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1196936

全球接口 IC 市場 - COVID-19 的增長、趨勢、影響和預測 (2023-2028)

Global Interface Ic Market - Growth, Trends, and Forecasts (2023 - 2028)
出版日期: | 出版商: Mordor Intelligence | 英文 100 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球接口 IC 市場預計在 2022 年至 2027 年的預測期內復合年增長率為 15.5%。

COVID-19 的全球爆發嚴重擾亂了 2020 年初所研究市場的供應鍊和生產。 勞動力短缺迫使全球半導體供應鏈中的許多參與者縮減規模或停止運營，從而影響市場增長。

*接口 IC 由於其緊湊和節能的設計，適用於一次性醫療設備、貼片和運動/健身設備。 例如，代工複雜混合信號 ASIC 的無晶圓廠公司 Ensilica 宣布推出 ENS62020，這是一款超低功耗醫療傳感器接口 IC，專為監測可穿戴醫療設備和醫療設備中的生命體徵而設計。我來了。

* 接口集成電路 (IC) 可以識別外部電源並根據其類型選擇兩個電池充電電流級別之一。 不同電子系統之間的信號通信由接口 IC 控制和管理。 通信協議決定了數據的傳輸方式。

*半導體設備製造商正在增加集成到單個 IC 中的晶體管數量，從而導致電路設計複雜性和物理訪問限制增加。 因此，需要使用無錯誤掩模進行有效圖案化，以將無錯誤和無缺陷的圖案轉移到晶圓上。 因此，OEM 需要在設備性能方面具有競爭優勢，這推動了市場增長。

*此外，我們多樣化的接口 IC 可實現可靠、高效且具有成本效益的連接，同時保持信號隔離和保護的最高標準。

*但是，封裝和組裝廠在標準引線框 (FCSOL)、四方扁平封裝無引線 (QFN) 和標準雙馬來□亞胺三秦 (BT) 樹脂基板上提供倒裝芯片安裝選項，以實現成本效益。我們已採取措施提供高質量的解決方案。 儘管晶圓製造的初始成本很高，但 Assembly House 使用成熟的技術和創新工藝為客戶提供更好的解決方案。

接口IC市場趨勢

預計汽車領域的市場份額將顯著增長

*汽車是這個市場的主要終端用戶之一。 汽車及其製造的進步增加了對小型、高能效設備的需求。

*高級駕駛輔助系統 (ADAS) 的日益普及以及全球範圍內越來越多的強制執行 ADAS 的政府法規也擴大了該細分市場的覆蓋面。 車載信息娛樂的日益普及也有望成為一個增長機會。 汽車數字應用日益複雜，需要接口 IC 和技術不斷發展。

*車載信息娛樂系統正變得越來越複雜，隨著顯示器數量的增加，面板選項正在擴展到廣泛使用的 LVDS（低壓差分信號）顯示器之外。 例如，2020 年 6 月，東芝電子元件及存儲裝置公司在其用於汽車車載信息娛樂 (IVI) 系統的顯示接口橋接 IC 中增加了兩款產品。 預計市場供應商的投資將提振需求。

*市場越來越關注產品線創新。 例如，在 2021 年 2 月，運動控制和節能係統傳感和電源解決方案的全球先驅 Allegro MicroSystems, Inc. 宣布推出汽車級接口 IC，用於具有信號調節算法的電阻橋式壓力傳感器，即 A17700。

*由於 5G 網絡的快速部署和 GaN 器件物聯網 (IoT) 應用的增加，例如用於駕駛員輔助和智能交通的 V2X 通信，預計對接口 IC 的需求將會增加。

預計亞太地區將佔據較大的市場份額

*亞太地區半導體製造基地眾多，在全球市場佔有很大份額。 該地區的半導體製造商正在提高產能，以滿足無晶圓廠供應商日益增長的需求。 中國也在努力鞏固基板製造市場，這正在推動市場的增長。

*該地區的供應商更加積極地專注於向非手機芯片領域的多元化發展。 例如，2022 年 4 月，由於智能手機需求不斷增長，台灣 IC 測試接口專家 Chunghwa Precision Test Tech (CHPT) 正在努力擴大其非手機部署。

*對 5G 基礎設施的投資增加、數據中心服務器和物聯網連接數量的增加以及網絡設備的進步是推動該地區 IT 和電信行業增長的關鍵因素。

*隨著 IT 和電信以及汽車行業等行業的需求，供應商正在擴大其在中國的生產能力，以在 2020 年搶占市場份額。 例如，2021年5月，奧地利電子供應商奧特斯宣布將投資4.5億歐元擴建其重慶工廠的產能。

*此外，2021 年 5 月，日本政府決定要求大型半導體公司台積電在日本開發芯片製造技術。 這些因素也有助於接口 IC 的市場增長。

接口IC市場競爭者分析

接口 IC 市場與許多區域和全球參與者競爭適中。 玩家已將協作、夥伴關係和協議等策略作為其主要發展策略。

*2022 年 2 月 - Onsemi 是一家智能電源和傳感器解決方案供應商，它採用了更精細的製造方法，通過提高毛利率來實現長期的財務成功。

*2021 年 8 月 - Analog Devices 宣布完成對 Maxim Integrated Products 的收購。 12個月後銷售額超過90億美元，進一步鞏固了ADI作為高性能模擬半導體製造商的地位。

其他好處

  • Excel 格式的市場預測 (ME) 表
  • 3 個月的分析師支持

內容

第一章介紹

  • 調查假設和市場定義
  • 調查範圍

第二章研究方法論

第 3 章執行摘要

第 4 章市場洞察

  • 市場概覽
  • 波特的五力分析
    • 供應商的議價能力
    • 買家的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭對手之間的競爭強度
  • 評估 COVID-19 的市場影響

第 5 章市場動態

  • 市場驅動力
    • MOSFET 功率晶體管在消費電子產品中的使用增加
    • 智能手機和平板電腦的普及以及對 MOSFET 功率晶體管的需求不斷增長
  • 市場挑戰
    • 製造過程的複雜性

第 6 章市場細分

  • 按產品類型
    • CAN接口IC
    • USB接口IC
    • 置換界面
    • 其他
  • 按行業
    • 消費類電子產品
    • 通訊設備
    • 工業設備
    • 汽車
    • 其他最終用戶
  • 區域信息
    • 北美
    • 歐洲
    • 亞太地區
    • 拉丁美洲
    • 中東

第七章競爭格局

  • 公司簡介
    • Infineon Technologies AG
    • Renesas Electronics Corporation
    • Texas Instruments Incorporated
    • Analog Devices, Inc.
    • Microchip Technology Inc
    • NXP Semiconductors.
    • Broadcom Inc.
    • Mitsubishi Electric Corporation
    • Toshiba Corporation
    • Vishay Intertechnology, Inc.

第8章 投資分析

第9章 市場未來性

簡介目錄
Product Code: 90954

The Global Interface IC Market is expected to register a CAGR of 15.5% over the forecast period from 2022 to 2027. The outbreak of COVID-19 across the globe significantly disrupted the supply chain and production of the studied market during the initial phase of 2020. Due to labor shortages, many of the players in the semiconductor supply chain worldwide had to reduce or even suspend their operations, which affected the market growth.

* The interface ICs are suitable for disposable medical devices and patches and sports and fitness equipment due to their small size and power-saving design. For instance, EnSilica, a fabless supplier of complex mixed-signal ASIC to OEMs, launched The ENS62020, an ultra-low-power healthcare sensor interface IC designed for monitoring vital signs in wearable healthcare and medical devices.

* The interface integrated circuit (IC) can recognize the external power source and select one of two battery charge current levels based on the type. Signal communications between different electronic systems are controlled and managed by interface ICs. Depending on the communication protocol, these ICs determine how data is transmitted.

* Semiconductor device manufacturers are integrating an increasing number of transistors per IC, leading to increased circuit design complexity and physical access limitations. It requires effective patterning that uses error-free masks to transfer the pattern onto wafers without any errors or defects. Therefore, the need for OEMs to have an edge in terms of device performance drives the market growth

* Also, a diverse range of interface ICs enables dependable, efficient, and cost-effective connections while maintaining the highest signal isolation and protection standards.

* However, the packaging and assembly houses have taken steps towards providing cost-effective solutions by offering flip-chip packaging options on a standard lead frame (FCSOL), quad flat pack no leads (QFN), and standard bis-maleimide triazine (BT) resin substrates. Whereas there may still be costs upfront in the wafer fabrication process, assembly houses are using proven technologies and innovative processes to provide customers with better solutions.

Interface IC Market Trends

Automotive Segment Expected to Witness Significant Market Share

* Automotive is one of the significant end users of the market. The advancement in automotive and its manufacturing is also driving the need for compact power-efficient devices.

* The growing adoption of advanced driver-assistance systems (ADAS) and increasing government regulations globally mandating ADAS are also expanding the scope of this segment. Also, the growing adoption of vehicle infotainment is expected to provide growth opportunities. The growing complexity of automotive digital applications requires the constant evolution of Interface IC and technologies.

* Automotive in-vehicle infotainment (IVI) systems are growing more advanced, and panel options are expanding beyond the widely used Low-voltage differential signaling (LVDS) display as the number of displays they contain increases. For instance, in June 2020, Toshiba Electronic Devices & Storage Corporation added two additional interface bridge ICs to its display interface bridge ICs for automobile In-Vehicle Infotainment (IVI) systems investments by market vendors are expected to drive the demand.

* The market is more focused on innovating the product lines. For instance, in February 2021, Allegro MicroSystems, Inc., a global pioneer in motion control and energy-efficient systems sensing and power solutions, announced the A17700, an automotive-grade interface IC for resistive bridge pressure sensors with signal conditioning algorithms.

* The rapid deployment of 5G networks, coupled with the increasing Internet of Things (IoT) applications for GaNdevices, such as assisted driving and vehicle-to-everything (V2X) communication for smart transport, is expected to increase the demand for Interface ICs.

Asia-Pacific Region Expected to Witness Significant Market Share

* Asia-Pacific holds a prominent share in the global market due to a significant number of regional semiconductor manufacturing operations. The pure-play manufacturers operating in the region are increasing their production capacity to cater to the growing demand from fabless vendors. China is also trying to consolidate its substrate manufacturing market, driving market growth.

* The region vendors are actively more focused on diversifying into non-handset chip segments. For instance, in April 2022, Chunghwa Precision Test Tech (CHPT), a Taiwanese IC test interface expert, is working on expanding deployments beyond handsets as demand for smartphones is growing.

* The growing investment in 5G infrastructure, the increasing number of data center servers and IoT connections, and the advancements in networking devices are some of the major factors driving the growth of the IT and telecom segment in the region.

* The vendors are expanding their production capacities in China to gain a share in the market with demand from sectors such as IT & telecom and the automotive industry during 2020. For instance, in May 2021, AT&S, an Austrian Electronics Component supplier, announced that it is investing EUR 450 million in expanding capacity in its Chongqing factory.

* Further, In May 2021, the Japanese government finalized a plan to enlist one of the major semiconductor companies, Taiwan Semiconductor Manufacturing Co., to develop chip-making technologies in Japan. Such factors also contribute to the growth of the market for interface IC.

Interface IC Market Competitor Analysis

The Interface IC Market is moderately competitive, with many regional and global players. The players are adopting strategies like collaboration, partnership, and agreement as their key developmental strategies.

* February 2022 - Onsemi, a provider of intelligent power and sensor solutions, adopted a fab-liter manufacturing approach to achieve long-term financial success by increasing gross margins.

* August 2021 - Analog Devices, Inc. announced completing the acquisition of Maxim Integrated Products, Inc. With a trailing twelve-month revenue of more than USD 9 billion, ADI's position as a high-performance analog semiconductor manufacturer is further strengthened.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumption and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power Of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat Of New Entrants
    • 4.2.4 Threat Of Substitutes
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Assessment of COVID-19 Impact on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Rising Usage of MOSFET Power Transistor in Consumer Electronics Applications
    • 5.1.2 High Adoption of Smartphones and Tablets and Growing Requirement for MOSFET Power Transistor
  • 5.2 Market Challenges
    • 5.2.1 Complexity in the Manufacturing Process

6 MARKET SEGMENTATION

  • 6.1 By Product Type
    • 6.1.1 CAN Interface IC
    • 6.1.2 USB InterfaceIC
    • 6.1.3 Displace Interface
    • 6.1.4 Others
  • 6.2 By End-User Industry
    • 6.2.1 Consumer Electronics
    • 6.2.2 Telecom
    • 6.2.3 Industrial
    • 6.2.4 Automotive
    • 6.2.5 Other End-user Industries
  • 6.3 By Geography
    • 6.3.1 North America
    • 6.3.2 Europe
    • 6.3.3 Asia-Pacific
    • 6.3.4 Latin America
    • 6.3.5 Middle-East

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Infineon Technologies AG
    • 7.1.2 Renesas Electronics Corporation
    • 7.1.3 Texas Instruments Incorporated
    • 7.1.4 Analog Devices, Inc.
    • 7.1.5 Microchip Technology Inc
    • 7.1.6 NXP Semiconductors.
    • 7.1.7 Broadcom Inc.
    • 7.1.8 Mitsubishi Electric Corporation
    • 7.1.9 Toshiba Corporation
    • 7.1.10 Vishay Intertechnology, Inc.

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET