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1418207

記憶體構裝基板市場報告：2030 年趨勢、預測與競爭分析

Memory Package Substrate Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

記憶體構裝基板趨勢與預測

預計 2024 年至 2030 年，全球記憶體構裝基板市場將以 5.6% 的年複合成長率成長。該市場的主要驅動力是資料消耗的增加和雲端運算的採用、人工智慧和高效能運算的擴展以及半導體技術和記憶體封裝的進步。全球記憶體構裝基板市場未來性廣闊，非揮發性記憶體和揮發性記憶體領域都有市場機會。

內存構裝基板市場洞察

Lucintel 預測，由於其成本低且易於製造，線焊球柵陣列預計將在預測期內實現最高成長。

在這個市場中，非揮發性記憶體由於其實惠的價格和廣泛的應用預計將出現高速成長。

由於中國、台灣和韓國等國家擁有主要電子產品製造地，預計亞太地區在預測期內將出現最高成長。

常問問題

Q1.市場成長預測如何？

A1. 2024年至2030年，全球記憶體構裝基板市場預計將以5.6%的年複合成長率成長。

Q2.影響市場成長的主要促進因素有哪些？

A2. 該市場的主要驅動力是資料消耗的增加和雲端運算的採用、人工智慧和高效能運算的擴展以及半導體技術和記憶體封裝的進步。

Q3.市場的主要細分市場有哪些？

A3. 記憶體構裝基板市場未來性廣闊，非揮發性記憶體和揮發性記憶體領域均存在市場機會。

Q4.市場上主要企業有哪些？

A4.生產記憶體構裝基板的主要企業如下。

  • Nanya
  • Daeduck
  • Ibiden
  • Shinko
  • Toppan Printing
  • Kyocera
  • Kinsus
  • Doosan Electronic
  • Fujitsu Global
  • Korea Circuit

Q5.未來最大的細分市場是什麼？

A5.Lucintel 預測，由於其成本低且易於製造，線焊球柵陣列預計將在預測期內實現最高成長。

Q6. 未來五年預計哪個地區將成為最大的市場？

A6.由於Lectronics在中國、台灣和韓國等國家擁有主要製造地，因此亞太地區預計在預測期內將出現最高成長。

Q7. 可以客製化報告嗎？

A7. 是的，Lucintel 提供 10% 的客製化服務，無需額外費用。

目錄

第1章執行摘要

第2章全球記憶體構裝基板市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球構裝基板市場趨勢（2018-2023）與預測（2024-2030）
  • 按類型分類的全球記憶體構裝基板市場
    • 引線鍵合球柵陣列
    • 覆晶球柵陣列
    • 3D積體電路
    • 晶圓級晶片規模封裝
  • 按應用分類的全球記憶體構裝基板市場
    • 非揮發性記憶體
    • 揮發性記憶體

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球構裝基板市場（按地區）
  • 北美記憶體構裝基板市場
  • 歐洲構裝基板市場
  • 亞太地區構裝基板市場
  • 世界其他地區 (ROW) 記憶體構裝基板市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 按類型分類的全球記憶體構裝基板市場成長機會
    • 全球構裝基板市場成長機會（按應用）
    • 全球構裝基板市場成長機會（按地區）
  • 全球記憶體構裝基板市場新趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球構裝基板市場產能
    • 全球記憶體構裝基板市場併購及合資
    • 認證和許可

第7章主要企業概況

  • Nanya
  • Daeduck
  • Ibiden
  • Shinko
  • Toppan Printing
  • Kyocera
  • Kinsus
  • Doosan Electronic
  • Fujitsu Global
  • Korea Circuit
簡介目錄

Memory Package Substrate Trends and Forecast

The future of the global memory package substrate market looks promising with opportunities in the non-volatile memory and volatile memory markets. The global memory package substrate market is expected to grow with a CAGR of 5.6% from 2024 to 2030. The major drivers for this market are rising data consumption and adoption of cloud computing, expansion of artificial intelligence and high-performance computing, and advancements in semiconductor technology and memory packaging.

A more than 150-page report is developed to help in your business decisions.

Memory Package Substrate by Segment

The study includes a forecast for the global memory package substrate by type, application, and region.

Memory Package Substrate Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Wire Bond Ball-Grid Arrays
  • Flip Chip Ball Grid Arrays
  • Three-Dimensional Integrated Circuit
  • Wafer Level Chip Scale Package

Memory Package Substrate Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Non-Volatile Memory
  • Volatile Memory

Memory Package Substrate Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Memory Package Substrate Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies memory package substrate companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the memory package substrate companies profiled in this report include-

  • Nanya
  • Daeduck
  • Ibiden
  • Shinko
  • Toppan Printing
  • Kyocera
  • Kinsus
  • Doosan Electronic
  • Fujitsu Global
  • Korea Circuit

Memory Package Substrate Market Insights

Lucintel forecasts that wire bond ball-grid arrays is expected to witness the highest growth over the forecast period due to its lower cost and ease of manufacturing.

Within this market, non-volatile memory is expected to witness the higher growth due to its affordability and wider range of applications.

APAC is expected to witness highest growth over the forecast period due to presence of major electronics manufacturing hubs in countries like China, Taiwan, and South Korea.

Features of the Global Memory Package Substrate Market

Market Size Estimates: Memory package substrate market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Memory package substrate market size by type, application, and region in terms of value ($B).

Regional Analysis: Memory package substrate market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the memory package substrate market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the memory package substrate market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast for memory package substrate market?

Answer: The global memory package substrate market is expected to grow with a CAGR of 5.6% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the memory package substrate market?

Answer: The major drivers for this market are rising data consumption and adoption of cloud computing, expansion of artificial intelligence and high-performance computing and advancements in semiconductor technology and memory packaging.

Q3. What are the major segments for memory package substrate market?

Answer: The future of the memory package substrate market looks promising with opportunities in the non-volatile memory and volatile memory markets.

Q4. Who are the key memory package substrate market companies?

Answer: Some of the key memory package substrate companies are as follows.

  • Nanya
  • Daeduck
  • Ibiden
  • Shinko
  • Toppan Printing
  • Kyocera
  • Kinsus
  • Doosan Electronic
  • Fujitsu Global
  • Korea Circuit

Q5. Which memory package substrate market segment will be the largest in future?

Answer: Lucintel forecasts that wire bond ball-grid arrays is expected to witness the highest growth over the forecast period due to its lower cost and ease of manufacturing.

Q6. In memory package substrate market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to presence of major electronics manufacturing hubs in countries like China, Taiwan, and South Korea.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the memory package substrate market by type (wire bond ball-grid arrays, flip chip ball grid arrays, three-dimensional integrated circuit, and wafer level chip scale package), application (non-volatile memory and volatile memory), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Memory Package Substrate Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Memory Package Substrate Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Memory Package Substrate Market by Type
    • 3.3.1: Wire Bond Ball-Grid Arrays
    • 3.3.2: Flip Chip Ball Grid Arrays
    • 3.3.3: Three-Dimensional Integrated Circuit
    • 3.3.4: Wafer Level Chip Scale Package
  • 3.4: Global Memory Package Substrate Market by Application
    • 3.4.1: Non-Volatile Memory
    • 3.4.2: Volatile Memory

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Memory Package Substrate Market by Region
  • 4.2: North American Memory Package Substrate Market
    • 4.2.2: North American Memory Package Substrate Market by Application: Non-Volatile Memory and Volatile Memory
  • 4.3: European Memory Package Substrate Market
    • 4.3.1: European Memory Package Substrate Market by Type: Wire Bond Ball-Grid Arrays, Flip Chip Ball Grid Arrays, Three-Dimensional Integrated Circuit, and Wafer Level Chip Scale Package
    • 4.3.2: European Memory Package Substrate Market by Application: Non-Volatile Memory and Volatile Memory
  • 4.4: APAC Memory Package Substrate Market
    • 4.4.1: APAC Memory Package Substrate Market by Type: Wire Bond Ball-Grid Arrays, Flip Chip Ball Grid Arrays, Three-Dimensional Integrated Circuit, and Wafer Level Chip Scale Package
    • 4.4.2: APAC Memory Package Substrate Market by Application: Non-Volatile Memory and Volatile Memory
  • 4.5: ROW Memory Package Substrate Market
    • 4.5.1: ROW Memory Package Substrate Market by Type: Wire Bond Ball-Grid Arrays, Flip Chip Ball Grid Arrays, Three-Dimensional Integrated Circuit, and Wafer Level Chip Scale Package
    • 4.5.2: ROW Memory Package Substrate Market by Application: Non-Volatile Memory and Volatile Memory

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Memory Package Substrate Market by Type
    • 6.1.2: Growth Opportunities for the Global Memory Package Substrate Market by Application
    • 6.1.3: Growth Opportunities for the Global Memory Package Substrate Market by Region
  • 6.2: Emerging Trends in the Global Memory Package Substrate Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Memory Package Substrate Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Memory Package Substrate Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Nanya
  • 7.2: Daeduck
  • 7.3: Ibiden
  • 7.4: Shinko
  • 7.5: Toppan Printing
  • 7.6: Kyocera
  • 7.7: Kinsus
  • 7.8: Doosan Electronic
  • 7.9: Fujitsu Global
  • 7.10: Korea Circuit