LED和OLED (有機發光二極體):市場分析與製造趨勢

本報告提供全球LED (發光半導體) 及OLED (有機LED/有機發光二極體)的市場、產業趨勢相關分析，產品的概要和產品的基本結構、生產方法，主要的推動及阻礙市場要素，生產量、市場規模趨勢預測，各產品領域詳細趨勢，政府的輔助策略，今後的技術進步、市場成長可能性等資訊彙整，為您概述為以下內容。

第1章 簡介

第2章 高亮度LED技術和應用相關的近幾年的進步

• LED:工作理論
• 智慧財產權 (IP) 地圖
• LED的製造技術與成本
• 一般照明LED市場

第3章 加工設備

• 簡介
• 沉澱
  • 固態照明(SSL)用有機金屬化學氣相澱積 (MOCVD):生產率的課題與解決的辦法
  • 低溫等離子化學氣相沉積 (RPCVD)
• 化學機器平坦化
• 品管測試、實驗
• 微影術
  • 步進機

第4章 結構材料

• 簡介
• 發光用、GaN為基礎的LED
  • 白色LED的效率改善手段
  • LED基板:商品化之前需要的時間
• LED螢光粉的製造上的課題
  • LED螢光粉的目前製造工程
  • LED螢光粉的成本

第5章 高亮度LED的封裝、組裝時的課題

• 高亮度LED (HB LED) 用封裝
  • Bonding (連接)
  • Die/Ball Bonding
  • Scribing
• 晶圓構裝:HB LED的情況
• 熱問題
• 實驗、檢驗

第6章 技術創新的促進因素的政府計劃

• DoE (美國能源局):SSL製造業支援政策
• DoE:SSL支援計劃的使命和目標
• LED相關的主要的政府研究計劃
• SSL製造業所面對的課題

第7章 OLED (有機發光二極體) 照明

• 照明廠商的機會
• OLED的功能的辦法
• OLED照明和OLED顯示器的差異
• OLED照明技術的優點
• OLED的性能指標

第8章 OLED的製造工程

• OLED照明沉澱設備、工程
  • 真空蒸發/真空熱沉澱 (VTE)
  • 有機沉澱 (OVPD)
  • 噴墨印刷
  • R2R (Roll-to-Roll)
• 通用OLED的製造成本相關考察
• 微影術
• 基板與封裝
  • 基板、封裝材料的選擇
  • 基板的塗裝
  • 透明電極
  • 封裝
• 檢驗、品管

第9章 全球OLED市場未來展望

• 簡介
• 被動式矩陣 (單純矩陣) 方式:生產能力和需求量
• 主動式矩陣方式:生產能力和需求量
• OLED照明的價格變化

第10章 全球高亮度LED (HB LED) 市場未來展望

• HB LED的技術
• HB LED的市場:概要與趨勢
  • SSL的市場促進因素
  • 筆記型電腦LED背光
  • 液晶TV用LED背光
  • 其他的用途的LED背光
  • LED照明市場
  • 室外用LED主動顯示市場
  • LED訊號燈市場
  • 汽車用LED市場
  • 行動電話用LED市場

The High Brightness Light Emitting Diode (HB LED) market is exploding as unit shipments continue their upward growth. LEDs are creating a niche market for conventional suppliers of semiconductor processing tools. Markets for HB LEDs, backlight LEDs, and OLEDs are forecast.

Table of Contents

Chapter 1: Introduction

Chapter 2: Recent Progress in High Brightness LED Technology and Applications

• 2.1. LED: Theory of Operation
• 2.2. Intellectual Property Map
• 2.3. LED Manufacturing Technologies & Costs
• 2.4. LED Market General Illumination

Chapter 3: Processing Equipment

• 3.1. Introduction
• 3.2. Deposition
  • 3.2.1. MOCVD for SSL - Productivity Challenges and Solutions
  • 3.2.2. Low temperature Remote Plasma Chemical Vapor Deposition (RPCVD)
• 3.3. Chemical Mechanical Planarization
• 3.4. Defect Inspection and Testing
• 3.5. Lithography
  • 3.5.1. Steppers

Chapter 4: Materials of Construction

• 4.1. Introduction
• 4.2. GaN-based LED for General Lighting
  • 4.2.1. Methods to Improve White LED Efficiency
  • 4.2.2. Time-to-Market for LED substrates
• 4.3. LED Phosphor Manufacturing Issues
  • 4.3.1. Current LED Phosphor Manufacturing
  • 4.3.2. LED Phosphor Cost

Chapter 5: Packaging and Assembly Issues for High Brightness LEDs

• 5.1. Packaging for HB LEDs
  • 5.1.1. Bonding
  • 5.1.2. Die/Ball Bonding
  • 5.1.3. Scribing
• 5.2. Wafer Level Packaging HB LEDs
• 5.3. Thermal Issues
• 5.4. Test and Inspection

Chapter 6: National Programs As Innovation Drivers

• 6.1. DOE Solid-State Lighting Manufacturing Initiative
• 6.2. DOE Solid-State Lighting Program Mission and Goal
• 6.3. Major National Research Programs Pertaining to LEDs
• 6.4. Challenges Facing SSL Manufacturing

Chapter 7: OLED Lighting

• 7.1. Opportunities for Luminaire Manufacturers
• 7.2. How Does an OLED Work
• 7.3. Differences Between OLED Lighting and OLED Display
• 7.4. Benefits of OLED Lighting Technology
• 7.5. OLED Performance Metrics

Chapter 8: OLED Manufacturing

• 8.1. Deposition Equipment and Processes for OLED Lighting
  • 8.1.1. Vacuum Deposition Or Vacuum Thermal Evaporation (VTE)
  • 8.1.2. Organic Vapor Deposition (OVPD)
  • 8.1.3. Inkjet Printing
  • 8.1.4. Roll-to-Roll (R2R)
• 8.2. General OLED Manufacturing Cost Considerations
• 8.3. Lithography
• 8.4. Substrates and Encapsulation
  • 8.4.1. Substrate and Encapsulation Material Selection
  • 8.4.2. Substrate Coatings
  • 8.4.3. Transparent Electrodes
  • 8.4.4. Encapsulation
• 8.5. Inspection and Quality Control

Chapter 9: Outlook for the Worldwide OLED Market

• 9.1. Introduction
• 9.2. Passive Matrix Capacity and Demand
• 9.3. Active Matrix Capacity and Demand
• 9.4. Cost Challenges for OLED Lighting

Chapter 10: Outlook for the Worldwide High-Brightness LED Market

• 10.1. HB LED Technology
• 10.2. HB LED Market Overview and trends
  • 10.2.1. Market Drivers for SSL
  • 10.2.2. LED Backlights for Notebook PCs
  • 10.2.3. LED Backlights for LCD TVs
  • 10.2.4. LED Backlights for Other Applications
  • 10.2.5. LED Lighting Market
  • 10.2.6. LED Active Outdoor Display Market
  • 10.2.7. LED Signal Market
  • 10.2.8. LED Automotive Market
  • 10.2.9. LED Mobile Market

List of Tables

• 2.1. Color, Wavelength Material Of LED
• 2.2. Light Source Comparison
• 2.3. Comparison of LED, HB-LED, UHB-LED Characteristics
• 3.1. Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap
• 3.2. Process Control Metrics
• 4.1. Production Method for Various LEDs
• 4.2. LED Cost Model: Impact of Substrate Choice
• 4.3. Comparison of $/klm for LED Made on Various 2" Substrates
• 5.1. Properties of Die Bonding Processes
• 7.1. Efficiency of Emitter Materials
• 7.2. Status of Technology Towards Lighting Targets
• 7.3. Cost Targets for Panels
• 7.4. Cost Comparison OLED Display vs Lighting
• 8.1. Cost Targets for Panels Produced by Traditional Methods
• 10.1. Forecast of LED Backlights for Notebook PCs
• 10.2. Forecast of LED Backlights for LCD TVs
• 10.3. Forecast of LED Backlights for Other Application
• 10.4. Forecast of LED Lighting Market
• 10.5. Forecast of LED Active Outdoor Display Market
• 10.6. Forecast of LED Signal Market
• 10.7. Forecast of LED Automotive Market
• 10.8. Forecast of LED Mobile Market
• 10.9. Top 10 LED Vendors

List of Figures

• 2.1. Operation of LED
• 2.2. Key Intellectual Property Relationships
• 2.3. DOE Roadmap
• 2.4. Relative Manufacturing Costs
• 2.5. Pareto Analysis Of SSL Manufacturing Costs
• 2.6. Market drivers for LED Biz and Applications
• 2.7. SSL vs. Classical Technologies
• 2.8. LED Performance vs. Traditional Light Sources
• 2.9. Energy Production and Use Comparison
• 2.10. Worldwide LED Market Forecast
• 3.1. SSL - LED manufacturing with MOCVD: productivity and Cost Analysis
• 3.2. Larger Wafer Size: GaN LEDs
• 3.3. Global Shipments of MOCVD Tools By Vendor
• 3.4. Global Shipments of MOCVD Tools By Region
• 3.5. Diagram of RPCVD Reactor
• 3.6. Comparison between MOCVD and RPCVD
• 3.7. CMP Process
• 3.8. Nanoimprint Lithography System
• 3.9. The Phlatlight Chip
• 4.1. Regular LED (white) Front-End Steps
• 4.2. Current Blocking Layer
• 4.3. Regular LED (white) Production Costs for 100k wafers/year
• 4.4. HB LED (white) Production Costs for 100k wafers/year
• 4.5. Main Manufacturing Steps for GaN-based LED
• 4.6. Regular LED (white) Back-End
• 4.7. Methods to Improve White LED Efficiency
• 4.8. Phosphor Coating - Four Approaches
• 5.1. Hybrid Integration Approach to HD-LED Package
• 5.2. Chain Wire Bond
• 5.3. HB-LED with Silicon Carrier Submount
• 5.4. Silicon interposer for MEMS / LED Applications
• 5.5. High Brightness LED
• 5.6. SMD Package Cost Structure
• 5.7. Packaging Changes Result in Optical Improvements
• 5.8. Substrate Solutions for HB/HP LEDs
• 6.1. DOE Solid-State Lighting Program Strategy
• 6.2. DOE Efficacy Targets
• 6.3. Congressional Appropriations
• 6.4. SSL R&D Project Funding
• 6.5. Price Targets
• 7.1. OLED Lighting Stack
• 8.1. Schematic of VTE Deposition System
• 8.2. Schematic of OVPD Deposition System
• 8.3. Comparison Between VTE and OVPD Technology
• 8.4. Schematic of Inkjet Deposition System
• 8.5. Schematic of R2R Deposition System
• 8.6. Illustration of Planarization Layer on OLED
• 9.1. Schematic of PMOLED
• 9.2. PMOLED Stack/Driving Architecture
• 9.3. Schematic of AMOLED
• 9.4. Passive Matrix OLED Capacity and Demand
• 9.5. Active Matrix OLED Capacity and Demand
• 10.1. LED Market by Sector
• 10.2. Worldwide LED Market Forecast