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1417978

寬頻通訊晶片組市場報告：2030 年趨勢、預測與競爭分析

Broadband Power Line Communication Chipset Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

寬頻通訊晶片組趨勢與預測

預計到 2030 年，全球寬頻通訊晶片組市場將達到 85 億美元，2024 年至 2030 年複合年成長率為 14.6%。該市場的主要驅動力是智慧電網技術的不斷使用和對高速網際網路的需求不斷成長、政府活性化推動智慧城市市場的開拓以及對能源效率的日益關注。全球寬頻電力線通訊晶片組市場的未來前景廣闊，智慧電網、網路、照明、安全與監控、遠距以及機器對機器 (M2M) 市場充滿機會。

寬頻通訊晶片組市場洞察

Lucintel 表示，在預測期內，獨立式將繼續成為最大的區隔市場，因為獨立式 PLC 晶片組只需要連接到電網，使其易於安裝，是維修現有住宅和建築物的理想選擇。預測這種情況將持續下去。

由於對網路存取的強勁需求，預計亞太地區在預測期內仍將是最大的地區。

常問問題

Q1.市場規模有多大？

A1. 到 2030 年，全球寬頻通訊晶片組市場預計將達到 85 億美元。

Q2.市場成長預測如何？

A2. 2024年至2030年，全球寬頻通訊晶片組市場預計將以14.6%的複合年成長率成長。

Q3.影響市場成長的主要促進因素有哪些？

A3. 該市場的主要驅動力是智慧電網技術的使用和對高速網路需求的增加、政府加強開拓智慧城市以及對能源效率的日益關注。

Q4.市場的主要區隔市場是什麼？

A4. 全球寬頻通訊晶片組市場的未來在智慧電網、網路、照明、安全與監控、遠距以及M2M（機器對機器）市場方面前景廣闊。

Q5.市場上主要企業有哪些？

A5. 寬頻通訊晶片組的主要企業如下。

  • Broadcom
  • Intel
  • Marvell Technology
  • Maxim Integrated
  • Megachips
  • Qualcomm
  • Semtech
  • ST Microelectronics
  • Vango Technologies
  • Yitran Technologies

Q6.未來最大的區隔市場是什麼？

A6.Lucintel預測，在預測期內，獨立的PLC晶元組仍將是最大的市場區隔，因為它們更容易安裝，因為它們只需要連接到電網，使其成為改造現有房屋和建築物的理想選擇。

Q7. 未來五年預計哪個地區將成為最大的市場？

A7.由於對網路接取的強勁需求，亞太地區在預測期內仍將是最大的地區。

Q8. 可以客製化報告嗎？

A8. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章全球寬​​頻通訊晶片組市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與課題

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球寬頻通訊晶片組市場趨勢（2018-2023）與預測（2024-2030）
  • 依標準分類的全球寬頻通訊組市場
    • 家用插頭AV
    • 家用插頭 AV1
    • 家用插頭 AV2
    • IEEE1901
    • IEEE 1905.1
    • G.Hn
    • 首頁 PNA
    • 其他
  • 依技術分類的全球寬頻通訊組市場
    • 獨立的
    • 混合
    • Wi-Fi
    • 紫蜂
    • 乙太網路
    • 其他
  • 全球寬頻通訊晶片組市場（依應用）
    • 智慧電網
    • 聯網
    • 點亮
    • 安全和監視
    • 遠距
    • 機器對機器
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球寬頻通訊晶片組市場（依地區）
  • 北美寬頻通訊晶片組市場
  • 歐洲寬頻通訊晶片組市場
  • 亞太寬頻寬頻通訊晶片組市場
  • 其他地區寬頻電力線通訊晶片組市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 依標準分類的全球寬頻通訊晶片組市場成長機會
    • 全球寬頻通訊晶片組市場成長機會（依技術）
    • 全球寬頻通訊晶片組市場成長機會（依應用）
    • 全球寬頻通訊晶片組市場成長機會（依地區）
  • 全球寬頻電力線通訊晶片組市場的新興趨勢
  • 戰略分析
    • 新產品開發
    • 全球寬頻通訊晶片組市場產能擴張
    • 全球寬頻通訊組市場的併購和合資企業
    • 認證和許可

第7章主要企業概況

  • Broadcom
  • Intel
  • Marvell Technology
  • Maxim Integrated
  • Megachips
  • Qualcomm
  • Semtech
  • ST Microelectronics
  • Vango Technologies
  • Yitran Technologies
簡介目錄

Broadband Power Line Communication Chipset Trends and Forecast

The future of the global broadband power line communication chipset market looks promising with opportunities in the smart grids, networking, lighting, security & surveillance, long haul, and machine to machine markets. The global broadband power line communication chipset market is expected to reach an estimated $8.5 billion by 2030 with a CAGR of 14.6% from 2024 to 2030. The major drivers for this market are rising use of smart grid technologies and rising demand for high-speed internet, growing government efforts to promote the development of smart cities, as well as, an increased emphasis on energy efficiency.

A more than 150-page report is developed to help in your business decisions.

Broadband Power Line Communication Chipset by Segment

The study includes a forecast for the global broadband power line communication chipset by standards, technology, application, and region.

Broadband Power Line Communication Chipset Market by Standards [Shipment Analysis by Value from 2018 to 2030]:

  • Homeplug AV
  • Homeplug AV1
  • Homeplug AV2
  • IEEE 1901
  • IEEE 1905.1
  • G.Hn
  • HomePNA
  • Others

Broadband Power Line Communication Chipset Market by Technology [Shipment Analysis by Value from 2018 to 2030]:

  • Standalone
  • Hybrid
  • Wi-Fi
  • Zigbee
  • Ethernet
  • Others

Broadband Power Line Communication Chipset Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Smart Grids
  • Networking
  • Lighting
  • Security & Surveillance
  • Long Haul
  • Machine To Machine
  • Others

Broadband Power Line Communication Chipset Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Broadband Power Line Communication Chipset Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies broadband power line communication chipset companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the broadband power line communication chipset companies profiled in this report include-

  • Broadcom
  • Intel
  • Marvell Technology
  • Maxim Integrated
  • Megachips
  • Qualcomm
  • Semtech
  • ST Microelectronics
  • Vango Technologies
  • Yitran Technologies

Broadband Power Line Communication Chipset Market Insights

Lucintel forecasts that standalone will remain the largest segment over the forecast period because the standalone PLC chipsets only require a connection to the electrical grid, making them easy to install and ideal for retrofitting existing homes and buildings.

APAC will remain the largest region over the forecast period due to strong demand for internet access in the region.

Features of the Global Broadband Power Line Communication Chipset Market

Market Size Estimates: Broadband power line communication chipset market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Broadband power line communication chipset market size by various segments, such as by standards, technology, application, and region in terms of value ($B).

Regional Analysis: Broadband power line communication chipset market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different standards, technology, application, and regions for the broadband power line communication chipset market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the broadband power line communication chipset market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the broadband power line communication chipset market size?

Answer: The global broadband power line communication chipset market is expected to reach an estimated $8.5 billion by 2030.

Q2. What is the growth forecast for broadband power line communication chipset market?

Answer: The global broadband power line communication chipset market is expected to grow with a CAGR of 14.6% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the broadband power line communication chipset market?

Answer: The major drivers for this market are rising use of smart grid technologies and rising demand for high-speed internet, growing government efforts to promote the development of smart cities, as well as, an increased emphasis on energy efficiency.

Q4. What are the major segments for broadband power line communication chipset market?

Answer: The future of the global broadband power line communication chipset market looks promising with opportunities in the smart grids, networking, lighting, security & surveillance, long haul, and machine to machine markets.

Q5. Who are the key broadband power line communication chipset market companies?

Answer: Some of the key broadband power line communication chipset companies are as follows.

  • Broadcom
  • Intel
  • Marvell Technology
  • Maxim Integrated
  • Megachips
  • Qualcomm
  • Semtech
  • ST Microelectronics
  • Vango Technologies
  • Yitran Technologies

Q6. Which broadband power line communication chipset market segment will be the largest in future?

Answer: Lucintel forecasts that standalone will remain the largest segment over the forecast period because the standalone PLC chipsets only require a connection to the electrical grid, making them easy to install and ideal for retrofitting existing homes and buildings.

Q7. In broadband power line communication chipset market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period due to strong demand for internet access in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the broadband power line communication chipset market by standards (homeplug AV, homeplug AV1, homeplug AV2, IEEE 1901, IEEE 1905.1, G.Hn, homePNA, and others), technology (standalone, hybrid, Wi-Fi, zigbee, ethernet, and others), application (smart grids, networking, lighting, security & surveillance, long haul, machine to machine, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Broadband Power Line Communication Chipset Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Broadband Power Line Communication Chipset Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Broadband Power Line Communication Chipset Market by Standards
    • 3.3.1: Homeplug AV
    • 3.3.2: HomePlug AV1
    • 3.3.3: HomePlug AV2
    • 3.3.4: IEEE 1901
    • 3.3.5: IEEE 1905.1
    • 3.3.6: G.Hn
    • 3.3.7: HomePNA
    • 3.3.8: Others
  • 3.4: Global Broadband Power Line Communication Chipset Market by Technology
    • 3.4.1: Standalone
    • 3.4.2: Hybrid
    • 3.4.3: Wi-Fi
    • 3.4.4: Zigbee
    • 3.4.5: Ethernet
    • 3.4.6: Others
  • 3.5: Global Broadband Power Line Communication Chipset Market by Application
    • 3.5.1: Smart Grids
    • 3.5.2: Networking
    • 3.5.3: Lighting
    • 3.5.4: Security & Surveillance
    • 3.5.5: Long Haul
    • 3.5.6: Machine to Machine
    • 3.5.7: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Broadband Power Line Communication Chipset Market by Region
  • 4.2: North American Broadband Power Line Communication Chipset Market
    • 4.2.1: North American Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.2.2: North American Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
  • 4.3: European Broadband Power Line Communication Chipset Market
    • 4.3.1: European Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.3.2: European Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
  • 4.4: APAC Broadband Power Line Communication Chipset Market
    • 4.4.1: APAC Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.4.2: APAC Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
  • 4.5: ROW Broadband Power Line Communication Chipset Market
    • 4.5.1: ROW Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.5.2: ROW Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Standards
    • 6.1.2: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Technology
    • 6.1.3: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Application
    • 6.1.4: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Region
  • 6.2: Emerging Trends in the Global Broadband Power Line Communication Chipset Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Broadband Power Line Communication Chipset Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Broadband Power Line Communication Chipset Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Broadcom
  • 7.2: Intel
  • 7.3: Marvell Technology
  • 7.4: Maxim Integrated
  • 7.5: Megachips
  • 7.6: Qualcomm
  • 7.7: Semtech
  • 7.8: ST Microelectronics
  • 7.9: Vango Technologies
  • 7.10: Yitran Technologies