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市場調查報告書
商品編碼
1417286

封裝天線技術市場報告：趨勢、預測、競爭分析

Antenna-in-Package Technology Market Report: Trends, Forecast and Competitive Analysis
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

封裝天線技術的市場趨勢與預測

預計到 2030 年，全球封裝天線技術市場將達到 3.311 億美元，2024 年至 2030 年複合年成長率為 29.0%。該市場的主要驅動力是5G網路和物聯網的不斷部署、緊湊型高效能行動裝置的日益普及，以及視訊串流和線上遊戲對高速連接的需求不斷成長。全球封裝天線技術市場前景廣闊，行動通訊、人工智慧、汽車電子和物聯網市場充滿機會。

洞察封裝天線技術市場

Lucintel 預測，雙面封裝在預測期內將出現更高的成長，因為它可以提高訊號強度和頻率範圍。

由於自動駕駛汽車的普及，汽車電子將繼續成為該市場的最大細分市場。

由於對小型電子設備的需求不斷成長以及該地區領先公司的存在，亞太地區在整個預測期內仍將是最大的地區。

常問問題

Q.1 封裝天線技術的市場規模有多大？

A1. 到 2030 年，全球封裝天線技術市場預計將達到 3.311 億美元。

Q.2 封裝天線技術市場的成長預測為何：

A2. 2024年至2030年，全球封裝天線技術市場預計將以29.0%的複合年成長率成長。

Q.3 影響封裝天線技術市場成長的關鍵因素有哪些：

A3. 該市場的主要驅動力是 5G 網路和物聯網的不斷擴大部署、緊湊型高效能行動裝置的日益普及，以及視訊串流和線上遊戲對高速連接的需求不斷成長。

Q4.市場的主要細分市場是：

A4. 封裝天線技術市場前景廣闊，行動通訊、人工智慧、汽車電子、物聯網市場蘊藏機會。

Q5.市場的主要企業是：

A5. 一些主要的封裝天線技術公司是：

  • 3D Glass Solutions
  • Advanced Semiconductor Engineering
  • Amkor Technology
  • LitePoint
  • MediaTek
  • Metawave Corporation
  • MixComm
  • Murata Manufacturing
  • Powertech Technology
  • Samsung Electronics

Q6.未來最大的細分市場是什麼？

A6.Lucintel 預測，雙面封裝在預測期內將出現更高的成長，因為它可以提高訊號強度和頻率範圍。

Q7. 未來五年預計哪些地區的市場成長最大？

A7.由於小型電子產品的需求不斷成長以及該地區領先公司的存在，亞太地區在整個預測期內仍將是最大的地區。

Q8. 可以客製化報告嗎？

A8. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章全球封裝天線技術市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球封裝天線技術市場趨勢（2018-2023）與預測（2024-2030）
  • 按產品類型分類的全球封裝天線技術市場
    • 雙面封裝
    • 嵌入式裸晶片封裝
    • 其他
  • 全球封裝天線技術市場（依應用）
    • 行動通訊
    • AI
    • 汽車電子產品
    • IoT
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球封裝天線技術市場區域分佈
  • 北美封裝天線技術市場
  • 歐洲封裝天線技術市場
  • 亞太地區封裝天線技術市場
  • 其他地區封裝天線技術市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 按產品類型分類的全球封裝天線技術市場成長機會
    • 全球封裝天線技術市場成長機會（按應用）
    • 全球封裝天線技術市場的區域成長機會
  • 全球封裝天線技術市場新趨勢
  • 戰略分析
    • 新產品開發
    • 全球封裝天線技術市場產能擴張
    • 全球封裝天線技術市場的合併、收購與合資企業
    • 認證和許可

第7章主要企業概況

  • 3D Glass Solutions
  • Advanced Semiconductor Engineering
  • Amkor Technology
  • LitePoint
  • MediaTek
  • Metawave Corporation
  • MixComm
  • Murata Manufacturing
  • Powertech Technology
  • Samsung Electronics
簡介目錄

Antenna-in-Package Technology Market Trends and Forecast

The future of the global antenna-in-package technology market looks promising with opportunities in the mobile communication, AI, automotive electronic, and IOT markets. The global antenna-in-package technology market is expected to reach an estimated $331.1 million by 2030 with a CAGR of 29.0% from 2024 to 2030. The major drivers for this market are growing deployment of 5G networks and IOT, increasing adoption of compact and high-performance mobile devices ,and rising demand for high-speed connectivity for video streaming and online gaming.

A more than 150-page report is developed to help in your business decisions.

Antenna-in-Package Technology Market by Segment

The study includes a forecast for the global antenna-in-package technology market by product type, application, and region

Antenna-in-Package Technology Market by Product Type [Shipment Analysis by Value from 2018 to 2030]:

  • Double-sided Package
  • Embedded Bare-chip Package
  • Others

Antenna-in-Package Technology Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Mobile Communication
  • AI
  • Automotive Electronics
  • IoT
  • Others

Antenna-in-Package Technology Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Antenna-in-Package Technology Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies antenna-in-package technology companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the antenna-in-package technology companies profiled in this report include-

  • 3D Glass Solutions
  • Advanced Semiconductor Engineering
  • Amkor Technology
  • LitePoint
  • MediaTek
  • Metawave Corporation
  • MixComm
  • Murata Manufacturing
  • Powertech Technology
  • Samsung Electronics
  • Taiwan Semiconductor Manufacturing Company

Antenna-in-Package Technology Market Insights

Lucintel forecasts that double-sided package is expected to witness higher growth over the forecast period as it enables increased signal strength and frequency range.

Within this market, automotive electronics will remain the largest segment due to increasing adoption of autonomous vehicles.

APAC will remain the largest region over the forecast period due to growing demand for miniaturizied electronic device and presence of major players in the region..

Features of the Global Antenna-in-Package Technology Market

Market Size Estimates: Antenna-in-package technology market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Antenna-in-package technology market size by type, application, and region in terms of value ($B).

Regional Analysis: Antenna-in-package technology market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different product types, applications, and regions for the antenna-in-package technology market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the antenna-in-package technology market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the antenna-in-package technology market size?

Answer: The global antenna-in-package technology market is expected to reach an estimated $331.1 million by 2030.

Q.2 What is the growth forecast for antenna-in-package technology market?

Answer: The global antenna-in-package technology market is expected to grow with a CAGR of 29.0% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the antenna-in-package technology market?

Answer: The major drivers for this market are growing deployment of 5g networks and iot increasing adoption of compact and high-performance mobile devices rising demand for high-speed connectivity for video streaming and online gaming.

Q4. What are the major segments for antenna-in-package technology market?

Answer: The future of the antenna-in-package technology market looks promising with opportunities in the mobile communication, AI, automotive electronic, and IOT markets.

Q5. Who are the key antenna-in-package technology market companies?

Answer: some of the key antenna-in-package technology companies are as follows.

  • 3D Glass Solutions
  • Advanced Semiconductor Engineering
  • Amkor Technology
  • LitePoint
  • MediaTek
  • Metawave Corporation
  • MixComm
  • Murata Manufacturing
  • Powertech Technology
  • Samsung Electronics

Q6. Which antenna-in-package technology market segment will be the largest in future?

Answer: Lucintel forecasts that double-sided package is expected to witness higher growth over the forecast period as it enables increased signal strength and frequency range.

Q7. In antenna-in-package technology market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period due to growing demand for miniaturizied electronic device and presence of major players in the region..

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the antenna-in-package technology market by type (double-sided package, embedded bare-chip package, and others), application (mobile communication, AI, automotive electronics, IOT, and other), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Antenna-in-Package Technology Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Antenna-in-Package Technology Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Antenna-in-Package Technology Market by Product Type
    • 3.3.1: Double-sided Package
    • 3.3.2: Embedded Bare-chip Package
    • 3.3.3: Others
  • 3.4: Global Antenna-in-Package Technology Market by Application
    • 3.4.1: Mobile Communication
    • 3.4.2: AI
    • 3.4.3: Automotive Electronics
    • 3.4.4: IoT
    • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Antenna-in-Package Technology Market by Region
  • 4.2: North American Antenna-in-Package Technology Market
    • 4.2.1: North American Antenna-in-Package Technology Market by Product Type: Double-sided Package, Embedded Bare-chip Package, and Others
    • 4.2.2: North American Antenna-in-Package Technology Market by Application: Mobile Communication, AI, Automotive Electronics, IoT, and Others
  • 4.3: European Antenna-in-Package Technology Market
    • 4.3.1: European Antenna-in-Package Technology Market by Product Type: Double-sided Package, Embedded Bare-chip Package, and Others
    • 4.3.2: European Antenna-in-Package Technology Market by Application: Mobile Communication, AI, Automotive Electronics, IoT, and Others
  • 4.4: APAC Antenna-in-Package Technology Market
    • 4.4.1: APAC Antenna-in-Package Technology Market by Product Type: Double-sided Package, Embedded Bare-chip Package, and Others
    • 4.4.2: APAC Antenna-in-Package Technology Market by Application: Mobile Communication, AI, Automotive Electronics, IoT, and Others
  • 4.5: ROW Antenna-in-Package Technology Market
    • 4.5.1: ROW Antenna-in-Package Technology Market by Product Type: Double-sided Package, Embedded Bare-chip Package, and Others
    • 4.5.2: ROW Antenna-in-Package Technology Market by Application: Mobile Communication, AI, Automotive Electronics, IoT, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Antenna-in-Package Technology Market by Product Type
    • 6.1.2: Growth Opportunities for the Global Antenna-in-Package Technology Market by Application
    • 6.1.3: Growth Opportunities for the Global Antenna-in-Package Technology Market Region
  • 6.2: Emerging Trends in the Global Antenna-in-Package Technology Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Antenna-in-Package Technology Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Antenna-in-Package Technology Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: 3D Glass Solutions
  • 7.2: Advanced Semiconductor Engineering
  • 7.3: Amkor Technology
  • 7.4: LitePoint
  • 7.5: MediaTek
  • 7.6: Metawave Corporation
  • 7.7: MixComm
  • 7.8: Murata Manufacturing
  • 7.9: Powertech Technology
  • 7.10: Samsung Electronics