The global Epoxy Molding Compounds market was valued at USD 2,178.04 million in 2021 and is expected to reach USD 3,059.10 million by the end of 2028, growing at a CAGR of 4.46% between 2022 and 2028.
Drivers and Restrains:
The research report has incorporated the analysis of different factors that augment the market's growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2017 to 2028. This section mentions the volume of production by region from 2017 to 2028. Pricing analysis is included in the report according to each type from the year 2017 to 2028, manufacturer from 2017 to 2022, region from 2017 to 2022, and global price from 2017 to 2028.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert's opinions have been taken to understand the market better.
Segment Analysis:
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2017 to 2028. by Application segment also provides consumption during the forecast period of 2017 to 2028. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
By Company
- Sumitomo Bakelite
- Hitachi Chemical
- Chang Chun Group
- Hysol Huawei Electronics
- Panasonic
- Kyocera
- KCC
- Samsung SDI
- Eternal Materials
- Jiangsu Zhongpeng New Material
- Shin-Etsu Chemical
- Nagase ChemteX Corporation
- Tianjin Kaihua Insulating Material
- HHCK
- Scienchem
- Beijing Sino-tech Electronic Material
Segment by Type
Segment by Application
- Memory
- Non-memory
- Discrete
- Power Module
Production by Region
- North America
- Europe
- China
- Japan
- South Korea
Consumption by Region
- Asia-Pacific
- China
- Japan
- South Korea
- China Taiwan
- Southeast Asia
- India
- Australia
- Europe
- Germany
- France
- U.K.
- Italy
- Russia
- Rest of Europe
- South America
- Mexico
- Brazil
- Rest of South America
TABLE OF CONTENTS
1 EPOXY MOLDING COMPOUNDS MARKET OVERVIEW
- 1.1 PRODUCT OVERVIEW AND SCOPE OF EPOXY MOLDING COMPOUNDS
- 1.2 EPOXY MOLDING COMPOUNDS SEGMENT BY TYPE
- 1.2.1 GLOBAL EPOXY MOLDING COMPOUNDS MARKET SIZE GROWTH RATE ANALYSIS BY TYPE: 2022 VS 2028
- 1.2.2 SOLID EMC
- 1.2.3 LIQUID EMC
- 1.3 EPOXY MOLDING COMPOUNDS SEGMENT BY APPLICATION
- 1.4 GLOBAL MARKET GROWTH PROSPECTS
- 1.4.1 GLOBAL EPOXY MOLDING COMPOUNDS REVENUE ESTIMATES AND FORECASTS (2017-2028)
- 1.4.2 GLOBAL EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY ESTIMATES AND FORECASTS (2017-2028)
- 1.4.3 GLOBAL EPOXY MOLDING COMPOUNDS PRODUCTION ESTIMATES AND FORECASTS (2017-2028)
2 MARKET COMPETITION BY MANUFACTURERS
- 2.1 GLOBAL EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY MARKET SHARE BY MANUFACTURERS (2017-2022)
- 2.2 GLOBAL EPOXY MOLDING COMPOUNDS REVENUE MARKET SHARE BY MANUFACTURERS (2017-2022)
- 2.3 EPOXY MOLDING COMPOUNDS MARKET SHARE BY COMPANY TYPE (TIER 1, TIER 2, AND TIER 3)
- 2.4 GLOBAL EPOXY MOLDING COMPOUNDS AVERAGE PRICE BY MANUFACTURERS (2017-2022)
- 2.5 MANUFACTURERS EPOXY MOLDING COMPOUNDS PRODUCTION SITES, AREA SERVED, PRODUCT TYPE
- 2.6 EPOXY MOLDING COMPOUNDS MARKET COMPETITIVE SITUATION AND TRENDS
- 2.6.1 EPOXY MOLDING COMPOUNDS MARKET CONCENTRATION RATE
- 2.6.2 GLOBAL 5 AND 10 LARGEST EPOXY MOLDING COMPOUNDS PLAYERS MARKET SHARE BY REVENUE
- 2.6.3 MERGERS & ACQUISITIONS, EXPANSION
3 SEGMENT BY TYPE
- 3.1 GLOBAL EPOXY MOLDING COMPOUNDS PRODUCTION MARKET SHARE BY TYPE (2017-2022)
- 3.2 GLOBAL EPOXY MOLDING COMPOUNDS REVENUE MARKET SHARE BY TYPE (2017-2022)
- 3.3 GLOBAL EPOXY MOLDING COMPOUNDS PRICE BY TYPE (2017-2022)
4 SEGMENT BY APPLICATION
- 4.1 GLOBAL EPOXY MOLDING COMPOUNDS PRODUCTION MARKET SHARE BY APPLICATION (2017-2022)
- 4.2 GLOBAL EPOXY MOLDING COMPOUNDS REVENUE MARKET SHARE BY APPLICATION (2017-2022)
- 4.3 GLOBAL EPOXY MOLDING COMPOUNDS PRICE BY APPLICATION (2017-2022)
5 SEGMENT BY SPECIFICATION
- 5.1 GLOBAL EPOXY MOLDING COMPOUNDS PRODUCTION MARKET SHARE BY SPECIFICATION (2017-2022)
- 5.2 GLOBAL EPOXY MOLDING COMPOUNDS REVENUE MARKET SHARE BY SPECIFICATION (2017-2022)
- 5.3 GLOBAL EPOXY MOLDING COMPOUNDS PRICE BY SPECIFICATION (2017-2022)
6 SEGMENT BY PRODUCT
- 6.1 GLOBAL EPOXY MOLDING COMPOUNDS PRODUCTION MARKET SHARE BY PRODUCT (2017-2022)
- 6.2 GLOBAL EPOXY MOLDING COMPOUNDS REVENUE MARKET SHARE BY PRODUCT (2017-2022)
- 6.3 GLOBAL EPOXY MOLDING COMPOUNDS PRICE BY PRODUCT (2017-2022)
7 KEY COMPANIES PROFILED
- 7.1 SUMITOMO BAKELITE
- 7.1.1 SUMITOMO BAKELITE EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.1.2 SUMITOMO BAKELITE EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.1.3 SUMITOMO BAKELITE EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.1.4 SUMITOMO BAKELITE MAIN BUSINESS AND MARKETS SERVED
- 7.2 SHOWA DENKO
- 7.2.1 SHOWA DENKO EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.2.2 SHOWA DENKO EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.2.3 SHOWA DENKO EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.2.4 SHOWA DENKO MAIN BUSINESS AND MARKETS SERVED
- 7.2.5 COMPANY NEWS
- 7.3 CHANG CHUN GROUP
- 7.3.1 CHANG CHUN GROUP EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.3.2 CHANG CHUN GROUP EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.3.3 CHANG CHUN GROUP EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.3.4 CHANG CHUN GROUP MAIN BUSINESS AND MARKETS SERVED
- 7.4 HYSOL HUAWEI ELECTRONICS
- 7.4.1 HYSOL HUAWEI ELECTRONICS EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.4.2 HYSOL HUAWEI ELECTRONICS EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.4.3 HYSOL HUAWEI ELECTRONICS EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.4.4 HYSOL HUAWEI ELECTRONICS MAIN BUSINESS AND MARKETS SERVED
- 7.5 PANASONIC
- 7.5.1 PANASONIC EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.5.2 PANASONIC EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.5.3 PANASONIC EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.5.4 PANASONIC MAIN BUSINESS AND MARKETS SERVED
- 7.6 KYOCERA
- 7.6.1 KYOCERA EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.6.2 KYOCERA EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.6.3 KYOCERA EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.6.4 KYOCERA MAIN BUSINESS AND MARKETS SERVED
- 7.7 KCC
- 7.7.1 KCC EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.7.2 KCC EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.7.3 KCC EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.7.4 KCC MAIN BUSINESS AND MARKETS SERVED
- 7.8 SAMSUNG SDI
- 7.8.1 SAMSUNG SDI EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.8.2 SAMSUNG SDI EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.8.3 SAMSUNG SDI EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.8.4 SAMSUNG SDI MAIN BUSINESS AND MARKETS SERVED
- 7.8.5 COMPANY NEWS
- 7.9 ETERNAL MATERIALS
- 7.9.1 ETERNAL MATERIALS EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.9.2 ETERNAL MATERIALS EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.9.3 ETERNAL MATERIALS EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.9.4 ETERNAL MATERIALS MAIN BUSINESS AND MARKETS SERVED
- 7.10 JIANGSU ZHONGPENG NEW MATERIAL
- 7.10.1 JIANGSU ZHONGPENG NEW MATERIAL EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.10.2 JIANGSU ZHONGPENG NEW MATERIAL EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.10.3 JIANGSU ZHONGPENG NEW MATERIAL EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.10.4 JIANGSU ZHONGPENG NEW MATERIAL MAIN BUSINESS AND MARKETS SERVED
- 7.11 SHIN-ETSU CHEMICAL
- 7.11.1 SHIN-ETSU CHEMICAL EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.11.2 SHIN-ETSU CHEMICAL EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.11.3 SHIN-ETSU CHEMICAL EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.11.4 SHIN-ETSU CHEMICAL MAIN BUSINESS AND MARKETS SERVED
- 7.12 NAGASE CHEMTEX CORPORATION
- 7.12.1 NAGASE CHEMTEX CORPORATION EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.12.2 NAGASE CHEMTEX CORPORATION EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.12.3 NAGASE CHEMTEX CORPORATION EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.12.4 NAGASE CHEMTEX CORPORATION MAIN BUSINESS AND MARKETS SERVED
- 7.13 TIANJIN KAIHUA INSULATING MATERIAL
- 7.13.1 TIANJIN KAIHUA INSULATING MATERIAL EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.13.2 TIANJIN KAIHUA INSULATING MATERIAL EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.13.3 TIANJIN KAIHUA INSULATING MATERIAL EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.13.4 TIANJIN KAIHUA INSULATING MATERIAL MAIN BUSINESS AND MARKETS SERVED
- 7.14 HHCK
- 7.14.1 HHCK EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.14.2 HHCK EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.14.3 HHCK EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.14.4 HHCK MAIN BUSINESS AND MARKETS SERVED
- 7.15 SCIENCHEM
- 7.15.1 SCIENCHEM EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.15.2 SCIENCHEM EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.15.3 SCIENCHEM EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.15.4 SCIENCHEM MAIN BUSINESS AND MARKETS SERVED
- 7.16 BEIJING SINO-TECH ELECTRONIC MATERIAL
- 7.16.1 BEIJING SINO-TECH ELECTRONIC MATERIAL EPOXY MOLDING COMPOUNDS CORPORATION INFORMATION
- 7.16.2 BEIJING SINO-TECH ELECTRONIC MATERIAL EPOXY MOLDING COMPOUNDS PRODUCT PORTFOLIO
- 7.16.3 BEIJING SINO-TECH ELECTRONIC MATERIAL EPOXY MOLDING COMPOUNDS PRODUCTION CAPACITY, REVENUE, PRICE AND GROSS MARGIN (2017-2022)
- 7.16.4 BEIJING SINO-TECH ELECTRONIC MATERIAL MAIN BUSINESS AND MARKETS SERVED
8 EPOXY MOLDING COMPOUNDS MANUFACTURING COST ANALYSIS
- 8.1 EPOXY MOLDING COMPOUNDS KEY RAW MATERIALS ANALYSIS
- 8.1.1 KEY RAW MATERIALS
- 8.1.2 KEY SUPPLIERS OF RAW MATERIALS
- 8.2 PROPORTION OF MANUFACTURING COST STRUCTURE
- 8.3 MANUFACTURING PROCESS ANALYSIS OF EPOXY MOLDING COMPOUNDS
- 8.4 EPOXY MOLDING COMPOUNDS INDUSTRIAL CHAIN ANALYSIS
9 FORECAST BY TYPE AND BY APPLICATION
- 9.1 GLOBAL PRODUCTION, REVENUE AND PRICE FORECAST BY TYPE (2023-2028)
- 9.1.1 GLOBAL FORECASTED PRODUCTION OF EPOXY MOLDING COMPOUNDS BY TYPE (2023-2028)
- 9.1.2 GLOBAL FORECASTED REVENUE OF EPOXY MOLDING COMPOUNDS BY TYPE (2023-2028)
- 9.1.3 GLOBAL FORECASTED PRICE OF EPOXY MOLDING COMPOUNDS BY TYPE (2023-2028)
- 9.2 GLOBAL PRODUCTION, REVENUE AND PRICE FORECAST BY APPLICATION (2023-2028)
- 9.2.1 GLOBAL FORECASTED PRODUCTION OF EPOXY MOLDING COMPOUNDS BY APPLICATION (2023-2028)
- 9.2.2 GLOBAL FORECASTED REVENUE OF EPOXY MOLDING COMPOUNDS BY APPLICATION (2023-2028)
- 9.2.3 GLOBAL FORECASTED PRICE OF EPOXY MOLDING COMPOUNDS BY APPLICATION (2023-2028)
- 9.3 GLOBAL PRODUCTION, REVENUE AND PRICE FORECAST BY SPECIFICATION (2023-2028)
- 9.3.1 GLOBAL FORECASTED PRODUCTION OF EPOXY MOLDING COMPOUNDS BY SPECIFICATION (2023-2028)
- 9.3.2 GLOBAL FORECASTED REVENUE OF EPOXY MOLDING COMPOUNDS BY SPECIFICATION (2023-2028)
- 9.3.3 GLOBAL FORECASTED PRICE OF EPOXY MOLDING COMPOUNDS BY SPECIFICATION (2023-2028)
- 9.4 GLOBAL PRODUCTION, REVENUE AND PRICE FORECAST BY PRODUCT (2023-2028)
- 9.4.1 GLOBAL FORECASTED PRODUCTION OF EPOXY MOLDING COMPOUNDS BY PRODUCT (2023-2028)
- 9.4.2 GLOBAL FORECASTED REVENUE OF EPOXY MOLDING COMPOUNDS BY PRODUCT (2023-2028)
- 9.4.3 GLOBAL FORECASTED PRICE OF EPOXY MOLDING COMPOUNDS BY PRODUCT (2023-2028)
10 RESEARCH FINDINGS AND CONCLUSION
11 METHODOLOGY AND DATA SOURCE
- 11.1 METHODOLOGY/RESEARCH APPROACH
- 11.1.1 RESEARCH PROGRAMS/DESIGN
- 11.1.2 MARKET SIZE ESTIMATION
- 11.1.3 MARKET BREAKDOWN AND DATA TRIANGULATION
- 11.2 DATA SOURCE
- 11.2.1 SECONDARY SOURCES
- 11.2.2 PRIMARY SOURCES
- 11.3 AUTHOR LIST
- 11.4 DISCLAIMER