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系統級封裝 (SiP) 技術市場：趨勢、機遇和競爭分析 [2023-2028]
市場調查報告書
商品編碼
1300747

系統級封裝 (SiP) 技術市場：趨勢、機遇和競爭分析 [2023-2028]

System in Package (SiP) Technology Market: Trends, Opportunities and Competitive Analysis [2023-2028]
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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簡介目錄

系統級封裝 (SiP) 技術市場趨勢和預測

到 2028 年，全球系統級封裝 (SiP) 技術市場預計將達到 402 億美元，2023 年至 2028 年復合年增長率為 10.2%。 該市場的主要驅動因素是小型電子設備需求的增長、物聯網設備數量的增加以及5G網絡連接設備的增長趨勢。 全球系統級封裝 (SiP) 技術市場前景廣闊，消費電子、汽車、通信、工業系統以及航空航天和國防市場充滿機遇。

系統級封裝 (SiP) 技術公司列表

同一市場中的公司通過其提供的產品質量進行競爭。 該市場的主要參與者專注於擴大製造設施、投資研發、開發基礎設施以及利用整個價值鏈的整合機會。 這些策略使系統級封裝 (SiP) 技術公司能夠滿足不斷增長的需求、保持競爭力、開發創新產品和技術、降低生產成本並擴大客戶群。 本報告中介紹的系統級封裝 (SiP) 技術公司包括：

系統級封裝 (SiP) 技術市場洞察

  • Lucintel 預測，3D IC 封裝在預測期內將繼續成為一個重要細分市場，因為與其他技術相比，3D IC 封裝具有更高的性能。
  • 由於智能手機和可穿戴設備的技術進步以及對小型電子設備的需求不斷增長，消費電子產品預計仍將是最大的細分市場。
  • 由於互聯設備的普及以及對機器人實現各種工作流程自動化以提高該地區效率的需求不斷增長，北美將繼續成為最大的地區。我會的。

本報告回答了 11 個關鍵問題：

  • Q.1. 該細分市場中最有前途和高增長的機會是什麼？
  • 問題 2：哪個細分市場將以更快的速度增長？為什麼？
  • 問題 3. 您認為哪些地區未來會出現更快的增長？為什麼？
  • Q.4.影響市場動態的主要因素有哪些？ 市場的主要挑戰和商業風險是什麼？
  • Q.5. 該市場存在哪些業務風險和競爭威脅？
  • Q.6.這個市場有哪些新趨勢？為什麼？
  • Q.7.市場客戶需求有何變化？
  • 問題8.您可以通過哪些方式開發新興市場？ 哪些公司正在引領這些發展？
  • Q.9.市場上的主要公司有哪些？ 主要公司採取哪些戰略舉措來發展業務？
  • Q.10. 該市場中的競爭產品有哪些？由於材料或產品替代而導致市場份額下降的威脅有多大？
  • Q.11.過去五年發生了哪些類型的併購，對行業產生了哪些影響？

目錄

第 1 章執行摘要

第 2 章全球系統級封裝 (SiP) 技術市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 行業驅動因素和挑戰

第三章2017-2028年市場趨勢及預測分析

  • 宏觀經濟趨勢（2017-2022 年）和預測（2023-2028 年）
  • 全球系統級封裝 (SiP) 技術市場趨勢（2017-2022 年）和預測（2023-2028 年）
  • 系統級封裝 (SiP) 技術的全球市場：按技術分類
    • 2D IC 封裝
    • 2.5D IC封裝
    • 3D IC 封裝
  • 系統級封裝 (SiP) 技術的全球市場：按方法分類
    • 引線鍵合
    • 倒裝芯片
  • 全球系統級封裝 (SiP) 技術市場：按最終用途分類
    • 消費電子產品
    • 汽車
    • 通訊
    • 工業系統
    • 航空航天/國防
    • 其他

第四章2017-2028年區域市場趨勢及預測分析

  • 系統級封裝 (SiP) 技術的全球區域市場
  • 北美系統級封裝 (SiP) 技術市場
  • 歐洲系統級封裝 (SiP) 技術市場
  • 亞太系統級封裝 (SiP) 技術市場
  • 其他區域系統級封裝 (SiP) 技術市場

第五章競爭分析

  • 產品組合分析
  • 運營整合
  • 波特五力分析

第 6 章增長機會和戰略分析

  • 增長機會分析
    • 系統級封裝 (SiP) 技術的全球市場增長機會：按技術分類
    • 系統級封裝 (SiP) 技術的全球市場增長機會：按方法分類
    • 系統級封裝 (SiP) 技術的全球市場增長機會：按應用分類
    • 系統級封裝 (SiP) 技術的全球市場增長機會：按地區劃分
  • 全球系統級封裝 (SiP) 技術市場的趨勢
  • 戰略分析
    • 新產品開發
    • 擴大系統級封裝 (SiP) 技術全球市場的產能
    • 全球系統級封裝 (SiP) 技術市場的合併、收購和合資企業
    • 身份驗證和許可

第7章主要公司簡介

  • Jiangsu Changjiang Electronics Technology
  • Chipmos Technologies
  • Powertech Technologies
  • ASE Group
  • Amkor Technology
  • Fujitsu
簡介目錄

System in Package (SiP) Technology Market Trends and Forecast

The future of the global system in package (SiP) technology market looks promising with opportunities in the consumer electronic, automotive, telecommunication, industrial system, and aerospace and defense markets. The global system in package (SiP) technology market is expected to reach an estimated $40.2 billion by 2028 with a CAGR of 10.2% from 2023 to 2028. The major drivers for this market are growing demand for compact electronic device, increasing number of IoT devices, and rising trend of 5G network connected devices.

A more than 150-page report is developed to help in your business decisions.

System in Package (SiP) Technology Market by Segment

The study includes a forecast for the global system in package (SiP) technology market by technology, method, end use, and region, as follows:

System in Package (SiP) Technology Market by Technology [Value ($B) Shipment Analysis from 2017 to 2028]:

  • 2D IC Packaging
  • 2.5D IC Packaging
  • 3D IC Packaging

System in Package (SiP) Technology Market by Method [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Wire Bond
  • Flip Chip

System in Package (SiP) Technology Market by End Use [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Consumer Electronics
  • Automotive
  • Telecommunication
  • Industrial System
  • Aerospace and Defense
  • Others

System in Package (SiP) Technology Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of System in Package (SiP) Technology Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies system in package (SiP) technology companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the system in package (SiP) technology companies profiled in this report includes.

  • Jiangsu Changjiang Electronics Technology
  • Chipmos Technologies
  • Powertech Technologies
  • ASE Group
  • Amkor Technology
  • Fujitsu

System in Package (SiP) Technology Market Insights

  • Lucintel forecasts that 3D IC packaging will remain the larger segment over the forecast period because it delivers improved performance compared to other technologies.
  • Consumer electronics is expected to remain the largest segment due to the growing demand compact electronic devices along with on going technological advancements in smartphones and wearable devices.
  • North America will remain the largest region due to the growing adoption of connected devices and increasing demand for robots so as to automate the various workflows for better efficiency in the region.

Features of the System in Package (SiP) Technology Market

  • Market Size Estimates: System in package (SiP) technology market size estimation in terms of value ($B)
  • Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: System in package (SiP) technology market size by various segments, such as by technology, method, end use, and region
  • Regional Analysis: System in package (SiP) technology market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different by technology, method, end use, and regions for the system in package (SiP) technology market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the system in package (SiP) technology market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the system in package (SiP) technology market size?

Answer: The global system in package (SiP) technology market is expected to reach an estimated $40.2 billion by 2028.

Q2. What is the growth forecast for system in package (SiP) technology market?

Answer: The global system in package (SiP) technology market is expected to grow with a CAGR of 10.2% from 2023 to 2028.

Q3. What are the major drivers influencing the growth of the system in package (SiP) technology market?

Answer: The major drivers for this market are growing demand for compact electronic device, increasing number of IoT devices, and rising trend of 5G network connected devices.

Q4. What are the major segments for system in package (SiP) technology market?

Answer: The future of the system in package (SiP) technology market looks promising with opportunities in the consumer electronic, automotive, telecommunication, industrial system, and aerospace and defense markets.

Q5. Who are the key system in package (SiP) technology companies?

Answer: Some of the key system in package (SiP) technology companies are as follows:

  • Jiangsu Changjiang Electronics Technology
  • Chipmos Technologies
  • Powertech Technologies
  • ASE Group
  • Amkor Technology

Q6. Which system in package (SiP) technology segment will be the largest in future?

Answer:Lucintel forecasts that 3D IC packaging will remain the larger segment over the forecast period because it delivers improved performance compared to other technologies.

Q7. In system in package (SiP) technology market, which region is expected to be the largest in next 5 years?

Answer: North America will remain the largest region due to the growing adoption of connected devices and increasing demand for robots so as to automate the various workflows for better efficiency in the region.

Q8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10.2% Customization Without any Additional Cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the system in package (SiP) technology market by technology (2D IC packaging, 2.5D IC packaging, and 3D IC packaging), method (wire bond and flip chip), end use (consumer electronics, automotive, telecommunication, industrial system, aerospace and defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global System in Package (SiP) Technology Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: Global System in Package (SiP) Technology Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: Global System in Package (SiP) Technology Market by Technology
    • 3.3.1: 2D IC Packaging
    • 3.3.2: 2.5D IC Packaging
    • 3.3.3: 3D IC Packaging
  • 3.4: Global System in Package (SiP) Technology Market by Method
    • 3.4.1: Wire Bond
    • 3.4.2: Flip Chip
  • 3.5: Global System in Package (SiP) Technology Market by End Use
    • 3.5.1: Consumer Electronics
    • 3.5.2: Automotive
    • 3.5.3: Telecommunication
    • 3.5.4: Industrial System
    • 3.5.5: Aerospace and Defense
    • 3.5.6: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

  • 4.1: Global System in Package (SiP) Technology Market by Region
  • 4.2: North American System in Package (SiP) Technology Market
    • 4.2.1: North American System in Package (SiP) Technology Market by Technology: 2D IC Packaging, 2.5D IC Packaging, and 3D IC Packaging
    • 4.2.2: North American System in Package (SiP) Technology Market by End Use: Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace and Defense, and Others
  • 4.3: European System in Package (SiP) Technology Market
    • 4.3.1: European System in Package (SiP) Technology Market by Technology: 2D IC Packaging, 2.5D IC Packaging, and 3D IC Packaging
    • 4.3.2: European System in Package (SiP) Technology Market by End Use: Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace and Defense, and Others
  • 4.4: APAC System in Package (SiP) Technology Market
    • 4.4.1: APAC System in Package (SiP) Technology Market by Technology: 2D IC Packaging, 2.5D IC Packaging, and 3D IC Packaging
    • 4.4.2: APAC System in Package (SiP) Technology Market by End Use: Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace and Defense, and Other
  • 4.5: ROW System in Package (SiP) Technology Market
    • 4.5.1: ROW System in Package (SiP) Technology Market by Technology: 2D IC Packaging, 2.5D IC Packaging, and 3D IC Packaging
    • 4.5.2: ROW System in Package (SiP) Technology Market by End Use: Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace and Defense, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global System in Package (SiP) Technology Market by Technology
    • 6.1.2: Growth Opportunities for the Global System in Package (SiP) Technology Market by Method
    • 6.1.3: Growth Opportunities for the Global System in Package (SiP) Technology Market by End Use
    • 6.1.4: Growth Opportunities for the Global System in Package (SiP) Technology Market by Region
  • 6.2: Emerging Trends in the Global System in Package (SiP) Technology Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global System in Package (SiP) Technology Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global System in Package (SiP) Technology Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Jiangsu Changjiang Electronics Technology
  • 7.2: Chipmos Technologies
  • 7.3: Powertech Technologies
  • 7.4: ASE Group
  • 7.5: Amkor Technology
  • 7.6: Fujitsu