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5G PCB市場報告：至2030年的趨勢、預測與競爭分析
市場調查報告書
商品編碼
1356393

5G PCB市場報告：至2030年的趨勢、預測與競爭分析

5G PCB Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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簡介目錄

5G PCB市場趨勢及預測

至2030年，全球5G PCB市場預計將達到436億美元，2024年至2030年的年複合成長率為15.4%。該市場的主要驅動力是對高速和低延遲技術的需求持續成長、對基於 5G PCB 的天線的日益偏好，以及汽車、通訊、消費性電子等各種最終用途領域對這些 PCB 的需求不斷成長、工業等，需求量巨大。全球5G PCB市場前景廣闊，汽車、通訊、家用電子電器和工業市場蘊藏商機。

5G PCB市場洞察

  • Lucintel 認為，高密度互連 (HDI) 在預測期內將是最好的，因為這些 PCB 因其高效能和可靠性以及處理高頻率和高速資料傳輸的能力而得到重要用途，預計在預測期內將出現成長。
  • 由於人們對先進通訊系統以及智慧型手機和平板電腦等連接設備的偏好增加，消費性電子產品預計將在預測期內實現最高成長。
  • 由於消費性電子和汽車產業的持續擴張，以及該地區資料中心和雲端基礎公司數量的不斷增加，亞太地區仍然是最大的地區。

本報告回答了 11 個關鍵問題：

  • Q.1.細分市場中最有前途和高成長的機會為何？
  • Q.2.哪個細分市場將以更快的速度成長？理由為何？
  • Q.3.哪些地區未來會出現更快的成長？理由為何？
  • Q.4.影響市場動態的主要因素有哪些？市場的主要挑戰和商業風險是什麼？
  • Q.5.這個市場的商業風險和競爭威脅為何？
  • Q.6.這個市場有哪些新趨勢？理由為何？
  • Q.7.市場客戶需求有何改變？
  • Q.8.該市場有哪些新發展以及哪些公司處於領先地位？
  • Q.9.這個市場的主要企業有哪些？主要企業採取哪些策略配合措施來發展業務？
  • Q.10.該市場上的競爭產品有哪些，由於材料或產品替代導致市場佔有率下降的威脅有多大？
  • Q.11.過去年度發生了哪些併購事件，對產業產生了哪些影響？

目錄

第1章 執行摘要

第2章 全球5G PCB市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球5G PCB市場趨勢（2018-2023）與預測（2024-2030）
  • 按 PCB 類型分類的全球 5G PCB 市場
    • 一邊
    • 雙方
    • 多層
    • 高密度互連 (HDI)
    • 其他
  • 全球5G PCB市場（按基板）
    • 難的
    • 靈活的
    • 剛性-軟性
  • 全球 5G PCB 市場（依最終用途行業）
    • 汽車
    • 通訊
    • 家用電器
    • 工業
    • 其他

第4章 2018-2030年市場趨勢及預測分析（依地區）

  • 全球5G PCB市場區域分佈
  • 北美5G PCB市場
  • 歐洲5G PCB市場
  • 亞太5G PCB市場
  • 其他地區5G PCB市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 全球 5G PCB 市場成長機會（按 PCB 類型）
    • 全球 5G PCB 市場成長機會（按基板）
    • 全球 5G PCB 市場成長機會（依最終用途產業）
    • 全球 5G PCB 市場成長機會（依區域）
  • 全球5G PCB市場新趨勢
  • 戰略分析
    • 新產品開發
    • 全球5G PCB市場產能擴張
    • 全球5G PCB市場合併與收購
    • 認證和許可

第7章 主要企業概況

  • Panasonic Industry
  • Xinfeng Huihe Circuits
  • Chin Poon Industrial
  • Tripod Technology
  • Shennan Circuits
  • WUS Printed Circuit
  • Kinsus
  • Zhen Ding Technology
  • Hannstar Board
  • Compeq Manufacturing
簡介目錄

5G PCB Market Trends and Forecast

The future of the global 5G PCB market looks promising with opportunities in the automotive, telecommunication, consumer electronics, and industrial markets. The global 5G PCB market is expected to reach an estimated $43.6 billion by 2030 with a CAGR of 15.4% from 2024 to 2030. The major drivers for this market are continual growth in demand for high-speed and low-latency technologies, growing preference for 5G PCB based antennas ,and significant demand for these PCBs in various end use sectors, such as automotive, telecommunication, consumer electronics, and industrial.

A more than 150-page report is developed to help in your business decisions.

5G PCB Market by Segment

The study includes a forecast for the global 5G PCB market by PCB type, substrate, end use industry, and region.

5G PCB Market by PCB Type [Shipment Analysis by Value from 2018 to 2030]:

  • Single-Sided
  • Double-Sided
  • Multi-Layered
  • High-Density Interconnect (HDI)
  • Others

5G PCB Market by Substrate [Shipment Analysis by Value from 2018 to 2030]:

  • Rigid
  • Flexible
  • Rigid-flexible

5G PCB Market by End Use Industry [Shipment Analysis by Value from 2018 to 2030]:

  • Automotive
  • Telecommunication
  • Consumer Electronics
  • Industrial
  • Others

5G PCB Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of 5G PCB Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies 5G PCB companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the 5G PCB companies profiled in this report include-

  • Panasonic Industry
  • Xinfeng Huihe Circuits
  • Chin Poon Industrial
  • Tripod Technology
  • Shennan Circuits
  • WUS Printed Circuit
  • Kinsus
  • Zhen Ding Technology
  • Hannstar Board
  • Compeq Manufacturing

5G PCB Market Insights

  • Lucintel forecast that high-density interconnect (HDI)is expected to witness highest growth over the forecast period due to its significant use of these PCBs owing to its high performance and reliability as well as the ability to handle high frequencies and high-speed data transmission.
  • Consumer electronics is expected to witness highest growth over the forecast perioddue to escalating preference for advanced communication systems and connected devices like smartphones and tablets.
  • APAC will remain the largest region due to continous expansion in consumer electronics and automotive industries and growing number of data centers and cloud based enterprises in the region.

Features of the Global 5G PCB Market

  • market Size Estimates: 5G PCB market size estimation in terms of value ($B).
  • Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
  • Segmentation Analysis: 5G PCB market size by PCB type, substrate,end use industry, and region in terms of value ($B).
  • Regional Analysis: 5G PCB market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
  • Growth Opportunities: Analysis of growth opportunities in different PCB type, substrate,end use industry, and region for the 5G PCB market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape of the 5G PCB market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1. What is the 5G PCB market size?

Answer: The global 5G PCB market is expected to reach an estimated $43.6 billion by 2030.

Q.2. What is the growth forecast for 5G PCB market?

Answer: The global 5G PCB market is expected to grow with a cagr of 15.4% from 2024 to 2030

Q.3. What are the major drivers influencing the growth of the 5G PCB market?

Answer: The major drivers for this market are continual growth in demand for high-speed and low-latency technologies growing preference for 5G PCB based antennas significant demand for these pcbs in various end use sectors, such as automotive, telecommunication, consumer electronics, and industrial

Q.4. What are the major segments for 5G PCB market?

Answer: The future of the 5G PCB market looks promising with opportunities in the automotive, telecommunication, consumer electronics, and industrialmarkets.

Q.5. Who are the key 5G PCB market companies?

Answer: Some of the key 5G PCB companies are as follows:

  • Panasonic Industry
  • Xinfeng Huihe Circuits
  • Chin Poon Industrial
  • Tripod Technology
  • Shennan Circuits
  • WUS Printed Circuit
  • Kinsus
  • Zhen Ding Technology
  • Hannstar Board
  • Compeq Manufacturing

Q.6. Which 5G PCB market segment will be the largest in future?

Answer: Lucintel forecast that high-density interconnect (HDI)is expected to witness highest growth over the forecast period due to its significant use of these pcbs owing to its high performance and reliability as well as the ability to handle high frequencies and high-speed data transmission.

Q.7. In 5G PCB market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region due to continous expansion in consumer electronics and automotive industries and growing number of data centers and cloud based enterprises in the region.

Q.8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the 5G PCB market by PCB type (single-sided, double-sided, multi-layered, high-density interconnect (HDI), and others), substrate (rigid, flexible, and rigid-flexible), end use industry (automotive, telecommunication, consumer electronics, industrial, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global 5G PCB Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global 5G PCB Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global 5G PCB Market by PCB Type
    • 3.3.1: Single-Sided
    • 3.3.2: Double-Sided
    • 3.3.3: Multi-Layered
    • 3.3.4: High-Density Interconnect (HDI)
    • 3.3.5: Others
  • 3.4: Global 5G PCB Market by Substrate
    • 3.4.1: Rigid
    • 3.4.2: Flexible
    • 3.4.3: Rigid-flexible
  • 3.5: Global 5G PCB Market by End Use Industry
    • 3.5.1: Automotive
    • 3.5.2: Telecommunication
    • 3.5.3: Consumer Electronics
    • 3.5.4: Industrial
    • 3.5.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global 5G PCB Market by Region
  • 4.2: North American 5G PCB Market
    • 4.2.1: North American 5G PCB Market by PCB Type: Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect (HDI), and Others
    • 4.2.2: North American 5G PCB Market by End Use Industry: Automotive, Telecommunication, Consumer Electronics, Industrial, and Others
  • 4.3: European 5G PCB Market
    • 4.3.1: European 5G PCB Market by PCB Type: Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect (HDI), and Others
    • 4.3.2: European 5G PCB Market by End Use Industry: Automotive, Telecommunication, Consumer Electronics, Industrial, and Others
  • 4.4: APAC 5G PCB Market
    • 4.4.1: APAC 5G PCB Market by PCB Type: Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect (HDI), and Others
    • 4.4.2: APAC 5G PCB Market by End Use Industry: Automotive, Telecommunication, Consumer Electronics, Industrial, and Others
  • 4.5: ROW 5G PCB Market
    • 4.5.1: ROW 5G PCB Market by PCB Type: Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect (HDI), and Others
    • 4.5.2: ROW 5G PCB Market by End Use Industry: Automotive, Telecommunication, Consumer Electronics, Industrial, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global 5G PCB Market by PCB Type
    • 6.1.2: Growth Opportunities for the Global 5G PCB Market by Substrate
    • 6.1.3: Growth Opportunities for the Global 5G PCB Market by End Use Industry
    • 6.1.4: Growth Opportunities for the Global 5G PCB Market Region
  • 6.2: Emerging Trends in the Global 5G PCB Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global 5G PCB Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global 5G PCB Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Panasonic Industry
  • 7.2: Xinfeng Huihe Circuits
  • 7.3: Chin Poon Industrial
  • 7.4: Tripod Technology
  • 7.5: Shennan Circuits
  • 7.6: WUS Printed Circuit
  • 7.7: Kinsus
  • 7.8: Zhen Ding Technology
  • 7.9: Hannstar Board
  • 7.10: Compeq Manufacturing