查看購物車
  • Simplified Chinese
  • English
  • Japanese
扇出封裝報告：2030 年趨勢、預測與競爭分析
市場調查報告書
商品編碼
1416475

扇出封裝報告：2030 年趨勢、預測與競爭分析

Fan Out Packaging Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

簡介目錄

扇出封裝趨勢和預測

預計到 2030 年，全球扇出封裝市場將達到 68 億美元，2024 年至 2030 年年複合成長率為 15.7%。該市場的主要驅動力包括由於高性能、高能源效率、薄型和小尺寸等外形封裝要求，在智慧型手機等佔地面積敏感設備中的應用不斷成長。全球扇出封裝市場未來性廣闊，OSAT、晶圓代工廠和IDM市場蘊含機會。

扇出封裝市場洞察

Lucintel 正在利用其晶圓級加工製造能力以及使用穿模互連開發 3D 結構的能力，包括高銅 (Cu) 柱、封裝通孔 (TPVS) 和先進的覆晶封裝技術。我們預計高密度扇出將繼續成為整個預測期內最大的部分，因為它有助於滿足要求。

晶圓代工廠將繼續成為該市場中最大的部分。

由於主要半導體製造商在該地區的存在，預計亞太地區在預測期內將出現最高的成長。

常問問題

Q.1 扇出封裝的市場規模有多大？

A1. 到 2030 年，全球扇出封裝市場預計將達到 68 億美元。

Q.2 扇出封裝市場的成長預測為何？

A2. 2024年至2030年，全球扇出封裝市場預計將以15.7%的年複合成長率成長。

Q.3 影響扇出封裝市場成長的關鍵因素有哪些？

A3. 該市場的主要驅動力是由於高性能、高能源效率、薄型和小尺寸等封裝要求，在智慧型手機等佔地面積敏感設備中的應用不斷成長。例如，

Q4.市場的主要細分市場是什麼？

A4. 扇出封裝市場未來性廣闊，OSAT、晶圓代工廠、IDM 領域都存在市場機會。

Q5. 市場上主要企業有哪些？

A5. 一些主要的扇出封裝公司如下：

  • Taiwan Semiconductor
  • Jiangsu Changjiang Electronics
  • Samsung Electro-Mechanics
  • Powertech Technology
  • Amkor Technology
  • Advanced Semiconductor
  • Nepes Corporation

Q6.未來最大的細分市場是什麼？

A6.Lucintel 規模較小，這要歸功於其晶圓級加工製造能力以及使用穿模互連開發 3D 結構的能力，例如高銅 (Cu) 柱、封裝通孔 (TPVS) 和先進的覆晶封裝技術。我們預測，高密度扇出將繼續成為整個預測期內最大的細分市場，因為它有助於滿足成長要求。

Q7. 未來五年預計哪個地區將成為最大的市場？

A7. 由於主要半導體製造商在該地區的存在，預計亞太地區在預測期內將出現最高成長。

Q8. 可以客製化報告嗎？

A8. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章全球扇出封裝市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球扇出封裝市場趨勢（2018-2023）與預測（2024-2030）
  • 按類型分類的全球扇出封裝市場
    • 核心扇出
    • 高密度扇出
    • 超密集扇出
  • 按營運商類型分類的全球扇出封裝市場
    • 200mm
    • 300mm
    • 控制板
  • 以經營模式分類的全球扇出封裝市場
    • OSAT
    • 晶圓代工廠
    • IDM

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球扇出封裝市場（按地區）
  • 北美扇出型封裝市場
  • 歐洲扇出型封裝市場
  • 亞太扇出封裝市場
  • 世界其他地區 (ROW) 扇出封裝市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 按類型分類的全球扇出封裝市場成長機會
    • 按載體類型分類的全球扇出封裝市場成長機會
    • 以經營模式分類的全球扇出型封裝市場成長機會
    • 全球扇出封裝市場的區域成長機會
  • 全球扇出封裝市場的新興趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球扇出封裝市場產能
    • 全球扇出封裝市場的合併、收購與合資企業
    • 認證和許可

第7章主要企業概況

  • Taiwan Semiconductor
  • Jiangsu Changjiang Electronics
  • Samsung Electro-Mechanics
  • Powertech Technology
  • Amkor Technology
  • Advanced Semiconductor
  • Nepes Corporation
簡介目錄

Fan Out Packaging Trends and Forecast

The future of the global fan out packaging market looks promising with opportunities in the OSAT, foundary, and IDM markets. The global fan out packaging market is expected to reach an estimated $6.8 billion by 2030 with a CAGR of 15.7% from 2024 to 2030. The major drivers for this market are growing applications in footprint sensitive devices like smartphones, owing to requirement of high performing, energy efficient, thin, and small form factor packages.

A more than 150-page report is developed to help in your business decisions.

Fan Out Packaging by Segment

The study includes a forecast for the global fan out packaging by type, carrier ttype, business model, and region

Fan Out Packaging Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Core Fan-Out
  • High-Density Fan-Out
  • Ultra High-density Fan Out

Fan Out Packaging Market by Carrier Type [Shipment Analysis by Value from 2018 to 2030]:

  • 200 mm
  • 300 mm
  • Panel

Fan Out Packaging Market by Business Model [Shipment Analysis by Value from 2018 to 2030]:

  • OSAT
  • Foundary
  • IDM

Fan Out Packaging Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Fan Out Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies fan out packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the fan out packaging companies profiled in this report include-

  • Taiwan Semiconductor
  • Jiangsu Changjiang Electronics
  • Samsung Electro-Mechanics
  • Powertech Technology
  • Amkor Technology
  • Advanced Semiconductor
  • Nepes Corporation

Fan Out Packaging Market Insights

Lucintel forecast that high-density fan out will remain the largest segment over the forecast period as it helps in meeting the requirement of miniaturization by fabrication capabilities of wafer-level processing along with its ability to develop 3D structures utilizing through-mold interconnects, such as tall copper (CU) pillars and through package vias (TPVS) and advanced flip chip packaging technologies.

Within this market, foundary will remain the largest segment.

APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturers in the region.

Features of the Global Fan Out Packaging Market

Market Size Estimates: Fan out packaging market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Fan out packaging market size by type, carrier type, business model, and region in terms of value ($B).

Regional Analysis: Fan out packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, carrier types, business models, and regions for the fan out packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the fan out packaging market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the fan out packaging market size?

Answer: The global fan out packaging market is expected to reach an estimated $6.8 billion by 2030.

Q.2 What is the growth forecast for fan out packaging market?

Answer: The global fan out packaging market is expected to grow with a CAGR of 15.7% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the fan out packaging market?

Answer: The major drivers for this market are growing applications in footprint sensitive devices like smartphones, owing to requirement of high performing, energy efficient, thin, and small form factor packages.

Q4. What are the major segments for fan out packaging market?

Answer: The future of the fan out packaging market looks promising with opportunities in the OSAT, foundary, IDM markets.

Q5. Who are the key fan out packaging market companies?

Answer: Some of the key fan out packaging companies are as follows:

  • Taiwan Semiconductor
  • Jiangsu Changjiang Electronics
  • Samsung Electro-Mechanics
  • Powertech Technology
  • Amkor Technology
  • Advanced Semiconductor
  • Nepes Corporation

Q6. Which fan out packaging market segment will be the largest in future?

Answer: Lucintel forecast that high-density fan out will remain the largest segment over the forecast period as it helps in meeting the requirement of miniaturization by fabrication capabilities of wafer-level processing along with its ability to develop 3D structures utilizing through-mold interconnects, such as tall copper (CU) pillars and through package vias (TPVS) and advanced flip chip packaging technologies.

Q7. In fan out packaging market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturers in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the fan out packaging market by type (core fan-out, high-density fan-out, and ultra high-density fan out), carrier type (200 mm, 300 mm, and panel), business model (OSAT, foundary, and IDM), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Fan Out Packaging Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Fan Out Packaging Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Fan Out Packaging Market by Type
    • 3.3.1: Core Fan-Out
    • 3.3.2: High-Density Fan-Out
    • 3.3.3: Ultra High-density Fan Out
  • 3.4: Global Fan Out Packaging Market by Carrier Type
    • 3.4.1: 200 mm
    • 3.4.2: 300 mm
    • 3.4.3: Panel
  • 3.5: Global Fan Out Packaging Market by Business Model
    • 3.5.1: OSAT
    • 3.5.2: Foundary
    • 3.5.3: IDM

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Fan Out Packaging Market by Region
  • 4.2: North American Fan Out Packaging Market
    • 4.2.1: North American Fan Out Packaging Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
    • 4.2.2: North American Fan Out Packaging Market by Business Model: OSAT, Foundary, and IDM
  • 4.3: European Fan Out Packaging Market
    • 4.3.1: European Fan Out Packaging Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
    • 4.3.2: European Fan Out Packaging Market by Business Model: OSAT, Foundary, and IDM
  • 4.4: APAC Fan Out Packaging Market
    • 4.4.1: APAC Fan Out Packaging Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
    • 4.4.2: APAC Fan Out Packaging Market by Business Model: OSAT, Foundary, and IDM
  • 4.5: ROW Fan Out Packaging Market
    • 4.5.1: ROW Fan Out Packaging Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
    • 4.5.2: ROW Fan Out Packaging Market by Business Model: OSAT, Foundary, and IDM

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Fan Out Packaging Market by Type
    • 6.1.2: Growth Opportunities for the Global Fan Out Packaging Market by Carrier Type
    • 6.1.3: Growth Opportunities for the Global Fan Out Packaging Market by Business Model
    • 6.1.4: Growth Opportunities for the Global Fan Out Packaging Market Region
  • 6.2: Emerging Trends in the Global Fan Out Packaging Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Fan Out Packaging Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Fan Out Packaging Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Taiwan Semiconductor
  • 7.2: Jiangsu Changjiang Electronics
  • 7.3: Samsung Electro-Mechanics
  • 7.4: Powertech Technology
  • 7.5: Amkor Technology
  • 7.6: Advanced Semiconductor
  • 7.7: Nepes Corporation