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3D 積體電路和矽穿孔電極(TSV) 互連市場報告：2030 年趨勢、預測與競爭分析

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

3D 積體電路和矽穿孔電極(TSV) 互連的趨勢和預測

至2030年，全球3D積體電路和矽穿孔電極(TSV)互連市場預計將達到373億美元，2024年至2030年的年複合成長率為10.7%。該市場的主要驅動力是日益成長的節能需求。消耗和密度不斷增加，3D 積體電路和 TSV 互連解決方案的採用增加，以及對高效能和小型化電子設備的需求不斷成長。全球 3D 積體電路和矽穿孔電極(TSV) 互連市場的未來前景廣闊，在軍事、航太和國防、消費性電器產品、資訊和通訊技術以及汽車市場中蘊藏著機會。

深入了解 3D 積體電路和矽穿孔電極(TSV) 互連市場

Lucintel 預計，在整個預測期內，絕緣體上矽將繼續成為更大的細分市場。

在該市場中，航太和國防預計將在預測期內實現最高成長。

由於智慧型手機製造對矽晶圓的需求不斷增加以及該地區 5G 技術的採用不斷增加，預計亞太地區在整個預測期內仍將是最大的地區。

常問問題

Q.1 3D 積體電路和矽穿孔電極(TSV) 互連的市場規模有多大？

A1. 到 2030 年，全球 3D 積體電路和矽穿孔電極(TSV) 互連市場預計將達到 373 億美元。

Q.2 3D積體電路和矽穿孔電極（TSV）互連市場的成長預測是什麼？

A2.全球3D 積體電路和矽穿孔電極(TSV) 互連市場預計 2024 年至 2030 年年複合成長率為 10.7%。

Q.3 影響 3D 積體電路和矽穿孔電極(TSV) 互連市場成長的關鍵因素有哪些：

A3. 該市場的主要驅動力是對降低消費量和增加密度的需求不斷成長、3D 整合電路和 TSV 互連解決方案的採用不斷增加，以及對高性能和小型化電子設備的需求不斷成長。

Q4.市場的主要細分市場是：

A4. 3D 積體電路和矽穿孔電極(TSV) 互連市場的未來前景廣闊，在軍事、航太和國防、消費性電器產品、資訊與通訊技術以及汽車市場中都有機遇。

Q5.市場的主要企業是：

A5. 一些主要的 3D 積體電路和矽穿孔電極(TSV) 互連公司包括：

  • Amkor Technology
  • Elpida Memory
  • Intel Corporation
  • Micron Technology
  • Monolithic 3d
  • Renesas Electronics Corporation

Q6.未來最大的細分市場是什麼？

A6.Lucintel 預計，由於以下因素的影響，絕緣體上矽在整個預測期內仍將佔據更大的市場佔有率：

Q7.未來五年預計哪些地區的市場成長最大？

A7.由於智慧型手機製造對矽晶圓的需求不斷增加以及該地區5G技術的採用不斷增加，預計亞太地區在整個預測期內仍將是最大的地區。

Q8. 可以客製化報告嗎？

A8. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章全球3D積體電路與矽穿孔電極（TSV）互連市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球3D積體電路與矽穿孔電極（TSV）互連市場趨勢（2018-2023）與預測（2024-2030）
  • 按技術分類的全球 3D 積體電路和矽穿孔電極(TSV) 互連市場
    • 矽晶絕緣體
    • 體矽
  • 全球 3D 積體電路和矽穿孔電極(TSV) 互連市場（依產品）
    • 記憶
    • 發光二極體
    • 感應器
    • 電源和類比元件
    • 電子機械系統
    • 其他
  • 全球 3D 積體電路和使用鍵合技術的矽穿孔電極孔 (TSV) 互連市場
    • 晶粒
    • 晶粒到晶圓
    • 晶圓到晶圓
    • 直接綁定
    • 用黏劑
    • 金屬結合劑
  • 全球 3D 積體電路和矽穿孔電極(TSV) 互連市場（依應用）
    • 軍隊
    • 航太和國防
    • 家用電器
    • 資訊和通訊技術
    • 車
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球3D積體電路與矽穿孔電極（TSV）互連市場（按地區）
  • 北美3D積體電路與矽穿孔電極（TSV）互連市場
  • 歐洲3D積體電路與矽穿孔電極(TSV)互連市場
  • 亞太地區 3D 積體電路和矽穿孔電極(TSV) 互連市場
  • 其他地區3D積體電路與矽穿孔電極（TSV）互連市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 全球 3D 積體電路和矽穿孔電極(TSV) 互連市場成長機會（按技術）
    • 全球 3D 積體電路和矽穿孔電極(TSV) 互連市場成長機會（依產品）
    • 全球 3D 積體電路和透過鍵合技術矽穿孔電極(TSV) 互連市場的成長機會
    • 全球 3D 積體電路與矽穿孔電極(TSV) 互連市場成長機會（依應用）
    • 全球 3D 積體電路和矽穿孔電極(TSV) 互連市場成長機會（按地區）
  • 全球 3D 積體電路和矽穿孔電極(TSV) 互連市場的新興趨勢
  • 戰略分析
    • 新產品開發
    • 全球3D積體電路與矽穿孔電極(TSV)互連市場產能擴張
    • 全球 3D 積體電路和矽穿孔電極(TSV) 互連市場的併購和合資企業
    • 認證和許可

第7章主要企業概況

  • Amkor Technology
  • Elpida Memory
  • Intel Corporation
  • Micron Technology
  • Monolithic 3d
  • Renesas Electronics Corporation
簡介目錄

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Trends and Forecast

The future of the global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market looks promising with opportunities in the military, aerospace and defense, consumer electronics, information and communication technology, and automotive markets. The global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market is expected to reach an estimated $37.3 billion by 2030 with a CAGR of 10.7% from 2024 to 2030. The major drivers for this market are increasing need for decreased energy consumption and enhanced density, growing adoption of 3D IC and TSV interconnect solutions, and rising demand of high-performance and miniaturized electronic devices.

A more than 150-page report is developed to help in your business decisions.

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect by Segment

The study includes a forecast for the global three-dimensional integrated circuit & through-silicon via (TSV) interconnect by technology, product, bonding technique, application, and region.

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology [Shipment Analysis by Value from 2018 to 2030]:

  • Silicon on Insulator
  • Bulk Silicon

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Product [Shipment Analysis by Value from 2018 to 2030]:

  • Memories
  • Light Emitting Diodes
  • Sensors
  • Power and Analog Components
  • Micro Electro Mechanical Systems
  • Others

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Bonding Technique [Shipment Analysis by Value from 2018 to 2030]:

  • Die to Die
  • Die to Wafer
  • Wafer to Wafer
  • Direct Bonding
  • Adhesive Bonding
  • Metallic Bonding

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Military
  • Aerospace and Defense
  • Consumer Electronics
  • Information and Communication Technology
  • Automotive
  • Others

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies three-dimensional integrated circuit & through-silicon via (TSV) interconnect companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the three-dimensional integrated circuit & through-silicon via (TSV) interconnect companies profiled in this report include-

  • Amkor Technology
  • Elpida Memory
  • Intel Corporation
  • Micron Technology
  • Monolithic 3D
  • Renesas Electronics Corporation

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market Insights

Lucintel forecasts that silicon on insulator will remain the larger segment over the forecast period.

Within this market, aerospace & defense is expected to witness the highest growth over the forecast period.

APAC will remain the largest region over the forecast period due to increasing need for silicon wafers in smartphone manufacturing and rising adoption of 5G technology in the region.

Features of the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market

Market Size Estimates: Three-dimensional integrated circuit & through-silicon via (TSV) interconnect market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Three-dimensional integrated circuit & through-silicon via (TSV) interconnect market size by technology, product, bonding technique, application, and region in terms of value ($B).

Regional Analysis: Three-dimensional integrated circuit & through-silicon via (TSV) interconnect market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different technologies, products, bonding techniques, applications, and regions for the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market size?

Answer: The global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market is expected to reach an estimated $37.3 billion by 2030.

Q.2 What is the growth forecast for three-dimensional integrated circuit & through-silicon via (TSV) interconnect market?

Answer: The global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market is expected to grow with a CAGR of 10.7% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market?

Answer: The major drivers for this market are increasing need for decreased energy consumption and enhanced density, growing adoption of 3D IC and TSV interconnect solutions, and rising demand of high-performance and miniaturized electronic devices.

Q4. What are the major segments for three-dimensional integrated circuit & through-silicon via (TSV) interconnect market?

Answer: The future of the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market looks promising with opportunities in the military, aerospace and defense, consumer electronics, information and communication technology, and automotive markets.

Q5. Who are the key three-dimensional integrated circuit & through-silicon Via (TSV) Interconnect market companies?

Answer: Some of the key three-dimensional integrated circuit & through-silicon via (TSV) interconnect companies are as follows:

  • Amkor Technology
  • Elpida Memory
  • Intel Corporation
  • Micron Technology
  • Monolithic 3d
  • Renesas Electronics Corporation

Q6. Which three-dimensional integrated circuit & through-silicon via (TSV) interconnect market segment will be the largest in future?

Answer: Lucintel forecasts that silicon on insulator will remain the larger segment over the forecast period due to .

Q7. In three-dimensional integrated circuit & through-silicon via (TSV) interconnect market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period due to increasing need for silicon wafers in smartphone manufacturing and rising adoption of 5G technology in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market by technology (silicon on insulator and bulk silicon), product (memories, light emitting diodes, sensors, power and analog components, micro electro mechanical systems, and others), bonding technique (die to die, die to wafer, wafer to wafer, direct bonding, adhesive bonding, and metallic bonding), application (military, aerospace and defense, consumer electronics, information and communication technology, automotive, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology
    • 3.3.1: Silicon on Insulator
    • 3.3.2: Bulk Silicon
  • 3.4: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Product
    • 3.4.1: Memories
    • 3.4.2: Light Emitting Diodes
    • 3.4.3: Sensors
    • 3.4.4: Power and Analog Components
    • 3.4.5: Micro Electro Mechanical Systems
    • 3.4.6: Others
  • 3.5: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Bonding Technique
    • 3.5.1: Die to Die
    • 3.5.2: Die to Wafer
    • 3.5.3: Wafer to Wafer
    • 3.5.4: Direct Bonding
    • 3.5.5: Adhesive Bonding
    • 3.5.6: Metallic Bonding
  • 3.6: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application
    • 3.6.1: Military
    • 3.6.2: Aerospace and Defense
    • 3.6.3: Consumer Electronics
    • 3.6.4: Information and Communication Technology
    • 3.6.5: Automotive
    • 3.6.6: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Region
  • 4.2: North American Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market
    • 4.2.2: North American Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application: Military, Aerospace and Defense, Consumer Electronics, Information and Communication Technology, Automotive, and Others
  • 4.3: European Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market
    • 4.3.1: European Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology: Silicon on Insulator and Bulk Silicon
    • 4.3.2: European Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application: Military, Aerospace and Defense, Consumer Electronics, Information and Communication Technology, Automotive, and Others
  • 4.4: APAC Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market
    • 4.4.1: APAC Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology: Silicon on Insulator and Bulk Silicon
    • 4.4.2: APAC Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application: Military, Aerospace and Defense, Consumer Electronics, Information and Communication Technology, Automotive, and Others
  • 4.5: ROW Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market
    • 4.5.1: ROW Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology: Silicon on Insulator and Bulk Silicon
    • 4.5.2: ROW Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application: Military, Aerospace and Defense, Consumer Electronics, Information and Communication Technology, Automotive, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology
    • 6.1.2: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Product
    • 6.1.3: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Bonding Technique
    • 6.1.4: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application
    • 6.1.5: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Region
  • 6.2: Emerging Trends in the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (Tsv) Interconnect Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (Tsv) Interconnect Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (Tsv) Interconnect Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Amkor Technology
  • 7.2: Elpida Memory
  • 7.3: Intel Corporation
  • 7.4: Micron Technology
  • 7.5: Monolithic 3d
  • 7.6: Renesas Electronics Corporation