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全球內插器/扇出晶圓層次電子構裝(FOWLP) 市場：依封裝組件/設計、封裝、裝置、產業 - 預測（至 2029 年）
市場調查報告書
商品編碼
1424580

全球內插器/扇出晶圓層次電子構裝(FOWLP) 市場：依封裝組件/設計、封裝、裝置、產業 - 預測（至 2029 年）

Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design, Packaging, Device, Industry - Global Forecast to 2029
出版日期: | 出版商: MarketsandMarkets | 英文 197 Pages | 訂單完成後即時交付

價格
簡介目錄

全球內插器/扇出晶圓層次電子構裝（FOWLP）市場規模預計到2024年將達到356億美元，到2029年將達到635億美元，2024年至2029年複合年成長率為12.3%。

人工智慧和高效能運算領域對先進封裝的需求不斷成長是市場的主要促進因素。

調查範圍
調查年份 2020-2029
基準年 2023年
預測期 2024-2029
單元 10億美元
部分 按封裝組件/設計、按設備、按行業、按地區
目標區域 亞太、北美、歐洲等地區

“從封裝類型來看，3D 封裝領域在預測期內將佔據市場最高的複合年成長率。”

由於性能提高、外形尺寸縮小以及解決與傳統 2D 封裝相關的挑戰，半導體封裝產業的 3D 封裝出現激增。隨著對更小、更強大的電子設備的需求增加，堆疊積體電路和穿透矽通孔等 3D 封裝技術因其在滿足不斷變化的市場需求方面的效率而受到關注。

“到2029年，消費性電子產品將佔據最大的市場佔有率。”

半導體封裝透過實現小型化、提高性能和提高能源效率，在消費性電子產品中發揮重要作用。對智慧型手機和穿戴式裝置等更小、更強大、更節能的裝置的需求正在推動半導體封裝技術的不斷創新，以滿足消費性電子市場不斷變化的需求。我敦促您。

“亞太地區的複合年成長率是市場中最高的。”

亞太地區半導體封裝的成長是由該地區在電子製造領域的強大影響力、熟練勞動力的可用性以及主要半導體公司尋求成本效益生產和接近性主要市場推動的先進封裝所推動的。設施。此外，政府的支持政策和研發投資也有助於該地區的半導體封裝優勢。

該報告研究並分析了全球內插器/扇出晶圓層次電子構裝(FOWLP) 市場，提供了包括關鍵促進因素和抑制因素、競爭形勢和未來趨勢等資訊。

目錄

第1章簡介

第2章調查方法

第3章執行摘要

第 4 章重要考察

  • 內插器/FOWLP 市場對公司極具吸引力的機會
  • 內插器/FOWLP 市場：依封裝組件/設計
  • 內插器/FOWLP 市場：依最終用戶產業分類
  • 按最終用戶產業和國家分類的亞太中介內插器和 FOWLP 市場
  • 內插器/FOWLP 市場：依國家分類

第5章市場概況

  • 介紹
  • 市場動態
    • 促進因素
    • 抑制因素
    • 機會
    • 任務
  • 供應鏈分析
  • 生態系/市場地圖
  • 價格分析
    • 主要企業提供的12吋晶圓平均售價
    • 12吋晶圓平均售價
    • 12吋晶圓平均售價：依地區分類
  • 影響客戶業務的趨勢/干擾
  • 技術分析
    • 3D層壓
    • 扇出面板級封裝
    • 整體 3d
    • 3D IC
  • 波特五力分析
  • 主要相關利益者和採購標準
  • 案例研究分析
  • 貿易分析
    • 導入場景
    • 出口場景
  • 專利分析
  • 重大會議和活動（2024-2025）
  • 關稅、監管形勢和標準
    • 符合 HS 編碼 381800 的產品在各國的關稅
    • 監管機構、政府機構和其他組織
    • 規定
    • 標準

第 6 章內插器/FOWLP 市場：依封裝組件/設計

  • 介紹
  • 內插器
    • 矽
    • 有機的
    • 玻璃
    • 陶瓷製品
    • 其他內插器
  • FOWLP
    • 多功能性和靈活的設計促進 FOWLP 技術的採用
    • 單晶粒
    • 多晶片

第 7 章內插器/FOWLP 市場：依封裝類型

  • 介紹
  • 2.5D
  • 3D

第 8 章內插器/FOWLP 市場：依元件類型

  • 介紹
  • 邏輯積體電路
  • 成像光電
  • 儲存裝置
  • MEMS/感測器
  • LED
  • 其他設備類型

第 9 章內插器/FOWLP 市場：依最終用戶產業

  • 介紹
  • 消費性電子產品
  • 製造業
  • 通訊
  • 車
  • 醫療保健
  • 航太

第10章內插器/FOWLP市場：依地區

  • 介紹
  • 北美洲
    • 景氣衰退對北美市場的影響
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 景氣衰退對歐洲市場的影響
    • 英國
    • 德國
    • 法國
    • 歐洲其他地區
  • 亞太地區
    • 景氣衰退對亞太市場的影響
    • 中國
    • 日本
    • 韓國
    • 其他亞太地區
  • 其他地區
    • 景氣衰退對其他地區市場的影響
    • 中東/非洲
    • 南美洲

第11章競爭形勢

  • 介紹
  • 主要企業採取的策略（2020-2023）
    • 擴大產品系列
    • 擴大區域足跡
    • 有機/無機成長
  • 市場佔有率分析（2023）
  • 內插器/FOWLP市場主要企業收益分析（2018-2022）
  • 企業評估矩陣（2023）
  • Start-Ups/中小企業評估矩陣（2023）
  • 競爭現狀及趨勢
    • 產品發表會
    • 交易

第12章 公司簡介

  • 介紹
  • 主要企業
    • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    • SAMSUNG
    • ASE TECHNOLOGY HOLDING CO., LTD.
    • AMKOR TECHNOLOGY
    • SK HYNIX INC.
    • GLOBAL FOUNDRIES INC.
    • DECA TECHNOLOGIES
    • JCET GROUP LTD.
    • POWERTECH TECHNOLOGY INC.
    • ADVANCED MICRO DEVICES, INC.
  • 其他公司
    • NEXLOGIC TECHNOLOGIES INC.
    • SPTS TECHNOLOGIES LTD.
    • TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    • SAMTEC
    • TELEDYNE DIGITAL IMAGING INC.
    • OKMETIC
    • AMS-OSRAM AG
    • NEPES
    • NHANCED SEMICONDUCTORS
    • DUPONT
    • ALLVIA INC.
    • UNITED MICROELECTRONICS CORPORATION
    • DAI NIPPON PRINTING CO., LTD.
    • RENA TECHNOLOGIES GMBH
    • MURATA MANUFACTURING CO., LTD

第13章附錄

簡介目錄
Product Code: SE 5184

The global interposer and FOWLP market is expected to be valued at USD 35.6 billion in 2024 and is projected to reach USD 63.5 billion by 2029; it is expected to grow at a CAGR of 12.3% from 2024 to 2029. Increasing demand for advanced packaging in AI and high-performance computing serves as a significant driver for the Interposer and FOWLP market.

Scope of the Report
Years Considered for the Study2020-2029
Base Year2023
Forecast Period2024-2029
Units ConsideredValue (USD Billion)
SegmentsBy Component, Offering, Industry and Re By Packaging Component & Design, Device, Industry and Region
Regions coveredAsia Pacific, North America, Europe, RoW

"3D packaging by packaging type segment to account higher CAGR in Interposer and FOWLP market during the forecast period"

The semiconductor packaging industry is witnessing a surge in 3D packaging due to its ability to enhance performance, reduce form factor, and address challenges associated with traditional 2D packaging. As demand for compact and powerful electronic devices increases, 3D packaging technologies, such as stacked integrated circuits and through-silicon vias, are gaining prominence for their efficiency in meeting these evolving market needs.

"Consumer Electronics to hold the largest share in Interposer and FOWLP market in 2029"

Semiconductor packaging plays a crucial role in consumer electronics by enabling miniaturization, improved performance, and energy efficiency. The demand for smaller, more powerful, and energy-efficient devices, such as smartphones and wearables, is driving continuous innovation in semiconductor packaging technologies to meet the evolving requirements of the consumer electronics market.

"Asia Pacific region growing at highest CAGR in Interposer and FOWLP market"

The growth of semiconductor packaging in Asia Pacific can be attributed to the region's strong presence in electronics manufacturing, the availability of skilled labor, and the establishment of advanced packaging facilities by major semiconductor companies seeking cost-effective production and proximity to key markets. Additionally, supportive government policies and investment in research and development contribute to the region's prominence in semiconductor packaging.

The study contains insights from various industry experts, ranging from component suppliers to Tier 1 companies and OEMs. The break-up of the primaries is as follows:

  • By Company Type: Tier 1 - 38%, Tier 2 - 28%, and Tier 3 - 34%
  • By Designation: C-level Executives - 40%, Directors - 30%, and Others - 30%
  • By Region: North America - 35%, Europe - 20%, Asia Pacific - 35%, and RoW - 10%

The key players operating in the Interposer and FOWLP market are Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), among others.

Research Coverage:

The research reports the Interposer and FOWLP Market, by Packaging Component & Design (Interposer, FOWLP); Packaging Type (2.5D,3D); Device Type (Logic ICs, Imaging & Optoelectronics, LEDs, MEMS/Sensors, Memory Devices and Other Device Types), End-user Industry (Consumer Electronics, Communications, Manufacturing, Automotive, Medical Devices, Aerospace); Region (North America, Europe, Asia Pacific, RoW)

The scope of the report covers detailed information regarding the major factors, such as drivers, restraints, challenges, and opportunities, influencing the growth of the interposer and FOWLP market. A detailed analysis of the key industry players has been done to provide insights into their business overviews, products, key strategies, contracts, partnerships, and agreements. New product & service launches, mergers and acquisitions, and recent developments associated with the Interposer and FOWLP market. Competitive analysis of upcoming startups in the Interposer and FOWLP market ecosystem is covered in this report.

Key Benefits of Buying the Report

  • Analysis of key drivers (Rising trend of miniaturization and form factor requirements; Increasing demand for advanced packaging in AI and high-performance computing; Growing demand for consumer electronics and gaming devices; Cost advantages offered by advanced packaging), restraints (Environmental concerns due to the usage of certain materials and chemicals; Complex manufacturing process), opportunities (Growing demand for IoT devices and wearables; Integration of advanced electronics in automobiles), and challenges (Thermal issues in wafer level packaging; Complexities in supply chain) influencing the growth of the Interposer and FOWLP market.
  • Product Development/Innovation: Detailed insights on upcoming technologies, research and development activities, and new product launches in the Interposer and FOWLP market
  • Market Development: Comprehensive information about lucrative markets - the report analyses the Interposer and FOWLP market across varied regions.
  • Market Diversification: Exhaustive information about new products/services, untapped geographies, recent developments, and investments in the Interposer and FOWLP market
  • Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players like Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), among others in the interposers and FOWLP market.

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 STUDY OBJECTIVES
  • 1.2 MARKET DEFINITION
  • 1.3 INCLUSIONS AND EXCLUSIONS
  • 1.4 STUDY SCOPE
    • FIGURE 1 INTERPOSER AND FOWLP MARKET SEGMENTATION
    • 1.4.1 REGIONAL SCOPE
    • 1.4.2 YEARS CONSIDERED
    • 1.4.3 CURRENCY CONSIDERED
    • 1.4.4 UNITS CONSIDERED
  • 1.5 LIMITATIONS
  • 1.6 STAKEHOLDERS
  • 1.7 SUMMARY OF CHANGES
  • 1.8 IMPACT OF RECESSION

2 RESEARCH METHODOLOGY

  • 2.1 RESEARCH DATA
    • FIGURE 2 INTERPOSER AND FOWLP MARKET: RESEARCH DESIGN
    • 2.1.1 SECONDARY AND PRIMARY RESEARCH
    • 2.1.2 SECONDARY DATA
      • 2.1.2.1 List of major secondary sources
      • 2.1.2.2 Key data from secondary sources
    • 2.1.3 PRIMARY DATA
      • 2.1.3.1 Breakdown of primaries
      • 2.1.3.2 Key data from primary sources
      • 2.1.3.3 Key industry insights
      • 2.1.3.4 List of primary interview participants
  • 2.2 MARKET SIZE ESTIMATION METHODOLOGY
    • FIGURE 3 INTERPOSER AND FOWLP MARKET: MARKET SIZE ESTIMATION METHODOLOGY
    • 2.2.1 BOTTOM-UP APPROACH
      • 2.2.1.1 Approach to arrive at market size using bottom-up analysis (demand side)
    • FIGURE 4 INTERPOSER AND FOWLP MARKET: BOTTOM-UP APPROACH
    • 2.2.2 TOP-DOWN APPROACH
      • 2.2.2.1 Approach to arrive at market size using top-down analysis (supply side)
    • FIGURE 5 INTERPOSER AND FOWLP MARKET: TOP-DOWN APPROACH
    • FIGURE 6 INTERPOSER AND FOWLP MARKET: SUPPLY-SIDE ANALYSIS
  • 2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
    • FIGURE 7 INTERPOSER AND FOWLP MARKET: DATA TRIANGULATION
  • 2.4 RESEARCH ASSUMPTIONS
    • TABLE 1 INTERPOSER AND FOWLP MARKET: RESEARCH ASSUMPTIONS
  • 2.5 RESEARCH LIMITATIONS
    • FIGURE 8 INTERPOSER AND FOWLP MARKET: RESEARCH LIMITATIONS
  • 2.6 RISK ASSESSMENT
    • TABLE 2 INTERPOSER AND FOWLP MARKET: RISK ASSESSMENT
  • 2.7 PARAMETERS CONSIDERED TO ANALYZE RECESSION IMPACT ON INTERPOSER AND FOWLP MARKET
    • TABLE 3 INTERPOSER AND FOWLP MARKET: PARAMETERS CONSIDERED TO ANALYZE RECESSION IMPACT ON INTERPOSER AND FOWLP MARKET

3 EXECUTIVE SUMMARY

    • FIGURE 9 CONSUMER ELECTRONICS TO HOLD LARGEST SHARE OF INTERPOSER AND FOWLP MARKET IN 2029
    • FIGURE 10 MEMS/SENSORS TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
    • FIGURE 11 2.5D PACKAGING TYPE TO ACCOUNT FOR LARGER MARKET SHARE IN 2024
    • FIGURE 12 INTERPOSER AND FOWLP PACKAGING MARKET IN ASIA PACIFIC TO RECORD HIGHEST CAGR FROM 2024 TO 2029

4 PREMIUM INSIGHTS

  • 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN INTERPOSER AND FOWLP MARKET
    • FIGURE 13 GROWING DEMAND FOR CONSUMER ELECTRONICS AND GAMING DEVICES TO BOOST MARKET GROWTH
  • 4.2 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN
    • FIGURE 14 INTERPOSERS TO ACCOUNT FOR LARGER MARKET SHARE IN 2029
  • 4.3 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY
    • FIGURE 15 MEMORY DEVICES TO DOMINATE INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
  • 4.4 INTERPOSER AND FOWLP MARKET IN ASIA PACIFIC, BY END-USER INDUSTRY AND COUNTRY
    • FIGURE 16 CONSUMER ELECTRONICS END-USER INDUSTRY AND CHINA HELD LARGEST SHARES OF INTERPOSER AND FOWLP MARKET IN ASIA PACIFIC IN 2023
  • 4.5 INTERPOSER AND FOWLP MARKET, BY COUNTRY
    • FIGURE 17 CHINA TO REGISTER HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD

5 MARKET OVERVIEW

  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    • FIGURE 18 INTERPOSER AND FOWLP MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES
    • 5.2.1 DRIVERS
      • 5.2.1.1 Surging demand for miniaturized electronic devices
      • 5.2.1.2 Growing reliance on AI and high-performance computing technologies
      • 5.2.1.3 Rising popularity of esports and game streaming platforms
    • FIGURE 19 NUMBER OF GLOBAL SMARTPHONE AND MOBILE PHONE USERS, 2020-2025
      • 5.2.1.4 Increasing focus on developing advanced chip packaging techniques
    • FIGURE 20 IMPACT ANALYSIS: DRIVERS
    • 5.2.2 RESTRAINTS
      • 5.2.2.1 Environmental concerns associated with use of chemicals in interposer production facilities
      • 5.2.2.2 Requirement for advanced and high-cost manufacturing techniques
    • FIGURE 21 IMPACT ANALYSIS: RESTRAINTS
    • 5.2.3 OPPORTUNITIES
      • 5.2.3.1 Growing demand for wearable IoT devices
      • 5.2.3.2 Integration of advanced electronics into automobiles
    • FIGURE 22 IMPACT ANALYSIS: OPPORTUNITIES
    • 5.2.4 CHALLENGES
      • 5.2.4.1 Thermal issues in interposer and wafer-level packaging
      • 5.2.4.2 Managing complex semiconductor supply chain
    • FIGURE 23 IMPACT ANALYSIS: CHALLENGES
  • 5.3 SUPPLY CHAIN ANALYSIS
    • FIGURE 24 INTERPOSER AND FOWLP MARKET: SUPPLY CHAIN ANALYSIS
  • 5.4 ECOSYSTEM/MARKET MAP
    • FIGURE 25 KEY PLAYERS IN INTERPOSER AND FOWLP ECOSYSTEM
    • TABLE 4 COMPANIES AND THEIR ROLES IN INTERPOSER AND FOWLP ECOSYSTEM
  • 5.5 PRICING ANALYSIS
    • 5.5.1 AVERAGE SELLING PRICE OF 12-INCH WAFERS OFFERED BY TWO KEY PLAYERS
    • FIGURE 26 AVERAGE SELLING PRICE OF 12-INCH WAFERS OFFERED BY TWO KEY PLAYERS (USD/THOUSAND UNITS)
    • 5.5.2 AVERAGE SELLING PRICE OF 12-INCH WAFERS
    • TABLE 5 AVERAGE SELLING PRICE OF 12-INCH WAFERS, 2019-2023 (USD/THOUSAND UNITS)
    • FIGURE 27 AVERAGE SELLING PRICE OF 12-INCH WAFERS, 2019-2023
    • 5.5.3 AVERAGE SELLING PRICE OF 12-INCH WAFERS, BY REGION
    • FIGURE 28 AVERAGE SELLING PRICE OF 12-INCH WAFERS, BY REGION, 2019-2023
  • 5.6 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS' BUSINESSES
    • FIGURE 29 INTERPOSER AND FOWLP MARKET: TRENDS/DISRUPTIONS IMPACTING CUSTOMERS' BUSINESSES
  • 5.7 TECHNOLOGY ANALYSIS
    • 5.7.1 3D STACKING
    • 5.7.2 FAN-OUT PANEL-LEVEL PACKAGING
    • 5.7.3 MONOLITHIC 3D
    • 5.7.4 3D IC
  • 5.8 PORTER'S FIVE FORCES ANALYSIS
    • FIGURE 30 INTERPOSER AND FOWLP MARKET: PORTER'S FIVE FORCES ANALYSIS
    • TABLE 6 INTERPOSER AND FOWLP MARKET: PORTER'S FIVE FORCES ANALYSIS
    • 5.8.1 INTENSITY OF COMPETITIVE RIVALRY
    • 5.8.2 BARGAINING POWER OF SUPPLIERS
    • 5.8.3 BARGAINING POWER OF BUYERS
    • 5.8.4 THREAT OF SUBSTITUTES
    • 5.8.5 THREAT OF NEW ENTRANTS
  • 5.9 KEY STAKEHOLDERS AND BUYING CRITERIA
    • 5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS
    • FIGURE 31 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USER INDUSTRIES
    • TABLE 7 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USER INDUSTRIES (%)
    • 5.9.2 BUYING CRITERIA
    • FIGURE 32 KEY BUYING CRITERIA FOR TOP 3 END-USER INDUSTRIES
    • TABLE 8 KEY BUYING CRITERIA FOR TOP 3 END-USER INDUSTRIES
  • 5.10 CASE STUDY ANALYSIS
    • 5.10.1 SPTS TECHNOLOGIES PARTNERS WITH IMEC TO REDUCE WAFER THINNING COSTS
    • 5.10.2 SEMICONDUCTOR FOUNDRY USES SPTS OMEGA RAPIER XE TO ENHANCE PRODUCTIVITY OF WAFER BACKSIDE VIA REVEAL PROCESS
    • 5.10.3 CHROMALOX, INC. DEVELOPS KAPTON HEATERS TO GAIN CONTROL OVER TEMPERATURE-SENSITIVE ETCHING CHEMICALS
  • 5.11 TRADE ANALYSIS
    • 5.11.1 IMPORT SCENARIO
    • FIGURE 33 IMPORT DATA FOR HS CODE 381800-COMPLIANT PRODUCTS, BY KEY COUNTRY, 2018-2022 (USD MILLION)
    • 5.11.2 EXPORT SCENARIO
    • FIGURE 34 EXPORT DATA FOR HS CODE 381800-COMPLIANT PRODUCTS, BY KEY COUNTRY, 2018-2022 (USD MILLION)
  • 5.12 PATENT ANALYSIS
    • FIGURE 35 INTERPOSER AND FOWLP MARKET: PATENTS APPLIED AND GRANTED, 2013-2023
    • TABLE 9 LIST OF PATENTS IN INTERPOSER AND FOWLP MARKET
  • 5.13 KEY CONFERENCES AND EVENTS, 2024-2025
    • TABLE 10 INTERPOSER AND FOWLP MARKET: LIST OF CONFERENCES AND EVENTS, 2024-2025
  • 5.14 TARIFF, REGULATORY LANDSCAPE, AND STANDARDS
    • 5.14.1 COUNTRY-WISE TARIFF FOR HS CODE 381800-COMPLIANT PRODUCTS
    • TABLE 11 MFN TARIFF FOR PRODUCTS UNDER HS CODE 381800 EXPORTED BY BRAZIL
    • 5.14.2 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 15 ROW: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • 5.14.3 REGULATIONS
      • 5.14.3.1 North America
      • 5.14.3.2 Europe
      • 5.14.3.3 Asia Pacific
      • 5.14.3.4 RoW
    • 5.14.4 STANDARDS

6 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN

  • 6.1 INTRODUCTION
    • FIGURE 36 INTERPOSERS TO REGISTER HIGHER CAGR BETWEEN 2024 AND 2029
    • TABLE 16 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020-2023 (USD BILLION)
    • TABLE 17 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024-2029 (USD BILLION)
  • 6.2 INTERPOSERS
    • TABLE 18 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020-2023 (USD BILLION)
    • TABLE 19 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024-2029 (USD BILLION)
    • TABLE 20 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT, 2020-2023 (USD MILLION)
    • TABLE 21 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT, 2024-2029 (USD MILLION)
    • TABLE 22 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 23 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
    • 6.2.1 SILICON
      • 6.2.1.1 Implementation of silicon interposers to stack multiple semiconductor dies in single package to foster segmental growth
    • 6.2.2 ORGANIC
      • 6.2.2.1 Adoption of organic interposers to facilitate effective thermal management to accelerate segmental growth
    • 6.2.3 GLASS
      • 6.2.3.1 Use of glass interposers to ensure high-speed electrical data transfer to fuel segmental growth
    • 6.2.4 CERAMIC
      • 6.2.4.1 Trend of electronic device miniaturization to augment demand for ceramic interposers
    • 6.2.5 OTHER INTERPOSERS
  • 6.3 FOWLP
    • 6.3.1 VERSATILITY AND FLEXIBLE DESIGN TO BOOST ADOPTION OF FOWLP TECHNOLOGY
    • TABLE 24 FOWLP: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020-2023 (USD BILLION)
    • TABLE 25 FOWLP: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024-2029 (USD BILLION)
    • TABLE 26 FOWLP: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 27 FOWLP: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
    • 6.3.2 SINGLE-DIE
    • 6.3.3 MULTI-DIE

7 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE

  • 7.1 INTRODUCTION
    • FIGURE 37 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE
    • FIGURE 38 3D PACKAGING TYPE TO DEPICT HIGHER CAGR FROM 2024 TO 2029
    • TABLE 28 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020-2023 (USD BILLION)
    • TABLE 29 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024-2029 (USD BILLION)
  • 7.2 2.5D
    • 7.2.1 ADOPTION OF 2.5D PACKAGING TECHNOLOGY TO ENHANCE PERFORMANCE OF COMPUTING SOLUTIONS TO DRIVE MARKET
    • TABLE 30 2.5D: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 31 2.5D: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 7.3 3D
    • 7.3.1 USE OF 3D PACKAGING SOLUTIONS IN ADVANCED SEMICONDUCTOR MANUFACTURING FACILITIES TO FUEL SEGMENTAL GROWTH
    • TABLE 32 3D: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 33 3D: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)

8 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE

  • 8.1 INTRODUCTION
    • FIGURE 39 MEMORY DEVICES TO DOMINATE INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD
    • TABLE 34 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020-2023 (USD BILLION)
    • TABLE 35 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024-2029 (USD BILLION)
  • 8.2 LOGIC ICS
    • 8.2.1 GROWING DEMAND FOR SMART HOME APPLIANCES TO CONTRIBUTE TO SEGMENTAL GROWTH
    • TABLE 36 LOGIC ICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 37 LOGIC ICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
  • 8.3 IMAGING & OPTOELECTRONICS
    • 8.3.1 RISING POPULARITY OF AUTONOMOUS VEHICLES TO ACCELERATE SEGMENTAL GROWTH
    • TABLE 38 IMAGING & OPTOELECTRONICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 39 IMAGING & OPTOELECTRONICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
  • 8.4 MEMORY DEVICES
    • 8.4.1 INCREASING DEMAND FOR SPECIALIZED AI AND ML HARDWARE COMPONENTS TO DRIVE MARKET
    • TABLE 40 MEMORY DEVICES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 41 MEMORY DEVICES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
  • 8.5 MEMS/SENSORS
    • 8.5.1 ESCALATING ADOPTION OF ADVANCED CONSUMER ELECTRONICS TO FOSTER SEGMENTAL GROWTH
    • TABLE 42 MEMS/SENSORS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 43 MEMS/SENSORS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
  • 8.6 LEDS
    • 8.6.1 INCREASING USE OF LEDS IN TELECOMMUNICATION DEVICES TO PROPEL MARKET
    • TABLE 44 LEDS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 45 LEDS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
  • 8.7 OTHER DEVICE TYPES
    • TABLE 46 OTHER DEVICE TYPES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 47 OTHER DEVICE TYPES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)

9 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY

  • 9.1 INTRODUCTION
    • FIGURE 40 AUTOMOTIVE END-USER INDUSTRY TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET FROM 2024 TO 2029
    • TABLE 48 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD BILLION)
    • TABLE 49 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD BILLION)
  • 9.2 CONSUMER ELECTRONICS
    • 9.2.1 SURGING DEMAND FOR SLEEK AND MULTIFUNCTIONAL ELECTRONIC GADGETS TO DRIVE MARKET
    • TABLE 50 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020-2023 (USD MILLION)
    • TABLE 51 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024-2029 (USD MILLION)
    • TABLE 52 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020-2023 (USD MILLION)
    • TABLE 53 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024-2029 (USD MILLION)
    • TABLE 54 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 55 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 9.3 MANUFACTURING
    • 9.3.1 ESCALATING ADOPTION OF SMART MANUFACTURING AND INDUSTRY 4.0 TECHNOLOGIES TO FUEL SEGMENTAL GROWTH
    • TABLE 56 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020-2023 (USD MILLION)
    • TABLE 57 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024-2029 (USD MILLION)
    • TABLE 58 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020-2023 (USD MILLION)
    • TABLE 59 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024-2029 (USD MILLION)
    • TABLE 60 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 61 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 9.4 COMMUNICATIONS
    • 9.4.1 INCREASING DEVELOPMENT OF DATA CENTERS TO CONTRIBUTE TO SEGMENTAL GROWTH
    • TABLE 62 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020-2023 (USD MILLION)
    • TABLE 63 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024-2029 (USD MILLION)
    • TABLE 64 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020-2023 (USD MILLION)
    • TABLE 65 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024-2029 (USD MILLION)
    • TABLE 66 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 67 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 9.5 AUTOMOTIVE
    • 9.5.1 RISING POPULARITY OF ELECTRIC VEHICLES TO ACCELERATE SEGMENTAL GROWTH
    • TABLE 68 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020-2023 (USD MILLION)
    • TABLE 69 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024-2029 (USD MILLION)
    • TABLE 70 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020-2023 (USD MILLION)
    • TABLE 71 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024-2029 (USD MILLION)
    • TABLE 72 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 73 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 9.6 HEALTHCARE
    • 9.6.1 RAPID ADVANCEMENTS IN WEARABLE HEALTHCARE DEVICES TO FOSTER SEGMENTAL GROWTH
    • TABLE 74 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020-2023 (USD MILLION)
    • TABLE 75 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024-2029 (USD MILLION)
    • TABLE 76 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020-2023 (USD MILLION)
    • TABLE 77 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024-2029 (USD MILLION)
    • TABLE 78 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 79 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 9.7 AEROSPACE
    • 9.7.1 INCREASING INTEGRATION OF COMPLEX SYSTEMS AND SENSORS INTO AIRCRAFT TO BOOST SEGMENTAL GROWTH
    • TABLE 80 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020-2023 (USD MILLION)
    • TABLE 81 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024-2029 (USD MILLION)
    • TABLE 82 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020-2023 (USD MILLION)
    • TABLE 83 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024-2029 (USD MILLION)
    • TABLE 84 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 85 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)

10 INTERPOSER AND FOWLP MARKET, BY REGION

  • 10.1 INTRODUCTION
    • FIGURE 41 ASIA PACIFIC TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET BETWEEN 2024 AND 2029
    • TABLE 86 INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD BILLION)
    • TABLE 87 INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD BILLION)
  • 10.2 NORTH AMERICA
    • FIGURE 42 NORTH AMERICA: INTERPOSER AND FOWLP MARKET SNAPSHOT
    • TABLE 88 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
    • TABLE 89 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
    • TABLE 90 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 91 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
    • TABLE 92 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020-2023 (USD MILLION)
    • TABLE 93 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024-2029 (USD MILLION)
    • 10.2.1 RECESSION IMPACT ON MARKET IN NORTH AMERICA
    • 10.2.2 US
      • 10.2.2.1 Rising focus on enhancing performance and functionality of electronic devices to drive market
    • 10.2.3 CANADA
      • 10.2.3.1 Growing emphasis on enhancing semiconductor design and manufacturing to contribute to market growth
    • 10.2.4 MEXICO
      • 10.2.4.1 Increasing investment in semiconductor R&D projects to fuel market growth
  • 10.3 EUROPE
    • FIGURE 43 EUROPE: INTERPOSER AND FOWLP MARKET SNAPSHOT
    • TABLE 94 EUROPE: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
    • TABLE 95 EUROPE: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
    • TABLE 96 EUROPE: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 97 EUROPE: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
    • TABLE 98 EUROPE: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020-2023 (USD MILLION)
    • TABLE 99 EUROPE: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024-2029 (USD MILLION)
    • 10.3.1 RECESSION IMPACT ON MARKET IN EUROPE
    • 10.3.2 UK
      • 10.3.2.1 Rapid advancement in 5G technology to foster market growth
    • 10.3.3 GERMANY
      • 10.3.3.1 Increased adoption of connected cars and smart home devices to accelerate market growth
    • 10.3.4 FRANCE
      • 10.3.4.1 Highly developed transport and communication networks to contribute to market growth
    • 10.3.5 REST OF EUROPE
  • 10.4 ASIA PACIFIC
    • FIGURE 44 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET SNAPSHOT
    • TABLE 100 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
    • TABLE 101 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
    • TABLE 102 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 103 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
    • TABLE 104 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020-2023 (USD MILLION)
    • TABLE 105 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024-2029 (USD MILLION)
    • 10.4.1 RECESSION IMPACT ON MARKET IN ASIA PACIFIC
    • 10.4.2 CHINA
      • 10.4.2.1 Increasing expansion of automobile and semiconductor manufacturing facilities to propel market
    • 10.4.3 JAPAN
      • 10.4.3.1 Rising production of advanced consumer electronics to boost market growth
    • 10.4.4 SOUTH KOREA
      • 10.4.4.1 Growing number of semiconductor fabrication plants to augment market growth
    • 10.4.5 REST OF ASIA PACIFIC
  • 10.5 ROW
    • TABLE 106 ROW: INTERPOSER AND FOWLP MARKET, BY REGION, 2020-2023 (USD MILLION)
    • TABLE 107 ROW: INTERPOSER AND FOWLP MARKET, BY REGION, 2024-2029 (USD MILLION)
    • TABLE 108 ROW: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020-2023 (USD MILLION)
    • TABLE 109 ROW: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024-2029 (USD MILLION)
    • TABLE 110 ROW: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020-2023 (USD MILLION)
    • TABLE 111 ROW: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024-2029 (USD MILLION)
    • 10.5.1 RECESSION IMPACT ON MARKET IN ROW
    • 10.5.2 MIDDLE EAST & AFRICA
      • 10.5.2.1 High commitment to technological innovation to contribute to market growth
    • 10.5.3 SOUTH AMERICA
      • 10.5.3.1 Increased R&D of advanced packaging technologies to propel market

11 COMPETITIVE LANDSCAPE

  • 11.1 INTRODUCTION
  • 11.2 STRATEGIES ADOPTED BY KEY PLAYERS, 2020-2023
    • TABLE 112 INTERPOSER AND FOWLP MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS, 2020-2023
    • 11.2.1 PRODUCT PORTFOLIO EXPANSION
    • 11.2.2 REGIONAL FOOTPRINT EXPANSION
    • 11.2.3 ORGANIC/INORGANIC GROWTH
  • 11.3 MARKET SHARE ANALYSIS, 2023
    • TABLE 113 INTERPOSER AND FOWLP MARKET: DEGREE OF COMPETITION
  • 11.4 REVENUE ANALYSIS OF KEY PLAYERS IN INTERPOSER AND FOWLP MARKET, 2018-2022
    • FIGURE 45 REVENUE ANALYSIS OF KEY PLAYERS IN INTERPOSER AND FOWLP MARKET, 2018-2022
  • 11.5 COMPANY EVALUATION MATRIX, 2023
    • 11.5.1 STARS
    • 11.5.2 EMERGING LEADERS
    • 11.5.3 PERVASIVE PLAYERS
    • 11.5.4 PARTICIPANTS
    • FIGURE 46 INTERPOSER AND FOWLP MARKET: COMPANY EVALUATION MATRIX, 2023
    • 11.5.5 COMPANY FOOTPRINT
    • TABLE 114 COMPANY PACKAGING TYPE FOOTPRINT (10 KEY COMPANIES)
    • TABLE 115 COMPANY PACKAGING COMPONENT AND DESIGN FOOTPRINT (10 KEY COMPANIES)
    • TABLE 116 COMPANY REGION FOOTPRINT (10 KEY COMPANIES)
    • TABLE 117 OVERALL COMPANY FOOTPRINT (10 KEY COMPANIES)
  • 11.6 START-UP/SME EVALUATION MATRIX, 2023
    • TABLE 118 INTERPOSER AND FOWLP MARKET: LIST OF KEY START-UPS/SMES
    • 11.6.1 PROGRESSIVE COMPANIES
    • 11.6.2 RESPONSIVE COMPANIES
    • 11.6.3 DYNAMIC COMPANIES
    • 11.6.4 STARTING BLOCKS
    • FIGURE 47 INTERPOSER AND FOWLP MARKET: START-UP/SME EVALUATION MATRIX, 2023
    • 11.6.5 COMPETITIVE BENCHMARKING
    • TABLE 119 INTERPOSER AND FOWLP MARKET: COMPETITIVE BENCHMARKING OF KEY START-UPS/SMES
  • 11.7 COMPETITIVE SITUATION AND TRENDS
    • 11.7.1 PRODUCT LAUNCHES
    • TABLE 120 INTERPOSER AND FOWLP MARKET: PRODUCT LAUNCHES, AUGUST 2020-NOVEMBER 2023
    • 11.7.2 DEALS
    • TABLE 121 INTERPOSER AND FOWLP MARKET: DEALS, FEBRUARY 2021-JANUARY 2024

12 COMPANY PROFILES

  • 12.1 INTRODUCTION
  • 12.2 KEY PLAYERS
  • (Business overview, Products/Solutions/Services offered, Recent developments, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses and Competitive threats)**
    • 12.2.1 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    • TABLE 122 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY OVERVIEW
    • FIGURE 48 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY SNAPSHOT
    • TABLE 123 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 124 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT LAUNCHES
    • TABLE 125 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: DEALS
    • 12.2.2 SAMSUNG
    • TABLE 126 SAMSUNG: COMPANY OVERVIEW
    • FIGURE 49 SAMSUNG: COMPANY SNAPSHOT
    • TABLE 127 SAMSUNG: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 128 SAMSUNG: PRODUCT LAUNCHES
    • TABLE 129 SAMSUNG: DEALS
    • 12.2.3 ASE TECHNOLOGY HOLDING CO., LTD.
    • TABLE 130 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY OVERVIEW
    • FIGURE 50 ASE TECHNOLOGY HOLDING CO. LTD.: COMPANY SNAPSHOT
    • TABLE 131 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 132 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCT LAUNCHES
    • TABLE 133 ASE TECHNOLOGY HOLDING CO., LTD.: DEALS
    • 12.2.4 AMKOR TECHNOLOGY
    • TABLE 134 AMKOR TECHNOLOGY: COMPANY OVERVIEW
    • FIGURE 51 AMKOR TECHNOLOGY: COMPANY SNAPSHOT
    • TABLE 135 AMKOR TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 136 AMKOR TECHNOLOGY: DEALS
    • TABLE 137 AMKOR TECHNOLOGY: OTHERS
    • 12.2.5 SK HYNIX INC.
    • TABLE 138 SK HYNIX INC.: COMPANY OVERVIEW
    • FIGURE 52 SK HYNIX INC.: COMPANY SNAPSHOT
    • TABLE 139 SK HYNIX INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 140 SK HYNIX INC.: PRODUCT LAUNCHES
    • 12.2.6 GLOBAL FOUNDRIES INC.
    • TABLE 141 GLOBAL FOUNDRIES INC.: COMPANY OVERVIEW
    • FIGURE 53 GLOBAL FOUNDRIES INC.: COMPANY SNAPSHOT
    • TABLE 142 GLOBAL FOUNDRIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 143 GLOBAL FOUNDRIES INC.: DEALS
    • TABLE 144 GLOBAL FOUNDRIES INC.: OTHERS
    • 12.2.7 DECA TECHNOLOGIES
    • TABLE 145 DECA TECHNOLOGIES: COMPANY OVERVIEW
    • TABLE 146 DECA TECHNOLOGIES: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 147 DECA TECHNOLOGIES: DEALS
    • 12.2.8 JCET GROUP LTD.
    • TABLE 148 JCET GROUP LTD.: COMPANY OVERVIEW
    • FIGURE 54 JCET GROUP LTD.: COMPANY SNAPSHOT
    • TABLE 149 JCET GROUP LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 150 JCET GROUP LTD.: PRODUCT LAUNCHES
    • TABLE 151 JCET GROUP LTD.: OTHERS
    • 12.2.9 POWERTECH TECHNOLOGY INC.
    • TABLE 152 POWERTECH TECHNOLOGY INC.: COMPANY OVERVIEW
    • FIGURE 55 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT
    • TABLE 153 POWERTECH TECHNOLOGY INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 154 POWERTECH TECHNOLOGY INC.: DEALS
    • 12.2.10 ADVANCED MICRO DEVICES, INC.
    • TABLE 155 ADVANCED MICRO DEVICES, INC.: COMPANY OVERVIEW
    • FIGURE 56 ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT
    • TABLE 156 ADVANCED MICRO DEVICES, INC.: PRODUCTS/SOLUTIONS/SERVICES
    • TABLE 157 ADVANCED MICRO DEVICES, INC.: PRODUCT LAUNCHES
  • 12.3 OTHER PLAYERS
    • 12.3.1 NEXLOGIC TECHNOLOGIES INC.
    • 12.3.2 SPTS TECHNOLOGIES LTD.
    • 12.3.3 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    • 12.3.4 SAMTEC
    • 12.3.5 TELEDYNE DIGITAL IMAGING INC.
    • 12.3.6 OKMETIC
    • 12.3.7 AMS-OSRAM AG
    • 12.3.8 NEPES
    • 12.3.9 NHANCED SEMICONDUCTORS
    • 12.3.10 DUPONT
    • 12.3.11 ALLVIA INC.
    • 12.3.12 UNITED MICROELECTRONICS CORPORATION
    • 12.3.13 DAI NIPPON PRINTING CO., LTD.
    • 12.3.14 RENA TECHNOLOGIES GMBH
    • 12.3.15 MURATA MANUFACTURING CO., LTD
  • *Details on Business overview, Products/Solutions/Services offered, Recent developments, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses and Competitive threats might not be captured in case of unlisted companies.

13 APPENDIX

  • 13.1 INSIGHTS FROM INDUSTRY EXPERTS
  • 13.2 DISCUSSION GUIDE
  • 13.3 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 13.4 CUSTOMIZATION OPTIONS
  • 13.5 RELATED REPORTS
  • 13.6 AUTHOR DETAILS