2024-2032 年按封裝技術、最終用途產業和地區分類的晶圓級封裝市場報告

IMARC Group年全球晶圓級封裝市場規模達57億美元。

晶圓級封裝（WLP）是指用於添加電子連接和積體電路（IC）保護層的封裝解決方案。它用於麥克風、壓力感測器、加速度計、陀螺儀、電容器、電阻器和電晶體等設備。一些常用的 WLP 整合類型包括扇出 (FO)、扇入 (FI)、覆晶、3D FOWLP。這些解決方案用於設備的晶圓級，而不是將晶圓切割成單一晶片並進行封裝。這提供了多種好處，例如縮小晶圓晶片的尺寸、簡化製造流程以及改進晶片功能。超薄晶圓還改善了散熱和性能，縮小了外形尺寸並最小化了功耗。

全球電子產業的顯著成長是創造積極市場成長前景的關鍵因素之一。此外，對更緊湊、更快的消費性電子產品日益成長的需求也推動了市場的成長。這也提高了對具有成本效益和高性能的封裝解決方案的整體需求，以增強設備的機械保護、結構支撐和延長電池壽命。此外，各種技術進步，例如連接設備與物聯網 (IoT) 的整合，也是其他促進成長的因素。例如，WLP 廣泛用於自動駕駛汽車雷達系統的製造。它也用於醫療保健領域，用於生產各種穿戴式設備。其他因素，包括微電子設備中電路日益小型化，以及廣泛的研發（R&D）活動，預計將進一步推動市場發展。

本報告回答的關鍵問題

• 全球晶圓級封裝市場有多大？
• 2024-2032年全球晶圓級封裝市場的預期成長率為何？
• 推動全球晶圓級封裝市場的關鍵因素是什麼？
• COVID-19 對全球晶圓級封裝市場有何影響？
• 基於封裝技術的全球晶圓級封裝市場的詳細情形如何？
• 基於最終用途產業的全球晶圓級封裝市場的詳細情形如何？
• 全球晶圓級封裝市場的重點區域有哪些？
• 全球晶圓級封裝市場的主要參與者/公司有哪些？

目錄

第1章：前言

第 2 章：範圍與方法

• 研究目的
• 利害關係人
• 資料來源
  • 主要資源
  • 二手資料
• 市場預測
  • 自下而上的方法
  • 自上而下的方法
• 預測方法

第 3 章：執行摘要

第 4 章：簡介

• 概述
• 主要行業趨勢

第 5 章：全球晶圓級封裝市場

• 市場概況
• 市場業績
• COVID-19 的影響
• 市場預測

第 6 章：市場區隔：依封裝技術

• 3D TSV 晶圓級封裝
  • 市場走向
  • 市場預測
• 2.5D TSV 晶圓級封裝
  • 市場走向
  • 市場預測
• 無線LCSP
  • 市場走向
  • 市場預測
• 奈米晶圓級封裝
  • 市場走向
  • 市場預測
• 其他
  • 市場走向
  • 市場預測

第 7 章：市場區隔：依最終用途產業

• 航太和國防
  • 市場走向
  • 市場預測
• 消費性電子產品
  • 市場走向
  • 市場預測
• 資訊科技與電信
  • 市場走向
  • 市場預測
• 衛生保健
  • 市場走向
  • 市場預測
• 汽車
  • 市場走向
  • 市場預測
• 其他
  • 市場走向
  • 市場預測

第 8 章：市場區隔：按地區

• 北美洲
  • 美國
  • 加拿大
• 亞太
  • 中國
  • 日本
  • 印度
  • 韓國
  • 澳洲
  • 印尼
  • 其他
• 歐洲
  • 德國
  • 法國
  • 英國
  • 義大利
  • 西班牙
  • 俄羅斯
  • 其他
• 拉丁美洲
  • 巴西
  • 墨西哥
  • 其他
• 中東和非洲
  • 市場走向
  • 市場細分：按國家/地區
  • 市場預測

第 9 章：SWOT 分析

• 概述
• 優勢
• 弱點
• 機會
• 威脅

第 10 章：價值鏈分析

第 11 章：波特五力分析

• 概述
• 買家的議價能力
• 供應商的議價能力
• 競爭程度
• 新進入者的威脅
• 替代品的威脅

第 12 章：價格分析

第13章：競爭格局

• 市場結構
• 關鍵參與者
• 關鍵參與者簡介
  • Amkor Technology Inc.
  • China Wafer Level CSP Co. Ltd.
  • Chipbond Technology Corporation
  • Deca Technologies Inc. (Infineon Technologies AG)
  • Fujitsu Limited
  • IQE PLC
  • JCET Group Co. Ltd.
  • Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
  • Tokyo Electron Ltd.
  • Toshiba Corporation

The global wafer level packaging market size reached US$ 5.7 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 22.5 Billion by 2032, exhibiting a growth rate (CAGR) of 16.1% during 2024-2032.

The wafer-level packaging (WLP) refers to a packaging solution used for adding a protective layer of electronic connections and integrated circuits (ICs). It is used for devices, such as microphones, pressure sensors, accelerometers, gyroscopes, capacitors, resistors and transistors. Some of the commonly used WLP integration types include fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP. These solutions are used at the wafer-level of the device, instead of dicing the wafer into the individual die and packaging them. This offers various benefits, such as a reduction in the size of the wafer chips, streamlining of the manufacturing processes and improvements in chip functionalities. The ultrathin wafers also provide improved heat dissipation and performance, form factor reduction and minimal power consumption.

Significant growth in the electronics industry across the globe represents one of the key factors creating a positive outlook on the market growth. Furthermore, the increasing requirement for more compact and faster consumer electronics is also driving the market growth. This has also enhanced the overall demand for cost-effective and high-performance packaging solutions for enhanced mechanical protection, structural support and extended battery life of the devices. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), are acting as other growth-inducing factors. For instance, WLP is widely used for the manufacturing of radar systems in self-driving automobiles. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market further.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global wafer level packaging market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on packaging technology and end use industry.

Breakup by Packaging Technology:

3D TSV WLP

2.5D TSV WLP

WLCSP

Nano WLP

Others

Breakup by End Use Industry:

Aerospace and Defense

Consumer Electronics

IT & Telecommunication

Healthcare

Automotive

Others

Breakup by Region:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation.

Key Questions Answered in This Report

• 1. How big is the global wafer level packaging market?
• 2. What is the expected growth rate of the global wafer level packaging market during 2024-2032?
• 3. What are the key factors driving the global wafer level packaging market?
• 4. What has been the impact of COVID-19 on the global wafer level packaging market?
• 5. What is the breakup of the global wafer level packaging market based on the packaging technology?
• 6. What is the breakup of the global wafer level packaging market based on the end use industry?
• 7. What are the key regions in the global wafer level packaging market?
• 8. Who are the key players/companies in the global wafer level packaging market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Wafer Level Packaging Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Packaging Technology

• 6.1 3D TSV WLP
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 2.5D TSV WLP
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast
• 6.3 WLCSP
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast
• 6.4 Nano WLP
  • 6.4.1 Market Trends
  • 6.4.2 Market Forecast
• 6.5 Others
  • 6.5.1 Market Trends
  • 6.5.2 Market Forecast

7 Market Breakup by End Use Industry

• 7.1 Aerospace and Defense
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 Consumer Electronics
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 IT & Telecommunication
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast
• 7.4 Healthcare
  • 7.4.1 Market Trends
  • 7.4.2 Market Forecast
• 7.5 Automotive
  • 7.5.1 Market Trends
  • 7.5.2 Market Forecast
• 7.6 Others
  • 7.6.1 Market Trends
  • 7.6.2 Market Forecast

8 Market Breakup by Region

• 8.1 North America
  • 8.1.1 United States
    • 8.1.1.1 Market Trends
    • 8.1.1.2 Market Forecast
  • 8.1.2 Canada
    • 8.1.2.1 Market Trends
    • 8.1.2.2 Market Forecast
• 8.2 Asia-Pacific
  • 8.2.1 China
    • 8.2.1.1 Market Trends
    • 8.2.1.2 Market Forecast
  • 8.2.2 Japan
    • 8.2.2.1 Market Trends
    • 8.2.2.2 Market Forecast
  • 8.2.3 India
    • 8.2.3.1 Market Trends
    • 8.2.3.2 Market Forecast
  • 8.2.4 South Korea
    • 8.2.4.1 Market Trends
    • 8.2.4.2 Market Forecast
  • 8.2.5 Australia
    • 8.2.5.1 Market Trends
    • 8.2.5.2 Market Forecast
  • 8.2.6 Indonesia
    • 8.2.6.1 Market Trends
    • 8.2.6.2 Market Forecast
  • 8.2.7 Others
    • 8.2.7.1 Market Trends
    • 8.2.7.2 Market Forecast
• 8.3 Europe
  • 8.3.1 Germany
    • 8.3.1.1 Market Trends
    • 8.3.1.2 Market Forecast
  • 8.3.2 France
    • 8.3.2.1 Market Trends
    • 8.3.2.2 Market Forecast
  • 8.3.3 United Kingdom
    • 8.3.3.1 Market Trends
    • 8.3.3.2 Market Forecast
  • 8.3.4 Italy
    • 8.3.4.1 Market Trends
    • 8.3.4.2 Market Forecast
  • 8.3.5 Spain
    • 8.3.5.1 Market Trends
    • 8.3.5.2 Market Forecast
  • 8.3.6 Russia
    • 8.3.6.1 Market Trends
    • 8.3.6.2 Market Forecast
  • 8.3.7 Others
    • 8.3.7.1 Market Trends
    • 8.3.7.2 Market Forecast
• 8.4 Latin America
  • 8.4.1 Brazil
    • 8.4.1.1 Market Trends
    • 8.4.1.2 Market Forecast
  • 8.4.2 Mexico
    • 8.4.2.1 Market Trends
    • 8.4.2.2 Market Forecast
  • 8.4.3 Others
    • 8.4.3.1 Market Trends
    • 8.4.3.2 Market Forecast
• 8.5 Middle East and Africa
  • 8.5.1 Market Trends
  • 8.5.2 Market Breakup by Country
  • 8.5.3 Market Forecast

9 SWOT Analysis

• 9.1 Overview
• 9.2 Strengths
• 9.3 Weaknesses
• 9.4 Opportunities
• 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

• 11.1 Overview
• 11.2 Bargaining Power of Buyers
• 11.3 Bargaining Power of Suppliers
• 11.4 Degree of Competition
• 11.5 Threat of New Entrants
• 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

• 13.1 Market Structure
• 13.2 Key Players
• 13.3 Profiles of Key Players
  • 13.3.1 Amkor Technology Inc.
    • 13.3.1.1 Company Overview
    • 13.3.1.2 Product Portfolio
    • 13.3.1.3 Financials
    • 13.3.1.4 SWOT Analysis
  • 13.3.2 China Wafer Level CSP Co. Ltd.
    • 13.3.2.1 Company Overview
    • 13.3.2.2 Product Portfolio
    • 13.3.2.3 SWOT Analysis
  • 13.3.3 Chipbond Technology Corporation
    • 13.3.3.1 Company Overview
    • 13.3.3.2 Product Portfolio
    • 13.3.3.3 SWOT Analysis
  • 13.3.4 Deca Technologies Inc. (Infineon Technologies AG)
    • 13.3.4.1 Company Overview
    • 13.3.4.2 Product Portfolio
  • 13.3.5 Fujitsu Limited
    • 13.3.5.1 Company Overview
    • 13.3.5.2 Product Portfolio
    • 13.3.5.3 Financials
    • 13.3.5.4 SWOT Analysis
  • 13.3.6 IQE PLC
    • 13.3.6.1 Company Overview
    • 13.3.6.2 Product Portfolio
    • 13.3.6.3 SWOT Analysis
  • 13.3.7 JCET Group Co. Ltd.
    • 13.3.7.1 Company Overview
    • 13.3.7.2 Product Portfolio
    • 13.3.7.3 SWOT Analysis
  • 13.3.8 Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
    • 13.3.8.1 Company Overview
    • 13.3.8.2 Product Portfolio
    • 13.3.8.3 Financials
  • 13.3.9 Tokyo Electron Ltd.
    • 13.3.9.1 Company Overview
    • 13.3.9.2 Product Portfolio
    • 13.3.9.3 Financials
    • 13.3.9.4 SWOT Analysis
  • 13.3.10 Toshiba Corporation
    • 13.3.10.1 Company Overview
    • 13.3.10.2 Product Portfolio
    • 13.3.10.3 Financials
    • 13.3.10.4 SWOT Analysis

List of Figures

• Figure 1: Global: Wafer Level Packaging Market: Major Drivers and Challenges
• Figure 2: Global: Wafer Level Packaging Market: Sales Value (in Billion US$), 2018-2023
• Figure 3: Global: Wafer Level Packaging Market Forecast: Sales Value (in Billion US$), 2024-2032
• Figure 4: Global: Wafer Level Packaging Market: Breakup by Packaging Technology (in %), 2023
• Figure 5: Global: Wafer Level Packaging Market: Breakup by End Use Industry (in %), 2023
• Figure 6: Global: Wafer Level Packaging Market: Breakup by Region (in %), 2023
• Figure 7: Global: Wafer Level Packaging (3D TSV WLP) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 8: Global: Wafer Level Packaging (3D TSV WLP) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 9: Global: Wafer Level Packaging (2.5D TSV WLP) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 10: Global: Wafer Level Packaging (2.5D TSV WLP) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 11: Global: Wafer Level Packaging (WLCSP) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 12: Global: Wafer Level Packaging (WLCSP) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 13: Global: Wafer Level Packaging (Nano WLP) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 14: Global: Wafer Level Packaging (Nano WLP) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 15: Global: Wafer Level Packaging (Others) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 16: Global: Wafer Level Packaging (Others) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 17: Global: Wafer Level Packaging (Aerospace and Defense) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 18: Global: Wafer Level Packaging (Aerospace and Defense) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 19: Global: Wafer Level Packaging (Consumer Electronics) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 20: Global: Wafer Level Packaging (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 21: Global: Wafer Level Packaging (IT & Telecommunication) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 22: Global: Wafer Level Packaging (IT & Telecommunication) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 23: Global: Wafer Level Packaging (Healthcare) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 24: Global: Wafer Level Packaging (Healthcare) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 25: Global: Wafer Level Packaging (Automotive) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 26: Global: Wafer Level Packaging (Automotive) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 27: Global: Wafer Level Packaging (Others) Market: Sales Value (in Million US$), 2018 & 2023
• Figure 28: Global: Wafer Level Packaging (Others) Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 29: North America: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 30: United States: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 31: United States: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 32: Canada: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 33: Canada: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 34: North America: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 35: Asia-Pacific: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 36: China: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 37: China: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 38: Japan: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 39: Japan: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 40: India: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 41: India: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 42: South Korea: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 43: South Korea: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 44: Australia: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 45: Australia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 46: Indonesia: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 47: Indonesia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 48: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 49: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 50: Asia-Pacific: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 51: Europe: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 52: Germany: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 53: Germany: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 54: France: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 55: France: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 56: United Kingdom: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 57: United Kingdom: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 58: Italy: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 59: Italy: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 60: Spain: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 61: Spain: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 62: Russia: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 63: Russia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 64: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 65: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 66: Europe: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 67: Latin America: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 68: Brazil: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 69: Brazil: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 70: Mexico: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 71: Mexico: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 72: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 73: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 74: Latin America: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 75: Middle East and Africa: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
• Figure 76: Middle East and Africa: Wafer Level Packaging Market: Breakup by Country (in %), 2023
• Figure 77: Middle East and Africa: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
• Figure 78: Global: Wafer Level Packaging Industry: SWOT Analysis
• Figure 79: Global: Wafer Level Packaging Industry: Value Chain Analysis
• Figure 80: Global: Wafer Level Packaging Industry: Porter's Five Forces Analysis

List of Tables

• Table 1: Global: Wafer Level Packaging Market: Key Industry Highlights, 2023 and 2032
• Table 2: Global: Wafer Level Packaging Market Forecast: Breakup by Packaging Technology (in Million US$), 2024-2032
• Table 3: Global: Wafer Level Packaging Market Forecast: Breakup by End Use Industry (in Million US$), 2024-2032
• Table 4: Global: Wafer Level Packaging Market Forecast: Breakup by Region (in Million US$), 2024-2032
• Table 5: Global: Wafer Level Packaging Market: Competitive Structure
• Table 6: Global: Wafer Level Packaging Market: Key Players