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1418221

CPU熱感膏市場報告：2030 年趨勢、預測與競爭分析

Thermal Paste for CPUs Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

CPU熱感膏的趨勢和預測

全球CPU熱感膏市場未來性，筆電CPU、桌上型電腦CPU和行動裝置CPU市場都有機會。 2024年至2030年，全球CPU熱感膏市場預計將以7.2%的年複合成長率成長。該市場的主要促進因素是對高效能 CPU 的需求不斷成長、CPU 的小型化以及遊戲機和高階 PC 的日益普及。

CPU熱感膏市場洞察

根據Lucintel的預測，矽基材料由於其高導熱性和長期穩定性，預計將在預測期內實現最高成長。

在這個市場中，筆記型電腦 CPU 仍然是最昂貴的部分。

由於對電子設備的高需求以及領先電子設備製造商的存在，預計亞太地區在預測期內將出現最高成長。

常問問題

Q1. 全球CPU熱感膏市場的成長預測如何？

A1.2024年至2030年，全球CPU熱感膏市場預計將以7.2%的年複合成長率成長。

Q2.影響全球CPU熱感膏市場成長的關鍵促進因素有哪些？

A2. 該市場的主要促進因素是對高效能 CPU 的需求不斷成長、CPU 的小型化以及遊戲和高階 PC 的採用不斷增加。

Q3.市場的主要細分市場有哪些？

A3. 全球CPU熱感膏市場未來性廣闊，筆電CPU、桌上型電腦CPU、行動裝置CPU市場都有機會。

Q4.市場上主要企業有哪些？

A4.生產CPU熱感膏的主要企業如下。

  • 3M
  • Henkel
  • Shinetsu
  • Dow Corning
  • Laird Technology
  • Wacker Chemie
  • Parker Chomerics
  • Sekisui Chemical
  • Noctua
  • Arctic Silver

Q5.未來最大的細分市場是什麼？

A5.Lucintel預測，由於矽基材料具有高導熱性和長期穩定性，預計在預測期內將出現最高成長。

Q6. 未來五年預計哪個地區將成為最大的市場？

A6.由於對電子設備的高需求以及主要電子設備製造商的存在，預計亞太地區在預測期內將出現最高成長。

Q7. 可以客製化報告嗎？

A7. 是的，Lucintel 提供 10% 的客製化服務，無需額外費用。

目錄

第1章執行摘要

第2章全球CPU熱感膏市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球CPU熱感膏市場趨勢（2018-2023）與預測（2024-2030）
  • 按類型分類的全球 CPU熱感膏市場
    • 矽膠底座
    • 銀基
    • 銅底座
    • 鋁底座
    • 碳基
    • 其他
  • 按應用分類的全球 CPU熱感膏市場
    • 筆記型電腦CPU
    • 桌上型電腦CPU
    • 行動裝置CPU
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球CPU熱感膏市場區域分佈
  • 北美CPU熱感膏市場
  • 歐洲CPU熱感膏市場
  • 亞太CPU熱感膏市場
  • 其他地區CPU熱感膏市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 按類型分類的全球 CPU熱感膏市場成長機會
    • 全球 CPU熱感膏市場成長機會（按應用）
    • 全球CPU熱感膏市場成長機會（按地區）
  • 全球CPU熱感膏市場新趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球CPU熱感膏市場產能
    • 全球CPU熱感膏市場的合併、收購與合資
    • 認證和許可

第7章主要企業概況

  • 3M
  • Henkel
  • ShinEtsu
  • Dow Corning
  • Laird Technology
  • Wacker Chemie
  • Parker Chomerics
  • Sekisui Chemical
  • Noctua
  • Arctic Silver
簡介目錄

Thermal Paste for CPUs Trends and Forecast

The future of thermal paste for the global CPUs market looks promising with opportunities in the laptop CPU, desktop CPU, and mobile device CPU markets. Thermal paste for the global CPUs market is expected to grow with a CAGR of 7.2% from 2024 to 2030. The major drivers for this market are increasing demand for high-performance CPUs, miniaturization of CPUs, and growing adoption of gaming and high-end personal computers.

A more than 150-page report is developed to help in your business decisions.

Thermal Paste for CPUs by Segment

The study includes a forecast for thermal paste for CPUs by type, application, and region.

Thermal Paste for CPUs Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Silicon Based
  • Silver Based
  • Copper Based
  • Aluminium Based
  • Carbon Based
  • Others

Thermal Paste for CPUs Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Laptop CPU
  • Desktop CPU
  • Mobile Device CPU
  • Others

Thermal Paste for CPUs Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Thermal Paste Companies for CPUs Market

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies thermal paste companies for CPUs market cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of thermal paste companies for CPUs market are profiled in this report include-

  • 3M
  • Henkel
  • ShinEtsu
  • Dow Corning
  • Laird Technology
  • Wacker Chemie
  • Parker Chomerics
  • Sekisui Chemical
  • Noctua
  • Arctic Silver

Thermal Paste for CPUs Market Insights

Lucintel forecasts that silicon based is expected to witness highest growth over the forecast period due to its high thermal conductivity and long term stability.

Within this market, laptop CPU will remain the highest segment.

APAC is expected to witness highest growth over the forecast period due to high demand of electronic devices and presence of leading electronics manufacturers in this region.

Features of Thermal Paste for the Global CPUs Market

Market Size Estimates: Thermal paste for CPUs market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Thermal paste for CPUs market size by type, application, and region in terms of value ($B).

Regional Analysis: Thermal paste for CPUs market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for thermal paste for CPUs market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of thermal paste for CPUs market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast of thermal paste for the global CPUs market?

Answer: Thermal paste for the global CPUs market is expected to grow with a CAGR of 7.2% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of thermal paste for the global CPUs market?

Answer: The major drivers for this market are increasing demand for high-performance CPUs, miniaturization of CPUs and growing adoption of gaming and high-end personal computers.

Q3. What are the major segments for thermal paste for the global CPUs market?

Answer: The future of thermal paste for the global CPUs market looks promising with opportunities in the laptop CPU, desktop CPU, and mobile device CPU markets.

Q4. Who are the key thermal paste for CPUs market companies?

Answer: Some of the key thermal paste for CPUs companies are as follows.

  • 3M
  • Henkel
  • Shinetsu
  • Dow Corning
  • Laird Technology
  • Wacker Chemie
  • Parker Chomerics
  • Sekisui Chemical
  • Noctua
  • Arctic Silver

Q5. Which thermal paste for the global CPUs market segment will be the largest in future?

Answer: Lucintel forecasts that silicon based is expected to witness highest growth over the forecast period due to its high thermal conductivity and long term stability.

Q6. In thermal paste for the global CPUs market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to high demand of electronic devices and presence of leading electronics manufacturers in this region.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for thermal paste for CPUs market by type (silicon based, silver based, copper based, aluminium based, carbon based, and others), application (laptop CPU, desktop CPU, mobile device CPU, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Thermal Paste for the Global CPUs Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Thermal Paste for the Global CPUs Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Thermal Paste for the Global CPUs Market by Type
    • 3.3.1: Silicon Based
    • 3.3.2: Silver Based
    • 3.3.3: Copper Based
    • 3.3.4: Aluminium Based
    • 3.3.5: Carbon Based
    • 3.3.6: Others
  • 3.4: Thermal Paste for the Global CPUs Market by Application
    • 3.4.1: Laptop CPU
    • 3.4.2: Desktop CPU
    • 3.4.3: Mobile Device CPU
    • 3.4.4: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Thermal Paste for the Global CPUs Market by Region
  • 4.2: Thermal Paste for the North American CPUs Market
    • 4.2.2: Thermal Paste for the North American CPUs Market by Application: Laptop CPU, Desktop CPU, Mobile Device CPU, and Others
  • 4.3: Thermal Paste for the European CPUs Market
    • 4.3.1: Thermal Paste for the European CPUs Market by Type: Silicon Based, Silver Based, Copper Based, Aluminium Based, Carbon Based, and Others
    • 4.3.2: Thermal Paste for the European CPUs Market by Application: Laptop CPU, Desktop CPU, Mobile Device CPU, and Others
  • 4.4: Thermal Paste for the APAC CPUs Market
    • 4.4.1: Thermal Paste for the APAC CPUs Market by Type: Silicon Based, Silver Based, Copper Based, Aluminium Based, Carbon Based, and Others
    • 4.4.2: Thermal Paste for the APAC CPUs Market by Application: Laptop CPU, Desktop CPU, Mobile Device CPU, and Others
  • 4.5: Thermal Paste for the ROW CPUs Market
    • 4.5.1: Thermal Paste for the ROW CPUs Market by Type: Silicon Based, Silver Based, Copper Based, Aluminium Based, Carbon Based, and Others
    • 4.5.2: Thermal Paste for the ROW CPUs Market by Application: Laptop CPU, Desktop CPU, Mobile Device CPU, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for Thermal Paste for the Global CPUs Market by Type
    • 6.1.2: Growth Opportunities for Thermal Paste for the Global CPUs Market by Application
    • 6.1.3: Growth Opportunities for Thermal Paste for the Global CPUs Market by Region
  • 6.2: Emerging Trends in Thermal Paste for the Global CPUs Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of Thermal Paste for the Global CPUs Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in Thermal Paste for the Global CPUs Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: 3M
  • 7.2: Henkel
  • 7.3: ShinEtsu
  • 7.4: Dow Corning
  • 7.5: Laird Technology
  • 7.6: Wacker Chemie
  • 7.7: Parker Chomerics
  • 7.8: Sekisui Chemical
  • 7.9: Noctua
  • 7.10: Arctic Silver