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紙和紙板技術市場 - COVID-19 的增長、趨勢、影響、預測（2022-2027 年）
市場調查報告書
商品編碼
1136157

紙和紙板技術市場 - COVID-19 的增長、趨勢、影響、預測（2022-2027 年）

Paper and Board Technologies Market - Growth, Trends, and Forecasts (2022 - 2027)
出版日期: | 出版商: Mordor Intelligence | 英文 101 Pages | 商品交期: 2-3個工作天內

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簡介目錄

在 2022-2027 年的預測期內，紙張和紙板技術市場的複合年增長率預計為 7.8%。

過去十年，行業變革步伐加快，技術顛覆性日益超過發展。在 COVID-19 大流行期間，紙和紙板產品為我們的客戶發揮了重要作用。例如，隨著消費者轉向在家工作，紙板被廣泛用作電子商務的包裝。

主要亮點

  • 在過去十年中，造紙和紙板行業的參與者將重點放在了紙漿和造紙行業的強制重組上，包括資產關閉和工廠轉換。對一些紙張（如圖形紙）的需求下降，迫使紙張和紙板行業的參與者將資產轉移到包裝和紙巾產能。為應對這一重組階段，許多全球紙漿和造紙公司出售相鄰業務領域或退出某些區域以專注於其核心業務。
  • 由於行業的技術創新浪潮（例如數字和分析技術）以及對可持續性的興趣日益濃厚，預計紙張和紙板行業將進入變革時期。與其他包裝行業產品不同，對紙和紙板包裝產品的需求在結構上不斷增加，因此預計下一階段的顛覆將涉及提高生產力和產量，以及可持續發展驅動的轉型。
  • 數字化和分析可以提供行業的下一次轉型。借助這些先進技術，企業可以將生產力和產量提高 10% 到 15% 或更多，顯著克服許多市場參與者之間的傳統成本曲線差異以及個別工廠和機器的成本曲線差異。這些技術可以進一步擴展，以優化從紡織品（森林和回收）到最終產品的端到端價值鏈，並利用供應鏈中數據的全部價值。
  • COVID-19 大流行加速了行業的數字化，這表明需要在紙和紙板包裝價值鏈中提高彈性和透明度。預計這一發展將擴大人工智能 (AI) 的使用，以監控成本效率和生產力並實時跟蹤流程。
  • 在 COVID-19 大流行爆發之前，一些品牌和加工商已經在試驗用於智能包裝應用的射頻識別 (RFID) 和近場通信 (NFC)。由於減少運輸錯誤、提高安全性以及原材料和成品驗證等優勢，工業 RFID 標籤正變得越來越流行。

主要市場趨勢

紙和紙板製品替代塑料和一次性紙製品的趨勢

  • 消除一次性塑料和減少紙製品消耗的壓力正在推動造紙和塗料技術的發展。紙和紙板包裝材料塗有功能性塗層材料和阻隔塗層材料，防止油、水、水蒸氣、氧氣、香料等進出，提高被包裝產品的阻隔性能。
  • 塑料法規的對象正逐漸從塑料購物袋擴大到一次性塑料包裝製品。限制使用塑料產品已導致許多最終用戶和許多國家尋求具有成本效益和環保的替代品。作為塑料產品的替代品，除了紙和紙板等材料外，還考慮了金屬、玻璃和可生物降解的塑料產品。
  • 隨著禁塑令的實施，自 COVID-19 流行以來，對一次性紙盒、紙袋和食品包裝紙罐等相關紙和紙板產品的需求有所增加。
  • 在這些紙和紙板包裝產品的製造中，正在使用創新技術來減輕包裝重量和體積，降低能源消耗，消除和減少有害添加劑，並建立可持續的商業模式，領先並引領市場。
  • 例如，2022 年 6 月，羅格斯公共衛生學院和環境與職業健康科學研究所的科學家們發現了一種基於植物的可生物降解塗層，可以噴塗到食品上以保護其免受致病、腐敗和運輸損壞。該研究旨在為塑料食品包裝和容器創造一種環保替代品。這種技術已使紙和紙板包裝產品用於包括食品在內的廣泛的最終用戶行業。

亞太地區有望錄得最快增速

  • 由於包裝機械的滲透率不斷提高，預計亞太地區將在預測期內實現最高增長率。該地區主要供應商建立戰略夥伴關係和合作將為市場帶來增長。例如，2021 年 10 月，印度最大的紙漿和紙張製造商之一的 JK Paper Limited 將為 JK Paper 最新的包裝紙板擴建項目提供 POM 方法（紙機方法技術）流程和備料系統。我們選擇 AFT Global
  • 由於 COVID-19 大流行，自動化變得越來越流行。鑑於零售市場部門的投資增加和規模擴大，預計中國將成為紙和紙板包裝自動化的主要市場之一。商品消費率的上升推動了對更多包裝的需求，影響了對包裝機器人的需求。
  • 日本包裝市場也在健康增長。日本對紙板箱的需求受到食品和飲料以及加工食品不斷增長的需求和發展的推動。日本加工食品行業的增長也有望成為紙張和紙板技術市場的主要驅動力之一。
  • 此外，在包裝設備中引入工業物聯網 (IIoT) 在該地區也越來越受歡迎，通過為機器、機器基礎設施和操作員的改進開闢新的機會來提高包裝線的效率。改進並為未來十年包裝設備數字化的未來鋪平道路。

競爭格局

紙和紙板技術市場適度分散，有大量參與者在其中運營。由於新技術和先進機械需要更多的資金和研發投入，更先進的技術通常由多個大型參與者提供，因此某些細分市場會向這些大型市場參與者匯聚。

  • 2022 年 6 月——國際科技集團ANDRITZ已簽署協議，收購總部位於意大利米蘭的 Bonetti 集團。此次收購擴大和加強了ANDRITZ的售後市場業務，並補充了其造紙機服務組合。
  • 2022 年 4 月 - Valmet宣布將向位於中國日照的Asia Symbol（山東）漿紙有限公司提供一條備料和多種自動化的高級紙生產線。這條新的高產能高級紙生產線將設計用於生產高質量的精細無塗層 (WFU) 等級。新生產線 PM14 計劃於 2023 年投產。該項目預計價值約80-1億歐元。

其他福利

  • Excel 格式的市場預測 (ME) 表
  • 3 個月的分析師支持

目錄

第 1 章 簡介

  • 研究假設和市場定義
  • 調查範圍

第二章研究方法論

第三章執行摘要

第四章市場洞察

  • 市場概況
  • 產業吸引力——波特五力分析
    • 供應商的議價能力
    • 消費者議價能力
    • 新進入者的威脅
    • 競爭對手之間的競爭
    • 替代品的威脅
  • 評估 COVID-19 的市場影響

第五章市場動態

  • 市場驅動力
    • 減輕包裝板的重量
    • 行業自動化和數字化的進步
  • 市場挑戰
    • 預算限制和解決方案的高成本

第六章市場細分

  • 按產品類型
    • 紙板
    • 紙板原紙
    • 包裝紙
    • 組織
    • 其他紙及紙板
  • 按用途
    • 生產線和機器部分
    • 自動化
    • 印刷
    • 服務
    • 其他應用
  • 區域信息
    • 北美
    • 歐洲
    • 亞太地區
    • 世界其他地區

第 7 章 競爭格局

  • 公司簡介
    • Valmet Oyj
    • Siemens AG
    • Andritz AG
    • Flint Group
    • Covestro AG
    • Honeywell International Inc.
    • ABB Ltd
    • Stora Enso Oyj
    • International Paper
    • BW Papersystems
    • Syntegon Technology GmbH

第八章投資分析

第九章 市場潛力

簡介目錄
Product Code: 92112

The Paper and Board Technologies Market is expected to register a CAGR of 7.8% during the forecast period 2022 to 2027. In the last decade, the pace of change in the industry has accelerated, with more and more frequent technological disruptions outpacing development. Paper and Board products have played a crucial role for customers during the COVID-19 pandemic. For example, as consumers transitioned to work from home, corrugated board packaging was extensively used for e-commerce packaging.

Key Highlights

  • During the last decade, paper and board industry players focused heavily on a forced restructuring of the pulp and paper industry, with asset closures and mill conversions. A decline in demand is some types of paper, such as graphic paper, prompted paper and board market players to shift their assets into packaging and tissue capacity. To manage this phase of forced restructuring, many global diversified pulp and paper corporations were also engaged in divesting adjacent business sectors and exiting some geographies to focus back on their core businesses.
  • The paper and board industry is expected to witness a transformational change characterized by the wave of industry technology disruption, such as digital and analytics, coupled with an increasing focus on sustainability. Unlike other packaging industry products, demand for paper and board packaging products is structurally increasing; therefore, the next level of disruption is anticipated to involve an increase in productivity and output along with the sustainability-led transformation.
  • Digital and analytics are able to offer the next transformation in the industry. Using these advanced technologies, companies can improve productivity and throughput by more than 10% to 15%, representing considerable gains on traditional cost-curve differences between many market players or individual mills and machines. These technologies can be further extended to optimize the end-to-end value chain, from fiber (forest or recycled) to the final product, in order to harness the complete value of the data along the supply chain.
  • Digitalization in the industry has been accelerated by the COVID-19 pandemic, which exposed a requirement for more resilience and transparency across the paper and board packaging value chain. This development is anticipated to lead to greater use of artificial intelligence (AI) to monitor cost efficiency and productivity and track processes in real-time.
  • Several brands and converters were already experimenting with radio-frequency identification (RFID) and near-field communications (NFC) for intelligent packaging applications before the COVID-19 pandemic struck. Industrial RFID tags have become more popular owing to the advantages it provides, such as reducing shipping errors, improving security, and validating raw materials and finished goods., among others.

Key Market Trends

Increasing Trend of Replacing Plastic and Single-use Paper Products with Paper and Board Products

  • Pressures to eliminate single-use plastic and reduce single-use paper product consumption are spurring developments in papermaking and coating technologies. Functional and barrier coating materials are applied to paper and board packaging to provide a barrier against the egress or ingress of oil and grease, water and water vapor, oxygen, and aroma, for the products packed.
  • The scope of plastic restrictions has gradually expanded from plastic bags to disposable plastic packaging products. The limited use of plastic products has prompted a number of end-users and many countries to look for cost-effective and environmentally friendly alternatives. Materials such as paper and board, along with other materials like metals, glass, and biodegradable plastics products, have been considered as alternatives to plastic products.
  • With the implementation of plastic bans, the demand for disposable paper boxes, paper bags, paper cans, and other related paper and board products for food packaging increased post COVID-19 pandemic period.
  • In manufacturing these paper and board packaging products, innovative technologies are helping to reduce weight and volume of packaging, reduce energy consumption, eliminate and minimize toxic additives, as well as create sustainable business models, therefore driving the market.
  • For instance, in June 2022, a scientist from Rutgers School of Public Health and Environmental and Occupational Health Sciences Institute developed a plant-based biodegradable coating which can be sprayed on foods, guarding them against pathogenic and spoilage microorganisms as well as transportation damage. This research was aimed to produce environmentally friendly alternatives to plastic food wrap and containers. Owing to technologies like these, paper and board packaging products can be used in a wide range of end-user industries including food.

Asia Pacific is Expected to Register the Fastest Growth Rate

  • Due to the increasing penetration of packaging machinery in the region, Asia Pacific is expected to witness the highest growth rate during the forecast period. The formation of strategic partnerships and collaborations by key regional vendors add growth to the market. For instance, in October 2021, JK Paper Limited, one of India's largest pulp and paper producers, selected AFT Global to supply a POM approach (paper machine approach technology) flow and stock preparation system for JK Paper's latest packaging board expansion project.
  • Automation became more prevalent with the spread of the COVID-19 pandemic. China is expected to be one of the critical markets for paper and board packaging automation, considering the increasing investments and the growing size of the retail market sector. The rising consumption rate of goods accelerates the need for more packaging; therefore, influencing the demand for packaging robots.
  • The packaging market in Japan is also experiencing healthy growth. The demand for corrugated packaging in the country has been fueled by the growing demand and development of beverages and packaged food. Japan's growing processed food industry is also expected to act as one of the crucial drivers for the paper and board technologies market.
  • In addition, the introduction of the Industrial Internet of Things (IIoT) into packaging equipment is also gaining popularity in the region, which is expected to improve the efficiency of packaging lines and pave the way for the digital future of packaging equipment over the next decade, by opening new opportunities for improved machinery, machine infrastructure, and operators.

Competitive Landscape

The Paper and Board Technologies Market is moderately fragmented with a significant number of players operating in the market. As new technologies and advanced machineries require more capital and R&D investment, more advanced technologies are usually provided by several large companies, therefore, certain segments of the market are consolidated within these large market players.

  • June 2022 - ANDRITZ, an international technology group signed an agreement to acquire the Bonetti Group, headquartered in Milan, Italy. This acquisition expanded and strengthened ANDRITZ's aftermarket business and supplemented the company's Paper Machine Service portfolio.
  • April 2022 - Valmet announced to supply a fine paper-making line with stock preparation and extensive scope of automation to Asia Symbol (Shandong) Pulp and Paper in Rizhao, China. This new high-capacity fine paper-making line is planned to be designed to produce high-quality wood-free uncoated paper (WFU) grades. The launch of the new production line PM14 is scheduled for 2023. The project is expected to be of value around EUR 80 to 100 million.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Consumers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Intensity of Competitive Rivalry
    • 4.2.5 Threat of Substitutes
  • 4.3 Assessment of Impact of COVID-19 on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Lightweighting of Packaging Board
    • 5.1.2 Increasing Automation and Digitalization of the Industry
  • 5.2 Market Challenges
    • 5.2.1 Budget Constraints and High Cost of Solutions

6 MARKET SEGMENTATION

  • 6.1 By Product Type
    • 6.1.1 Containerboard
    • 6.1.2 Cartonboard
    • 6.1.3 Wrapping Paper
    • 6.1.4 Tissue
    • 6.1.5 Other Paper and Board
  • 6.2 By Application
    • 6.2.1 Production Lines and Machine Sections
    • 6.2.2 Automation
    • 6.2.3 Printing
    • 6.2.4 Services
    • 6.2.5 Other Application
  • 6.3 By Geography
    • 6.3.1 North America
    • 6.3.2 Europe
    • 6.3.3 Asia Pacific
    • 6.3.4 Rest of the World

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Valmet Oyj
    • 7.1.2 Siemens AG
    • 7.1.3 Andritz AG
    • 7.1.4 Flint Group
    • 7.1.5 Covestro AG
    • 7.1.6 Honeywell International Inc.
    • 7.1.7 ABB Ltd
    • 7.1.8 Stora Enso Oyj
    • 7.1.9 International Paper
    • 7.1.10 BW Papersystems
    • 7.1.11 Syntegon Technology GmbH

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET