全球介電前驅體市場分析（2023-2024）

本報告分析了全球CVD/ALD電介質和SOD前驅體市場趨勢和技術趨勢。我們還討論了新型前驅物的開發途徑和路線圖，以及目前的 EHS（環境、健康和安全）以及將這些材料投入大批量生產 (HVM) 的監管障礙。為所有類型的前驅物提供預測，特別關注先進的前端電介質和導電材料，包括犧牲層、低 k 電介質、硬掩模、心軸和蝕刻停止層。這些製程領域與先進邏輯（sub-45nm、28nm至10/7nm節點、未來5nm和3nm節點）、先進DRAM和3DNAND易失性和非揮發性記憶體相關的高成長潛力正在引起關注。

主要優點

• 提供 CVD、ALD 和 SOD 應用的有機和無機前驅物（包括 ILD、低 k 電介質、硬掩模、側壁間隔物和蝕刻停止層）的市場和技術趨勢資訊。
• 為供應鏈經理、流程整合、研發 (R&D) 總監、業務開發和財務分析師提供重點資訊。
• 涵蓋主要電介質前驅物和供應商的資訊、材料供應鏈中的問題和趨勢、供應商市場估計和預測以及電子材料領域的預測。
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CVD/電介質前驅市場最新資訊與分析：概述 - 特色新聞稿：

目錄

第一章執行摘要

第 2 章範圍、目的與方法

第三章 半導體產業市場現況與展望

• 世界經濟
  • 連結半導體產業與全球經濟
  • 半導體銷售額成長率
  • 台灣月度銷售趨勢
  • 2023年高度不確定性－半導體收入成長預計將放緩至負值
• 晶片銷售趨勢：按電子設備細分市場
  • 手機
  • PC 出貨量
  • 伺服器/IT市場
• 半導體製造業的成長與擴張
  • 鑄造廠擴建公告：概述
  • 透過在世界各地擴大鑄造廠來加速成長
  • 資本支出趨勢
  • 技術路線圖
  • 代工投資評估
• 政策和貿易趨勢及影響
• 半導體材料概述
  • 晶片生產進度可能受到材料產能限制
  • 減少物流問題
  • 晶圓市場趨勢預測（至2027年）
  • 材料市場預測

第四章 前驅體市場走勢

• 市場趨勢
  • 市場趨勢 - 晶圓啟動
  • 市場趨勢 - 晶圓啟動（邏輯）
  • 市場趨勢 - 晶圓起始 (DRAM)
  • 市場趨勢 - 晶圓起始 (NAND)
• 供給能力、需求和投資
  • WF6 的需求驅動因素
• 供給能力、需求和投資
• 區域趨勢 - 電介質前驅體
  • 區域趨勢和驅動因素
• CVD/ALD設備市場
  • 市場預測：所有類型
  • 市場預測：層壓、蝕刻/清潔、光刻、計量等。
• 技術驅動因素/材料變化與轉變：依設備類型
  • 過去10年整體趨勢：從PVD/LPCVD到PECVD/ALD
  • 高階邏輯節點HVM的估計
  • DRAM節點HVM估計
  • 3D NAND 節點 HVM 估計
  • 按設備細分市場劃分的機會：概述
• 半導體製程和材料的趨勢
  • 按元件類型劃分的蝕刻製程：原子層蝕刻
  • 區域選擇性沉積
  • 定向自組裝 (DSA) 和 EUV
  • 直接自組裝 (DSA) 和 EUV
  • 2D TDM（過渡金屬二硫化物）
  • EUV 乾抗蝕劑
  • EUV抗蝕劑下層
  • 其他用途：光學
• EHS 和物流問題
  • 半導體製造產生的溫室氣體
  • EUV 和能源
  • 評估原子層沉積 (ALD) 製程的環境影響以及減少影響的途徑
• 標準套件/閥門類型變更

第五章市場統計與預測：按細分市場

• 前驅體市場表現及預測（5年）
• 電介質前驅體收入（百萬美元，2021-2027）
  • 介電前驅體的評價
• 併購 (M&A) 活動
  • 併購活動 - MERCK & MECARO
• 新工廠
• 供應商工廠關閉 - 未報告
• 新加入者 - 幹阻聯盟

第六章 下層材料供應鏈

• 下游供應鏈：概述
• 後勤
• 下游供應鏈的新進入者 - 未報告
• 下游供應鏈工廠最新資訊（新）-無報告
• 下游供應鏈：TechCET 分析師評估

第七章 供應商簡介

• ADEKA CORPORATION
• AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
• AZMAX CO., LTD.
• CITY CHEMICAL LLC
• DNF CO., LTD.
• 其他20多家企業

This report provides market and technical trend information CVD/ALD dielectric and SOD precursors. For the last 20 years, there have been many research papers and patents published regarding ALD and CVD precursors specifically for the semiconductor industry. This report includes detail on the development path and roadmaps for new precursors and any current EHS and regulatory hurdles for these materials to enter into high volume manufacturing (HVM). Forecasts are provided on precursors of all types, with a focus is on the leading-edge front end of the line insulating and conductive materials, including sacrificial layers, low-k dielectrics, hard masks, mandrel, and etch stop layers. These process areas are of interest because of the high growth potential associated with leading-edge logic <45 nm, 28 nm to 10/7 nm nodes, and the future 5 & 3 nm nodes, as well as advanced DRAM and 3DNAND volatile and non-volatile memories.

This report comes with 3 Quarterly Updates featuring updated market information and forecasting from the report analyst.

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

• 1.1. REGIONAL TRENDS-DIELECTRIC PRECURSORS
• 1.2. PRECURSOR MARKET-HISTORICAL AND 5-YEAR FORECAST
• 1.3. DIELECTRIC PRECURSOR REVENUE 2021 TO 2027 (M USD)
• 1.4. TECHNOLOGY TRENDS DIELECTRIC PRECURSORS
• 1.5. CVD AND ALD EQUIPMENT MARKET
• 1.6. ANALYST ASSESSMENT-PRECURSORS

2. SCOPE, PURPOSE, AND METHODOLOGY

• 2.1. SCOPE
• 2.2. PURPOSE
• 2.3. METHODOLOGY
• 2.4. OVERVIEW OF OTHER TECHCET CMR™ REPORTS

3. SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

• 3.1. WORLDWIDE ECONOMY
  • 3.1.1. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
  • 3.1.2. SEMICONDUCTOR SALES GROWTH
  • 3.1.3. TAIWAN MONTHLY SALES TRENDS
  • 3.1.4. UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023-SLOWER TO NEGATIVE SEMICONDUCTOR REVENUE GROWTH EXPECTED
• 3.2. CHIPS SALES BY ELECTRONIC GOODS SEGMENT
  • 3.2.1. SMARTPHONES
  • 3.2.2. PC UNIT SHIPMENTS
  • 3.2.3. SERVERS / IT MARKET
• 3.3. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
  • 3.3.1. FAB EXPANSION ANNOUNCEMENT SUMMARY
  • 3.3.2. WW FAB EXPANSION DRIVING GROWTH
  • 3.3.3. EQUIPMENT SPENDING TRENDS
  • 3.3.4. TECHNOLOGY ROADMAPS
  • 3.3.5. FAB INVESTMENT ASSESSMENT
• 3.4. POLICY & TRADE TRENDS AND IMPACT
• 3.5. SEMICONDUCTOR MATERIALS OVERVIEW
  • 3.5.1. COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
  • 3.5.2. LOGISTICS ISSUES EASED DOWN
  • 3.5.3. TECHCET WAFER STARTS FORECAST THROUGH 2027
  • 3.5.4. TECHCET'S MATERIAL FORECAST

4. PRECURSOR MARKET TRENDS

• 4.1. MARKET TRENDS
  • 4.1.1. MARKET TRENDS-WAFER STARTS
  • 4.1.2. MARKET TRENDS-WAFER STARTS LOGIC
  • 4.1.3. MARKET TRENDS-WAFER STARTS DRAM
  • 4.1.4. MARKET TRENDS-WAFER STARTS NAND
• 4.2. SUPPLY CAPACITY AND DEMAND, INVESTMENTS
  • 4.2.1. WF6 DEMAND DRIVERS
• 4.3. SUPPLY CAPACITY AND DEMAND, INVESTMENTS
• 4.4. REGIONAL TRENDS-DIELECTRIC PRECURSORS
  • 4.4.1. REGIONAL TRENDS AND DRIVERS
• 4.5. CVD AND ALD EQUIPMENT MARKET
  • 4.5.1. WFE FORECAST: ALL TYPES
  • 4.5.2. WFE FORECAST: DEPOSITION, ETCH & CLEAN, LITHOGRAPHY, METROLOGY ETC.
• 4.6. TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS BY DEVICE TYPE
  • 4.6.1. GENERAL TREND LAST DECADE GOING FROM PVD & LPCVD TO PECVD & ALD
  • 4.6.2. ADVANCED LOGIC NODE HVM ESTIMATE
  • 4.6.3. DRAM NODE HVM ESTIMATE
  • 4.6.4. 3D NAND NODE HVM ESTIMATE
  • 4.6.5. SUMMARY OF OPPORTUNITIES BY DEVICE SEGMENT
• 4.7. SEMICONDUCTOR PROCESS & MATERIALS TRENDS
  • 4.7.1. ETCH PROCESS BY DEVICE TYPE-ATOMIC LAYER ETCHING ALE
  • 4.7.2. AREA SELECTIVE DEPOSITION
  • 4.7.3. DIRECTED SELF ASSEMBLY (DSA) AND EUV
  • 4.7.4. DIRECT SELF ASSEMBLY (DSA) AND EUV
  • 4.7.5. 2D TRANSITION METAL DICHALCOGENIDES (TMD)
  • 4.7.6. DRY RESIST FOR EUV
  • 4.7.7. UNDERLAYERS FOR EUV RESIST
  • 4.7.8. OTHER APPLICATIONS-OPTICS
• 4.8. EHS AND LOGISTIC ISSUES
  • 4.8.1. GREEN HOUSE GASES FROM SEMICONDUCTOR PRODUCTION
  • 4.8.2. EUV AND ENERGY
  • 4.8.3. ASSESSING THE ENVIRONMENTAL IMPACT OF ATOMIC LAYER DEPOSITION (ALD) PROCESSES AND PATHWAYS TO LOWER IT
• 4.9. CHANGES IN STANDARD PACKAGING/VALVE TYPES

5. SEGMENT MARKET STATISTICS AND FORECASTS

• 5.1. PRECURSOR MARKET-HISTORICAL AND 5-YEAR FORECAST
• 5.2. DIELECTRIC PRECURSOR REVENUE 2021 TO 2027 (M USD)
  • 5.2.1. ASSESSMENT DIELECTRIC PRECURSORS
• 5.3. M&A ACTIVITIES
  • 5.3.1. M&A ACTIVITIES-MERCK & MECARO
• 5.4. NEW PLANTS
• 5.5. SUPPLIER PLANT CLOSURES-NONE REPORTED
• 5.6. NEW ENTRANTS-DRY RESIST CONSORTIUM

6. SUB TIER MATERIAL SUPPLY CHAIN

• 6.1. SUB-TIER SUPPLY-CHAIN: INTRODUCTION
• 6.2. LOGISTICS
  • 6.2.1. LOGISTICS, CONTINUED
• 6.3. SUB-TIER SUPPLY-CHAIN "NEW" ENTRANTS-NONE REPORTED
• 6.4. SUB-TIER SUPPLY-CHAIN PLANTS UPDATES-NEW-NONE REPORTED
• 6.5. SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

7. SUPPLIER PROFILES

• ADEKA CORPORATION
• AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
• AZMAX CO., LTD.
• CITY CHEMICAL LLC
• DNF CO., LTD.
• ...and 20+ more

FIGURES

• FIGURE 1: HARDMASK, LOW K DIELECTRIC PRECURSORS REGIONAL SHARES 2022
• FIGURE 2: TOTAL PRECURSOR MARKET, M USD
• FIGURE 3 DIELECTRIC PRECURSOR MARKET 2021 TO 2027
• FIGURE 4: CVD AND ALD TOTAL EQUIPMENT MARKET 2022 USD 17-18 BILLION
• FIGURE 5: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2022)
• FIGURE 6: WORLDWIDE SEMICONDUCTOR SALES
• FIGURE 7: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI)*
• FIGURE 8: 2023 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
• FIGURE 9: 2022 SEMICONDUCTOR CHIP APPLICATIONS
• FIGURE 10: MOBILE PHONE SHIPMENTS WW ESTIMATES
• FIGURE 11: WORLDWIDE PC AND TABLET FORECAST
• FIGURE 12: ELECTRIFICATION TREND BY WORLD REGION
• FIGURE 13: SEMICONDUCTOR AUTOMOTIVE PRODUCTION
• FIGURE 14: TSMC PHOENIX INVESTMENT ESTIMATED WILL BE US $40 B
• FIGURE 15: CHIP EXPANSIONS 2022-2027 US$366 B
• FIGURE 16: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
• FIGURE 17: GLOBAL TOTAL EQUIPMENT SPENDING BY SEGMENT (US$ B)
• FIGURE 18: OVERVIEW OF ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP
• FIGURE 19: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST RENDERING (ON BOTTOM)
• FIGURE 20: EUROPE CHIP EXPANSION UPSIDE
• FIGURE 21: PORT OF LA
• FIGURE 22: TECHCET WAFER START FORECAST BY NODE SEGMENTS**
• FIGURE 23: GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK
• FIGURE 24: FORECASTS - WAFER STARTS 2021 TO 2027
• FIGURE 25: FORECASTS - WAFER STARTS LOGIC 300 MM
• FIGURE 26: FORECASTS - WAFER STARTS DRAM 300 MM
• FIGURE 27: FORECASTS - WAFER STARTS NAND 300 MM
• FIGURE 28: 3DNAND MARKET SHARE 2022
• FIGURE 29: HARDMASK, LOW K DIELECTRIC PRECURSORS REGIONAL SHARES 2022
• FIGURE 30: CVD AND ALD TOTAL EQUIPMENT MARKET 2022 USD 17-18 BILLION
• FIGURE 31: SEMI 2022 SEMICONDUCTOR EQUIPMENT FORECAST
• FIGURE 32: 2022 TECHINSIGHTS WFE SPENDING (TOP) AND 2022 GARTNER WFE SPENDING PER NODE (BOTTOM)
• FIGURE 33: 3D DEVICE ARCHITECTURES
• FIGURE 34: LOGIC TECHNOLOGY NODE ROADMAP FOR LEADING IDMS
• FIGURE 35: SAMSUNG START 3 NM PILOT RAMP USING GAA-FET TECHNOLOGY JUNE 2022
• FIGURE 36: IMEC 2022 LOGIC ROADMAP
• FIGURE 37: SCALING AND LITHOGRAPHY TRENDS - A HIGH COST IN CAPITAL EXPENDITURE, ENERGY AND EMISSIONS
• FIGURE 38: APPLIED MATERIALS CENTURA PATTERN SHAPING CLUSTER
• FIGURE 39: DRAM TECHNOLOGY ROADMAP FOR LEADING IDMS
• FIGURE 40: IP FILING IN THE FIELD OF 3DRAM IS ACCELERATING
• FIGURE 41: NAND TECHNOLOGY ROADMAP FOR LEADING IDMS
• FIGURE 42: PATHWAYS FOR CONTINUED 3D NAND SCALING
• FIGURE 43: 3DNAND STACK TRENDS FROM <100L TO 4 STACKS
• FIGURE 44: MEMORY STACK CHALLENGES FOR V-NAND
• FIGURE 45A: FINFET TO GAA TRANSISTOR DIAGRAMS SHOWING SELECTIVE ETCHING IS NEEDED TO ADD RESS DEVICE COMPLEXITY
• FIGURE 45B: ALE PROCESS CYCLE
• FIGURE 46: PERIOD TABLE INDICATING CANDIDATES FOR ALE (ISOTROPIC ETCHING)
• FIGURE 47: APPLICATION OF ALE (ISOTROPIC ETCH)
• FIGURE 48: ALD AND ALE COMBO PROCESS
• FIGURE 49: PLASMA AND THERMAL ALE PROCESSES
• FIGURE 50: LAM ALE PROCESS
• FIGURE 51: ALD / ALE PROCESS ROADMAP
• FIGURE 52: ALE PATENT ACTIVITY BY COMPANY THROUGH 2022
• FIGURE 53: AREA SELECTIVE SIN DEPOSITION BY ALD (AVS ASD2022)
• FIGURE 54: DSA AND EUS PROCESSES
• FIGURE 55: RESIST RECTIFICATION WITH DSA
• FIGURE 56: TEM AND ARTIST RENDERING OF MONOLAYER CHANNEL FORMATION
• FIGURE 57: EUV LITHOGRAPHY ENABLING GATE STRUCTURES AND PITCH SCALING
• FIGURE 58: DRY RESIST FOR EUV SEM IMAGE
• FIGURE 59: SPIN ON CARBON (SOC) DIELECTRIC FOR EUV METAL OXIDE RESISTS PATTERNS AFTER LITHO
• FIGURE 60: UNDERLAYER (DIELECTRIC) HARDMASKS TRENDS FOR NIGH NA EUV
• FIGURE 61: SPIN ON PRIMER (SOC) VS. HMDS PRIMER
• FIGURE 62: GREENHOUSE GAS CONTRIBUTIONS OF CHIP FAB MATERIALS AND EQUIPMENT
• FIGURE 63: ENVIRONMENTAL IMPACT (GWP) OF VARIOUS PROCESSES AND GASES
• FIGURE 64: CO2EQ OUTPUT FROM ETCH GASES
• FIGURE 65: TOTAL EMISSIONS AND ENERGY USE PROJECTION PER LOGIC NODE
• FIGURE 66: ENVIRONMENTAL IMPACT OF ALD
• FIGURE 67: SEGMENTATION OF THE AMPOULE FLEET 2020 BASED ON NUMBER OF UNITS IN THE FIELD
• FIGURE 68: TOTAL PRECURSOR MARKET, M USD
• FIGURE 69: DIELECTRIC PRECURSOR MARKET 2021 TO 2027
• FIGURE 70: TEOS
• FIGURE 71: WHAT IS EUV DRY RESIST?
• FIGURE 72: TYPICAL NON-HALIDE LIGANDS USED FOR ALD PRECURSORS
• FIGURE 73: EXAMPLES OF PRECURSORS SUPPLIED BY SHIP
• FIGURE 74: OCEAN CONTAINER PRICE INDEX - JULY '20 TO MARCH '23

TABLES

• TABLE 1: DIELECTRIC PRECURSOR REVENUES BY REGION (US$ M)
• TABLE 2: 2017 TO 2027 5-YEAR CAGRS
• TABLE 3: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
• TABLE 4: IMF ECONOMIC OUTLOOK*
• TABLE 5: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2022
• TABLE 6: DIELECTRIC PRECURSOR MARKET SIZE BY REGION
• TABLE 7: REGIONAL WAFER MARKETS
• TABLE 8: REGIONAL PRECURSOR MARKETS
• TABLE 9: OVERVIEW OF DEPOSITION PROCESSES BY DEVICE TYPE AND MATERIAL FOR LOGIC DEVICES
• TABLE 10: OVERVIEW OF DEPOSITION PROCESSES BY DEVICE TYPE AND MATERIAL FOR DRAM
• TABLE 11: OVERVIEW OF DEPOSITION PROCESSES BY DEVICE TYPE AND MATERIAL FOR 3DNAND
• TABLE 12: GAS TRENDS AND OPPORTUNITIES BY DEVICE TYPE
• TABLE 13: PRECURSOR 5-YEAR CAGR COMPARISON