Product Code: A01498
The global system in package (SiP) technology market size was valued at $14.77 billion in 2020, and is projected to reach $34.15 billion by 2030, registering a CAGR of 9.7% from 2021 to 2030. A system in package (SiP) is a technique that combines many integrated circuits (ICs) or semiconductor dies with diverse functionality into a single package or a system that performs multiple functions. SiP has progressed from a niche technology with a limited number of applications to a high-volume technology with a wide range of uses. In mobile applications, the technology is often employed in stack memory or logic devices, as well as compact modules. SiP has become a viable alternative to system on chip (SoC) due to various advantages, such as flexibility, less R&D costs, and low product costs.
Growth of the global system in package (SiP) technology market is anticipated to be driven by factors, such as advent of 5G network connected devices, high demand for compact electronics gadgets with internet connectivity, and rise in the number of the Internet of Things (IoT) devices. In addition, growing adoption of smartphones and smart wearables boosts the market growth. However, higher level of integration leads to thermal issues acts as a major restraint for the market. On the contrary, high demand from Asia-Pacific is expected to fuel the market growth during the forecast period.
The system in package (SiP) technology market is segmented on the basis of packaging technology, packaging method, end user, and region. By packaging technology, the market is classified into 2D IC packaging, 2.5D IC packaging, and 3D IC packaging. Depending on packaging method, it is categorized into wire bond and flip chip. On the basis of end user, market is divided into consumer electronics, automotive, telecommunication, industrial system, aerospace & defense, and others.
Region-wise, the system in package (SiP) technology market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, India, South Korea, and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). Asia-Pacific dominated the system in package (SiP) technology market in 2020, and is projected to register significant growth rate during the forecast period, owing to growth in the consumer electronics segment. Also, Asia-Pacific is expected to witnesses significant growth by the end of the forecast period, followed by LAMEA. The key players operating in the market include Amkor Technology Inc., ASE Group, Chipmos Technologies Inc., Fujitsu Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., Powertech Technologies Inc., Qualcomm Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., and Toshiba Corporation.
KEY BENEFITS FOR STAKEHOLDERS
- This study comprises analytical depiction of the global system in package (SiP) technology market size along with current trends and future estimations to depict imminent investment pockets.
- The overall system in package (SiP) technology market analysis is determined to understand the profitable trends to gain a stronger foothold.
- The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
- The current system in package (SiP) technology market forecast is quantitatively analyzed from 2020 to 2030 to benchmark the financial competency.
- Porter's five forces analysis illustrates the potency of the buyers and the system in package (SiP) technology market share of key vendors.
- The report includes the market trends and the market share of key vendors.
Key Market Segments
By Packaging Technology
- 2D IC Packaging
- 2.5D IC Packaging
- 3D IC Packaging
By Packaging Method
By End User
- Consumer Electronics
- Automotive
- Telecommunication
- Industrial System
- Aerospace and Defense
- Others
By Region
- North America
- Europe
- U.K.
- Germany
- France
- Rest of Europe
- Asia-Pacific
- China
- Japan
- Taiwan
- India
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
- Key Market Players
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- CHIPMOS TECHNOLOGIES INC.
- POWERTECH TECHNOLOGIES INC.
- ASE GROUP
- AMKOR TECHNOLOGY INC.
- FUJITSU LTD
- TOSHIBA CORPORATION
- RENESAS ELECTRONICS CORPORATION
- SAMSUNG ELECTRONICS CO LTD
- Qualcomm Inc
TABLE OF CONTENTS
CHAPTER 1:INTRODUCTION
- 1.1.Report description
- 1.2.Key market segments
- 1.3.Key benefits to the stakeholders
- 1.4.Research Methodology
- 1.4.1.Secondary research
- 1.4.2.Primary research
- 1.4.3.Analyst tools and models
CHAPTER 2:EXECUTIVE SUMMARY
- 2.1.Key findings of the study
- 2.2.CXO Perspective
CHAPTER 3:MARKET OVERVIEW
- 3.1.Market definition and scope
- 3.2.Key findings
- 3.2.1.Top investment pockets
- 3.3.Porter's five forces analysis
- 3.4.Top player positioning
- 3.5.Market dynamics
- 3.5.1.Drivers
- 3.5.2.Restraints
- 3.5.3.Opportunities
- 3.6.COVID-19 Impact Analysis on the market
CHAPTER 4: SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY PACKAGING TECHNOLOGY
- 4.1 Overview
- 4.1.1 Market size and forecast
- 4.2 2D IC Packaging
- 4.2.1 Key market trends, growth factors and opportunities
- 4.2.2 Market size and forecast, by region
- 4.2.3 Market analysis by country
- 4.3 2.5D IC Packaging
- 4.3.1 Key market trends, growth factors and opportunities
- 4.3.2 Market size and forecast, by region
- 4.3.3 Market analysis by country
- 4.4 3D IC Packaging
- 4.4.1 Key market trends, growth factors and opportunities
- 4.4.2 Market size and forecast, by region
- 4.4.3 Market analysis by country
CHAPTER 5: SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY PACKAGING METHOD
- 5.1 Overview
- 5.1.1 Market size and forecast
- 5.2 Wire Bond
- 5.2.1 Key market trends, growth factors and opportunities
- 5.2.2 Market size and forecast, by region
- 5.2.3 Market analysis by country
- 5.3 Flip Chip
- 5.3.1 Key market trends, growth factors and opportunities
- 5.3.2 Market size and forecast, by region
- 5.3.3 Market analysis by country
CHAPTER 6: SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY END USER
- 6.1 Overview
- 6.1.1 Market size and forecast
- 6.2 Consumer Electronics
- 6.2.1 Key market trends, growth factors and opportunities
- 6.2.2 Market size and forecast, by region
- 6.2.3 Market analysis by country
- 6.3 Automotive
- 6.3.1 Key market trends, growth factors and opportunities
- 6.3.2 Market size and forecast, by region
- 6.3.3 Market analysis by country
- 6.4 Telecommunication
- 6.4.1 Key market trends, growth factors and opportunities
- 6.4.2 Market size and forecast, by region
- 6.4.3 Market analysis by country
- 6.5 Industrial System
- 6.5.1 Key market trends, growth factors and opportunities
- 6.5.2 Market size and forecast, by region
- 6.5.3 Market analysis by country
- 6.6 Aerospace and Defense
- 6.6.1 Key market trends, growth factors and opportunities
- 6.6.2 Market size and forecast, by region
- 6.6.3 Market analysis by country
- 6.7 Others
- 6.7.1 Key market trends, growth factors and opportunities
- 6.7.2 Market size and forecast, by region
- 6.7.3 Market analysis by country
CHAPTER 7: SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY REGION
- 7.1 Overview
- 7.1.1 Market size and forecast
- 7.2 North America
- 7.2.1 Key trends and opportunities
- 7.2.2 North America Market size and forecast, by Packaging Technology
- 7.2.3 North America Market size and forecast, by Packaging Method
- 7.2.4 North America Market size and forecast, by End User
- 7.2.5 North America Market size and forecast, by country
- 7.2.5.1 U.S.
- 7.2.5.1.1 Market size and forecast, by Packaging Technology
- 7.2.5.1.2 Market size and forecast, by Packaging Method
- 7.2.5.1.3 Market size and forecast, by End User
- 7.2.5.2 Canada
- 7.2.5.2.1 Market size and forecast, by Packaging Technology
- 7.2.5.2.2 Market size and forecast, by Packaging Method
- 7.2.5.2.3 Market size and forecast, by End User
- 7.2.5.3 Mexico
- 7.2.5.3.1 Market size and forecast, by Packaging Technology
- 7.2.5.3.2 Market size and forecast, by Packaging Method
- 7.2.5.3.3 Market size and forecast, by End User
- 7.3 Europe
- 7.3.1 Key trends and opportunities
- 7.3.2 Europe Market size and forecast, by Packaging Technology
- 7.3.3 Europe Market size and forecast, by Packaging Method
- 7.3.4 Europe Market size and forecast, by End User
- 7.3.5 Europe Market size and forecast, by country
- 7.3.5.1 U.K.
- 7.3.5.1.1 Market size and forecast, by Packaging Technology
- 7.3.5.1.2 Market size and forecast, by Packaging Method
- 7.3.5.1.3 Market size and forecast, by End User
- 7.3.5.2 Germany
- 7.3.5.2.1 Market size and forecast, by Packaging Technology
- 7.3.5.2.2 Market size and forecast, by Packaging Method
- 7.3.5.2.3 Market size and forecast, by End User
- 7.3.5.3 France
- 7.3.5.3.1 Market size and forecast, by Packaging Technology
- 7.3.5.3.2 Market size and forecast, by Packaging Method
- 7.3.5.3.3 Market size and forecast, by End User
- 7.3.5.4 Rest of Europe
- 7.3.5.4.1 Market size and forecast, by Packaging Technology
- 7.3.5.4.2 Market size and forecast, by Packaging Method
- 7.3.5.4.3 Market size and forecast, by End User
- 7.4 Asia-Pacific
- 7.4.1 Key trends and opportunities
- 7.4.2 Asia-Pacific Market size and forecast, by Packaging Technology
- 7.4.3 Asia-Pacific Market size and forecast, by Packaging Method
- 7.4.4 Asia-Pacific Market size and forecast, by End User
- 7.4.5 Asia-Pacific Market size and forecast, by country
- 7.4.5.1 China
- 7.4.5.1.1 Market size and forecast, by Packaging Technology
- 7.4.5.1.2 Market size and forecast, by Packaging Method
- 7.4.5.1.3 Market size and forecast, by End User
- 7.4.5.2 Japan
- 7.4.5.2.1 Market size and forecast, by Packaging Technology
- 7.4.5.2.2 Market size and forecast, by Packaging Method
- 7.4.5.2.3 Market size and forecast, by End User
- 7.4.5.3 Taiwan
- 7.4.5.3.1 Market size and forecast, by Packaging Technology
- 7.4.5.3.2 Market size and forecast, by Packaging Method
- 7.4.5.3.3 Market size and forecast, by End User
- 7.4.5.4 India
- 7.4.5.4.1 Market size and forecast, by Packaging Technology
- 7.4.5.4.2 Market size and forecast, by Packaging Method
- 7.4.5.4.3 Market size and forecast, by End User
- 7.4.5.5 South Korea
- 7.4.5.5.1 Market size and forecast, by Packaging Technology
- 7.4.5.5.2 Market size and forecast, by Packaging Method
- 7.4.5.5.3 Market size and forecast, by End User
- 7.4.5.6 Rest of Asia-Pacific
- 7.4.5.6.1 Market size and forecast, by Packaging Technology
- 7.4.5.6.2 Market size and forecast, by Packaging Method
- 7.4.5.6.3 Market size and forecast, by End User
- 7.5 LAMEA
- 7.5.1 Key trends and opportunities
- 7.5.2 LAMEA Market size and forecast, by Packaging Technology
- 7.5.3 LAMEA Market size and forecast, by Packaging Method
- 7.5.4 LAMEA Market size and forecast, by End User
- 7.5.5 LAMEA Market size and forecast, by country
- 7.5.5.1 Latin America
- 7.5.5.1.1 Market size and forecast, by Packaging Technology
- 7.5.5.1.2 Market size and forecast, by Packaging Method
- 7.5.5.1.3 Market size and forecast, by End User
- 7.5.5.2 Middle East
- 7.5.5.2.1 Market size and forecast, by Packaging Technology
- 7.5.5.2.2 Market size and forecast, by Packaging Method
- 7.5.5.2.3 Market size and forecast, by End User
- 7.5.5.3 Africa
- 7.5.5.3.1 Market size and forecast, by Packaging Technology
- 7.5.5.3.2 Market size and forecast, by Packaging Method
- 7.5.5.3.3 Market size and forecast, by End User
CHAPTER 8: COMPANY LANDSCAPE
- 8.1. Introduction
- 8.2. Top winning strategies
- 8.3. Product Mapping of Top 10 Player
- 8.4. Competitive Dashboard
- 8.5. Competitive Heatmap
- 8.6. Key developments
CHAPTER 9: COMPANY PROFILES
- 9.1 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- 9.1.1 Company overview
- 9.1.2 Company snapshot
- 9.1.3 Operating business segments
- 9.1.4 Product portfolio
- 9.1.5 Business performance
- 9.1.6 Key strategic moves and developments
- 9.2 CHIPMOS TECHNOLOGIES INC.
- 9.2.1 Company overview
- 9.2.2 Company snapshot
- 9.2.3 Operating business segments
- 9.2.4 Product portfolio
- 9.2.5 Business performance
- 9.2.6 Key strategic moves and developments
- 9.3 POWERTECH TECHNOLOGIES INC.
- 9.3.1 Company overview
- 9.3.2 Company snapshot
- 9.3.3 Operating business segments
- 9.3.4 Product portfolio
- 9.3.5 Business performance
- 9.3.6 Key strategic moves and developments
- 9.4 ASE GROUP
- 9.4.1 Company overview
- 9.4.2 Company snapshot
- 9.4.3 Operating business segments
- 9.4.4 Product portfolio
- 9.4.5 Business performance
- 9.4.6 Key strategic moves and developments
- 9.5 AMKOR TECHNOLOGY INC.
- 9.5.1 Company overview
- 9.5.2 Company snapshot
- 9.5.3 Operating business segments
- 9.5.4 Product portfolio
- 9.5.5 Business performance
- 9.5.6 Key strategic moves and developments
- 9.6 FUJITSU LTD
- 9.6.1 Company overview
- 9.6.2 Company snapshot
- 9.6.3 Operating business segments
- 9.6.4 Product portfolio
- 9.6.5 Business performance
- 9.6.6 Key strategic moves and developments
- 9.7 TOSHIBA CORPORATION
- 9.7.1 Company overview
- 9.7.2 Company snapshot
- 9.7.3 Operating business segments
- 9.7.4 Product portfolio
- 9.7.5 Business performance
- 9.7.6 Key strategic moves and developments
- 9.8 RENESAS ELECTRONICS CORPORATION
- 9.8.1 Company overview
- 9.8.2 Company snapshot
- 9.8.3 Operating business segments
- 9.8.4 Product portfolio
- 9.8.5 Business performance
- 9.8.6 Key strategic moves and developments
- 9.9 SAMSUNG ELECTRONICS CO LTD
- 9.9.1 Company overview
- 9.9.2 Company snapshot
- 9.9.3 Operating business segments
- 9.9.4 Product portfolio
- 9.9.5 Business performance
- 9.9.6 Key strategic moves and developments
- 9.10 Qualcomm Inc
- 9.10.1 Company overview
- 9.10.2 Company snapshot
- 9.10.3 Operating business segments
- 9.10.4 Product portfolio
- 9.10.5 Business performance
- 9.10.6 Key strategic moves and developments