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1458035

全球多模式晶片組市場研究報告 - 2024 年至 2032 年產業分析、規模、佔有率、成長、趨勢與預測

Global Multi-Mode Chipset Market Research Report - Industry Analysis, Size, Share, Growth, Trends and Forecast 2024 to 2032

出版日期: 2024年03月01日 | 出版商:

Value Market Research | 英文 112 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄圖表

全球多模晶片組市場需求預計將從 2023 年的 67.4 億美元增至 2032 年的近 224.6 億美元，2024-2032 年研究期間CAGR為 14.3%。

多模式晶片組是指在電子設備內支援和啟用多種通訊模式的積體電路。這些晶片組通常包含各種無線技術的功能，例如 Wi-Fi、藍牙和蜂窩連接。透過將多種模式整合到單一晶片組中，製造商可以創建具有增強連接選項的多功能緊湊型設備，從而提高智慧型手機、平板電腦和物聯網設備等各種電子產品的效率和功能。

市場動態

由於對高速可靠通訊網路的需求不斷成長、連接設備的激增以及無線通訊技術的進步，多模晶片組市場經歷了成長。多模晶片組使設備能夠支援多種無線通訊標準，包括 3G、4G 和 5G，從而在不同的網路環境中提供靈活性和相容性。智慧型手機、智慧家庭設備和物聯網 (IoT) 設備的日益普及促進了市場成長。此外，5G 網路的全球擴張以及跨不同代無線技術無縫連接的需求推動了市場成長。更高資料速率、低延遲通訊和智慧基礎設施發展的趨勢進一步刺激了市場成長。包括整合天線和節能設計在內的技術創新有助於提高多模晶片組的性能和效率，支援其整合到各種無線設備和網路設備中。

研究報告涵蓋波特五力模型、市場吸引力分析和價值鏈分析。這些工具有助於清晰地了解行業結構並評估全球範圍內的競爭吸引力。此外，這些工具也對全球多模晶片組市場的各個細分市場進行了包容性評估。多模晶片組產業的成長和趨勢為本研究提供了整體方法。

市場區隔

多模晶片組市場報告的這一部分提供了國家和地區級別細分市場的詳細資料，從而幫助戰略家確定相應產品或服務的目標人群以及即將到來的機會。

按申請

智慧型手機
平板電腦
穿戴式裝置
其他

區域分析

本節涵蓋區域前景，重點介紹北美、歐洲、亞太地區、拉丁美洲以及中東和非洲多模晶片組市場當前和未來的需求。此外，該報告重點關注所有主要地區各個應用領域的需求、估計和預測。

全球多模式晶片組市場佔有率（按地區）（代表性圖）
全球多模晶片組市場佔有率

該研究報告還涵蓋了市場主要參與者的全面概況以及對全球競爭格局的深入了解。多模晶片組市場的主要參與者包括海思半導體、英特爾公司、高通技術公司、三星集團、聯發科、展訊通訊、Marvell 科技集團、Altair Semiconductor, Inc.、博通公司、GCT Semiconductor Inc.。對競爭格局的整體看法，包括各種策略發展，例如關鍵併購、未來能力、合作夥伴關係、財務概況、合作、新產品開發、新產品發布和其他發展。

如果您有任何客製化要求，請寫信給我們。我們的研究團隊可以根據您的需求提供客製化報告。

區域展望
介紹
北美銷售分析
- 概覽、歷史與預測資料銷售分析
- 北美按細分市場銷售分析
- 北美按國家銷售分析
- 美國銷售分析
- 加拿大銷售分析
- 墨西哥銷售分析
歐洲銷售分析
- 概覽、歷史與預測資料銷售分析
- 歐洲按細分市場銷售分析
- 歐洲按國家銷售分析
- 英國銷售分析
- 法國銷售分析
- 德國銷售分析
- 義大利銷售分析
- 俄羅斯銷售分析
- 歐洲其他地區銷售分析
亞太地區銷售分析
- 概覽、歷史與預測資料銷售分析
- 亞太地區按細分市場銷售分析
- 亞太地區國家/地區銷售分析
- 中國銷售分析
- 印度銷售分析
- 日本銷售分析
- 韓國銷售分析
- 澳洲銷售分析
- 東南亞銷售分析
- 亞太地區其他地區銷售分析
拉丁美洲銷售分析
- 概覽、歷史與預測資料銷售分析
- 拉丁美洲按細分市場銷售分析
- 拉丁美洲按國家銷售分析
- 巴西銷售分析
- 阿根廷銷售分析
- 秘魯銷售分析
- 智利銷售分析
- 拉丁美洲其他地區銷售分析
中東和非洲銷售分析
- 概覽、歷史與預測資料銷售分析
- 中東和非洲按細分市場銷售分析
- 中東和非洲國家銷售分析
- 沙烏地阿拉伯銷售分析
- 阿拉伯聯合大公國銷售分析
- 以色列銷售分析
- 南非銷售分析
- 中東其他地區和非洲銷售分析

第 7 章：多模式晶片組公司的競爭格局

多模晶片組市場競爭
夥伴關係/協作/協議
併購
新產品發布
其他發展

第 8 章：公司簡介

公司股份分析
市場集中度
HiSilicon Technologies

公司簡介
公司收入
產品
最近的發展

Intel Corporation

公司簡介
公司收入
產品
最近的發展

Qualcomm Technologies Inc.

公司簡介
公司收入
產品
最近的發展

Samsung Group

公司簡介
公司收入
產品
最近的發展

MediaTek

公司簡介
公司收入
產品
最近的發展

Spreadtrum Communications

公司簡介
公司收入
產品
最近的發展

Marvell Technology Group

公司簡介
公司收入
產品
最近的發展

Altair Semiconductor Inc.

公司簡介
公司收入
產品
最近的發展

Broadcom Corporation

公司簡介
公司收入
產品
最近的發展

GCT Semiconductor Inc.

公司簡介
公司收入
產品
最近的發展

注意 - 在公司概況中，財務詳細資訊和近期發展視情況而定，或者如果是私人公司，則可能不包括在內

簡介目錄圖表

Product Code: VMR112113859

The global demand for Multi-Mode Chipset Market is presumed to reach the market size of nearly USD 22.46 BN by 2032 from USD 6.74 BN in 2023 with a CAGR of 14.3% under the study period 2024 - 2032.

Multi-mode chipset refers to integrated circuits that support and enable multiple communication modes within electronic devices. These chipsets often include capabilities for various wireless technologies, such as Wi-Fi, Bluetooth, and cellular connectivity. By integrating multiple modes into a single chipset, manufacturers can create versatile and compact devices with enhanced connectivity options, contributing to the efficiency and functionality of diverse electronic products like smartphones, tablets, and IoT devices.

MARKET DYNAMICS

The multi-mode chipset market experiences growth driven by the escalating demand for high-speed and reliable communication networks, the proliferation of connected devices, and advancements in wireless communication technologies. Multi-mode chipsets enable devices to support multiple wireless communication standards, including 3G, 4G, and 5G, providing flexibility and compatibility in diverse network environments. The growing adoption of smartphones, smart home devices, and Internet of Things (IoT) devices contributes to market growth. Additionally, the global expansion of 5G networks and the need for seamless connectivity across different generations of wireless technologies drive the market growth. The trend towards higher data rates, low-latency communication, and smart infrastructure development further stimulate market growth. Technological innovations, including integrated antennas and power-efficient designs, contribute to the performance and efficiency of multi-mode chipsets, supporting their integration into a wide range of wireless devices and network equipment.

The research report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of multi-mode chipset. The growth and trends of multi-mode chipset industry provide a holistic approach to this study.

MARKET SEGMENTATION

This section of the multi-mode chipset market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.

By Application

Smartphones
Tablets
Wearable Devices
Others

REGIONAL ANALYSIS

This section covers the regional outlook, which accentuates current and future demand for the Multi-Mode Chipset market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

GLOBAL MULTI-MODE CHIPSET MARKET SHARE BY REGION (REPRESENTATIVE GRAPH)
Global Multi-Mode Chipset Market Share

The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the Multi-Mode Chipset market include HiSilicon Technologies, Intel Corporation, Qualcomm Technologies Inc., Samsung Group, MediaTek, Spreadtrum Communications, Marvell Technology Group, Altair Semiconductor, Inc., Broadcom Corporation, GCT Semiconductor Inc. This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.

In case you have any custom requirements, do write to us. Our research team can offer a customized report as per your need.

1 . PREFACE

1.1. Report Description
- 1.1.1. Objective
- 1.1.2. Target Audience
- 1.1.3. Unique Selling Proposition (USP) & offerings
1.2. Research Scope
1.3. Research Methodology
- 1.3.1. Market Research Process
- 1.3.2. Market Research Methodology

2 . EXECUTIVE SUMMARY

2.1. Highlights of Market
2.2. Global Market Snapshot

3 . MULTI-MODE CHIPSET - INDUSTRY ANALYSIS

3.1. Introduction - Market Dynamics
3.2. Market Drivers
3.3. Market Restraints
3.4. Opportunities
3.5. Industry Trends
3.6. Porter's Five Force Analysis
3.7. Market Attractiveness Analysis
- 3.7.1 Market Attractiveness Analysis By Application
- 3.7.2 Market Attractiveness Analysis By Region

4 . VALUE CHAIN ANALYSIS

4.1. Value Chain Analysis
4.2. Raw Material Analysis
- 4.2.1. List of Raw Materials
- 4.2.2. Raw Material Manufactures List
- 4.2.3. Price Trend of Key Raw Materials
4.3. List of Potential Buyers
4.4. Marketing Channel
- 4.4.1. Direct Marketing
- 4.4.2. Indirect Marketing
- 4.4.3. Marketing Channel Development Trend

5 . GLOBAL MULTI-MODE CHIPSET MARKET ANALYSIS BY APPLICATION

5.1 Overview by Application
5.2 Historical and Forecast Data
5.3 Analysis by Application
5.4 Smartphones Historic and Forecast Sales by Regions
5.5 Tablets Historic and Forecast Sales by Regions
5.6 Wearable Devices Historic and Forecast Sales by Regions
5.7 Others Historic and Forecast Sales by Regions

6 . GLOBAL MULTI-MODE CHIPSET MARKET ANALYSIS BY GEOGRAPHY

6.1. Regional Outlook
6.2. Introduction
6.3. North America Sales Analysis
- 6.3.1. Overview, Historic and Forecast Data Sales Analysis
- 6.3.2. North America By Segment Sales Analysis
- 6.3.3. North America By Country Sales Analysis
- 6.3.4. United State Sales Analysis
- 6.3.5. Canada Sales Analysis
- 6.3.6. Mexico Sales Analysis
6.4. Europe Sales Analysis
- 6.4.1. Overview, Historic and Forecast Data Sales Analysis
- 6.4.2. Europe by Segment Sales Analysis
- 6.4.3. Europe by Country Sales Analysis
- 6.4.4. United Kingdom Sales Analysis
- 6.4.5. France Sales Analysis
- 6.4.6. Germany Sales Analysis
- 6.4.7. Italy Sales Analysis
- 6.4.8. Russia Sales Analysis
- 6.4.9. Rest Of Europe Sales Analysis
6.5. Asia Pacific Sales Analysis
- 6.5.1. Overview, Historic and Forecast Data Sales Analysis
- 6.5.2. Asia Pacific by Segment Sales Analysis
- 6.5.3. Asia Pacific by Country Sales Analysis
- 6.5.4. China Sales Analysis
- 6.5.5. India Sales Analysis
- 6.5.6. Japan Sales Analysis
- 6.5.7. South Korea Sales Analysis
- 6.5.8. Australia Sales Analysis
- 6.5.9. South East Asia Sales Analysis
- 6.5.10. Rest Of Asia Pacific Sales Analysis
6.6. Latin America Sales Analysis
- 6.6.1. Overview, Historic and Forecast Data Sales Analysis
- 6.6.2. Latin America by Segment Sales Analysis
- 6.6.3. Latin America by Country Sales Analysis
- 6.6.4. Brazil Sales Analysis
- 6.6.5. Argentina Sales Analysis
- 6.6.6. Peru Sales Analysis
- 6.6.7. Chile Sales Analysis
- 6.6.8. Rest of Latin America Sales Analysis
6.7. Middle East & Africa Sales Analysis
- 6.7.1. Overview, Historic and Forecast Data Sales Analysis
- 6.7.2. Middle East & Africa by Segment Sales Analysis
- 6.7.3. Middle East & Africa by Country Sales Analysis
- 6.7.4. Saudi Arabia Sales Analysis
- 6.7.5. UAE Sales Analysis
- 6.7.6. Israel Sales Analysis
- 6.7.7. South Africa Sales Analysis
- 6.7.8. Rest Of Middle East And Africa Sales Analysis

7 . COMPETITIVE LANDSCAPE OF THE MULTI-MODE CHIPSET COMPANIES

7.1. Multi-Mode Chipset Market Competition
7.2. Partnership/Collaboration/Agreement
7.3. Merger And Acquisitions
7.4. New Product Launch
7.5. Other Developments

8 . COMPANY PROFILES OF MULTI-MODE CHIPSET INDUSTRY

8.1. Company Share Analysis
8.2. Market Concentration Rate
8.3. HiSilicon Technologies
- 8.3.1. Company Overview
- 8.3.2. Company Revenue
- 8.3.3. Products
- 8.3.4. Recent Developments
8.4. Intel Corporation
- 8.4.1. Company Overview
- 8.4.2. Company Revenue
- 8.4.3. Products
- 8.4.4. Recent Developments
8.5. Qualcomm Technologies Inc.
- 8.5.1. Company Overview
- 8.5.2. Company Revenue
- 8.5.3. Products
- 8.5.4. Recent Developments
8.6. Samsung Group
- 8.6.1. Company Overview
- 8.6.2. Company Revenue
- 8.6.3. Products
- 8.6.4. Recent Developments
8.7. MediaTek
- 8.7.1. Company Overview
- 8.7.2. Company Revenue
- 8.7.3. Products
- 8.7.4. Recent Developments
8.8. Spreadtrum Communications
- 8.8.1. Company Overview
- 8.8.2. Company Revenue
- 8.8.3. Products
- 8.8.4. Recent Developments
8.9. Marvell Technology Group
- 8.9.1. Company Overview
- 8.9.2. Company Revenue
- 8.9.3. Products
- 8.9.4. Recent Developments
8.10. Altair Semiconductor Inc.
- 8.10.1. Company Overview
- 8.10.2. Company Revenue
- 8.10.3. Products
- 8.10.4. Recent Developments
8.11. Broadcom Corporation
- 8.11.1. Company Overview
- 8.11.2. Company Revenue
- 8.11.3. Products
- 8.11.4. Recent Developments
8.12. GCT Semiconductor Inc.
- 8.12.1. Company Overview
- 8.12.2. Company Revenue
- 8.12.3. Products
- 8.12.4. Recent Developments