市場調查報告書
商品編碼
1418051
高性能剛性 PCB 市場報告:2030 年趨勢、預測與競爭分析High Performance Rigid PCB Market Report: Trends, Forecast and Competitive Analysis to 2030 |
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高性能剛性 PCB 趨勢與預測
預計2024年至2030年全球高性能剛性PCB市場將以4.6%的複合年成長率成長。該市場的主要促進因素是消費性電子、汽車、航太和通訊等各行業對高性能剛性 PCB 的需求不斷成長,電子產品、雲端運算、物聯網、5G 等領域的技術不斷發展和改進。以資料為中心的技術和應用(例如人工智慧)的快速成長。全球高性能剛性 PCB 市場的未來前景廣闊,航太、消費性電子、汽車、通訊、醫療和工業市場充滿機會。
Lucintel 預測,多層板將由多層導電材料與絕緣層粘合而成,從而實現單層或兩層基板不可能實現的具有高元件密度的高度複雜電路。預計在此期間將出現最高成長。
在預測期內,亞太地區可能仍然是最大的地區,因為它是中國、台灣和韓國等主要電子製造地的所在地。
Q1.市場成長預測如何?
A1. 2024年至2030年,全球高性能剛性PCB市場預計將以4.6%的複合年成長率成長。
Q2.影響市場成長的主要促進因素有哪些?
A2. 該市場的主要促進因素是消費性電子、汽車、航太和通訊等各行業對高性能剛性PCB的需求不斷成長,電子產品和雲端運算的不斷技術發展和改進。以資料為中心的技術和應用(例如物聯網、5G 和人工智慧)的成長。
Q3.市場的主要細分市場有哪些?
A3. 全球高性能剛性PCB市場前景廣闊,航太、消費性電子、汽車、通訊、醫療和工業市場充滿機會。
Q4.市場上主要企業有哪些?
A4. 主要高性能剛性PCB公司如下。
Q5.未來最大的細分市場是什麼?
A5.Lucintel認為,在預測期內,多層板由多層導電材料與絕緣層粘合而成,可以實現具有高密度元件的極其複雜的電路,這是單層或雙層基板無法實現的.預計將出現最高成長。
Q6. 未來五年預計哪個地區將成為最大的市場?
A6. 由於中國、台灣和韓國等主要電子製造地,預計亞太地區在預測期內仍將是最大的地區。
Q7. 可以客製化報告嗎?
A7. 是的,Lucintel 提供 10% 的客製化服務,無需額外付費。
High Performance Rigid PCB Trends and Forecast
The future of the global high performance rigid PCB market looks promising with opportunities in the aerospace, consumer electronics, automobile, communication, medical, and industrial markets. The global high performance rigid PCB market is expected to grow with a CAGR of 4.6% from 2024 to 2030. The major drivers for this market are growing need for high-performance rigid PCBs in a variety of industries, including consumer electronics, automotive, aerospace, and telecommunications, constant technical development and improvements in electronic gadgets, along with the exponential growth of data-centric technologies and applications, including cloud computing, IoT, 5G, and AI.
A more than 150-page report is developed to help in your business decisions.
High Performance Rigid PCB by Segment
The study includes a forecast for the global high performance rigid PCB by type, application, and region.
List of High Performance Rigid PCB Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies high performance rigid PCB companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the high performance rigid PCB companies profiled in this report include-
High Performance Rigid PCB
Lucintel forecasts that multi-layer is expected to witness highest growth over the forecast period because it consists of several layers of conductive material bonded together with insulating layers and this allows for incredibly complex circuitry with high component density, which is impossible to achieve with single or double-layer boards.
APAC will remain the largest region over the forecast period because the region is home to major electronics manufacturing hubs like China, Taiwan, and South Korea.
Features of the Global High Performance Rigid PCB Market
Market Size Estimates: High performance rigid pcb market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: High performance rigid pcb market size by type, application, and region in terms of value ($B).
Regional Analysis: High performance rigid pcb market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the high performance rigid PCB market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the high performance rigid PCB market.
Analysis of competitive intensity of the industry based on Porter's Five Forces model.
FAQ
Q1. What is the growth forecast for high performance rigid PCB market?
Answer: The global high performance rigid PCB market is expected to grow with a CAGR of 4.6% from 2024 to 2030.
Q2. What are the major drivers influencing the growth of the high performance rigid PCB market?
Answer: The major drivers for this market are growing need for high-performance rigid PCBs in a variety of industries, including consumer electronics, automotive, aerospace, and telecommunications, constant technical development and improvements in electronic gadgets, along with the exponential growth of data-centric technologies and applications, including cloud computing, IoT, 5G, and AI.
Q3. What are the major segments for high performance rigid PCB market?
Answer: The future of the global high performance rigid PCB market looks promising with opportunities in the aerospace, consumer electronics, automobile, communication, medical, and industrial markets.
Q4. Who are the key high performance rigid PCB market companies?
Answer: Some of the key high performance rigid PCB companies are as follows.
Q5. Which high performance rigid PCB market segment will be the largest in future?
Answer: Lucintel forecasts that multi-layer is expected to witness highest growth over the forecast period because it consists of several layers of conductive material bonded together with insulating layers and this allows for incredibly complex circuitry with high component density, which is impossible to achieve with single or double-layer boards.
Q6. In high performance rigid PCB market, which region is expected to be the largest in next 5 years?
Answer: APAC will remain the largest region over the forecast period because the region is home to major electronics manufacturing hubs like China, Taiwan, and South Korea.
Q7. Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.