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市場調查報告書
商品編碼
1356855

電子封裝市場報告：至2030年的趨勢、預測與競爭分析

Electronic Packaging Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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簡介目錄

電子封裝趨勢與預測

全球電子封裝市場預計到2030年將達到 34 億美元，2024年至2030年年複合成長率為 12.3%。該市場的主要驅動力是消費性電子產品的需求不斷成長，智慧型手機的普及不斷提高以及物聯網和無線設備在全球範圍內的使用不斷增加。全球電子封裝市場前景廣闊，家用電子電器、航太和國防、汽車和通訊市場蘊藏機會。

電子封裝市場洞察

Lucintel 預測，金屬將在預測期內呈現最高成長。

預計亞太地區在預測期內將出現最高成長。

本報告回答了 11 個關鍵問題：

  • Q.1.細分市場中最有前途和高成長的機會為何？
  • Q.2.哪個細分市場將以更快的速度成長？理由為何？
  • Q.3.哪些地區未來會出現更快的成長？理由為何？
  • Q.4.影響市場動態的主要因素有哪些？市場的主要挑戰和業務風險是什麼？
  • Q.5.這個市場的商業風險和競爭威脅為何？
  • Q.6.這個市場有哪些新趨勢？理由為何？
  • Q.7.市場客戶需求有何改變？
  • Q.8.該市場有哪些新發展以及哪些公司處於領先地位？
  • Q.9.這個市場的主要企業有哪些？主要企業採取哪些策略配合措施來發展業務？
  • Q.10.該市場上的競爭產品有哪些？由於材料或產品替代而導致市場佔有率下降的威脅有多大？
  • Q.11.過去年度發生了哪些併購事件，對產業產生了哪些影響？

目錄

第1章 執行摘要

第2章 全球電子封裝市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球電子封裝市場趨勢（2018-2023）與預測（2024-2030）
  • 按材料分類：全球電子封裝市場
    • 塑膠
    • 金屬
    • 玻璃
    • 其他
  • 依封裝技術：全球電子封裝市場
    • 通孔安裝
    • 表面表面黏著技術[SMD]
    • 晶片級封裝 [CSP]
  • 依最終用途產業：全球電子封裝市場
    • 家用電器
    • 航太和國防
    • 汽車
    • 通訊
    • 其他

第4章 2018-2030年市場趨勢及預測分析，依地區

  • 全球電子封裝市場，依地區
  • 北美電子封裝市場
  • 歐洲電子封裝市場
  • 亞太地區電子封裝市場
  • 其他區域電子封裝市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
  • 全球電子封裝市場的新興趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球電子封裝市場產能
    • 全球電子封裝市場的合併、收購與合資企業
    • 認證和許可

第7章 主要企業概況

  • Ametek
  • Dordan Manufacturing Company
  • DuPont de Nemours
  • GY Packaging
  • Plastiform
  • Kiva Container Corporation
  • Quality Foam Packaging
  • Sealed Air Corporation
  • The Box
  • UFP Technologies
簡介目錄

Electronic Packaging Trends and Forecast

The future of the global electronic packaging market looks promising with opportunities in the consumer electronic, aerospace & defense, automotive, and telecommunication markets. The global electronic packaging market is expected to reach an estimated $3.4 billion by 2030 with a CAGR of 12.3% from 2024 to 2030. The major drivers for this market are the demand for consumer electronics is on the rise, growing adoption of smartphones, and there is an increasing utilization of IoT and wireless devices across the globe.

A more than 150-page report is developed to help in your business decisions.

Electronic Packaging by Segment

The study includes a forecast for the global electronic packaging by material, packaging technology, end use industry, and region.

Electronic Packaging Market by Material [Shipment Analysis by Value from 2018 to 2030]:

  • Plastic
  • Metal
  • Glass
  • Others

Electronic Packaging Market by Packaging Technology [Shipment Analysis by Value from 2018 to 2030]:

  • Through-Hole Mounting
  • Surface Surface-Mount Technology [SMD]
  • Chip-Scale Packages [CSP]

Electronic Packaging Market by End Use Industry [Shipment Analysis by Value from 2018 to 2030]:

  • Consumer Electronics
  • Aerospace & Defense
  • Automotive
  • Telecommunication
  • Others

Electronic Packaging Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Electronic Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies electronic packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the electronic packaging companies profiled in this report include-

  • Ametek
  • Dordan Manufacturing Company
  • Dupont de Nemours
  • GY Packaging
  • Plastiform
  • Kiva Container Corporation
  • Quality Foam Packaging
  • Sealed Air Corporation
  • The Box
  • UFP Technologies

Electronic Packaging Market Insights

Lucintel forecasts that metal is expected to witness highest growth over the forecast period.

APAC is expected to witness highest growth over the forecast period.

Features of the Global Electronic Packaging Market

Market Size Estimates: Electronic packaging market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Electronic packaging market size by material, packaging technology, end use industry, and region. in terms of value ($B).

Regional Analysis: Electronic packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different materials, packaging technologies, end use industries, and region.s for the electronic packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the electronic packaging market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1. What is the electronic packaging market size?

Answer: The global electronic packaging market is expected to reach an estimated $3.4 billion by 2030.

Q.2. What is the growth forecast for electronic packaging market?

Answer: The global electronic packaging market is expected to grow with a CAGR of 12.3% from 2024 to 2030.

Q.3. What are the major drivers influencing the growth of the electronic packaging market?

Answer: The major drivers for this market are the demand for consumer electronics is on the rise, growing adoption of smartphones, and there is an increasing utilization of IoT and wireless devices across the globe.

Q.4. What are the major segments for electronic packaging market?

Answer: The future of the electronic packaging market looks promising with opportunities in the consumer electronic, aerospace & defense, automotive, and telecommunication markets.

Q.5. Who are the key electronic packaging market companies?

Answer: Some of the key electronic packaging companies are as follows:

  • Ametek
  • Dordan Manufacturing Company
  • DuPont de Nemours
  • GY Packaging
  • Plastiform
  • Kiva Container Corporation
  • Quality Foam Packaging
  • Sealed Air Corporation
  • The Box
  • UFP Technologies

Q.6. Which electronic packaging market segment will be the largest in future?

Answer: Lucintel forecasts that xx is expected to witness highest growth over the forecast period.

Q.7. In electronic packaging market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period.

Q.8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the electronic packaging market by material (plastic, metal, glass, and others), packaging technology (through-hole mounting, surface surface-mount technology [SMD] and chip-scale packages [CSP]), end use industry (consumer electronics, aerospace & defense, automotive, telecommunication, and others), and region. (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Electronic Packaging Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Electronic Packaging Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Electronic Packaging Market by Material
    • 3.3.1: Plastic
    • 3.3.2: Metal
    • 3.3.3: Glass
    • 3.3.4: Others
  • 3.4: Global Electronic Packaging Market by Packaging Technology
    • 3.4.1: Through-Hole Mounting
    • 3.4.2: Surface Surface-Mount Technology [SMD]
    • 3.4.3: Chip-Scale Packages [CSP]
  • 3.5: Global Electronic Packaging Market by End Use Industry
    • 3.5.1: Consumer Electronics
    • 3.5.2: Aerospace & Defense
    • 3.5.3: Automotive
    • 3.5.4: Telecommunication
    • 3.5.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Electronic Packaging Market by Region
  • 4.2: North American Electronic Packaging Market
    • 4.2.2: North American Electronic Packaging Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, and Others
  • 4.3: European Electronic Packaging Market
    • 4.3.1: European Electronic Packaging Market by Material: Plastic, Metal, Glass, and Others
    • 4.3.2: European Electronic Packaging Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, and Others
  • 4.4: APAC Electronic Packaging Market
    • 4.4.1: APAC Electronic Packaging Market by Material: Plastic, Metal, Glass, and Others
    • 4.4.2: APAC Electronic Packaging Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, and Others
  • 4.5: ROW Electronic Packaging Market
    • 4.5.1: ROW Electronic Packaging Market by Material: Plastic, Metal, Glass, and Others
    • 4.5.2: ROW Electronic Packaging Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Electronic Packaging Market by Material
    • 6.1.2: Growth Opportunities for the Global Electronic Packaging Market by Packaging Technology
    • 6.1.3: Growth Opportunities for the Global Electronic Packaging Market by End Use Industry
    • 6.1.4: Growth Opportunities for the Global Electronic Packaging Market by Region
  • 6.2: Emerging Trends in the Global Electronic Packaging Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Electronic Packaging Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Electronic Packaging Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Ametek
  • 7.2: Dordan Manufacturing Company
  • 7.3: DuPont de Nemours
  • 7.4: GY Packaging
  • 7.5: Plastiform
  • 7.6: Kiva Container Corporation
  • 7.7: Quality Foam Packaging
  • 7.8: Sealed Air Corporation
  • 7.9: The Box
  • 7.10: UFP Technologies