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軟性印刷電路板市場 - 全球產業規模、佔有率、趨勢、機會和預測，按類型、最終用戶、地區、競爭細分，2018-2028 年

Flexible Printed Circuit Board Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Type, By End User, By Region, By Competition, 2018-2028
出版日期: | 出版商: TechSci Research | 英文 190 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2022 年全球軟性印刷電路板市場價值為 278.9 億美元，預計到 2028 年預測期內將實現強勁成長，複合CAGR為 10.25%。全球軟性印刷電路板 (FPCB) 市場目前正在經歷顯著成長，由多種因素共同推動，這些因素正在重塑產業和消費者將FPCB 整合到各種應用和設備中的方式。軟性印刷電路板已成為增強功能、最佳化性能以及確保電子解決方案和應用可靠性的關鍵組件。 FPCB 是當代技術格局的核心，在各行業提供創新、能源效率和卓越營運方面發揮關鍵作用。在電子解決方案普遍且不可或缺的時代，軟性印刷電路板已發展成為從物聯網設備到工業自動化等各種應用的重要元件。軟性印刷電路板迅速普及的主要驅動力之一是對小型化和多功能性的需求不斷成長。在當今世界，設備變得越來越小、越來越攜帶，產業和消費者尋求能夠適應緊湊外形尺寸同時保持高效能的解決方案。 FPCB 是滿足這項需求的核心，因為它們能夠設計輕量、靈活且節省空間的電子解決方案。它們的靈活性和適應性使其適合傳統剛性 PCB 無法滿足的應用。

此外，隨著各行業擁抱物聯網 (IoT) 以及對互聯設備的需求不斷成長，FPCB 處於實現無縫連接的最前沿。這些闆對於物聯網設備、穿戴式裝置和其他智慧解決方案至關重要，因為它們以緊湊且靈活的形式提供必要的電氣連接。它們也非常適合在具有挑戰性的環境中需要可靠性的應用，例如醫療設備、航空航太和汽車系統。安全性和資料完整性已成為現代技術領域最重要的議題。 FPCB 提供加密、安全資料傳輸和資料保護等進階功能，增強了系統的安全性和可靠性。這些功能對於保護敏感資料、防止網路威脅和確保數位解決方案的可信度至關重要。

此外，隨著對先進消費性電子產品、汽車資訊娛樂系統和航空航太技術的需求不斷增加，FPCB 對於推動這些創新是不可或缺的。在消費性電子產品中，FPCB 促進了軟性顯示器、穿戴式技術和緊湊型高性能設備的開發。在汽車應用中，它們是車載娛樂系統、GPS 導航和高級駕駛員輔助系統操作的核心。在航空航太領域，FPCB 支援通訊、導航和控制系統，有助於提高航空旅行的安全性和效率。

市場概況
預測期 2024-2028
2022 年市場規模 278.9億美元
2028 年市場規模 525.9億美元
2023-2028 年CAGR 10.25%
成長最快的細分市場 雙面FPCB
最大的市場 亞太

總之，隨著業界認知到 FPCB 在各種應用中實現小型化、多功能性和安全性的關鍵作用，全球軟性印刷電路板市場正在大幅成長。隨著技術的不斷進步和我們的世界變得越來越數位化，FPCB 將繼續處於各個領域創新和可靠性的前沿。這項轉變凸顯了 FPCB 在塑造電子系統和應用的未來、為全球各產業的效率和卓越做出貢獻的重要性。

主要市場促進因素：

小型化和外型靈活性

目錄

第 1 章：產品概述

  • 市場定義
  • 市場範圍
    • 涵蓋的市場
    • 研究年份
    • 主要市場區隔

第 2 章：研究方法

  • 研究目的
  • 基線方法
  • 範圍的製定
  • 假設和限制
  • 研究來源
    • 二次研究
    • 初步研究
  • 市場研究方法
    • 自下而上的方法
    • 自上而下的方法
  • 計算市場規模和市場佔有率所遵循的方法
  • 預測方法
    • 數據三角測量與驗證

第 3 章：執行摘要

第 4 章：客戶之聲

第 5 章：全球軟性印刷電路板市場概述

第 6 章：全球軟性印刷電路板市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按類型（單面 FPCB、雙面 FPCB、多層 FPCB、剛柔結合 PCB）
    • 依最終用戶（消費性電子、汽車電子、工業電子），
    • 按地區（北美、歐洲、南美、中東和非洲、亞太地區）
  • 按公司分類 (2022)
  • 市場地圖

第 7 章：北美軟性印刷電路板市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按類型
    • 按最終用戶
    • 按國家/地區
  • 北美：國家分析
    • 美國
    • 加拿大
    • 墨西哥

第 8 章：歐洲軟性印刷電路板市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按類型
    • 按最終用戶
    • 按國家/地區
  • 歐洲：國家分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙
    • 比利時

第 9 章：南美洲軟性印刷電路板市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按類型
    • 按最終用戶
    • 按國家/地區
  • 南美洲：國家分析
    • 巴西
    • 哥倫比亞
    • 阿根廷
    • 智利
    • 秘魯

第 10 章：中東和非洲軟性印刷電路板市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按類型
    • 按最終用戶
    • 按國家/地區
  • 中東和非洲：國家分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非
    • 土耳其
    • 以色列

第 11 章：亞太地區軟性印刷電路板市場展望

  • 市場規模及預測
    • 按類型
    • 按最終用戶
    • 按國家/地區
  • 亞太地區：國家分析
    • 中國軟性電路板
    • 印度軟性印刷電路板
    • 日本軟性印刷電路板
    • 韓國軟性印刷電路板
    • 澳洲軟性印刷電路板
    • 印尼軟性印刷電路板
    • 越南軟性印刷電路板

第 12 章：市場動態

  • 促進要素
  • 挑戰

第 13 章：市場趨勢與發展

第 14 章：公司簡介

  • 日本Mektron株式會社
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 多細線電子有限公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 軟性電路技術公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 藤倉有限公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 住友電工工業株式會社
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 振鼎科技控股股份有限公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 欣興科技股份有限公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 科銳科技（製造）有限公司：
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • Flexium 互連公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 建滔Group Limited
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered

第 15 章：策略建議

第 16 章：關於我們與免責聲明

簡介目錄
Product Code: 19949

Global Flexible Printed Circuit Board Market was valued at USD 27.89 Billion in 2022 and is anticipated to project robust growth in the forecast period with a CAGR of 10.25% through 2028. The Global Flexible Printed Circuit Board (FPCB) Market is currently experiencing significant growth, driven by a convergence of factors that are reshaping how industries and consumers integrate FPCBs into a wide array of applications and devices. Flexible printed circuit boards have become pivotal components in enhancing functionality, optimizing performance, and ensuring the reliability of electronic solutions and applications. FPCBs are at the heart of the contemporary technological landscape, playing a pivotal role in delivering innovation, energy efficiency, and operational excellence across various industries. In an era where electronic solutions are pervasive and indispensable, flexible printed circuit boards have evolved into essential components across applications ranging from IoT devices to industrial automation. One of the primary drivers for the burgeoning adoption of flexible printed circuit boards is the increasing demand for miniaturization and versatility. In today's world, where devices are becoming smaller and more portable, industries and consumers seek solutions that can adapt to compact form factors while maintaining high performance. FPCBs are central to addressing this need, as they enable the design of lightweight, flexible, and space-efficient electronic solutions. Their flexibility and adaptability make them suitable for applications where traditional rigid PCBs fall short.

Additionally, as industries embrace the Internet of Things (IoT) and the demand for connected devices continues to grow, FPCBs are at the forefront of enabling seamless connectivity. These boards are crucial for IoT devices, wearables, and other smart solutions, as they provide the necessary electrical connections in a compact and flexible format. They are also ideal for applications that require reliability in challenging environments, such as medical devices, aerospace, and automotive systems. Security and data integrity have become paramount concerns in the modern technological landscape. FPCBs offer advanced features such as encryption, secure data transmission, and data protection, which enhance system security and reliability. These features are critical in safeguarding sensitive data, preventing cyber threats, and ensuring the trustworthiness of digital solutions.

Furthermore, as the demand for advanced consumer electronics, automotive infotainment systems, and aerospace technologies increases, FPCBs are indispensable for powering these innovations. In consumer electronics, FPCBs enable the development of flexible displays, wearable technology, and compact, high-performance devices. In automotive applications, they are central to the operation of in-car entertainment systems, GPS navigation, and advanced driver-assistance systems. In aerospace, FPCBs support communication, navigation, and control systems, contributing to the safety and efficiency of air travel.

Market Overview
Forecast Period2024-2028
Market Size 2022USD 27.89 Billion
Market Size 2028USD 52.59 Billion
CAGR 2023-202810.25%
Fastest Growing SegmentDouble-Sided FPCBs
Largest MarketAsia-Pacific

In conclusion, the Global Flexible Printed Circuit Board Market is witnessing substantial growth as industries recognize the pivotal role of FPCBs in delivering miniaturization, versatility, and security across a diverse range of applications. As technology continues to advance and our world becomes increasingly digital, FPCBs will remain at the forefront of innovation and reliability in various sectors. This transformation underscores the significance of FPCBs in shaping the future of electronic systems and applications, contributing to efficiency and excellence across industries worldwide.

Key Market Drivers:

Miniaturization and Form Factor Flexibility

The relentless drive toward smaller, lighter, and more portable electronic devices is a pivotal factor propelling the growth of the Global Flexible Printed Circuit Board (FPCB) Market. As technology evolves, so do the expectations of consumers and industries. Smaller, more compact electronic devices are not only desirable but often essential for applications ranging from wearables and consumer electronics to medical devices and automotive systems.

FPCBs play a central role in addressing this need for miniaturization and form factor flexibility. Unlike traditional rigid printed circuit boards (PCBs), FPCBs are designed to be flexible, lightweight, and capable of bending and conforming to various shapes. This flexibility enables designers to create electronic solutions that fit into compact and irregular spaces while maintaining high performance and reliability. Whether it's a flexible display for a smartphone, a wearable health tracker, or a medical device that conforms to the body, FPCBs are the enablers of these innovations.

The importance of miniaturization extends beyond consumer electronics. Industries like aerospace and automotive also benefit from FPCBs' ability to save space and reduce weight. In aerospace, FPCBs are used in communication, navigation, and control systems, where every ounce and inch saved can contribute to fuel efficiency and cost reduction. In the automotive sector, FPCBs support infotainment systems, advanced driver-assistance systems (ADAS), and in-car electronics. Their flexibility allows for creative and space-efficient designs that enhance the overall driving experience.

Connectivity and the Internet of Things (IoT)

The era of the Internet of Things (IoT) is upon us, and it's driving the demand for seamless connectivity across an ever-expanding range of devices and applications. This surge in interconnected devices, from smart home appliances to industrial sensors, necessitates robust and reliable electronic interconnections. FPCBs are at the forefront of enabling this connectivity.

FPCBs are crucial for IoT devices due to their versatility and adaptability. They can be integrated into various form factors, including flexible and curved designs, which is essential for many IoT applications. Whether it's a smart sensor in a factory, a wearable health monitor, or a home automation system, FPCBs provide the electrical connections needed for data transfer, power distribution, and sensor interfaces.

The ability of FPCBs to withstand bending and flexing without compromising their performance is particularly valuable for IoT applications. For instance, sensors placed in industrial environments may be subject to vibrations or mechanical stress, and FPCBs ensure reliable connectivity under such conditions. This reliability is also important in wearables, where FPCBs support the continuous monitoring of vital signs and activities. As the IoT ecosystem continues to expand, FPCBs will remain integral to creating interconnected, data-driven solutions that enhance productivity, efficiency, and convenience across various industries.

Enhanced Data Security and Data Integrity

In an era of increasing cybersecurity threats and data privacy concerns, ensuring the security and integrity of electronic systems is paramount. FPCBs contribute to this imperative by offering advanced features and capabilities that enhance data security and data integrity.

One of the key security features provided by FPCBs is hardware-based encryption. This encryption is embedded within the board's design, ensuring that sensitive data transmitted across the FPCB remains secure. Whether it's financial transactions, medical data, or confidential industrial information, the encryption capabilities of FPCBs protect against unauthorized access and data breaches.

Secure boot processes are another critical element in enhancing security. FPCBs can be designed to incorporate secure boot mechanisms that verify the integrity of the system software during startup. This prevents malicious code from compromising the system's functionality, ensuring that only trusted software is executed.

Data protection mechanisms embedded in FPCBs also guard against data corruption or loss. For applications where data integrity is crucial, such as critical infrastructure and healthcare, FPCBs ensure that data remains accurate and reliable even in challenging conditions.

In conclusion, the Global Flexible Printed Circuit Board (FPCB) Market is being driven by the compelling need for miniaturization and form factor flexibility, the demand for connectivity in the IoT era, and the growing emphasis on data security and integrity. These factors converge to position FPCBs as essential components in the development of innovative electronic solutions across various industries, contributing to enhanced efficiency, connectivity, and security. As technology continues to evolve, FPCBs will remain integral to the advancement of electronic systems and applications worldwide.

Key Market Challenges

Design and Manufacturing Complexity

One of the primary challenges in the Global Flexible Printed Circuit Board (FPCB) Market is the inherent complexity in designing and manufacturing flexible circuits. Unlike traditional rigid printed circuit boards (PCBs), FPCBs require a different approach in terms of materials, processes, and design considerations. This complexity stems from various factors, including the need to accommodate bending, flexibility, and durability while maintaining high-performance standards.

Designing FPCBs necessitates a deep understanding of flexible materials, their mechanical properties, and their electrical characteristics. Engineers and designers must consider factors like bend radius, material selection, and component placement, all of which are unique to flexible circuits. This complexity is compounded when dealing with intricate and densely populated designs.

Moreover, manufacturing flexible circuits presents challenges in terms of precision and quality control. The flexible materials used in FPCBs can be more sensitive to variations in the manufacturing process compared to rigid boards. Ensuring that the circuits meet the required electrical specifications while maintaining their flexibility and reliability is a demanding task.

The challenge of design and manufacturing complexity is particularly relevant when dealing with high-density interconnects and miniaturized components. Meeting the stringent requirements of advanced applications, such as aerospace and medical devices, adds an extra layer of complexity to FPCB design and production.

Addressing this challenge requires ongoing research and development to advance materials, design tools, and manufacturing techniques. Additionally, it necessitates collaboration among stakeholders in the supply chain, from material suppliers to fabricators, to ensure that FPCBs meet the exacting standards of modern electronics.

Durability and Reliability

Another significant challenge in the FPCB market is ensuring the long-term durability and reliability of flexible circuits. FPCBs are often deployed in applications where they may undergo bending, flexing, and exposure to various environmental factors. These conditions can subject the circuits to mechanical stress, thermal cycling, and moisture, which can impact their performance and longevity.To ensure the durability of FPCBs, manufacturers need to develop materials and construction techniques that can withstand these challenges. This includes selecting flexible substrates with high resistance to fatigue, designing circuits that distribute stress evenly, and implementing protective coatings that guard against environmental factors.

However, ensuring reliability in FPCBs is not only about material selection and design; it also involves rigorous testing and quality control. Testing methods must be adapted to evaluate the performance of flexible circuits under dynamic conditions, simulating the bending and flexing that they will experience during their operational life. This is particularly crucial in applications where FPCBs are subjected to repeated mechanical stress, such as in wearable technology and aerospace systems.

Reliability concerns are especially critical in industries where FPCBs are deployed in mission-critical applications, like medical devices and automotive safety systems. Any failure or degradation in performance can have serious consequences, making it essential to address this challenge through rigorous testing, quality assurance, and ongoing monitoring of FPCB performance in the field.

Material Advancements and Cost-Effective Production

The choice of materials is a critical factor in the performance and cost-effectiveness of FPCBs. While flexible substrates like polyimide and polyester are commonly used, their performance characteristics, cost, and availability can pose challenges.

The challenge of material advancements is twofold. First, there is a need for continuous research and development to improve the properties of existing materials and to explore new materials that offer superior electrical and mechanical properties. This includes materials that can withstand extreme temperature variations, resist environmental factors, and exhibit long-term reliability in demanding applications.

Second, the cost-effectiveness of producing FPCBs is a significant challenge. High-quality flexible materials can be more expensive than traditional rigid substrates like FR-4. Additionally, the complexity of FPCB manufacturing processes, which may include intricate layering and additive processes, can contribute to higher production costs.

Balancing the need for advanced materials with cost-effectiveness is a challenge that the FPCB industry must address. This requires ongoing collaboration between material suppliers, manufacturers, and end-users to optimize material selection and production processes.

In conclusion, the Global Flexible Printed Circuit Board (FPCB) Market faces challenges related to design and manufacturing complexity, the durability and reliability of flexible circuits, and the need for material advancements and cost-effective production. Addressing these challenges requires a combination of research and development efforts, quality control measures, and industry collaboration to ensure that FPCBs meet the demands of diverse applications and maintain their position as crucial components in the electronics industry.

Key Market Trends

Proliferation of Wearable Technology and IoT Devices

One of the most prominent trends in the Global Flexible Printed Circuit Board (FPCB) Market is the proliferation of wearable technology and Internet of Things (IoT) devices. This trend is driven by the increasing demand for compact, lightweight, and flexible electronic solutions that can seamlessly integrate into our daily lives.

Wearable technology, including smartwatches, fitness trackers, and augmented reality glasses, relies heavily on FPCBs to provide the necessary flexibility and miniaturization. FPCBs allow these devices to conform to the contours of the human body, ensuring comfort and wearability while maintaining high-performance standards.

In the IoT landscape, FPCBs are essential components for connecting a wide array of devices and sensors. Whether it's a smart home system, industrial sensor networks, or medical devices, FPCBs enable the efficient transfer of data and power within compact and often unconventional form factors. The ability to bend and flex is a core feature of FPCBs, making them ideal for applications where rigid circuit boards fall short.

This trend is poised to grow as the adoption of wearable technology and IoT devices continues to surge. Consumers and industries alike are seeking innovative ways to collect and process data, and FPCBs are central to enabling these devices to function optimally.

Advanced Materials and Manufacturing Techniques

Another notable trend in the FPCB market is the continuous advancement of materials and manufacturing techniques. As the demand for more complex and high-performance flexible circuits increases, material suppliers and manufacturers are innovating to meet these needs.

One area of advancement is in materials. Polyimide and polyester have been traditional choices for FPCB substrates, but new materials are emerging with enhanced properties. For instance, liquid crystal polymer (LCP) substrates offer improved thermal stability, high-frequency performance, and moisture resistance. These materials are particularly beneficial for applications where reliability in harsh environments is essential, such as aerospace and automotive systems.

Manufacturing techniques are also evolving to meet the demand for smaller, denser, and more complex FPCBs. Additive manufacturing, such as 3D printing, is gaining traction as a way to produce flexible circuits with intricate patterns and features. This approach enables rapid prototyping and customization while reducing waste and lead times.

Advancements in materials and manufacturing techniques not only improve the performance of FPCBs but also contribute to cost-efficiency. By optimizing production processes and materials, the industry can strike a balance between high-performance capabilities and affordability.

Green and Sustainable FPCBs

Environmental consciousness and sustainability have become significant drivers in the electronics industry, and this trend is extending to the FPCB market. As consumers and industries prioritize eco-friendly products and manufacturing processes, the demand for green and sustainable FPCBs is on the rise. One aspect of sustainability is the use of recyclable and biodegradable materials in FPCBs. Manufacturers are exploring alternatives to traditional materials that reduce the environmental impact of circuit boards. These materials are designed to be less harmful to the environment during production and disposal.

In addition to materials, there is a growing emphasis on sustainable manufacturing practices. Companies are adopting eco-friendly processes, reducing waste, and implementing energy-efficient production techniques. This not only aligns with sustainability goals but also appeals to environmentally conscious consumers.

The drive for sustainable FPCBs is also pushing the development of eco-friendly disposal and recycling methods. As electronic waste (e-waste) continues to be a global concern, finding ways to recycle and recover materials from old and discarded FPCBs is becoming increasingly important. Recycling initiatives and the responsible disposal of electronic components are gaining traction to minimize the environmental impact of electronic devices.

In conclusion, the Global Flexible Printed Circuit Board (FPCB) Market is witnessing several notable trends, including the proliferation of wearable technology and IoT devices, advancements in materials and manufacturing techniques, and the growing focus on green and sustainable FPCBs. These trends are shaping the industry by fostering innovation, improving performance, and aligning with the values of eco-conscious consumers and industries. As technology continues to advance, FPCBs will remain at the forefront of enabling flexibility, miniaturization, and environmental responsibility in various applications and devices.

Segmental Insights

Type Insights

Double-sided FPCBs are the dominating segment in the global flexible printed circuit board (FPCB) market by type.The dominance of the double-sided FPCBs segment is due to a number of factors, including: Cost-effectiveness: Double-sided FPCBs are the most cost-effective type of FPCB, making them ideal for a wide range of applications.

Flexibility: Double-sided FPCBs are highly flexible, allowing them to be used in applications where space is limited or where components need to be mounted on curved surfaces.

Versatility: Double-sided FPCBs can be used in a wide range of applications, including consumer electronics, automotive, medical devices, and industrial automation. Other type segments in the global FPCB market include single-sided FPCBs, multilayer FPCBs, and rigid-flex PCBs. However, the double-sided FPCBs segment is expected to remain the dominating segment in the market in the coming years.

Regional Insights

Asia Pacific is the dominating region in the global flexible printed circuit board (FPCB) market. The dominance of the Asia Pacific region is due to a number of factors, including:

The presence of major FPCB manufacturers in the region: Asia Pacific is home to some of the world's largest FPCB manufacturers, such as Nippon Mektron, Sumitomo Electric Industries, and Fujikura. These companies have a strong presence in the region and are well-positioned to meet the growing demand for FPCBs.

The growing demand for FPCBs in consumer electronics, automotive, and industrial applications in the region: Asia Pacific is a major market for consumer electronics, automotive, and industrial products. These products all rely heavily on FPCBs for their operation. The growing demand for these products is driving the growth of the FPCB market in the region.

The government support for the development of the FPCB industry in several countries in the region: Governments in several Asia Pacific countries, such as China and Japan, are providing support for the development of the FPCB industry. This support is in the form of financial incentives, tax breaks, and research and development funding. This support is helping to accelerate the growth of the FPCB market in the region.

Key Market Players

Nippon Mektron, Ltd.

Multi-Fineline Electronix, Inc.

Flexible Circuit Technologies, Inc.

Fujikura Ltd.

Sumitomo Electric Industries, Ltd.

Zhen Ding Technology Holding Limited

Career Technology (MFG.) Co., Ltd.

Unimicron Technology Corporation

Flexium Interconnect, Inc.

Kingboard Holdings Limited

Report Scope:

In this report, the Global Flexible Printed Circuit Board Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Flexible Printed Circuit Board Market, By Type:

  • Single-Sided FPCBs
  • Double-Sided FPCBs
  • Multilayer FPCBs
  • Rigid-Flex PCBs

Flexible Printed Circuit Board Market, By End User:

  • Consumer Electronics
  • Automotive Electronics
  • Industrial Electronics

Flexible Printed Circuit Board Market, By Region:

  • North America
  • United States
  • Canada
  • Mexico
  • Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
  • Belgium
  • Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • Indonesia
  • Vietnam
  • South America
  • Brazil
  • Argentina
  • Colombia
  • Chile
  • Peru
  • Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE
  • Turkey
  • Israel

Competitive Landscape

  • Company Profiles: Detailed analysis of the major companies present in the Global Flexible Printed Circuit Board Market.

Available Customizations:

  • Global Flexible Printed Circuit Board market report with the given market data, Tech Sci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Formulation of the Scope
  • 2.4. Assumptions and Limitations
  • 2.5. Sources of Research
    • 2.5.1. Secondary Research
    • 2.5.2. Primary Research
  • 2.6. Approach for the Market Study
    • 2.6.1. The Bottom-Up Approach
    • 2.6.2. The Top-Down Approach
  • 2.7. Methodology Followed for Calculation of Market Size & Market Shares
  • 2.8. Forecasting Methodology
    • 2.8.1. Data Triangulation & Validation

3. Executive Summary

4. Voice of Customer

5. Global Flexible Printed Circuit Board Market Overview

6. Global Flexible Printed Circuit Board Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Type (Single-Sided FPCBs, Double-Sided FPCBs, Multilayer FPCBs, Rigid-Flex PCBs)
    • 6.2.2. By End User (Consumer Electronics, Automotive Electronics, Industrial Electronics),
    • 6.2.3. By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)
  • 6.3. By Company (2022)
  • 6.4. Market Map

7. North America Flexible Printed Circuit Board Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Type
    • 7.2.2. By End User
    • 7.2.3. By Country
  • 7.3. North America: Country Analysis
    • 7.3.1. United States Flexible Printed Circuit Board Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Type
        • 7.3.1.2.2. By End User
    • 7.3.2. Canada Flexible Printed Circuit Board Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Type
        • 7.3.2.2.2. By End User
    • 7.3.3. Mexico Flexible Printed Circuit Board Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Type
        • 7.3.3.2.2. By End User

8. Europe Flexible Printed Circuit Board Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Type
    • 8.2.2. By End User
    • 8.2.3. By Country
  • 8.3. Europe: Country Analysis
    • 8.3.1. Germany Flexible Printed Circuit Board Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Type
        • 8.3.1.2.2. By End User
    • 8.3.2. France Flexible Printed Circuit Board Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Type
        • 8.3.2.2.2. By End User
    • 8.3.3. United Kingdom Flexible Printed Circuit Board Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Type
        • 8.3.3.2.2. By End User
    • 8.3.4. Italy Flexible Printed Circuit Board Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Type
        • 8.3.4.2.2. By End User
    • 8.3.5. Spain Flexible Printed Circuit Board Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Type
        • 8.3.5.2.2. By End User
    • 8.3.6. Belgium Flexible Printed Circuit Board Market Outlook
      • 8.3.6.1. Market Size & Forecast
        • 8.3.6.1.1. By Value
      • 8.3.6.2. Market Share & Forecast
        • 8.3.6.2.1. By Type
        • 8.3.6.2.2. By End User

9. South America Flexible Printed Circuit Board Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Type
    • 9.2.2. By End User
    • 9.2.3. By Country
  • 9.3. South America: Country Analysis
    • 9.3.1. Brazil Flexible Printed Circuit Board Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Type
        • 9.3.1.2.2. By End User
    • 9.3.2. Colombia Flexible Printed Circuit Board Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Type
        • 9.3.2.2.2. By End User
    • 9.3.3. Argentina Flexible Printed Circuit Board Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Type
        • 9.3.3.2.2. By End User
    • 9.3.4. Chile Flexible Printed Circuit Board Market Outlook
      • 9.3.4.1. Market Size & Forecast
        • 9.3.4.1.1. By Value
      • 9.3.4.2. Market Share & Forecast
        • 9.3.4.2.1. By Type
        • 9.3.4.2.2. By End User
    • 9.3.5. Peru Flexible Printed Circuit Board Market Outlook
      • 9.3.5.1. Market Size & Forecast
        • 9.3.5.1.1. By Value
      • 9.3.5.2. Market Share & Forecast
        • 9.3.5.2.1. By Type
        • 9.3.5.2.2. By End User

10. Middle East & Africa Flexible Printed Circuit Board Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Type
    • 10.2.2. By End User
    • 10.2.3. By Country
  • 10.3. Middle East & Africa: Country Analysis
    • 10.3.1. Saudi Arabia Flexible Printed Circuit Board Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Type
        • 10.3.1.2.2. By End User
    • 10.3.2. UAE Flexible Printed Circuit Board Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Type
        • 10.3.2.2.2. By End User
    • 10.3.3. South Africa Flexible Printed Circuit Board Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Type
        • 10.3.3.2.2. By End User
    • 10.3.4. Turkey Flexible Printed Circuit Board Market Outlook
      • 10.3.4.1. Market Size & Forecast
        • 10.3.4.1.1. By Value
      • 10.3.4.2. Market Share & Forecast
        • 10.3.4.2.1. By Type
        • 10.3.4.2.2. By End User
    • 10.3.5. Israel Flexible Printed Circuit Board Market Outlook
      • 10.3.5.1. Market Size & Forecast
        • 10.3.5.1.1. By Value
      • 10.3.5.2. Market Share & Forecast
        • 10.3.5.2.1. By Type
        • 10.3.5.2.2. By End User

11. Asia Pacific Flexible Printed Circuit Board Market Outlook

  • 11.1. Market Size & Forecast
    • 11.1.1. By Type
    • 11.1.2. By End User
    • 11.1.3. By Country
  • 11.2. Asia-Pacific: Country Analysis
    • 11.2.1. China Flexible Printed Circuit Board Market Outlook
      • 11.2.1.1. Market Size & Forecast
        • 11.2.1.1.1. By Value
      • 11.2.1.2. Market Share & Forecast
        • 11.2.1.2.1. By Type
        • 11.2.1.2.2. By End User
    • 11.2.2. India Flexible Printed Circuit Board Market Outlook
      • 11.2.2.1. Market Size & Forecast
        • 11.2.2.1.1. By Value
      • 11.2.2.2. Market Share & Forecast
        • 11.2.2.2.1. By Type
        • 11.2.2.2.2. By End User
    • 11.2.3. Japan Flexible Printed Circuit Board Market Outlook
      • 11.2.3.1. Market Size & Forecast
        • 11.2.3.1.1. By Value
      • 11.2.3.2. Market Share & Forecast
        • 11.2.3.2.1. By Type
        • 11.2.3.2.2. By End User
    • 11.2.4. South Korea Flexible Printed Circuit Board Market Outlook
      • 11.2.4.1. Market Size & Forecast
        • 11.2.4.1.1. By Value
      • 11.2.4.2. Market Share & Forecast
        • 11.2.4.2.1. By Type
        • 11.2.4.2.2. By End User
    • 11.2.5. Australia Flexible Printed Circuit Board Market Outlook
      • 11.2.5.1. Market Size & Forecast
        • 11.2.5.1.1. By Value
      • 11.2.5.2. Market Share & Forecast
        • 11.2.5.2.1. By Type
        • 11.2.5.2.2. By End User
    • 11.2.6. Indonesia Flexible Printed Circuit Board Market Outlook
      • 11.2.6.1. Market Size & Forecast
        • 11.2.6.1.1. By Value
      • 11.2.6.2. Market Share & Forecast
        • 11.2.6.2.1. By Type
        • 11.2.6.2.2. By End User
    • 11.2.7. Vietnam Flexible Printed Circuit Board Market Outlook
      • 11.2.7.1. Market Size & Forecast
        • 11.2.7.1.1. By Value
      • 11.2.7.2. Market Share & Forecast
        • 11.2.7.2.1. By Type
        • 11.2.7.2.2. By End User

12. Market Dynamics

  • 12.1. Drivers
  • 12.2. Challenges

13. Market Trends and Developments

14. Company Profiles

  • 14.1. Nippon Mektron, Ltd.
    • 14.1.1. Business Overview
    • 14.1.2. Key Revenue and Financials
    • 14.1.3. Recent Developments
    • 14.1.4. Key Personnel/Key Contact Person
    • 14.1.5. Key Product/Services Offered
  • 14.2. Multi-Fineline Electronix, Inc.
    • 14.2.1. Business Overview
    • 14.2.2. Key Revenue and Financials
    • 14.2.3. Recent Developments
    • 14.2.4. Key Personnel/Key Contact Person
    • 14.2.5. Key Product/Services Offered
  • 14.3. Flexible Circuit Technologies, Inc.
    • 14.3.1. Business Overview
    • 14.3.2. Key Revenue and Financials
    • 14.3.3. Recent Developments
    • 14.3.4. Key Personnel/Key Contact Person
    • 14.3.5. Key Product/Services Offered
  • 14.4. Fujikura Ltd.
    • 14.4.1. Business Overview
    • 14.4.2. Key Revenue and Financials
    • 14.4.3. Recent Developments
    • 14.4.4. Key Personnel/Key Contact Person
    • 14.4.5. Key Product/Services Offered
  • 14.5. Sumitomo Electric Industries, Ltd.
    • 14.5.1. Business Overview
    • 14.5.2. Key Revenue and Financials
    • 14.5.3. Recent Developments
    • 14.5.4. Key Personnel/Key Contact Person
    • 14.5.5. Key Product/Services Offered
  • 14.6. Zhen Ding Technology Holding Limited
    • 14.6.1. Business Overview
    • 14.6.2. Key Revenue and Financials
    • 14.6.3. Recent Developments
    • 14.6.4. Key Personnel/Key Contact Person
    • 14.6.5. Key Product/Services Offered
  • 14.7. Unimicron Technology Corporation
    • 14.7.1. Business Overview
    • 14.7.2. Key Revenue and Financials
    • 14.7.3. Recent Developments
    • 14.7.4. Key Personnel/Key Contact Person
    • 14.7.5. Key Product/Services Offered
  • 14.8. Career Technology (MFG.) Co., Ltd.:
    • 14.8.1. Business Overview
    • 14.8.2. Key Revenue and Financials
    • 14.8.3. Recent Developments
    • 14.8.4. Key Personnel/Key Contact Person
    • 14.8.5. Key Product/Services Offered
  • 14.9. Flexium Interconnect, Inc.
    • 14.9.1. Business Overview
    • 14.9.2. Key Revenue and Financials
    • 14.9.3. Recent Developments
    • 14.9.4. Key Personnel/Key Contact Person
    • 14.9.5. Key Product/Services Offered
  • 14.10. Kingboard Holdings Limited
    • 14.10.1. Business Overview
    • 14.10.2. Key Revenue and Financials
    • 14.10.3. Recent Developments
    • 14.10.4. Key Personnel/Key Contact Person
    • 14.10.5. Key Product/Services Offered

15. Strategic Recommendations

16. About Us & Disclaimer