底部填充塗佈設備的全球市場:各產品類型，各用途，各地區分析-預測(～2028年)

全球底部填充塗佈設備的市場規模，2021年為651億1,000萬美金，在預測期間內預計以10.9％的年複合成長率成長，2028年達到1,343億2,000萬美元。

本報告提供全球底部填充塗佈設備市場相關調查分析，市場市場促進因素，阻礙因素，各產品類型、用途、終端用戶、地區市場分析，企業簡介等相關資訊。

目錄

第1章 摘要整理

第2章 序文

第3章 市場趨勢分析

• 簡介
• 促進因素
• 阻礙因素
• 機會
• 威脅
• 產品分析
• 用途分析
• 終端用戶分析
• 新興市場
• COVID-19影響

第4章 波特的五力分析

第5章 全球底部填充塗佈設備市場:各產品類型

• 無流動底部填充
• 成型底部填充
• 毛細管流動底部填充

第6章 全球底部填充塗佈設備市場:各用途

• 家電產品
• 半導體包裝

第7章 全球底部填充塗佈設備市場:各終端用戶

• 覆晶
• 晶片規模包裝
• 球柵陣列

第8章 全球底部填充塗佈設備市場:各地區

• 北美
  • 美國
  • 加拿大
  • 墨西哥
• 歐洲
  • 德國
  • 英國
  • 義大利
  • 法國
  • 西班牙
  • 其他歐洲
• 亞太地區
  • 日本
  • 中國
  • 印度
  • 澳洲
  • 紐西蘭
  • 韓國
  • 其他亞太地區
• 南美
  • 阿根廷
  • 巴西
  • 智利
  • 其他南美
• 中東和非洲
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 卡達
  • 南非
  • 其他中東和非洲

第9章 主要發展

• 契約，夥伴關係，合作，合資企業
• 收購與合併
• 新產品的銷售
• 擴大
• 其他的主要策略

第10章 企業簡介

• Zymet Inc.
• MKS Instruments, Inc.
• Sulzer Ltd.
• Nordson Corporation
• Shenzhen STIHOM Machine Electronics Co., Ltd
• Master Bond Inc.
• Illinois Tool Works
• Henkel AG & Co. KGaA
• Essemtec AG
• Zmation Inc.

According to Stratistics MRC, the Global Underfill Dispenser Market is accounted for $65.11 billion in 2021 and is expected to reach $134.32 billion by 2028 growing at a CAGR of 10.9% during the forecast period. Underfill material is used in semiconductor wrapping to offer strength, improve the overall consistency and thermo-mechanical recital, and augment the impact resistance. It is used to fill space beneath a die and adhere to its carrier. Underfill creates a strong mechanical link between the chip and the PCB connector, preventing mechanical stress on the soldered parts. It also aids in the transmission of heat.

Semiconductors are important technology enablers that power many cutting-edge digital devices. The growing trend of adopting connected devices in the residential and industrial sectors is augmenting the demand for the semiconductors market. According to Cisco Systems, the number of connected wearable devices is expected to increase from 593 million in 2018 to 1,105 million in 2022. Thus, the rapid development in the technology and size of consumer electronics is also boosting the demand for advanced semiconductor technology.

Market Dynamics:

Driver:

Advances in dispensing systems set tone of technological progress

Underfills serve the primary function of recuperating the service life of die packages in semiconductor industry. They aid decrease stress from mismatch caused by coefficient of thermal growth in interconnect devices. A range of dispenser valves are used in underfill dispensing market. New jetting systems have come to the fore for improving precision of dispensing among other performance characteristics. More importantly, the demand dynamics in the market comes from the interplay of factors such as cost of ownership, ease of applications, and evolving demands in the PCB industry. Rise in demand for smart consumer electronics industries has also opened new, challenging demands for dispensing systems. These devices are growing in production on the back of the increasing trend of electronic devices with functionality and performance in both consumer and enterprise applications.

Restraint:

High initial investment

The high initial investment required for research and development might limit the market's growth in certain regions. Several smaller businesses are struggling under the weight of excessive high research and development investment, which could have adverse impact on the overall market. Also several market players are finding it difficult to cope with the high investment required for research and development. This makes companies reluctant to fund R&D activities, which could act against the overall market prospect.

Opportunity:

Growing demand for handheld devices

The underfill dispensers market is basically gaining popularity from the increasing demand for handheld devices. Asia Pacific particularly features profitable market opportunities as it the home to a booming consumer electronics industry. The demand for handheld devices such as tablets and mobile phones is considerably high across nations such as India, Australia, China, and Japan. This in turn creates an environment conducive to growth of the underfill dispenser market in Asia Pacific, subsequently propelling the market's overall growth. Also, with the growing inclination towards miniaturizing gadgets, in future the demand for underfull dispenser is poised to rise exponentially. These factors are indicative of the growing willingness of consumers towards spending on advanced consumer electronics.

Threat:

Pandemic had a negative impact on global underfill dispensers market

Most industries across the world have been negatively impacted over the last few months. This can be attributed to significant disruptions experienced by their respective manufacturing and supply-chain operations as a result of various precautionary lockdowns, as well as other restrictions that were enforced by governing authorities across the globe. The same applies to the global underfill dispenser market. Moreover, consumer demand has also subsequently reduced as individuals are now keener on eliminating non-essential expenses from their respective budgets as the general economic status of most individuals have been severely affected by this outbreak.

The capillary flow underfill segment is expected to be the largest during the forecast period

The capillary flow underfill segment is estimated to have a lucrative growth due to the micro-electromechanical systems (MEMS) applications in various industries that require PCB connectors. Capillary underfill offers important advantages for high-performance computing devices, including CPU, GPU, and AI processors in datacenter, autonomous driving, and mobile devices with AI capability. With so much field data, it's easier for engineers to manage and control the capillary underfill process to prevent potential reliability issues such as voids.

The ball grid array segment is expected to have the highest CAGR during the forecast period

The ball grid array segment is anticipated to witness the fastest CAGR growth during the forecast period owing to the increase in R&D investments in the miniaturization of IC packages over the years. Ball grid array has evolved as one of the technologies that enable the miniaturization of IC packages in the MEMS sector. It is a type of surface-mount packaging used for circuit board assemblies. It is used to permanently mount microprocessors and other devices. BGA underfill is used to protect the circuit board assembly by creating sounder thermal and mechanical properties.

Region with highest share:

Asia Pacific is projected to hold the largest market share during the forecast period, as it is a home to booming consumer electronics and automotive sectors, and also boost a strong defense sector. Countries such as India, China, and Japan allocated increasing funds in the modernization of defense equipment. This provides lucrative growth opportunities for the underfill dispenser market in Asia Pacific.

Region with highest CAGR:

North America is projected to have the highest CAGR over the forecast period, owing to the rising demand for miniaturization of smart devices and sophisticated industrial infrastructure within the region. These regions are characterized by the presence of multinational dispensing equipment suppliers. Furthermore, these regions are, in the context of equipment, technologically advanced compared to other regions.

Key players in the market

Some of the key players profiled in the Underfill Dispenser Market include Zymet Inc., MKS Instruments, Inc., Sulzer Ltd., Nordson Corporation, Shenzhen STIHOM Machine Electronics Co., Ltd, Master Bond Inc., Illinois Tool Works, Henkel AG & Co. KGaA , Essemtec AG and Zmation Inc.

Key Developments:

In Aug 2019: Nordson Corporation launched its Forte™ Series fluid dispensing system. The Forte Series combines high accuracy fluid dispensing with increased throughput and productivity in a narrow footprint to handle applications such as flex circuit and printed circuit board assembly, electro-mechanical assembly, MEMS, underfill, precise coating, and encapsulation.

Product Types Covered:

• No Flow Underfill
• Molded Underfill
• Capillary Flow Underfill

Applications Covered:

• Consumer Electronics
• Semiconductor Packaging

End Users Covered:

• Flip-Chips
• Chip Scale Packaging
• Ball Grid Array

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2020, 2021, 2022, 2025, and 2028
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Product Analysis
• 3.7 Application Analysis
• 3.8 End User Analysis
• 3.9 Emerging Markets
• 3.10 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Underfill Dispenser Market, By Product Type

• 5.1 Introduction
• 5.2 No Flow Underfill
• 5.3 Molded Underfill
• 5.4 Capillary Flow Underfill

6 Global Underfill Dispenser Market, By Application

• 6.1 Introduction
• 6.2 Consumer Electronics
• 6.3 Semiconductor Packaging

7 Global Underfill Dispenser Market, By End User

• 7.1 Introduction
• 7.2 Flip-Chips
• 7.3 Chip Scale Packaging
• 7.4 Ball Grid Array

8 Global Underfill Dispenser Market, By Geography

• 8.1 Introduction
• 8.2 North America
  • 8.2.1 US
  • 8.2.2 Canada
  • 8.2.3 Mexico
• 8.3 Europe
  • 8.3.1 Germany
  • 8.3.2 UK
  • 8.3.3 Italy
  • 8.3.4 France
  • 8.3.5 Spain
  • 8.3.6 Rest of Europe
• 8.4 Asia Pacific
  • 8.4.1 Japan
  • 8.4.2 China
  • 8.4.3 India
  • 8.4.4 Australia
  • 8.4.5 New Zealand
  • 8.4.6 South Korea
  • 8.4.7 Rest of Asia Pacific
• 8.5 South America
  • 8.5.1 Argentina
  • 8.5.2 Brazil
  • 8.5.3 Chile
  • 8.5.4 Rest of South America
• 8.6 Middle East & Africa
  • 8.6.1 Saudi Arabia
  • 8.6.2 UAE
  • 8.6.3 Qatar
  • 8.6.4 South Africa
  • 8.6.5 Rest of Middle East & Africa

9 Key Developments

• 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 9.2 Acquisitions & Mergers
• 9.3 New Product Launch
• 9.4 Expansions
• 9.5 Other Key Strategies

10 Company Profiling

• 10.1 Zymet Inc.
• 10.2 MKS Instruments, Inc.
• 10.3 Sulzer Ltd.
• 10.4 Nordson Corporation
• 10.5 Shenzhen STIHOM Machine Electronics Co., Ltd
• 10.6 Master Bond Inc.
• 10.7 Illinois Tool Works
• 10.8 Henkel AG & Co. KGaA
• 10.9 Essemtec AG
• 10.10 Zmation Inc.

List of Tables

• Table 1 Global Underfill Dispenser Market Outlook, By Region (2020-2028) ($MN)
• Table 2 Global Underfill Dispenser Market Outlook, By Product Type (2020-2028) ($MN)
• Table 3 Global Underfill Dispenser Market Outlook, By No Flow Underfill (2020-2028) ($MN)
• Table 4 Global Underfill Dispenser Market Outlook, By Molded Underfill (2020-2028) ($MN)
• Table 5 Global Underfill Dispenser Market Outlook, By Capillary Flow Underfill (2020-2028) ($MN)
• Table 6 Global Underfill Dispenser Market Outlook, By Application (2020-2028) ($MN)
• Table 7 Global Underfill Dispenser Market Outlook, By Consumer Electronics (2020-2028) ($MN)
• Table 8 Global Underfill Dispenser Market Outlook, By Semiconductor Packaging (2020-2028) ($MN)
• Table 9 Global Underfill Dispenser Market Outlook, By End User (2020-2028) ($MN)
• Table 10 Global Underfill Dispenser Market Outlook, By Flip-Chips (2020-2028) ($MN)
• Table 11 Global Underfill Dispenser Market Outlook, By Chip Scale Packaging (2020-2028) ($MN)
• Table 12 Global Underfill Dispenser Market Outlook, By Ball Grid Array (2020-2028) ($MN)
• Table 13 North America Underfill Dispenser Market Outlook, By Country (2020-2028) ($MN)
• Table 14 North America Underfill Dispenser Market Outlook, By Product Type (2020-2028) ($MN)
• Table 15 North America Underfill Dispenser Market Outlook, By No Flow Underfill (2020-2028) ($MN)
• Table 16 North America Underfill Dispenser Market Outlook, By Molded Underfill (2020-2028) ($MN)
• Table 17 North America Underfill Dispenser Market Outlook, By Capillary Flow Underfill (2020-2028) ($MN)
• Table 18 North America Underfill Dispenser Market Outlook, By Application (2020-2028) ($MN)
• Table 19 North America Underfill Dispenser Market Outlook, By Consumer Electronics (2020-2028) ($MN)
• Table 20 North America Underfill Dispenser Market Outlook, By Semiconductor Packaging (2020-2028) ($MN)
• Table 21 North America Underfill Dispenser Market Outlook, By End User (2020-2028) ($MN)
• Table 22 North America Underfill Dispenser Market Outlook, By Flip-Chips (2020-2028) ($MN)
• Table 23 North America Underfill Dispenser Market Outlook, By Chip Scale Packaging (2020-2028) ($MN)
• Table 24 North America Underfill Dispenser Market Outlook, By Ball Grid Array (2020-2028) ($MN)
• Table 25 Europe Underfill Dispenser Market Outlook, By Country (2020-2028) ($MN)
• Table 26 Europe Underfill Dispenser Market Outlook, By Product Type (2020-2028) ($MN)
• Table 27 Europe Underfill Dispenser Market Outlook, By No Flow Underfill (2020-2028) ($MN)
• Table 28 Europe Underfill Dispenser Market Outlook, By Molded Underfill (2020-2028) ($MN)
• Table 29 Europe Underfill Dispenser Market Outlook, By Capillary Flow Underfill (2020-2028) ($MN)
• Table 30 Europe Underfill Dispenser Market Outlook, By Application (2020-2028) ($MN)
• Table 31 Europe Underfill Dispenser Market Outlook, By Consumer Electronics (2020-2028) ($MN)
• Table 32 Europe Underfill Dispenser Market Outlook, By Semiconductor Packaging (2020-2028) ($MN)
• Table 33 Europe Underfill Dispenser Market Outlook, By End User (2020-2028) ($MN)
• Table 34 Europe Underfill Dispenser Market Outlook, By Flip-Chips (2020-2028) ($MN)
• Table 35 Europe Underfill Dispenser Market Outlook, By Chip Scale Packaging (2020-2028) ($MN)
• Table 36 Europe Underfill Dispenser Market Outlook, By Ball Grid Array (2020-2028) ($MN)
• Table 37 Asia Pacific Underfill Dispenser Market Outlook, By Country (2020-2028) ($MN)
• Table 38 Asia Pacific Underfill Dispenser Market Outlook, By Product Type (2020-2028) ($MN)
• Table 39 Asia Pacific Underfill Dispenser Market Outlook, By No Flow Underfill (2020-2028) ($MN)
• Table 40 Asia Pacific Underfill Dispenser Market Outlook, By Molded Underfill (2020-2028) ($MN)
• Table 41 Asia Pacific Underfill Dispenser Market Outlook, By Capillary Flow Underfill (2020-2028) ($MN)
• Table 42 Asia Pacific Underfill Dispenser Market Outlook, By Application (2020-2028) ($MN)
• Table 43 Asia Pacific Underfill Dispenser Market Outlook, By Consumer Electronics (2020-2028) ($MN)
• Table 44 Asia Pacific Underfill Dispenser Market Outlook, By Semiconductor Packaging (2020-2028) ($MN)
• Table 45 Asia Pacific Underfill Dispenser Market Outlook, By End User (2020-2028) ($MN)
• Table 46 Asia Pacific Underfill Dispenser Market Outlook, By Flip-Chips (2020-2028) ($MN)
• Table 47 Asia Pacific Underfill Dispenser Market Outlook, By Chip Scale Packaging (2020-2028) ($MN)
• Table 48 Asia Pacific Underfill Dispenser Market Outlook, By Ball Grid Array (2020-2028) ($MN)
• Table 49 South America Underfill Dispenser Market Outlook, By Country (2020-2028) ($MN)
• Table 50 South America Underfill Dispenser Market Outlook, By Product Type (2020-2028) ($MN)
• Table 51 South America Underfill Dispenser Market Outlook, By No Flow Underfill (2020-2028) ($MN)
• Table 52 South America Underfill Dispenser Market Outlook, By Molded Underfill (2020-2028) ($MN)
• Table 53 South America Underfill Dispenser Market Outlook, By Capillary Flow Underfill (2020-2028) ($MN)
• Table 54 South America Underfill Dispenser Market Outlook, By Application (2020-2028) ($MN)
• Table 55 South America Underfill Dispenser Market Outlook, By Consumer Electronics (2020-2028) ($MN)
• Table 56 South America Underfill Dispenser Market Outlook, By Semiconductor Packaging (2020-2028) ($MN)
• Table 57 South America Underfill Dispenser Market Outlook, By End User (2020-2028) ($MN)
• Table 58 South America Underfill Dispenser Market Outlook, By Flip-Chips (2020-2028) ($MN)
• Table 59 South America Underfill Dispenser Market Outlook, By Chip Scale Packaging (2020-2028) ($MN)
• Table 60 South America Underfill Dispenser Market Outlook, By Ball Grid Array (2020-2028) ($MN)
• Table 61 Middle East & Africa Underfill Dispenser Market Outlook, By Country (2020-2028) ($MN)
• Table 62 Middle East & Africa Underfill Dispenser Market Outlook, By Product Type (2020-2028) ($MN)
• Table 63 Middle East & Africa Underfill Dispenser Market Outlook, By No Flow Underfill (2020-2028) ($MN)
• Table 64 Middle East & Africa Underfill Dispenser Market Outlook, By Molded Underfill (2020-2028) ($MN)
• Table 65 Middle East & Africa Underfill Dispenser Market Outlook, By Capillary Flow Underfill (2020-2028) ($MN)
• Table 66 Middle East & Africa Underfill Dispenser Market Outlook, By Application (2020-2028) ($MN)
• Table 67 Middle East & Africa Underfill Dispenser Market Outlook, By Consumer Electronics (2020-2028) ($MN)
• Table 68 Middle East & Africa Underfill Dispenser Market Outlook, By Semiconductor Packaging (2020-2028) ($MN)
• Table 69 Middle East & Africa Underfill Dispenser Market Outlook, By End User (2020-2028) ($MN)
• Table 70 Middle East & Africa Underfill Dispenser Market Outlook, By Flip-Chips (2020-2028) ($MN)
• Table 71 Middle East & Africa Underfill Dispenser Market Outlook, By Chip Scale Packaging (2020-2028) ($MN)
• Table 72 Middle East & Africa Underfill Dispenser Market Outlook, By Ball Grid Array (2020-2028) ($MN)