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貼裝機的全球市場-各技術，各用途-地區展望，競爭策略，市場區隔預測(～2033年)
市場調查報告書
商品編碼
1273233

貼裝機的全球市場-各技術，各用途-地區展望，競爭策略，市場區隔預測(～2033年)

Chip Mounter Market Size- By Technology, By Application- Regional Outlook, Competitive Strategies and Segment Forecast to 2033
出版日期: | 出版商: SPER Market Research Pvt. Ltd. | 英文 220 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

全球貼裝機的市場規模在2033年前預計將以5.79％的年複合成長率增長，推定將達到111億4,000萬美元。需要使用小型複雜電子元件的智慧裝置和IoT的普及，促進著市場成長。

本報告提供全球貼裝機市場的相關調查，提供市場動態，市場分析，企業簡介等全面性資訊。

目錄

第1章 簡介

  • 調查範圍
  • 市場區隔分析

第2章 調查手法

  • 調查資料來源
    • 2次資料
    • 1次資料
    • SPER內部資料庫
    • KOL的洞察
  • 市場規模的估計
    • Top-Down(由上而下)和Bottom-Up(由下而上)的方法
  • 資料的三角測量

第3章 摘要整理

第4章 市場動態

  • 促進因素，阻礙因素，機會，課題的分析
    • 促進因素
    • 阻礙因素
    • 機會
    • 課題
  • COVID-19全球貼裝機對市場的影響

第5章 市場變數與展望

  • SWOT分析
    • 優勢
    • 弱點
    • 機會
    • 威脅
  • PESTEL分析
    • 政治形勢
    • 經濟形勢
    • 社會形勢
    • 技術性形勢
    • 環境的形勢
    • 法律上的形勢
  • 波特的五力分析
    • 供給企業談判力
    • 買方議價能力
    • 替代品的威脅
    • 新加入廠商者的威脅
    • 競爭企業間的敵對關係
  • 熱圖分析

第6章 競爭情形

  • 全球貼裝機市場製造地的分佈，銷售區域，產品類型
  • 全球貼裝機市場的合併·收購，夥伴關係，產品銷售，及聯盟

第7章 全球貼裝機市場:各技術(100萬美元)

  • 全球貼裝機市場金額佔有率與預測:各技術(2023年～2033年)
  • 全技術
  • 表面貼裝技術
  • 細間距技術

第8章 全球貼裝機市場:各用途(100萬美元)

  • 全球貼裝機市場金額佔有率與預測:各用途(2023年～2033年)
  • 家電
  • 醫學
  • 汽車
  • 通訊
  • 其他

第9章 全球貼裝機市場預測(2019年～2033年)(100萬美元)

第10章 全球貼裝機市場:各技術(2019年～2033年)(100萬美元)

第11章 全球貼裝機市場:各用途(2019年～2033年)(100萬美元)

第12章 全球貼裝機市場:各地區(2019年～2033年)(100萬美元)

  • 亞太地區
    • 澳洲
    • 中國
    • 印度
    • 日本
    • 韓國
    • 其他的亞太地區
  • 歐洲
    • 法國
    • 德國
    • 義大利
    • 西班牙
    • 英國
    • 其他的歐洲
  • 中東和非洲
    • 沙烏地阿拉伯王國
    • 阿拉伯聯合大公國
    • 其他的中東和非洲
  • 北美
    • 加拿大
    • 墨西哥
    • 美國
  • 南美
    • 阿根廷
    • 巴西
    • 其他的南美

第13章 企業簡介

  • ASM Pacific Technology
  • Canon
  • Essemtech
  • Hitachi
  • Juki
  • Nordson
  • Ohashi Engineering
  • Panasonic
  • Samsung
  • Sony

第14章 簡稱的清單

第15章 參考鏈接

第16章 結論

第17章 調查範圍

簡介目錄
Product Code: MACH2324

Global Chip Mounter Market Overview

According to SPER Market Research, the Global Chip Mounter Market is estimated to reach USD 11.14 billion by 2033 with a CAGR of 5.79%.

A chip mounter, also known as a pick-and-place machine, is an electronic device used in the manufacturing of printed circuit boards (PCBs) to place surface-mount devices (SMDs) onto the board. The chip mounter market is a segment of the electronics manufacturing industry and has experienced significant growth in recent years due to the increasing demand for smaller, more powerful electronic devices. The chip mounter market is driven by a variety of factors, including the proliferation of smart devices and the Internet of Things (IoT), which require the use of smaller and more complex electronic components.

What challenges does the Global Chip Mounter Market face?

While the global chip mounter market has experienced significant growth in recent years, it is not without its challenges. One of the main challenges is the increasing complexity of electronic components, which has led to a need for more advanced and precise chip mounters. This has made it difficult for smaller companies to compete in the market, as they may not have the resources to invest in the latest technology.

Scope of the Report

Report Metric Details:

  • Market size available for years: 2019-2033
  • Base year considered: 2022
  • Forecast period: 2023-2033
  • Segments covered: By Technology, By Application.
  • Regions covered: Asia-Pacific, Europe, Middle East and Africa, North America, Latin America
  • Companies Covered: ASM Pacific Technology, Canon, Essemtech, Hitachi, Juki, Nordson, Ohashi Engineering, Panasonic, Samsung, Sony

Global Chip Mounter Market Segmentation:

  • By Technology: Based on the Technology, Global Chip Mounter Market is segmented as; Hole Technology, Surface Mount Technology, Fine Pitch Technology.
  • By Application: Based on the Application, Global Chip Mounter Market is segmented as; Consumer Electronics, Medical, Automotive, Telecommunication, Others.
  • By Region: This report also provides the data for key regional segments of Asia-Pacific, Europe, Middle East and Africa, North America, Latin America.

Table of Contents

1. Introduction

  • 1.1. Scope of the report
  • 1.2. Market segment analysis

2. Research Methodology

  • 2.1. Research data source
    • 2.1.1. Secondary Data
    • 2.1.2. Primary Data
    • 2.1.3. SPER's internal database
    • 2.1.4. Premium insight from KOL's
  • 2.2. Market size estimation
    • 2.2.1. Top-down and Bottom-up approach
  • 2.3. Data triangulation

3. Executive Summary

4. Market Dynamics

  • 4.1. Driver, Restraint, Opportunity and Challenges analysis
    • 4.1.1. Drivers
    • 4.1.2. Restraints
    • 4.1.3. Opportunities
    • 4.1.4. Challenges
  • 4.2. COVID-19 Impacts of the Global Chip Mounter Market

5. Market variable and outlook

  • 5.1. SWOT Analysis
    • 5.1.1. Strengths
    • 5.1.2. Weaknesses
    • 5.1.3. Opportunities
    • 5.1.4. Threats
  • 5.2. PESTEL Analysis
    • 5.2.1. Political Landscape
    • 5.2.2. Economic Landscape
    • 5.2.3. Social Landscape
    • 5.2.4. Technological Landscape
    • 5.2.5. Environmental Landscape
    • 5.2.6. Legal Landscape
  • 5.3. PORTER's Five Forces
    • 5.3.1. Bargaining power of suppliers
    • 5.3.2. Bargaining power of buyers
    • 5.3.3. Threat of Substitute
    • 5.3.4. Threat of new entrant
    • 5.3.5. Competitive rivalry
  • 5.4. Heat Map Analysis

6. Competitive Landscape

  • 6.1. Global Chip Mounter Market Manufacturing Base Distribution, Sales Area, Product Type
  • 6.2. Mergers & Acquisitions, Partnerships, Product Launch, and Collaboration in Global Chip Mounter Market

7. Global Chip Mounter Market, By Technology (USD Million)

  • 7.1. Global Chip Mounter Market Value Share and Forecast, By Technology, 2023-2033
  • 7.2. Hole Technology
  • 7.3. Surface Mount Technology
  • 7.4. Fine Pitch Technology

8. Global Chip Mounter Market, By Application (USD Million)

  • 8.1. Global Chip Mounter Market Value Share and Forecast, By Application, 2023-2033
  • 8.2. Consumer Electronics
  • 8.3. Medical
  • 8.4. Automotive
  • 8.5. Telecommunication
  • 8.6. Others

9. Global Chip Mounter Market Forecast, 2019-2033 (USD Million)

  • 9.1. Global Chip Mounter Market Size and Market Share

10. Global Chip Mounter Market, By Technology, 2019-2033 (USD Million)

  • 10.1. Global Chip Mounter Market Size and Market Share By Technology (2019-2026)
  • 10.2. Global Chip Mounter Market Size and Market Share By Technology (2027-2033)

11. Global Chip Mounter Market, By Application, 2019-2033 (USD Million)

  • 11.1. Global Chip Mounter Market Size and Market Share By Application (2019-2026)
  • 11.2. Global Chip Mounter Market Size and Market Share By Application (2027-2033)

12. Global Chip Mounter Market, By Region, 2019-2033 (USD Million)

  • 12.1. Global Chip Mounter Market Size and Market Share By Region (2019-2026)
  • 12.2. Global Chip Mounter Market Size and Market Share By Region (2027-2033)
  • 12.3. Asia-Pacific
    • 12.3.1. Australia
    • 12.3.2. China
    • 12.3.3. India
    • 12.3.4. Japan
    • 12.3.5. South Korea
    • 12.3.6. Rest of Asia-Pacific
  • 12.4. Europe
    • 12.4.1. France
    • 12.4.2. Germany
    • 12.4.3. Italy
    • 12.4.4. Spain
    • 12.4.5. United Kingdom
    • 12.4.6. Rest of Europe
  • 12.5. Middle East and Africa
    • 12.5.1. Kingdom of Saudi Arabia
    • 12.5.2. United Arab Emirates
    • 12.5.3. Rest of Middle East & Africa
  • 12.6. North America
    • 12.6.1. Canada
    • 12.6.2. Mexico
    • 12.6.3. United States
  • 12.7. Latin America
    • 12.7.1. Argentina
    • 12.7.2. Brazil
    • 12.7.3. Rest of Latin America

13. Company Profile

  • 13.1. ASM Pacific Technology
    • 13.1.1. Company details
    • 13.1.2. Financial outlook
    • 13.1.3. Product summary
    • 13.1.4. Recent developments
  • 13.2. Canon
    • 13.2.1. Company details
    • 13.2.2. Financial outlook
    • 13.2.3. Product summary
    • 13.2.4. Recent developments
  • 13.3. Essemtech
    • 13.3.1. Company details
    • 13.3.2. Financial outlook
    • 13.3.3. Product summary
    • 13.3.4. Recent developments
  • 13.4. Hitachi
    • 13.4.1. Company details
    • 13.4.2. Financial outlook
    • 13.4.3. Product summary
    • 13.4.4. Recent developments
  • 13.5. Juki
    • 13.5.1. Company details
    • 13.5.2. Financial outlook
    • 13.5.3. Product summary
    • 13.5.4. Recent developments
  • 13.6. Nordson
    • 13.6.1. Company details
    • 13.6.2. Financial outlook
    • 13.6.3. Product summary
    • 13.6.4. Recent developments
  • 13.7. Ohashi Engineering
    • 13.7.1. Company details
    • 13.7.2. Financial outlook
    • 13.7.3. Product summary
    • 13.7.4. Recent developments
  • 13.8. Panasonic
    • 13.8.1. Company details
    • 13.8.2. Financial outlook
    • 13.8.3. Product summary
    • 13.8.4. Recent developments
  • 13.9. Samsung
    • 13.9.1. Company details
    • 13.9.2. Financial outlook
    • 13.9.3. Product summary
    • 13.9.4. Recent developments
  • 13.10. Sony
    • 13.10.1. Company details
    • 13.10.2. Financial outlook
    • 13.10.3. Product summary
    • 13.10.4. Recent developments

14. List of Abbreviations

15. Reference Links

16. Conclusion

17. Research Scope