查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1258806

到 2028 年的密封包裝市場預測 - 按產品、成分、應用、最終用戶和地區分列的全球分析

Hermetic Packaging Market Forecasts to 2028 - Global Analysis By Product, Configuration, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 175+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，2022 年全球密封包裝市場規模將達到 39.5 億美元，預計到 2028 年將達到 57 億美元，預測期內復合年增長率為 6.3。 10%。

密封封裝是一種高級封裝技術，主要用於半導體和電子製造、有源和無源電子產品。 此外，密封封裝可保護電子系統免受外部因素的影響，例如氣壓變化、水分、土壤和其他可能損害電氣連接和敏感電子元件的危害。 通過延長電氣元件的使用壽命，它們對許多醫療保健和技術設備的安全和可靠性能做出了重大貢獻。

據 SIPRI 稱，2020 年美國軍費開支預計將超過 7780 億美元，比 2019 年增長 4.4%。

市場動態:

驅動程序

更多地使用密封包裝來保護敏感的電子元件

封裝商品可抵禦各種環境因素，例如污垢、污垢、濕氣和大氣壓力變化，這些因素會損壞敏感的電子設備或乾擾電氣連接。 也有需要氣密性的應用，例如在需要氣密性的產品的情況下，功能的喪失可能會帶來災難性的後果。 因此，氣密封裝越來越多地用於保護高度敏感的電子元件，預計這一趨勢將在整個預測期內持續下去。 這是影響密封包裝市場的主要變數之一。

約束

嚴格的洩漏率要求

由於其惡劣的環境和關鍵應用，軍事、航空航天和醫療系統中使用的微電子元件必須符合最嚴格的氣密封裝標準。 這些增加的法規迫使公司購買新的洩漏測試設備。 這是因為舊設備缺乏根據新標准進行測試所需的靈敏度。 密封包裝供應商必須遵守這些標準，以便以更高的成本獲得市場份額。 這種對密封包裝的嚴格規定預計將限制市場增長。

機會

更多地使用密封包裝來保護植入式醫療設備

雖然智能設備變得更加複雜和高度集成，但微技術的進步使它們變得更小。 因此，微電子封裝必須高度可靠且體積小。 此外，植入式醫療設備等生命攸關物品的包裝需要密封良好的環境，以保護設備不與身體接觸。 下一代植入式醫療器械的小型化有望推動創新封裝技術的發展。

威脅

半密封包裝的出現

金屬、陶瓷和玻璃以外的聚合物材料用於製造近乎氣密的封裝。 它也被稱為半密封、非完全密封或接近密封的材料。 如果製造、製造和測試正確，這些封裝技術有可能成為密封封裝的可靠替代品。 在預測期內，密閉包裝憑藉其低成本、輕量化和小型化等優勢，以及產量增加和標準化程度提高，有望取代密封包裝。

COVID-19 的影響:

當前爆發的 COVID-19 正在影響密封包裝供應商的資源和財務狀況。 大流行病引發的全球健康危機正在對全球金融市場、國民經濟和密封包裝商品的最終用途企業產生負面影響。 預計這將引發經濟放緩並對密封電氣元件的需求產生不利影響。 COVID-19 對密封包裝市場的長期影響預計將取決於許多變量，包括大流行的全球傳播和持續時間、全球政府的反應以及疾病的嚴重程度。

蘆葦草段預計在預測期內最大

據估計，蘆葦草行業將經歷有利可圖的增長。 簧片玻璃在數百萬個開關週期內提供非常穩定的簧片開關封裝。 當必須密封、絕緣和保護分立電子元件時，玻璃管經常用於電子應用中。 然而，這種玻璃的用途通常是無源元件的氣密密封或電絕緣。 簧片玻璃用於熱水鍋爐開關、皮帶傳感器、汽車中控鎖系統等。

在預測期內，預計軍事和國防部門的複合年增長率最高。

軍事和國防部門在預測期內將增長最快，因為由於安全問題加劇、國防預算擴大和政治動態變化，預計在預測期內對密封包裝的需求將增加。預計將呈現複合年增長率. 由於太空探索中公共和私人支出的增加，密封封裝可能會出現增長。

市場份額最高的地區:

由於能源需求增加、新興經濟體和國防開支增加等因素，預計亞太地區在預測期內將佔據最大的市場份額，從而推動該地區的市場增長。 隨著中國、印度和韓國等新興國家軍事實力的增強，對敏感電子元器件氣密封裝的需求越來越大。

複合年增長率最高的地區:

由於政府在航空航天和國防工業上的支出增加，預計北美在預測期內的複合年增長率最高。 此外，航空業對新型飛機的依賴正在推動對密封包裝的需求，從而使密封包裝行業受益。 在汽車工業中，密封件用於確保防翻倒和安全氣囊系統中的傳感器性能。 因此，如果安全氣囊裝置變得司空見慣，市場可能需要密封包裝。

市場主要參與者

密封包裝市場的主要參與者包括:Legacy Technologies, Inc.、NGK Spark Plug Co., Ltd.、Schott AG、Ametek, Inc.、Mackin Technologies、SST International、Teledyne Microelectronic Technologies、Willow Technologies、Kyocera Corporation、Sinclair Manufacturing Company、Egide S.A.、Special Hermetic Products, Inc、Amkor Technology、Materion Corporation 和 SGA Technologies。

主要發展:

2019 年 8 月，京瓷公司在神奈川縣橫濱市啟動了新的 Minato Mirai 研究中心。 該中心的成立旨在促進開放式創新，發展新業務和新技術。

2019 年 6 月，肖特推出了新的 SCHOTT HEATAN 饋通，擴展了其密封傳感器封裝產品組合。 SCHOTT HEATAN 饋通件可在超過 1000度C 的腐蝕性高溫環境中提供可靠的性能。

2019 年 2 月，AMETEK 的電子元器件和封裝部門 AMETEK Coining 推出了革命性的 Copper-Core Connect，這是高性能電子封裝中使用的厚焊料預成型件的一種經濟高效的替代品。確實如此。

2018 年 7 月，肖特簽署了收購 Primoceler 的協議，通過玻璃微鍵合技術擴展其氣密封裝產品組合。 這種黏合技術提供了一種具有優異生物相容性的新型玻璃。 該技術為晶圓級芯片級封裝 (WL-CSP) 開闢了新的可能性，適用於廣泛的應用，例如 MEMS 設備、醫療植入物和其他對可靠性至關重要的電子和光學器件。

這份報告提供了什麼

  • 區域和國家/地區細分市場份額評估
  • 向新進入者提出戰略建議
  • 2020、2021、2022、2025 和 2028 年的綜合市場數據
  • 市場驅動因素（市場趨勢、制約因素、機遇、威脅、挑戰、投資機會、建議等）
  • 根據市場預測在關鍵業務領域提出戰略建議
  • 競爭格局和趨勢
  • 公司簡介，包括詳細的戰略、財務狀況和近期發展
  • 供應鏈趨勢反映了最新的技術進步。

提供免費定制

購買此報告的客戶將免費獲得以下定制之一。

  • 公司簡介
    • 其他市場參與者的綜合概況（最多 3 家公司）
    • 主要參與者的 SWOT 分析（最多 3 家公司）
  • 區域細分
    • 應客戶要求提供主要國家/地區的市場估算、預測和復合年增長率（注意:基於可行性檢查）
  • 競爭基準
    • 根據產品組合、地域分佈和戰略聯盟對主要參與者進行基準測試

內容

第 1 章執行摘要

第2章前言

  • 概覽
  • 利益相關者
  • 調查範圍
  • 調查方法
    • 數據挖掘
    • 數據分析
    • 數據驗證
    • 研究方法
  • 調查來源
    • 主要研究信息來源
    • 二手研究資源
    • 假設

第3章市場趨勢分析

  • 司機
  • 約束因素
  • 機會
  • 威脅
  • 產品分析
  • 應用分析
  • 最終用戶分析
  • 新興市場
  • COVID-19 的影響

第 4 章波特五力分析

  • 供應商的議價能力
  • 買家的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第 5 章全球密封包裝市場:按產品分類

  • 應答器玻璃
  • 鈍化玻璃
  • 蘆葦玻璃
  • 陶瓷金屬密封 (CERTM)
  • 玻璃金屬密封 (GTMS)
  • 其他產品

第 6 章全球密封包裝市場:按成分分類

  • 壓陶瓷封裝
  • 多層陶瓷封裝
  • 金屬罐包裝

第 7 章全球密封包裝市場:按應用

  • 雷射
  • 微機電開關
  • 晶體管
  • 安全氣囊點火器
  • 振動晶體
  • 光電二極管
  • 傳感器
  • 其他應用

第 8 章全球氣密包裝市場:按最終用戶分類

  • 能源與核安全
  • 家用電器
  • 軍事與國防
  • 汽車
  • 航空航天
  • 醫學
  • 溝通
  • 其他最終用戶

第 9 章全球氣密包裝市場:按地區

  • 北美
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 意大利
    • 法國
    • 西班牙
    • 其他歐洲
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳大利亞
    • 新西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲
  • 中東和非洲
    • 沙特阿拉伯
    • 阿拉伯聯合酋長國
    • 卡塔爾
    • 南非
    • 其他中東和非洲地區

第10章主要發展

  • 合同、夥伴關係、協作和合資企業
  • 收購與合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第11章公司簡介

  • Legacy Technologies, Inc.
  • NGK Spark Plug Co., Ltd.
  • Schott AG
  • Ametek, Inc.
  • Mackin Technologies
  • SST International
  • Teledyne Microelectronic Technologies
  • Willow Technologies
  • Kyocera Corporation
  • Sinclair Manufacturing Company
  • Egide S.A.
  • Special Hermetic Products, Inc.
  • Amkor Technology
  • Materion Corporation
  • SGA Technologies
Product Code: SMRC22692

According to Stratistics MRC, the Global Hermetic Packaging Market is accounted for $3.95 billion in 2022 and is expected to reach $5.70 billion by 2028 growing at a CAGR of 6.3% during the forecast period. Hermetic packaging is a high-level packing technique that is primarily used in semiconductor and electronics manufacturing, as well as in active and passive electronic devices. Moreover, hermetic packaging shields the electronic systems from external factors that could harm electrical connections or delicate electronic components, such as changes in atmospheric pressure, moisture, soil, and other dangers. By increasing the service life of electrical components, it contributes significantly to the safe and reliable performance of many healthcare and technological equipment.

According to SIPRI Military spending in the United States is expected to exceed USD 778 billion in 2020, a 4.4% increase over 2019.

Market Dynamics:

Driver:

Increasing use of hermetic packaging for protecting highly sensitive electronic components

Hermetic goods offer protection from a range of environmental factors, including soil/grime, moisture/humidity, variations in atmospheric pressure, and other natural hazards that could harm delicate electronics or interfere with electrical connections. Applications for products that need to be hermetically sealed if their functionality is disrupted since doing so could have disastrous consequences. As a result, hermetic packaging is increasingly being used to protect extremely sensitive electronic components, and this trend is only projected to continue throughout the forecast period. This is one of the main variables influencing the market for hermetic packaging.

Restraint:

Stringent leak rate requirements

Due to their harsh surroundings and important uses, microelectronic components used in military, aerospace, and medical systems must adhere to the strictest criteria for hermetic packaging. The tightening of regulations forces businesses to purchase new leak test equipment since outdated equipment lacks the sensitivity needed to test in accordance with the new criteria. Providers of hermetic packaging must abide by these criteria in order to gain market share at the cost of higher costs. It is anticipated that the market growth will be constrained by these strict regulations for hermetic packaging.

Opportunity:

Increase in use of hermetic packing to safeguard implantable medical devices

Smart gadgets have significantly shrunk in size thanks to contemporary micro-technology, despite their complexity and integration growing. Microelectronics packaging needs to be dependable and small because of this. The packaging for life-critical items, such as implantable medical devices, must offer a superior hermetic environment to shield the device from contact with the body. The development of innovative packaging techniques is anticipated to be facilitated by the miniaturisation of implantable medical devices of the next generation.

Threat:

Emergence of quasi-hermetic packaging

Polymeric materials, as opposed to metals, ceramics, and glasses, are used to create the nearly hermetic packaging. They are also referred to as quasi-hermetic, not quite hermetic, or almost hermetic materials. These packaging techniques have the potential to be trustworthy alternatives to hermetic packaging if they are produced, created, and tested correctly. During the projection period, near-hermetic packaging is anticipated to be utilised instead of hermetic packaging because of its advantages, including lower cost, lighter weight, and smaller size, as well as anticipated growth in production and the development of standardisation.

COVID-19 Impact:

The latest COVID-19 epidemic has impacted the resources and financial situation of hermetic packaging suppliers. A worldwide health crisis brought on by the pandemic is having a negative impact on global financial markets, national economies, and end-use businesses for hermetic packaged goods. This is anticipated to trigger an economic slump and have a detrimental impact on the demand for electrical components that are hermetically sealed. The overall long-term impact of COVID-19 on the hermetic packaging market is anticipated to rely on a number of variables, including the pandemic's global spread and length, the response of different governments around the world, and the disease's severity.

The reed glasses segment is expected to be the largest during the forecast period

The reed glasses segment is estimated to have a lucrative growth. Through millions of switching cycles, Reed Glasses offer incredibly stable encapsulation of reed switches. Where discrete electronic components need to be sealed, isolated, or protected, glass tubes are frequently employed in electronic applications. Yet, the purpose of this glass is typically to hermetically seal or electrically insulate passive components. Hot water boiler switches, belt sensors, and centralised locking systems for automobiles have all utilised reed glass.

The military & defense segment is expected to have the highest CAGR during the forecast period

The military & defense segment is anticipated to witness the fastest CAGR growth during the forecast period, due to the demand for hermetic packaging is anticipated to increase over the course of the forecast period as a result of rising security concerns, expanding defence budgets, and shifting political dynamics. Hermetic packaging is likely to experience growth due to rising public and private expenditure in space exploration.

Region with highest share:

Asia Pacific is projected to hold the largest market share during the forecast period owing to factors like rising energy needs, developing economies, and rising defence spending, this market is expanding in the area. The demand for hermetic packaging for delicate electronic components is increasing as a result of the growing military prowess of emerging nations like China, India, and South Korea.

Region with highest CAGR:

North America is projected to have the highest CAGR over the forecast period, owing to the region's government's increased spending on the aerospace and defence industries. Also, the aviation sector boosts demand for hermetic packaging by relying on new aircraft, which benefits the hermetic packaging sector. In the automotive industry, hermetic is utilised to guarantee sensor performance in rollover devices and airbag apparatus. As a result, the market might require hermetic packaging if airbag equipment becomes more common.

Key players in the market:

Some of the key players profiled in the Hermetic Packaging Market include: Legacy Technologies, Inc., NGK Spark Plug Co., Ltd., Schott AG, Ametek, Inc., Mackin Technologies, SST International, Teledyne Microelectronic Technologies, Willow Technologies, Kyocera Corporation, Sinclair Manufacturing Company, Egide S.A., Special Hermetic Products, Inc., Amkor Technology, Materion Corporation and SGA Technologies.

Key Developments:

In August 2019, KYOCERA Corporation inaugurated its new Minato Mirai Research Center in Yokohama, Kanagawa Prefecture, Japan. The center was created with the aim of promoting open innovation and the development of new business and technologies.

In June 2019, SCHOTT launched new SCHOTT HEATAN feedthroughs to expand its hermetic sensor packaging portfolio. SCHOTT HEATAN feedthroughs can perform reliably in corrosive, high-heat environments beyond 1000°C.

In February 2019, AMETEK Coining-a unit of AMETEK's Electronic Components and Packaging division launched the Copper-Core Connect-a cost-effective, innovative alternative to thick solder preforms that are used in high-performance electronic packaging.

In July 2018, SCHOTT signed an agreement to acquire Primoceler to expand the company's hermetic packaging portfolio with glass micro bonding technology. This bonding technology offers excellent biocompatibility with new glass types. This technology creates new possibilities for wafer level chip scale packaging (WL-CSP) in a wide range of applications such as MEMS devices, medical implants, and other reliability-critical electronic and optical devices.

Products Covered:

  • Transponder Glass
  • Passivation Glass
  • Reed Glass
  • Ceramic-Metal Sealing (CERTM)
  • Glass-Metal Sealing (GTMS)
  • Other Products

Configurations Covered:

  • Pressed Ceramic Packages
  • Multilayer Ceramic Packages
  • Metal Can Packages

Applications Covered:

  • Lasers
  • MEMS Switch
  • Transistors
  • Airbag Ignitors
  • Oscillating Crystals
  • Photo Diodes
  • Sensors
  • Other Applications

End Users Covered:

  • Energy & Nuclear Safety
  • Consumer Electronics
  • Military & Defense
  • Automotive
  • Aeronautics & Space
  • Medical
  • Telecommunication
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2020, 2021, 2022, 2025, and 2028
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Hermetic Packaging Market, By Product

  • 5.1 Introduction
  • 5.2 Transponder Glass
  • 5.3 Passivation Glass
  • 5.4 Reed Glass
  • 5.5 Ceramic-Metal Sealing (CERTM)
  • 5.6 Glass-Metal Sealing (GTMS)
  • 5.7 Other Products

6 Global Hermetic Packaging Market, By Configuration

  • 6.1 Introduction
  • 6.2 Pressed Ceramic Packages
  • 6.3 Multilayer Ceramic Packages
  • 6.4 Metal Can Packages

7 Global Hermetic Packaging Market, By Application

  • 7.1 Introduction
  • 7.2 Lasers
  • 7.3 MEMS Switch
  • 7.4 Transistors
  • 7.5 Airbag Ignitors
  • 7.6 Oscillating Crystals
  • 7.7 Photo Diodes
  • 7.8 Sensors
  • 7.9 Other Applications

8 Global Hermetic Packaging Market, By End User

  • 8.1 Introduction
  • 8.2 Energy & Nuclear Safety
  • 8.3 Consumer Electronics
  • 8.4 Military & Defense
  • 8.5 Automotive
  • 8.6 Aeronautics & Space
  • 8.7 Medical
  • 8.8 Telecommunication
  • 8.9 Other End Users

9 Global Hermetic Packaging Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 Legacy Technologies, Inc.
  • 11.2 NGK Spark Plug Co., Ltd.
  • 11.3 Schott AG
  • 11.4 Ametek, Inc.
  • 11.5 Mackin Technologies
  • 11.6 SST International
  • 11.7 Teledyne Microelectronic Technologies
  • 11.8 Willow Technologies
  • 11.9 Kyocera Corporation
  • 11.10 Sinclair Manufacturing Company
  • 11.11 Egide S.A.
  • 11.12 Special Hermetic Products, Inc.
  • 11.13 Amkor Technology
  • 11.14 Materion Corporation
  • 11.15 SGA Technologies

List of Tables

  • Table 1 Global Hermetic Packaging Market Outlook, By Region (2020-2028) ($MN)
  • Table 2 Global Hermetic Packaging Market Outlook, By Product (2020-2028) ($MN)
  • Table 3 Global Hermetic Packaging Market Outlook, By Transponder Glass (2020-2028) ($MN)
  • Table 4 Global Hermetic Packaging Market Outlook, By Passivation Glass (2020-2028) ($MN)
  • Table 5 Global Hermetic Packaging Market Outlook, By Reed Glass (2020-2028) ($MN)
  • Table 6 Global Hermetic Packaging Market Outlook, By Ceramic-Metal Sealing (CERTM) (2020-2028) ($MN)
  • Table 7 Global Hermetic Packaging Market Outlook, By Glass-Metal Sealing (GTMS) (2020-2028) ($MN)
  • Table 8 Global Hermetic Packaging Market Outlook, By Other Products (2020-2028) ($MN)
  • Table 9 Global Hermetic Packaging Market Outlook, By Configuration (2020-2028) ($MN)
  • Table 10 Global Hermetic Packaging Market Outlook, By Pressed Ceramic Packages (2020-2028) ($MN)
  • Table 11 Global Hermetic Packaging Market Outlook, By Multilayer Ceramic Packages (2020-2028) ($MN)
  • Table 12 Global Hermetic Packaging Market Outlook, By Metal Can Packages (2020-2028) ($MN)
  • Table 13 Global Hermetic Packaging Market Outlook, By Application (2020-2028) ($MN)
  • Table 14 Global Hermetic Packaging Market Outlook, By Lasers (2020-2028) ($MN)
  • Table 15 Global Hermetic Packaging Market Outlook, By MEMS Switch (2020-2028) ($MN)
  • Table 16 Global Hermetic Packaging Market Outlook, By Transistors (2020-2028) ($MN)
  • Table 17 Global Hermetic Packaging Market Outlook, By Airbag Ignitors (2020-2028) ($MN)
  • Table 18 Global Hermetic Packaging Market Outlook, By Oscillating Crystals (2020-2028) ($MN)
  • Table 19 Global Hermetic Packaging Market Outlook, By Photo Diodes (2020-2028) ($MN)
  • Table 20 Global Hermetic Packaging Market Outlook, By Sensors (2020-2028) ($MN)
  • Table 21 Global Hermetic Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
  • Table 22 Global Hermetic Packaging Market Outlook, By End User (2020-2028) ($MN)
  • Table 23 Global Hermetic Packaging Market Outlook, By Energy & Nuclear Safety (2020-2028) ($MN)
  • Table 24 Global Hermetic Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
  • Table 25 Global Hermetic Packaging Market Outlook, By Military & Defense (2020-2028) ($MN)
  • Table 26 Global Hermetic Packaging Market Outlook, By Automotive (2020-2028) ($MN)
  • Table 27 Global Hermetic Packaging Market Outlook, By Aeronautics & Space (2020-2028) ($MN)
  • Table 28 Global Hermetic Packaging Market Outlook, By Medical (2020-2028) ($MN)
  • Table 29 Global Hermetic Packaging Market Outlook, By Telecommunication (2020-2028) ($MN)
  • Table 30 Global Hermetic Packaging Market Outlook, By Other End Users (2020-2028) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.