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市場調查報告書
商品編碼
1418090

構裝基板市場報告：2030 年趨勢、預測與競爭分析

Package Substrate Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

構裝基板趨勢與預測

預計2024年至2030年全球構裝基板市場將以6.8%的年複合成長率成長。該市場的主要驅動力是電子設備小型化趨勢的日益成長、先進封裝技術的日益採用以及對高性能儲存設備的需求不斷增加。全球構裝基板市場前景廣闊，行動裝置和汽車市場蘊藏機會。

構裝基板市場洞察

Lucintel預測，由於覆晶尺寸封裝的導熱性提高和製造成本降低，預計在預測期內將實現最高成長。

由於通訊控制和資料處理應用的使用增加，汽車市場預計將出現高速成長。

由於主要半導體製造和電子生產中心的存在，預計亞太地區在預測期內將出現最高成長。

常問問題

Q1.市場成長預測如何？

A1. 2024年至2030年，全球構裝基板市場預計將以6.8%的年複合成長率成長。

Q2.影響市場成長的主要促進因素有哪些？

A2. 該市場的主要促進因素是電子設備小型化的趨勢日益明顯、先進封裝技術的採用不斷增加以及對高性能儲存設備的需求不斷增加。

Q3.市場的主要細分市場有哪些？

A3.全球構裝基板市場未來性廣闊，行動裝置市場和汽車市場都有機會。

Q4.市場上主要企業有哪些？

A4.構裝基板主要企業如下。

  • Ibiden
  • Shinko Electric Industries
  • Kyocera
  • Samsung Electro-Mechanics
  • Fujitsu
  • Hitachi
  • Eastern
  • LG Innotek
  • Simmtech
  • Daeduck

Q5.未來最大的細分市場是什麼？

A5.Lucintel 預測，由於導熱率的提高和製造成本的降低，覆晶級封裝預計將在預測期內出現最高的成長。

Q6. 未來五年預計哪個地區將成為最大的市場？

A6.由於主要半導體製造和電子生產中心的存在，預計亞太地區在預測期內將出現最高成長。

Q7. 可以客製化報告嗎？

A7. 是的，Lucintel 提供 10% 的客製化服務，無需額外費用。

目錄

第1章執行摘要

第2章 全球構裝基板市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球構裝基板市場趨勢（2018-2023）與預測（2024-2030）
  • 按類型分類的全球構裝基板市場
    • 覆晶
    • 焊線
    • 球超過尖端
    • 系統級封裝
    • 覆晶球柵陣列
  • 全球構裝基板市場（按應用）
    • 行動裝置
    • 汽車產業
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球構裝基板市場（按地區）
  • 北美構裝基板市場
  • 歐洲構裝基板市場
  • 亞太地區構裝基板市場
  • 其他地區構裝基板市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 按類型分類的全球構裝基板市場成長機會
    • 全球構裝基板市場成長機會（按應用）
    • 按地區分類的全球構裝基板市場成長機會
  • 全球構裝基板市場新趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球構裝基板市場產能
    • 全球構裝基板市場的合併、收購與合資
    • 認證和許可

第7章主要企業概況

  • Ibiden
  • Shinko Electric Industries
  • Kyocera
  • Samsung Electro-Mechanics
  • Fujitsu
  • Hitachi
  • Eastern
  • LG Innotek
  • Simmtech
  • Daeduck
簡介目錄

Package Substrate Trends and Forecast

The future of the global package substrate market looks promising with opportunities in the mobile device and automotive markets. The global package substrate market is expected to grow with a CAGR of 6.8% from 2024 to 2030. The major drivers for this market are rising trend of miniaturization of electronic devices, growing adoption of advanced packaging technologies, and increasing demand for high-performance memory devices.

A more than 150-page report is developed to help in your business decisions.

Package Substrate by Segment

The study includes a forecast for the global package substrate by type, application, and region.

Package Substrate Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Flip Chip Chip Scale Package
  • Wire Bonding Chip Scale Package
  • Ball Over Chip
  • System In Package
  • Flip Chip-Ball Grid Array

Package Substrate Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Mobile Devices
  • Automotive Industry
  • Others

Package Substrate Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Package Substrate Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies package substrate companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the package substrate companies profiled in this report include-

  • Ibiden
  • Shinko Electric Industries
  • Kyocera
  • Samsung Electro-Mechanics
  • Fujitsu
  • Hitachi
  • Eastern
  • LG Innotek
  • Simmtech
  • Daeduck

Package Substrate Market Insights

Lucintel forecasts that flip chip chip scale package is expected to witness the highest growth over the forecast period due to its improved thermal conductivity and low manufacturing cost.

Within this market, automotive is expected to witness the higher growth due to increasing usage in communication control and data processing applications.

APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturing and electronics production hubs in the region.

Features of the Global Package Substrate Market

Market Size Estimates: Package substrate market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Package substrate market size by type, application, and region in terms of value ($B).

Regional Analysis: Package substrate market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the package substrate market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the package substrate market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast for package substrate market?

Answer: The global package substrate market is expected to grow with a CAGR of 6.8% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the package substrate market?

Answer: The major drivers for this market are rising trend of miniaturization of electronic devices, growing adoption of advanced packaging technologies, and increasing demand for high-performance memory devices.

Q3. What are the major segments for package substrate market?

Answer: The future of the global package substrate market looks promising with opportunities in the mobile device and automotive markets.

Q4. Who are the key package substrate market companies?

Answer: Some of the key package substrate companies are as follows.

  • Ibiden
  • Shinko Electric Industries
  • Kyocera
  • Samsung Electro-Mechanics
  • Fujitsu
  • Hitachi
  • Eastern
  • LG Innotek
  • Simmtech
  • Daeduck

Q5. Which package substrate market segment will be the largest in future?

Answer: Lucintel forecasts that flip chip chip scale package is expected to witness the highest growth over the forecast period due to its improved thermal conductivity and low manufacturing cost.

Q6. In package substrate market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturing and electronics production hubs in the region.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the package substrate market by type (flip chip chip scale package, wire bonding chip scale package, ball over chip, system in package, and flip chip-ball grid array), application (mobile devices, automotive industry, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Package Substrate Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Package Substrate Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Package Substrate Market by Type
    • 3.3.1: Flip Chip Chip Scale Package
    • 3.3.2: Wire Bonding Chip Scale Package
    • 3.3.3: Ball Over Chip
    • 3.3.4: System In Package
    • 3.3.5: Flip Chip-Ball Grid Array
  • 3.4: Global Package Substrate Market by Application
    • 3.4.1: Mobile Devices
    • 3.4.2: Automotive Industry
    • 3.4.3: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Package Substrate Market by Region
  • 4.2: North American Package Substrate Market
    • 4.2.2: North American Package Substrate Market by Application: Mobile Devices, Automotive Industry, and Others
  • 4.3: European Package Substrate Market
    • 4.3.1: European Package Substrate Market by Type: Flip Chip Chip Scale Package, Wire Bonding Chip Scale Package, Ball Over Chip, System In Package, and Flip Chip-Ball Grid Array
    • 4.3.2: European Package Substrate Market by Application: Mobile Devices, Automotive Industry, and Others
  • 4.4: APAC Package Substrate Market
    • 4.4.1: APAC Package Substrate Market by Type: Flip Chip Chip Scale Package, Wire Bonding Chip Scale Package, Ball Over Chip, System In Package, and Flip Chip-Ball Grid Array
    • 4.4.2: APAC Package Substrate Market by Application: Mobile Devices, Automotive Industry, and Others
  • 4.5: ROW Package Substrate Market
    • 4.5.1: ROW Package Substrate Market by Type: Flip Chip Chip Scale Package, Wire Bonding Chip Scale Package, Ball Over Chip, System In Package, and Flip Chip-Ball Grid Array
    • 4.5.2: ROW Package Substrate Market by Application: Mobile Devices, Automotive Industry, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Package Substrate Market by Type
    • 6.1.2: Growth Opportunities for the Global Package Substrate Market by Application
    • 6.1.3: Growth Opportunities for the Global Package Substrate Market by Region
  • 6.2: Emerging Trends in the Global Package Substrate Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Package Substrate Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Package Substrate Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Ibiden
  • 7.2: Shinko Electric Industries
  • 7.3: Kyocera
  • 7.4: Samsung Electro-Mechanics
  • 7.5: Fujitsu
  • 7.6: Hitachi
  • 7.7: Eastern
  • 7.8: LG Innotek
  • 7.9: Simmtech
  • 7.10: Daeduck