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1287485

晶圓級封裝市場：2023-2028年全球行業趨勢、佔有率、規模、成長、機會和預測

Wafer Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028
出版日期: | 出版商: IMARC | 英文 141 Pages | 商品交期: 2-3個工作天內

價格

市場概況：

2022年，全球晶圓級封裝市場規模達到48億美元。展望未來，IMARC集團預計，到2028年，市場規模將達到132億美元，在2023-2028年期間呈現18.3%的成長率（CAGR）。

晶圓級封裝（WLP）是指用於為電子連接和整合電路（IC）添加保護層的一種包裝解決方案。它用於設備，如麥克風、壓力感測器、加速計、陀螺儀、電容器、電阻和電晶體。一些常用的WLP整合類型包括扇出（FO）、扇入（FI）、覆晶、3D FOWLP。這些解決方案是在裝置的晶圓級使用的，而不是將晶圓切割成單獨的晶片並進行封裝。這提供了各種好處，如減少晶圓晶片的尺寸，簡化製造過程和改善晶片功能。超薄晶圓還提供了更好的散熱和性能，降低了外形尺寸和最小的功率消耗。

全球範圍內電子行業的大幅成長是創造市場成長前景的關鍵因素之一。此外，對更緊湊和更快的消費電子產品的要求越來越高，也推動了市場的成長。這也提高了對成本效益和高性能包裝解決方案的整體需求，以加強機械保護、結構支援和延長設備的電池壽命。此外，各種技術進步，如連接設備與物聯網（IoT）的整合，成為其他成長的誘導因素。例如，WLP廣泛用於製造自動駕駛汽車的雷達系統。它也用於醫療保健領域，用於生產各種穿戴式設備。其他因素，包括微電子設備的電路微型化程度的提高，以及廣泛的研究和開發（R&D）活動，預計將進一步推動市場發展。

本報告回答的關鍵問題：

  • 迄今為止，全球晶圓級封裝市場的表現如何，在未來幾年將如何表現？
  • COVID-19對全球晶圓級封裝市場的影響是什麼？
  • 主要的區域市場是什麼？
  • 基於封裝類型的市場細分是什麼？
  • 基於終端使用行業的市場細分是什麼？
  • 該行業價值鏈的各個階段是什麼？
  • 該行業的關鍵驅動因素和挑戰是什麼？
  • 全球晶圓級封裝市場的結構是什麼，誰是主要的參與者？
  • 該行業的競爭程度如何？

目錄

第一章：前言

第二章：範圍和方法

  • 研究的目標
  • 利益相關者
  • 資料來源
    • 主要來源
    • 二級來源
  • 市場評估
    • 自下而上的方法
    • 自上而下的方法
  • 預測方法

第三章：執行摘要

第四章：簡介

  • 概述
  • 主要行業趨勢

第五章：全球晶圓級封裝市場

  • 市場概況
  • 市場表現
  • COVID-19的影響
  • 市場預測

第六章：按封裝技術分類的市場

  • 3D TSV WLP
    • 市場趨勢
    • 市場預測
  • 2.5D TSV WLP
    • 市場趨勢
    • 市場預測
  • WLCSP
    • 市場趨勢
    • 市場預測
  • 奈米WLP
    • 市場趨勢
    • 市場預測
  • 其他
    • 市場趨勢
    • 市場預測

第7章：按最終使用行業分類的市場

  • 航太和國防
    • 市場趨勢
    • 市場預測
  • 消費電子
    • 市場趨勢
    • 市場預測
  • IT和電信
    • 市場趨勢
    • 市場預測
  • 醫療保健
    • 市場趨勢
    • 市場預測
  • 汽車行業
    • 市場趨勢
    • 市場預測
  • 其他
    • 市場趨勢
    • 市場預測

第8章：按地區分類的市場

  • 北美洲
    • 美國
      • 市場趨勢
      • 市場預測
    • 加拿大
      • 市場趨勢
      • 市場預測
  • 亞太地區
    • 中國
      • 市場趨勢
      • 市場預測
    • 日本
      • 市場趨勢
      • 市場預測
    • 印度
      • 市場趨勢
      • 市場預測
    • 韓國
      • 市場趨勢
      • 市場預測
    • 澳洲
      • 市場趨勢
      • 市場預測
    • 印尼
      • 市場趨勢
      • 市場預測
    • 其他國家
      • 市場趨勢
      • 市場預測
  • 歐洲
    • 德國
      • 市場趨勢
      • 市場預測
    • 法國
      • 市場趨勢
      • 市場預測
    • 英國
      • 市場趨勢
      • 市場預測
    • 義大利
      • 市場趨勢
      • 市場預測
    • 西班牙
      • 市場趨勢
      • 市場預測
    • 俄羅斯
      • 市場趨勢
      • 市場預測
    • 其他國家
      • 市場趨勢
      • 市場預測
  • 拉丁美洲
    • 巴西
      • 市場趨勢
      • 市場預測
    • 墨西哥
      • 市場趨勢
      • 市場預測
    • 其他國家
      • 市場趨勢
      • 市場預測
  • 中東和非洲
    • 市場趨勢
    • 按國家分類的市場
    • 市場預測

第九章：SWOT分析

  • 概述
  • 優勢
  • 劣勢
  • 機會
  • 威脅

第十章：價值鏈分析

第十一章：波特五力分析

  • 概述
  • 買方的議價能力
  • 供應商的議價能力
  • 競爭程度
  • 新進入者的威脅
  • 替代品的威脅

第十二章：價格分析

第十三章：競爭格局

  • 市場結構
  • 主要參與者
  • 主要參與者的概況
    • Amkor Technology Inc.
    • China Wafer Level CSP Co. Ltd.
    • Chipbond Technology Corporation
    • Deca Technologies Inc. (Infineon Technologies AG)
    • Fujitsu Limited
    • IQE PLC
    • JCET Group Co. Ltd.
    • Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
    • Tokyo Electron Ltd.
    • Toshiba Corporation
Product Code: SR1623A186_Report

Market Overview:

The global wafer level packaging market size reached US$ 4.8 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 13.2 Billion by 2028, exhibiting a growth rate (CAGR) of 18.3% during 2023-2028.

The wafer-level packaging (WLP) refers to a packaging solution used for adding a protective layer of electronic connections and integrated circuits (ICs). It is used for devices, such as microphones, pressure sensors, accelerometers, gyroscopes, capacitors, resistors and transistors. Some of the commonly used WLP integration types include fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP. These solutions are used at the wafer-level of the device, instead of dicing the wafer into the individual die and packaging them. This offers various benefits, such as a reduction in the size of the wafer chips, streamlining of the manufacturing processes and improvements in chip functionalities. The ultrathin wafers also provide improved heat dissipation and performance, form factor reduction and minimal power consumption.

Significant growth in the electronics industry across the globe represents one of the key factors creating a positive outlook on the market growth. Furthermore, the increasing requirement for more compact and faster consumer electronics is also driving the market growth. This has also enhanced the overall demand for cost-effective and high-performance packaging solutions for enhanced mechanical protection, structural support and extended battery life of the devices. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), are acting as other growth-inducing factors. For instance, WLP is widely used for the manufacturing of radar systems in self-driving automobiles. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market further.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global wafer level packaging market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on packaging technology and end use industry.

Breakup by Packaging Technology:

  • 3D TSV WLP
  • 2.5D TSV WLP
  • WLCSP
  • Nano WLP
  • Others

Breakup by End Use Industry:

  • Aerospace and Defense
  • Consumer Electronics
  • IT & Telecommunication
  • Healthcare
  • Automotive
  • Others

Breakup by Region:

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Others
  • Europe
    • Germany
    • France
    • United Kingdom
    • Italy
    • Spain
    • Russia
    • Others
  • Latin America
    • Brazil
    • Mexico
    • Others
  • Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation.

Key Questions Answered in This Report:

  • How has the global wafer level packaging market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global wafer level packaging market?
  • What are the key regional markets?
  • What is the breakup of the market based on the packaging type?
  • What is the breakup of the market based on the end use industry?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global wafer level packaging market and who are the key players?
  • What is the degree of competition in the industry?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Wafer Level Packaging Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Packaging Technology

  • 6.1 3D TSV WLP
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 2.5D TSV WLP
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast
  • 6.3 WLCSP
    • 6.3.1 Market Trends
    • 6.3.2 Market Forecast
  • 6.4 Nano WLP
    • 6.4.1 Market Trends
    • 6.4.2 Market Forecast
  • 6.5 Others
    • 6.5.1 Market Trends
    • 6.5.2 Market Forecast

7 Market Breakup by End Use Industry

  • 7.1 Aerospace and Defense
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Consumer Electronics
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 IT & Telecommunication
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Healthcare
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Automotive
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast
  • 7.6 Others
    • 7.6.1 Market Trends
    • 7.6.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 Amkor Technology Inc.
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
      • 13.3.1.3 Financials
      • 13.3.1.4 SWOT Analysis
    • 13.3.2 China Wafer Level CSP Co. Ltd.
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
      • 13.3.2.3 SWOT Analysis
    • 13.3.3 Chipbond Technology Corporation
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
      • 13.3.3.3 SWOT Analysis
    • 13.3.4 Deca Technologies Inc. (Infineon Technologies AG)
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
    • 13.3.5 Fujitsu Limited
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
      • 13.3.5.3 Financials
      • 13.3.5.4 SWOT Analysis
    • 13.3.6 IQE PLC
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
      • 13.3.6.3 SWOT Analysis
    • 13.3.7 JCET Group Co. Ltd.
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 SWOT Analysis
    • 13.3.8 Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
      • 13.3.8.3 Financials
    • 13.3.9 Tokyo Electron Ltd.
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
      • 13.3.9.3 Financials
      • 13.3.9.4 SWOT Analysis
    • 13.3.10 Toshiba Corporation
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
      • 13.3.10.3 Financials
      • 13.3.10.4 SWOT Analysis

List of Figures

  • Figure 1: Global: Wafer Level Packaging Market: Major Drivers and Challenges
  • Figure 2: Global: Wafer Level Packaging Market: Sales Value (in Billion US$), 2017-2022
  • Figure 3: Global: Wafer Level Packaging Market Forecast: Sales Value (in Billion US$), 2023-2028
  • Figure 4: Global: Wafer Level Packaging Market: Breakup by Packaging Technology (in %), 2022
  • Figure 5: Global: Wafer Level Packaging Market: Breakup by End Use Industry (in %), 2022
  • Figure 6: Global: Wafer Level Packaging Market: Breakup by Region (in %), 2022
  • Figure 7: Global: Wafer Level Packaging (3D TSV WLP) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 8: Global: Wafer Level Packaging (3D TSV WLP) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 9: Global: Wafer Level Packaging (2.5D TSV WLP) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 10: Global: Wafer Level Packaging (2.5D TSV WLP) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 11: Global: Wafer Level Packaging (WLCSP) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 12: Global: Wafer Level Packaging (WLCSP) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 13: Global: Wafer Level Packaging (Nano WLP) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 14: Global: Wafer Level Packaging (Nano WLP) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 15: Global: Wafer Level Packaging (Others) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 16: Global: Wafer Level Packaging (Others) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 17: Global: Wafer Level Packaging (Aerospace and Defense) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 18: Global: Wafer Level Packaging (Aerospace and Defense) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 19: Global: Wafer Level Packaging (Consumer Electronics) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 20: Global: Wafer Level Packaging (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 21: Global: Wafer Level Packaging (IT & Telecommunication) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 22: Global: Wafer Level Packaging (IT & Telecommunication) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 23: Global: Wafer Level Packaging (Healthcare) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 24: Global: Wafer Level Packaging (Healthcare) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 25: Global: Wafer Level Packaging (Automotive) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 26: Global: Wafer Level Packaging (Automotive) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 27: Global: Wafer Level Packaging (Others) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 28: Global: Wafer Level Packaging (Others) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 29: North America: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 30: United States: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 31: United States: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 32: Canada: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 33: Canada: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 34: North America: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 35: Asia-Pacific: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 36: China: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 37: China: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 38: Japan: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 39: Japan: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 40: India: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 41: India: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 42: South Korea: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 43: South Korea: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 44: Australia: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 45: Australia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 46: Indonesia: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 47: Indonesia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 48: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 49: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 50: Asia-Pacific: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 51: Europe: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 52: Germany: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 53: Germany: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 54: France: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 55: France: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 56: United Kingdom: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 57: United Kingdom: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 58: Italy: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 59: Italy: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 60: Spain: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 61: Spain: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 62: Russia: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 63: Russia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 64: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 65: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 66: Europe: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 67: Latin America: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 68: Brazil: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 69: Brazil: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 70: Mexico: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 71: Mexico: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 72: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 73: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 74: Latin America: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 75: Middle East and Africa: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 76: Middle East and Africa: Wafer Level Packaging Market: Breakup by Country (in %), 2022
  • Figure 77: Middle East and Africa: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 78: Global: Wafer Level Packaging Industry: SWOT Analysis
  • Figure 79: Global: Wafer Level Packaging Industry: Value Chain Analysis
  • Figure 80: Global: Wafer Level Packaging Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Wafer Level Packaging Market: Key Industry Highlights, 2022 and 2028
  • Table 2: Global: Wafer Level Packaging Market Forecast: Breakup by Packaging Technology (in Million US$), 2023-2028
  • Table 3: Global: Wafer Level Packaging Market Forecast: Breakup by End Use Industry (in Million US$), 2023-2028
  • Table 4: Global: Wafer Level Packaging Market Forecast: Breakup by Region (in Million US$), 2023-2028
  • Table 5: Global: Wafer Level Packaging Market: Competitive Structure
  • Table 6: Global: Wafer Level Packaging Market: Key Players