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市場調查報告書

HMC (混合、記憶體、立方體)的全球市場:市場規模、趨勢、未來預測

Global Hybrid Memory Cube Market - Segmented By End-User, and Region- Growth, Trends and Forecasts (2018 - 2023)

出版商 Mordor Intelligence LLP 商品編碼 393774
出版日期 內容資訊 英文 103 Pages
商品交期: 最快1-2個工作天內
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HMC (混合、記憶體、立方體)的全球市場:市場規模、趨勢、未來預測 Global Hybrid Memory Cube Market - Segmented By End-User, and Region- Growth, Trends and Forecasts (2018 - 2023)
出版日期: 2018年02月08日 內容資訊: 英文 103 Pages
簡介

本報告提供全球HMC (混合、記憶體、立方體) 市場相關分析,產品、技術概要和市場基本結構,主要的推動及阻礙市場要素,市場規模趨勢預測 (今後6年分),各技術、各記憶體密度、各產業、各地區的詳細趨勢,企業間競爭、資本交易的動向,主要企業簡介,今後的市場方向性等相關調查與考察。

第1章 簡介

第2章 分析方法

第3章 摘要整理 (市場佔有率)

  • 概要
  • 整體市場佔有率 (最新值)
  • 未來預測

第4章 市場概要

  • 概要
  • 市場規模與其預測
  • 產業的價值鏈分析
  • 產業的向心力:波特的五力分析

第5章 市場動態

  • 簡介
  • 推動市場要素
  • 阻礙市場要素
  • 市場機會

第6章 市場區隔

  • 各技術
    • Near Memory
    • Far Memory
  • 各密度
    • 2GB
    • 4GB
  • 各產業
    • 家用電子電器
      • 桌上型電腦
      • 筆記型電腦/行動PC
    • 儲存 (記憶媒體)
    • 雲端運算
    • 網路、通訊
  • 各地區
    • 北美
    • 歐洲
    • 亞太地區
    • 南美
    • 中東、非洲

第7章 各供應商市場佔有率

第8章 競爭分析 - 企業簡介

第9章 全球HMC市場未來展望

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目錄
Product Code: 33668

The global hybrid memory cube (HMC) market is expected to register a CAGR of 54.82% during the forecast period, 2018-2023. Asia-Pacific accounted for the highest growth rate, and is estimated to witness a CAGR of 58.57% over the forecast period. The scope of the report is limited to solutions offered by major players, including to end users, such as enterprise storage, telecommunications, and various others. The regions considered in the scope of the report include North America, Europe, Asia-Pacific, and Rest of the World. The study also emphasizes on how the demand for supercomputers is driving the market, and how the increasing demand for enterprise storage is affecting the market.

HMC is considered as a technological revolution, representing a paradigm shift from the current memory architectures. It is redefining memory by advancing past the conventional DRAM system. Also, a new standard in the memory market space is being set through the adoption of HMC that can catch up with the advancements of CPUs and GPUs. The growing need for high-performance computing catering to specific demands is expected to increase the demand for HMC. Moreover, it provides improvements in performance, breaking through the memory wall, and enabling dramatic performance and bandwidth improvements. Also, the architecture of HMC is more efficient than current memory, utilizing 70% less energy per bit than the current DRAM technologies. However, the market is still flooded with DRAM's, which can affect the adoption rate of HMC.

Establishment of HMC Consortium

The HMC Consortium is a working group founded by Micron Technology and Samsung Electronics Co. Ltd, and is made up of industry leaders who build, design-in, or enable HMC memory technology. The group works to innovate and expand the capabilities of the next generation of memory-based solutions. The main goal of the HMC Consortium is to facilitate HMC integration into a wide variety of systems, platforms, and applications by defining an adoptable industry-wide interface that enables developers, manufacturers, and enablers to leverage this revolutionary technology. Thus, HMC consortium has been a major driving force for the hybrid memory cube market.

Enterprise Storage to Show Highest Growth

The storage industry generated around 50.1 exabytes of capacity (in Q1 2017), which represented a year-on-year increase of 41% from the preceding year (Q1 2016). It is a segment that includes products & services designed to assist large organizations with saving and retrieving digital information and can surely benefit from HMC technology facilitating faster computing processes. Moreover, with the development of HMC, these applications are exploring the technology as a solution to address increasing computing demand, further driving the hybrid memory cube market forward.

Asia-Pacific to Show Highest Growth Rate

China and Japan are largely responsible for the rapid growth of HMC systems in the Asia-Pacific region. Japan, Korea, and China claim to be one of the prominent hubs of semiconductor manufacturing systems. Industries like retail, healthcare, IT, and telecommunication in the region are in dire need of advanced and fast data processing systems, owing to the increasing consumer base and data traffic. Also, by 2020, China wishes to establish a world-class IC design unit in applications, such as telecommunications, IoT, big data, and cloud computing industries, further boosting the HMC market.

Key Developments in the Market

April 2017 - Intel launched its Optane Memory line for solid-state drives. Optane Memory is designed to accelerate storage subsystems on compatible machines to improve transfer speed and reduce latency. It is one of the first products to leverage 3D Xpoint memory technology that was developed by Micron and Intel, offering properties like NAND flash. This partnership between rival companies is expected to pave the way for other companies to partner and take gain leverage from their field of expertise.

Major Players: MICRON TECHNOLOGIES INC., INTEL CORPORATION, XILINX INC., FUJITSU LTD, SEMTECH CORPORATION, OPEN SILICON INC., OMNIPHY, ACHRONIX SEMICONDUCTOR CORPORATION, TEKSTART LLC, amongst others

Reasons to Purchase this Report

To examine the need for high-performance computing systems that are expected to change the market scenario

Analyze various market perspectives with the help of Porter's five forces analysis

To find out the end user and region that are expected to dominate the market

Identify the latest developments, market shares, and strategies employed by major market players

3 months analyst support, along with the Market Estimate sheet (in excel)

Customization of the Report

This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.

Table of Contents

1. Introduction

  • 1.1 Key Deliverables of the Study
  • 1.2 Study Assumptions
  • 1.3 Market Definition
  • 1.4 Key Findings of the Study

2. Research Approach and Methodology

3. Executive Summary

4. Market Dynamics

  • 4.1 Market Overview
  • 4.2 Factors Driving the Market
    • 4.2.1 Establishment of HMC Consortium
    • 4.2.2 Increasing Demand for Enterprise Storage Application
  • 4.3 Factors Restraining the Market
    • 4.3.1 Strong Presence of Existing DRAMs
  • 4.4 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.4.1 Bargaining Power of Suppliers
    • 4.4.2 Bargaining Power of Consumers
    • 4.4.3 Threat of New Entrants
    • 4.4.4 Threat of Substitute Products or Services
    • 4.4.5 Competitive Rivalry among Existing Competitors

5. Global Hybrid Memory Cube Market Segmentation

  • 5.1 By End User
    • 5.1.1 Enterprise Storage
    • 5.1.2 Telecommunication & Networking
    • 5.1.3 Others
  • 5.2 By Region
    • 5.2.1 North America
    • 5.2.2 Europe
    • 5.2.3 Asia-Pacific
    • 5.2.4 Rest of the World

6. Competitive Intelligence - Company Profiles

  • 6.1 Micron Technologies Inc.
  • 6.2 Intel Corporation
  • 6.3 Xilinx Inc.
  • 6.4 Fujitsu Ltd
  • 6.5 Semtech Corporation
  • 6.6 Open Silicon Inc.
  • 6.7 OmniPhy
  • 6.8 Achronix Semiconductor Corporation
  • 6.9 TekStart LLC

7. Investment Analysis

8. Future of the Hybrid Memory Cube Market

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