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市場調查報告書

固態照明市場與製造成本削減趨勢

LED and OLED Lighting: Market Analysis and Manufacturing Trends

出版商 Information Network 商品編碼 105450
出版日期 內容資訊 英文
商品交期: 2-3個工作天內
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固態照明市場與製造成本削減趨勢 LED and OLED Lighting: Market Analysis and Manufacturing Trends
出版日期: 2019年10月01日內容資訊: 英文
簡介

高亮度發光二極體(HB-LED)市場預測2009年到2012年,出貨數將增加一倍。

本報告提供高亮度LED的技術趨勢與應用的相關驗證,設備與材料,包裝與組裝時的課題,彙整有機發光二極體市場的趨勢,國家的配合,今後的預測等等資料,為您概述為以下內容。

第1章 介紹

第2章 高亮度LED技術與最新應用趨勢

  • LED:工作理論
  • 智慧財產權流程
  • LED製造技術和成本
  • LED市場的一般照明

第3章 加工設備

  • 介紹
  • 固態照明(SSL)用MOCVD:生產率的相關課題和解決辦法
  • 低溫等離子化學氣相沈積
  • 品管測試及檢驗
  • 光刻

第4章 結構材料

  • 介紹
  • 一般照明用氮化鎵發光二極體LED(GaN基LED)
  • LED螢光粉製造上的相關課題

第5章 高亮度LED的包裝和裝配上的相關課題

  • 包裝
  • 晶圓構裝
  • 控溫問題
  • 檢驗

第6章 作為促進革新因素的國家計劃

  • DoE的製造獎勵辦法
  • 計劃任務與目標
  • 關於LED的研究計劃
  • SSL製造面臨的相關課題

第7章 有機發光二極體(OLED)照明

  • 照明業者的機會
  • 為了促進有機發光二極體市場成長的重要課題
  • 製造法和設備需求
  • 主要材料是否容易取得
  • 有機發光二極體的成本

第8章 有機發光二極體的製造

  • 有機發光二極體的真空蒸鍍設備與工程
  • 一般有機發光二極體製造成本
  • Roll-to-Roll有機發光二極體
  • 光刻
  • 基板與構裝
  • 檢驗和品管

第9章 全球有機發光二極體市場的預測

  • 介紹
  • 被動式矩陣容量和需求
  • 主動式矩陣容量和需求
  • 有機發光二極體成本上的相關課題

第10章 全球高亮度LED市場今後的預測

  • 技術趨勢:2000∼2009年
  • 2008年的市場概要與趨勢
    • 推動市場的要素
    • 筆記型電腦用LED背光
    • 液晶電視用LED背光
    • 其他LED背光
    • LED照明市場
    • LED活動式戶外顯示器
    • LED信號
    • 汽車用LED
    • 行動電話用LED

圖表

目錄

The High Brightness Light Emitting Diode (HB LED) market is exploding as unit shipments continue their upward growth. LEDs are creating a niche market for conventional suppliers of semiconductor processing tools. Markets for HB LEDs, backlight LEDs, and OLEDs are forecast.

Table of Contents

Chapter 1: Introduction

Chapter 2: Recent Progress in High Brightness LED Technology and Applications

  • 2.1. LED: Theory of Operation
  • 2.2. Intellectual Property Map
  • 2.3. LED Manufacturing Technologies & Costs
  • 2.4. LED Market General Illumination

Chapter 3: Processing Equipment

  • 3.1. Introduction
  • 3.2. Deposition
    • 3.2.1. MOCVD for SSL - Productivity Challenges and Solutions
    • 3.2.2. Low temperature Remote Plasma Chemical Vapor Deposition (RPCVD)
  • 3.3. Chemical Mechanical Planarization
  • 3.4. Defect Inspection and Testing
  • 3.5. Lithography
    • 3.5.1. Steppers

Chapter 4: Materials of Construction

  • 4.1. Introduction
  • 4.2. GaN-based LED for General Lighting
    • 4.2.1. Methods to Improve White LED Efficiency
    • 4.2.2. Time-to-Market for LED substrates
  • 4.3. LED Phosphor Manufacturing Issues
    • 4.3.1. Current LED Phosphor Manufacturing
    • 4.3.2. LED Phosphor Cost

Chapter 5: Packaging and Assembly Issues for High Brightness LEDs

  • 5.1. Packaging for HB LEDs
    • 5.1.1. Bonding
    • 5.1.2. Die/Ball Bonding
    • 5.1.3. Scribing
  • 5.2. Wafer Level Packaging HB LEDs
  • 5.3. Thermal Issues
  • 5.4. Test and Inspection

Chapter 6: National Programs As Innovation Drivers

  • 6.1. DOE Solid-State Lighting Manufacturing Initiative
  • 6.2. DOE Solid-State Lighting Program Mission and Goal
  • 6.3. Major National Research Programs Pertaining to LEDs
  • 6.4. Challenges Facing SSL Manufacturing

Chapter 7: OLED Lighting

  • 7.1. Opportunities for Luminaire Manufacturers
  • 7.2. How Does an OLED Work
  • 7.3. Differences Between OLED Lighting and OLED Display
  • 7.4. Benefits of OLED Lighting Technology
  • 7.5. OLED Performance Metrics

Chapter 8: OLED Manufacturing

  • 8.1. Deposition Equipment and Processes for OLED Lighting
    • 8.1.1. Vacuum Deposition Or Vacuum Thermal Evaporation (VTE)
    • 8.1.2. Organic Vapor Deposition (OVPD)
    • 8.1.3. Inkjet Printing
    • 8.1.4. Roll-to-Roll (R2R)
  • 8.2. General OLED Manufacturing Cost Considerations
  • 8.3. Lithography
  • 8.4. Substrates and Encapsulation
    • 8.4.1. Substrate and Encapsulation Material Selection
    • 8.4.2. Substrate Coatings
    • 8.4.3. Transparent Electrodes
    • 8.4.4. Encapsulation
  • 8.5. Inspection and Quality Control

Chapter 9: Outlook for the Worldwide OLED Market

  • 9.1. Introduction
  • 9.2. Passive Matrix Capacity and Demand
  • 9.3. Active Matrix Capacity and Demand
  • 9.4. Cost Challenges for OLED Lighting

Chapter 10: Outlook for the Worldwide High-Brightness LED Market

  • 10.1. HB LED Technology
  • 10.2. HB LED Market Overview and trends
    • 10.2.1. Market Drivers for SSL
    • 10.2.2. LED Backlights for Notebook PCs
    • 10.2.3. LED Backlights for LCD TVs
    • 10.2.4. LED Backlights for Other Applications
    • 10.2.5. LED Lighting Market
    • 10.2.6. LED Active Outdoor Display Market
    • 10.2.7. LED Signal Market
    • 10.2.8. LED Automotive Market
    • 10.2.9. LED Mobile Market

List of Tables

  • 2.1. Color, Wavelength Material Of LED
  • 2.2. Light Source Comparison
  • 2.3. Comparison of LED, HB-LED, UHB-LED Characteristics
  • 3.1. Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap
  • 3.2. Process Control Metrics
  • 4.1. Production Method for Various LEDs
  • 4.2. LED Cost Model: Impact of Substrate Choice
  • 4.3. Comparison of $/klm for LED Made on Various 2" Substrates
  • 5.1. Properties of Die Bonding Processes
  • 7.1. Efficiency of Emitter Materials
  • 7.2. Status of Technology Towards Lighting Targets
  • 7.3. Cost Targets for Panels
  • 7.4. Cost Comparison OLED Display vs Lighting
  • 8.1. Cost Targets for Panels Produced by Traditional Methods
  • 10.1. Forecast of LED Backlights for Notebook PCs
  • 10.2. Forecast of LED Backlights for LCD TVs
  • 10.3. Forecast of LED Backlights for Other Application
  • 10.4. Forecast of LED Lighting Market
  • 10.5. Forecast of LED Active Outdoor Display Market
  • 10.6. Forecast of LED Signal Market
  • 10.7. Forecast of LED Automotive Market
  • 10.8. Forecast of LED Mobile Market
  • 10.9. Top 10 LED Vendors

List of Figures

  • 2.1. Operation of LED
  • 2.2. Key Intellectual Property Relationships
  • 2.3. DOE Roadmap
  • 2.4. Relative Manufacturing Costs
  • 2.5. Pareto Analysis Of SSL Manufacturing Costs
  • 2.6. Market drivers for LED Biz and Applications
  • 2.7. SSL vs. Classical Technologies
  • 2.8. LED Performance vs. Traditional Light Sources
  • 2.9. Energy Production and Use Comparison
  • 2.10. Worldwide LED Market Forecast
  • 3.1. SSL - LED manufacturing with MOCVD: productivity and Cost Analysis
  • 3.2. Larger Wafer Size: GaN LEDs
  • 3.3. Global Shipments of MOCVD Tools By Vendor
  • 3.4. Global Shipments of MOCVD Tools By Region
  • 3.5. Diagram of RPCVD Reactor
  • 3.6. Comparison between MOCVD and RPCVD
  • 3.7. CMP Process
  • 3.8. Nanoimprint Lithography System
  • 3.9. The Phlatlight Chip
  • 4.1. Regular LED (white) Front-End Steps
  • 4.2. Current Blocking Layer
  • 4.3. Regular LED (white) Production Costs for 100k wafers/year
  • 4.4. HB LED (white) Production Costs for 100k wafers/year
  • 4.5. Main Manufacturing Steps for GaN-based LED
  • 4.6. Regular LED (white) Back-End
  • 4.7. Methods to Improve White LED Efficiency
  • 4.8. Phosphor Coating - Four Approaches
  • 5.1. Hybrid Integration Approach to HD-LED Package
  • 5.2. Chain Wire Bond
  • 5.3. HB-LED with Silicon Carrier Submount
  • 5.4. Silicon interposer for MEMS / LED Applications
  • 5.5. High Brightness LED
  • 5.6. SMD Package Cost Structure
  • 5.7. Packaging Changes Result in Optical Improvements
  • 5.8. Substrate Solutions for HB/HP LEDs
  • 6.1. DOE Solid-State Lighting Program Strategy
  • 6.2. DOE Efficacy Targets
  • 6.3. Congressional Appropriations
  • 6.4. SSL R&D Project Funding
  • 6.5. Price Targets
  • 7.1. OLED Lighting Stack
  • 8.1. Schematic of VTE Deposition System
  • 8.2. Schematic of OVPD Deposition System
  • 8.3. Comparison Between VTE and OVPD Technology
  • 8.4. Schematic of Inkjet Deposition System
  • 8.5. Schematic of R2R Deposition System
  • 8.6. Illustration of Planarization Layer on OLED
  • 9.1. Schematic of PMOLED
  • 9.2. PMOLED Stack/Driving Architecture
  • 9.3. Schematic of AMOLED
  • 9.4. Passive Matrix OLED Capacity and Demand
  • 9.5. Active Matrix OLED Capacity and Demand
  • 10.1. LED Market by Sector
  • 10.2. Worldwide LED Market Forecast
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