GLOBALFOUNDRIES Inc., Samsung Electronics Co., Ltd., Semiconductor Manufacturing International Corporation, Taiwan Semiconductor Manufacturing Company Limited, and United Microelectronics Corporation stand out as leaders. These companies which are renowned for their technological expertise and extensive market presence, drive innovation in advanced eNVM solutions to meet evolving industry demands. The market outlook indicates that growth will continue, fueled by increased consumer electronics, automotive, and IoT demand. Strategic collaboration, partnerships, and continuous research and development efforts are anticipated to be crucial strategies for these players, ensuring their competitiveness in the rapidly evolving semiconductor sector.
In September 2023, GlobalFoundries officially opened its USD 4 billion expansion fabrication plant ("fab") in Singapore. The 23,000-square-meter fab will create 1,000 high-wage positions in Singapore, with 95% of them being equipment technicians, process technicians, and engineers.
In September 2023, GlobalFoundries and Microchip Technology unveiled the availability of the SST ESF3 third-generation embedded SuperFlash technology NVM solution in the GF 28SLPe foundry process via Microchip's Silicon Storage Technology (SST) subsidiary.
All segments will be provided for all regions and countries covered:
Companies mentioned above DO NOT hold any order as per market share and can be changed as per information available during research work.