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1459346

全球故障分析市場 - 2024-2031

Global Failure Analysis Market - 2024-2031

出版日期: 2024年04月03日 | 出版商:

DataM Intelligence | 英文 280 Pages | 商品交期: 約2個工作天內

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簡介目錄

概述

全球故障分析市場在 2023 年達到 51 億美元，預計到 2031 年將達到 95 億美元，在 2024-2031 年預測期間複合CAGR為 8.2%。

產品故障的可能性隨著產品複雜性（包括小型化和複雜設計）的增加而增加。這種複雜性影響著工業、汽車、航空航太、電子和醫療保健領域。為了確定故障的根本原因並確保這些複雜結構的可靠性和功能性，故障分析至關重要。行業協會和監管機構執行高品質和安全標準，以確保產品的合規性、安全性和可靠性。透過定位材料、零件和系統中的缺陷和故障模式，故障分析對於滿足這些要求至關重要。汽車、航空航太、醫療器材和製藥業的嚴格限制增加了對故障分析服務和解決方案的需求。

為了滿足消費者對故障分析解決方案日益成長的需求，市場上的一些主要參與者正在全球擴展業務。例如，2023 年 9 月 1 日，電子製造服務供應商 NEOTech 擴建了位於墨西哥的故障分析實驗室，為客戶提供更高水準的產品品質保證。 NEOTech 承諾投資尖端設備，使其能夠提供一流的服務。由於對品質的執著，NEOTech 的客戶可以保證其產品保持競爭優勢。

由於在預測期內該地區主要參與者不斷推出技術先進的故障分析產品，亞太地區成為市場的主導地區。例如，2021 年 8 月 8 日，Joel Ltd. 推出了半透鏡版本 (i)/(is)，最適合觀察肖特基場發射電子顯微鏡 JSM-IT800 的半導體裝置。

透過將電子束與物鏡下方形成的強大磁場透鏡合併，半透鏡可產生極高的解析度。此外，該設備有效地收集從樣品中釋放的低能二次電子，並使用上部透鏡內檢測器（UID）來檢測電子。因此，它可以以高解析度查看和分析傾斜和橫截面樣本，這對於半導體裝置故障調查是必要的。

動力學

嚴格的監管標準

監管機構對製造商和供應商提出強制性合規要求，包括美國食品藥物管理局(FDA)、歐洲藥品管理局(EMA)、美國聯邦航空管理局(FAA)、國際標準化組織(ISO) 和多個行業特定監管機構機構。為了確保法規遵循，這些標準通常涉及嚴格的品質控制方法、產品測試程序和故障分析程序。為了實現並維持合規性，建議企業投資故障分析服務和解決方案。

例如，中央藥品標準控制組織（CDSCO）是印度負責監督各種醫療器材的監管組織。每一種想要在印度傳播或推廣的醫療器材都必須先獲得CDSCO的授權才能獲準上市。 CDSCO 遵守有關醫療器材產業的所有適用法律、法規和規章。每年有數千人申請註冊。因此，如今法規變得越來越嚴格，以確保只銷售有益於人民的產品。 CDSCO 發布的需要註冊的非通報醫療器材清單中的醫療保健產品之一是顯微鏡。

分析和成像技術的進步

透射電子顯微鏡和掃描電子顯微鏡等顯微鏡技術的發展提高了品質。分析師可以透過更高解析度的成像來確定故障過程和根本原因，以查看材料和組件中的微小特徵和缺陷。使用通常提供材料的 2D 影像的傳統成像技術時，解釋複雜的 3D 結構更具挑戰性。透過先進的成像方法（例如電腦斷層掃描和共焦顯微鏡等）可以對材料和組件進行3D成像。透過暴露底層結構和空間連接，3D視覺化提高了故障分析的準確性。

研究人員可以透過使用現場測試和分析方法來了解現實環境中的材料行為和失效機制。原位 TEM 和原位光譜等方法可以動態監測不同環境暴露下的樣品，例如熱循環、機械應力、腐蝕等。研究人員利用原位分析創建故障分析預測模型，提供有關故障過程演變的深刻資訊。

擁有及維護成本高

通常需要大量的初始資金支出來購買複雜的故障分析工具，例如透射電子顯微鏡 (TEM)、聚焦離子束 (FIB) 系統和掃描電子顯微鏡 (SEM)。對於許多組織來說，尤其是規模較小的組織或資源較少的研究機構，可能很難維持購買此類技術所需的初始成本。

故障分析設備經常需要超出最初購買的持續維護和維修成本。此費用包括定期維護以確保最佳效率的費用以及更換或維修老化零件的費用。在設備的整個生命週期中，這些維護費用會不斷增加並提高整體擁有成本。使用和維護複雜的故障分析設備經常需要特定領域的專業知識。為了確保設備正常運作和維護，組織需要進行培訓計畫投資或招募稱職的員工。缺乏具有故障分析方法經驗的合格工程師或技術人員可能會進一步增加勞動成本並提高總擁有成本。

The likelihood of product failures rises with product complexity, including miniaturization and complicated designs. The complexity affects the industrial, automotive, aerospace, electronics and healthcare sectors. To determine the root cause of failures and ensure the dependability and functionality of these complex structures, failure analysis is crucial. High quality and safety standards are enforced by industry associations and regulatory agencies to guarantee product conformity, safety and dependability. By locating shortcomings weaknesses and failure modes in materials, components and systems, failure analysis is essential to fulfilling these requirements. Strict restrictions in the automobile, aerospace, medical device and pharmaceutical industries have increased demand for failure analysis services and solutions.

To fulfill consumers increased demand for failure analysis solutions some of the major key players in the market are expanding their business globally. For instance, on September 01, 2023, NEOTech, an electronic manufacturing service provider expanded its failure analysis laboratory in Mexico to provide customers with enhanced levels of product quality assurance. NEOTech has shown its commitment to investing in cutting-edge equipment, enabling it to provide best-in-class services. Customers of NEOTech are guaranteed to maintain their products' competitive edge because of this dedication to quality.

Asia-Pacific is the dominating region in the market due to the growing technologically advanced failure analysis product launches by major key players in the region over the forecast period. For instance, on August 08, 2021, Joel Ltd. launched semi-in-lens versions (i)/(is) which are optimal for the observation of semiconductor devices of the Schottky Field Emission Electron Microscope JSM-IT800.

By merging electron beams with the powerful magnetic field lens that forms below the objective lens, a semi-in-lens produces extremely high resolution. Additionally, the device effectively gathers the low-energy secondary electrons released from a sample and uses the upper in-lens detector (UID) to detect the electrons. As a result, it makes it possible to see and analyze inclined and cross-sectional specimens at high resolution, which is necessary for semiconductor device failure investigation.

Dynamics

Stringent Regulatory Standards

Mandatory compliance requirements are imposed on manufacturers and suppliers by regulatory bodies, including the Food and Drug Administration (FDA), European Medicines Agency (EMA), Federal Aviation Administration (FAA), International Organization for Standardization (ISO) and several industry-specific regulatory agencies. To guarantee regulatory compliance, these criteria frequently involve strict quality control methods, product testing procedures and failure analysis procedures. To achieve and sustain compliance, businesses are advised to invest in failure analysis services and solutions.

For instance, the Central Drug Standard Control Organization or CDSCO, is the regulatory organization in India that oversees various medical devices. Every medical device that wants to be propagated or promoted in India must first receive authorization from the CDSCO before being allowed to be marketed. The CDSCO conforms with all applicable laws, rules and regulations about the medical device industry. Thousands of people apply for registration each year. Due to this, regulations are becoming more strict these days to guarantee that only products that benefit people are sold. One of the healthcare products on the CDSCO-released list of non-notified medical devices that require registration is a microscope.

Technological Advancements in Analytical and Imaging

Technological developments in microscopy like transmission electron microscopy and scanning electron microscopy, have improved quality. Analysts can determine failure processes and root causes via higher-resolution imaging to see minute features and imperfections in materials and components. Interpreting complex 3-D structures is more challenging when using conventional imaging techniques, which usually offer 2-D images of materials. Three-dimensional imaging of materials and components is made possible by advanced imaging methods such as computed tomography and confocal microscopy, among others. By exposing underlying structures and spatial connections, three-dimensional visualization improves the accuracy of failure analysis.

Researchers can see material behavior and failure mechanisms in real-world settings by using in-situ testing and analysis methods. Methods like in-situ TEM and in-situ spectroscopy allow the dynamic monitoring of samples under different environmental exposures such as heat cycling, mechanical stress, corrosion and others. Researchers create prediction models for failure analysis with the use of in-situ analysis, which offers insightful information about the evolution of failure processes.

High Ownership and Maintenance Cost

It typically requires a substantial initial expenditure of funds to purchase sophisticated failure analysis tools like transmission electron microscopes (TEMs), focused ion beam (FIB) systems and scanning electron microscopes (SEMs). It may be difficult for many organizations, especially smaller ones or research facilities with smaller resources, to uphold the initial cost required for purchasing such technology.

Failure analysis equipment frequently requires continuing maintenance and servicing costs beyond the initial purchase. The covers the expenses of doing regular maintenance to ensure optimal efficiency as well as the price of replacing or repairing aging components. Throughout the equipment's life, these maintenance expenses can add up and raise the overall cost of ownership. Expertise in particular fields is frequently needed to use and maintain sophisticated failure analysis equipment. To guarantee that the equipment is operated and maintained properly organizations would need to make training program investments or recruit competent staff. The lack of qualified engineers or technicians with experience in failure analysis methods might raise labor expenses further and raise the total cost of ownership.

Segment Analysis

The global failure analysis market is segmented based on technology, equipment, test, end-user and region.

Growing Adoption of Failure Analysis Software Globally

Based on the Technology, the failure analysis market is segmented into Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Focused Ion Beam (FIB), Energy-dispersive X-ray spectroscopy (EDS), X-ray Photoelectron Spectroscopy (XPS) and Others. With the use of SEM's high-resolution imaging capabilities, analysts study sample surfaces with resolution down to the nanoscale. The is ideal for identifying the fundamental causes of various materials and component failures as it allows the examination of microstructures and failure locations. SEM has a broad depth of focus in comparison to other microscopy techniques, which enables it to examine materials with uneven or rough surfaces. Due to this, SEM is very useful for analyzing complex structures and identifying small imperfections that could lead to failures.

Through the use of this skill, analysts may determine the chemical makeup of materials and locate impurities or contaminants that cause failures. Several substances, including biological specimens and ceramics, metals and semiconductors, were analyzed employing scanning electron microscopy. Over the projection period, the leading important players' increasing number of product launches contribute to the growth of the market. For instance, on January 29, 2021, Emory University, launched Energy-Dispersive Spectroscopy for elemental analysis. Particular substances and their relative percentages in different sections of a sample can be determined by combining the current scanning electron microscope (SEM) with an EDS system. EDS makes use of the idea that each element's related atomic structure produces a unique peak profile on an X-ray spectrum.

Geographical Penetration

Asia-Pacific is Dominating the Failure Analysis Market

Asia-Pacific is a significant center for manufacturing across several industries, such as consumer products, automobiles and aerospace. Because of the robust manufacturing sector in the region, which requires product quality and conformance to industry standards, failure analysis services are in high demand. Leading semiconductor producers, suppliers of electronic components and technological companies that promote technical innovation and breakthroughs in failure analysis methods and instruments are based in Asia-Pacific. The region's importance in the globally failure analysis market is attributed to its proficiency in electronics and semiconductor production.

The demand for failure analysis services has increased in response to the rapid industrialization and economic expansion of countries like China, Japan, South Korea and Taiwan, which has helped in the creation and manufacturing of cutting-edge goods and technology. Failure analysis is becoming increasingly necessary as the region's businesses modernize and use sophisticated production techniques to identify and mitigate risks.

Competitive Landscape.

The major global players in the market include Keysight Technologies, Anritsu Corporation, TUV SUD, NEC Corporation, L3Harris Technologies, Inc., Smiths Interconnect, Intertech Group Plc., TEC Materials Testing, McDowell Owens Engineering Inc., Panacea Engineers and Metallurgical Engineering Services, Inc.

COVID-19 Impact Analysis

The pandemic produced delays in the delivery of components, tools and supplies needed for failure analysis procedures by upsetting globally supply networks. Travel restrictions and interruptions to business operations led to shortages and logistical problems that impacted the velocity of failure analysis services. The pandemic's impact on consumer spending and financial instability contributed to a reduction in demand for products and services in several industries, including electronics, automotive and aerospace.

Money and resources were diverted from failure analysis programs, especially in areas of the economy that were directly grasped by pandemic response activities. For failure analysis service providers and their clients, the shift to remote labor presented difficulties, especially in sectors where on-site inspections and practical testing are crucial. The use of remote work arrangements has resulted in obstacles to cooperation, communication and physical inspection capabilities, ultimately causing delays and inefficiencies in failure analysis processes.

Russia-Ukraine War Impact Analysis

Significant suppliers of raw materials, parts and technology to a variety of industries, including electronics, semiconductor manufacturing, aerospace and defense, contain Russia and Ukraine. Any disruption in the conflict's supply chain might result in shortages of vital supplies or parts, which would interfere with production plans and cause failure analysis studies to be postponed. The conflict's unpredictability might cause price volatility in the world's commodities markets, which include those for energy resources, metals and minerals. Price fluctuations affect the supplies and equipment required for failure analysis procedures, which result in increased operational costs for market participants.

Global trade relations and regulatory environments are impacted by geopolitical tensions emerging from the conflict. The transfer of products, technology and services across borders is impacted by increased sanctions, trade restrictions or export controls placed on Russia or Ukraine. The restricts access to essential assets or hamper cross-border cooperation in the failure analysis industry. Industries that are directly affected by the conflict, such as electronics, aircraft and defense, could put more money and resources into supply chain vulnerabilities or risk mitigation. The causes changes in the market for failure analysis services, with a greater emphasis on locating and resolving possible weaknesses in vital infrastructure and supply networks.

By Technology

Scanning Electron Microscopy (SEM)
Transmission Electron Microscopy (TEM)
Focused Ion Beam (FIB)
Energy-dispersive X-ray spectroscopy (EDS)
X-ray Photoelectron Spectroscopy (XPS)
Others

By Equipment

Electron Microscopes
Optical Microscopes
X-ray Machines
Ion Beam Machines
Spectroscopy Equipment
Thermal Analyzers
Others

By Test

Material Testing
Non-Destructive Testing (NDT)
Chemical Analysis
Physical Testing
Electrical Testing
Mechanical Testing
Others

By End-User

Semiconductor & Electronics
Automotive
Aerospace & Defense
Medical Devices
Material Science
Oil & Gas
Others

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- Germany
- UK
- France
- Italy
- Spain
- Rest of Europe
South America
- Brazil
- Argentina
- Rest of South America
Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific
Middle East and Africa

Key Developments

On November 08, 2022, TESCAN, launched New TENSOR Scanning Transmission Electron Microscope in the market. TENSOR is designed to meet the demands of semiconductor R&D and failure analysis (FA) engineers, materials scientists and crystallographers, as well as anybody interested in multimodal nano-characterization applications (morphological, chemical and structural).
On June 06, 2023, LambdaTest launched an AI-powered Test Failure Analysis feature in its smart test orchestration platform HyperExecute. With just one click, digital organizations will be able to expedite their troubleshooting and repair process for test case failures due to this revolutionary new feature.
On May 12, 2020, Sauce Labs launched a new machine learning-based analytics solution to improve test quality. Failure Analysis allows developers, testers and QA managers to quickly tackle the most common issues and promote rapid test quality improvement by providing information on how frequently a certain type of failure occurs across a test suite.

Why Purchase the Report?

To visualize the global failure analysis market segmentation based on technology, equipment, test, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of failure analysis market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global failure analysis market report would provide approximately 73 tables, 78 figures and 280 Pages.

Target Audience 2024

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1.Methodology and Scope

1.1.Research Methodology
1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

3.1.Snippet by Technology
3.2.Snippet by Equipment
3.3.Snippet by Test
3.4.Snippet by End-User
3.5.Snippet by Region

4.Dynamics

4.1.Impacting Factors
- 4.1.1.Drivers
  - 4.1.1.1.Stringent Regulatory Standards
  - 4.1.1.2.Technological Advancements in Analytical and Imaging
- 4.1.2.Restraints
  - 4.1.2.1.High Ownership and Maintenance Cost
- 4.1.3.Opportunity
- 4.1.4.Impact Analysis

5.Industry Analysis

5.1.Porter's Five Force Analysis
5.2.Supply Chain Analysis
5.3.Pricing Analysis
5.4.Regulatory Analysis
5.5.Russia-Ukraine War Impact Analysis
5.6.DMI Opinion

6.COVID-19 Analysis

6.1.Analysis of COVID-19
- 6.1.1.Scenario Before COVID
- 6.1.2.Scenario During COVID
- 6.1.3.Scenario Post COVID
6.2.Pricing Dynamics Amid COVID-19
6.3.Demand-Supply Spectrum
6.4.Government Initiatives Related to the Market During Pandemic
6.5.Manufacturers Strategic Initiatives
6.6.Conclusion

7.By Technology

7.1.Introduction
- 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 7.1.2.Market Attractiveness Index, By Technology
7.2.Scanning Electron Microscopy (SEM)*
- 7.2.1.Introduction
- 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3.Transmission Electron Microscopy (TEM)
7.4.Focused Ion Beam (FIB)
7.5.Energy-dispersive X-ray spectroscopy (EDS)
7.6.X-ray Photoelectron Spectroscopy (XPS)
7.7.Others

8.By Equipment

8.1.Introduction
- 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
- 8.1.2.Market Attractiveness Index, By Equipment
8.2.Electron Microscopes*
- 8.2.1.Introduction
- 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3.Optical Microscopes
8.4.X-ray Machines
8.5.Ion Beam Machines
8.6.Spectroscopy Equipment
8.7.Thermal Analyzers
8.8.Others

9.By Test

9.1.Introduction
- 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
- 9.1.2.Market Attractiveness Index, By Test
9.2.Material Testing*
- 9.2.1.Introduction
- 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3.Non-Destructive Testing (NDT)
9.4.Chemical Analysis
9.5.Physical Testing
9.6.Electrical Testing
9.7.Mechanical Testing
9.8.Others

10.By End-User

10.1.Introduction
- 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.1.2.Market Attractiveness Index, By End-User
10.2.Semiconductor & Electronics*
- 10.2.1.Introduction
- 10.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
10.3.Automotive
10.4.Aerospace & Defense
10.5.Medical Devices
10.6.Material Science
10.7.Oil & Gas
10.8.Others

11.By Region

11.1.Introduction
- 11.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 11.1.2.Market Attractiveness Index, By Region
11.2.North America
- 11.2.1.Introduction
- 11.2.2.Key Region-Specific Dynamics
- 11.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 11.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
- 11.2.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
- 11.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.2.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.2.7.1.U.S.
  - 11.2.7.2.Canada
  - 11.2.7.3.Mexico
11.3.Europe
- 11.3.1.Introduction
- 11.3.2.Key Region-Specific Dynamics
- 11.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 11.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
- 11.3.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
- 11.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.3.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.3.7.1.Germany
  - 11.3.7.2.UK
  - 11.3.7.3.France
  - 11.3.7.4.Italy
  - 11.3.7.5.Spain
  - 11.3.7.6.Rest of Europe
11.4.South America
- 11.4.1.Introduction
- 11.4.2.Key Region-Specific Dynamics
- 11.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 11.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
- 11.4.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
- 11.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.4.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.4.7.1.Brazil
  - 11.4.7.2.Argentina
  - 11.4.7.3.Rest of South America
11.5.Asia-Pacific
- 11.5.1.Introduction
- 11.5.2.Key Region-Specific Dynamics
- 11.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 11.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
- 11.5.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
- 11.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.5.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.5.7.1.China
  - 11.5.7.2.India
  - 11.5.7.3.Japan
  - 11.5.7.4.Australia
  - 11.5.7.5.Rest of Asia-Pacific
11.6.Middle East and Africa
- 11.6.1.Introduction
- 11.6.2.Key Region-Specific Dynamics
- 11.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 11.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
- 11.6.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
- 11.6.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

12.Competitive Landscape

12.1.Competitive Scenario
12.2.Market Positioning/Share Analysis
12.3.Mergers and Acquisitions Analysis

13.Company Profiles

13.1.Keysight Technologies*
- 13.1.1.Company Overview
- 13.1.2.Product Portfolio and Description
- 13.1.3.Financial Overview
- 13.1.4.Key Developments
13.2.Anritsu Corporation
13.3.TUV SUD
13.4.NEC Corporation
13.5.L3Harris Technologies, Inc.
13.6.Smith's Interconnect
13.7.Intertech Group Plc.
13.8.TEC Materials Testing
13.9.McDowell Owens Engineering Inc.
13.10.Panacea Engineers
13.11.Metallurgical Engineering Services, Inc.