IO-Link市場:趨勢、機會、競爭分析 [2023-2028]
市場調查報告書
商品編碼
1342026

IO-Link市場:趨勢、機會、競爭分析 [2023-2028]

IO-Link Market: Trends, Opportunities and Competitive Analysis [2023-2028]

出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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簡介目錄

IO-Link市場趨勢與預測

預計到2028年,全球IO-Link市場將達到 324 億美元,2023年至2028年年複合成長率為20.40%。該市場的主要促進因素是對工業 4.0 的需求不斷成長、政府對採用工業自動化的配合措施不斷增加,以及消費者對製造業中可靠、緊湊的解決方案的意願不斷增加。全球IO-Link市場的未來可能包括工具機、搬運和組裝自動化、內部物流和包裝市場的商機。

IO-Link 市場洞察

  • Lucintel 預測IO-Link主站將成為一個不斷成長的細分市場。
  • 工具機可能會繼續屬於這一領域,因為 IO 鏈路提供與多種類型的感測器和致動器的兼容性和彈性。
  • 由於對高度先進的互聯和自動駕駛汽車的需求不斷成長,以及該地區汽車、航太和工業製造業的存在,預計歐洲在預測期內仍將是最大的地區。

本報告回答了 11 個關鍵問題:

  • Q.1.細分市場中最有前途和高成長的機會是什麼?
  • Q.2.哪個細分市場將以更快的速度成長?為什麼?
  • Q.3.哪些地區未來會出現更快的成長?為什麼?
  • Q.4.影響市場動態的主要要素有哪些?市場的主要挑戰和商業風險是什麼?
  • Q.5.這個市場的商業風險和競爭威脅是什麼?
  • Q.6.這個市場有哪些新趨勢?為什麼?
  • Q.7.市場客戶需求有何改變?
  • Q.8.該市場有哪些新發展以及哪些公司處於領先地位?
  • Q.9.這個市場的主要企業有哪些?此外,主要企業採取什麼樣的策略配合措施?
  • Q10.該市場的競爭產品有哪些?因材料或產品替代而導致市場佔有率下降的威脅有多大?
  • Q11.過去年度發生了哪些併購事件,對產業產生了哪些影響?

目錄

第1章 執行摘要

第2章 全球IO-Link市場:市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2017-2028年市場趨勢及預測分析

  • 宏觀經濟趨勢(2017-2022)與預測(2023-2028)
  • 全球IO-Link市場趨勢(2017-2022)與預測(2023-2028)
  • 依類型分類的全球IO-Link市場
    • IO連結有線
    • IO連接無線
  • 全球IO-Link市場(依應用)
    • 工具機
    • 自動化搬運和組裝
    • 物流
    • 包裝
  • 依組件分類的全球IO-Link市場
    • IO連結主站
    • IO連結設備
    • 感測器節點
    • 模組
    • 執行器
    • RFID讀取頭
    • 其他

第4章 2017-2028年分地區市場趨勢及預測分析

  • 全球IO-Link 市場(依地區)
  • 北美IO-Link市場
  • 歐洲IO-Link市場
  • 亞太IO-Link市場
  • 其他地區IO-Link市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 依類型分類的全球IO-Link市場成長機會
    • 全球IO-Link市場成長機會(依應用)
    • 依組件分類的全球IO-Link市場成長機會
    • 依地區分類的全球IO-Link市場成長機會
  • 全球IO-Link市場新趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球IO-Link市場的能力
    • 全球IO-Link市場的合併、收購與合資企業
    • 認證和許可

第7章 主要企業概況

  • Balluff
  • ifm electronic
  • Banner
  • SICK
  • Siemens
  • Emerson
  • Rockwell Automation
  • Pepperl+Fuchs
  • Hans Turck
  • Omron Corporation
簡介目錄

IO-Link Market Trends and Forecast

The future of the global IO-link market looks promising with opportunities in the machine tool, handling & assembly automation, intralogistic, and packaging markets. The global IO-link market is expected to reach an estimated $32.4 billion by 2028 with a CAGR of 20.40% from 2023 to 2028. The major drivers for this market are growing demand for growing demand for industry 4.0, rising government initiatives towards the adoption of industrial automation and increasing consumer inclination towards reliable and compact solutions in the manufacturing industry.

A more than 150-page report is developed to help in your business decisions.

IO-Link Market by Segment

The study includes trends and forecast for the global IO-link market by type, application, component and region, as follows:

IO-Link Market by Type [Shipment Analysis by Value from 2017 to 2028]:

  • IO-link Wired
  • IO-link Wireless

IO-Link Market by Application [Shipment Analysis by Value from 2017 to 2028]:

  • Machine Tool
  • Handling & Assembly Automation
  • Intralogistics
  • Packaging

IO-Link Market by Component [Shipment Analysis by Value from 2017 to 2028]:

  • IO-link Master
  • IO-link Devices
  • Sensor Nodes
  • Modules
  • Actuators
  • RFID Read Heads
  • Others

IO-Link Market by Region [Shipment Analysis by Value from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of IO-Link Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, IO-link companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the IO-link companies profiled in this report include:

  • Balluff
  • ifm electronic
  • Banner
  • SICK
  • Siemens
  • Emerson
  • Rockwell Automation
  • Pepperl+Fuchs
  • Hans Turck
  • Omron Corporation

IO-Link Market Insights

  • Lucintel forecasts that IO-link masters will witness the highest growing segment over the forecast period due to its increasing usage as gateway in field applications for connecting eight IO link devices, which include input modules, valves, sensors, and binary output.
  • Machine tools will remain the segment because IO-link delivers compatibility as well as flexibility with many types of sensors and actuators, which is mostly used in the industrial automotive systems.
  • Europe will remain the largest region over the forecast period due to the increasing demand for highly advanced connected cars and autonomous vehicles and existence of automotive, aerospace, and industrial manufacturing verticals in the region.

Features of the IO-Link Market

  • Market Size Estimates: IO-link market size estimation in terms of value ($B)
  • Trend and Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: IO-link market size by various segments, such as by type, application, component, and region
  • Regional Analysis: IO-link market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different types, applications, components, and regions for the IO-link market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the IO-link market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

  • Q1. What is the IO-link market size?
  • Answer: The global IO-link market is expected to reach an estimated $32.4 billion by 2028.
  • Q2. What is the growth forecast for IO-link market?
  • Answer: The global IO-link market is expected to grow with a CAGR of 20.40% from 2023 to 2028.
  • Q3. What are the major drivers influencing the growth of the IO-link market?
  • Answer: The major drivers for this market are growing demand for growing demand for industry 4.0, rising government initiatives towards the adoption of industrial automation, and increasing consumer inclination towards reliable and compact solutions in the manufacturing industry.
  • Q4. What are the major segments for IO-link market?
  • Answer: The future of the global IO-link market looks promising with opportunities in the machine tool, handling & assembly automation, intralogistic, and packaging markets.
  • Q5. Who are the key IO-link companies?
  • Answer: Some of the key IO-link companies are as follows:
    • Balluff
    • ifm electronic
    • Banner
    • SICK
    • Siemens
    • Emerson
    • Rockwell Automation
    • Pepperl+Fuchs
    • Hans Turck
    • Omron Corporation
  • Q6. Which IO-link segment will be the largest in future?
  • Answer:Lucintel forecast that IO-link masters will witness the highest growing segment over the forecast period due to its increasing usage as gateway in field applications for connecting eight IO link devices, which includes input modules, valves, sensors, and binary output.
  • Q7. In IO-link market, which region is expected to be the largest in next 5 years?
  • Answer: Europe will remain the largest region over the forecast period due to the increasing demand for highly advanced connected cars and autonomous vehicles and existence of automotive, aerospace, and industrial manufacturing verticals in the region.
  • Q8. Do we receive customization in this report?
  • Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the global IO-link market by type (IO-link wired, and IO-link wireless), application (machine tool, handling & assembly automation, intralogistic, and packaging), component (IO-link master, IO-link devices, sensor nodes, modules, actuators, RFID read heads, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global IO-Link Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: Global IO-Link Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: Global IO-Link Market by Type
    • 3.3.1: IO-link Wired
    • 3.3.2: IO-link Wireless
  • 3.4: Global IO-Link Market by Application
    • 3.4.1: Machine Tool
    • 3.4.2: Handling & Assembly Automation
    • 3.4.3: Intralogistics
    • 3.4.4: Packaging
  • 3.5: Global IO-Link Market by Component
    • 3.5.1: IO-link Master
    • 3.5.2: IO-link Devices
    • 3.5.3: Sensor Nodes
    • 3.5.4: Modules
    • 3.5.5: Actuators
    • 3.5.6: RFID Read Heads
    • 3.5.7: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

  • 4.1: Global IO-Link Market by Region
  • 4.2: North American IO-Link Market
    • 4.2.1: North American IO-Link Market by Type: IO-link Wired, and IO-link Wireless
    • 4.2.2: North American IO-Link Market by Application: Machine Tool, Handling & Assembly Automation, Intralogistics, and Packaging
  • 4.3: European IO-Link Market
    • 4.3.1: European IO-Link Market by Type: IO-link Wired, and IO-link Wireless
    • 4.3.2: European IO-Link Market by Application: Machine Tool, Handling & Assembly Automation, Intralogistics, and Packaging
  • 4.4: APAC IO-Link Market
    • 4.4.1: APAC IO-Link Market by Type: IO-link Wired, and IO-link Wireless
    • 4.4.2: APAC IO-Link Market by Application: Machine Tool, Handling & Assembly Automation, Intralogistics, and Packaging
  • 4.5: ROW IO-Link Market
    • 4.5.1: ROW IO-Link Market by Type: IO-link Wired, and IO-link Wireless
    • 4.5.2: ROW IO-Link Market by Application: Machine Tool, Handling & Assembly Automation, Intralogistics, and Packaging

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global IO-Link Market by Type
    • 6.1.2: Growth Opportunities for the Global IO-Link Market by Application
    • 6.1.3: Growth Opportunities for the Global IO-Link Market by Component
    • 6.1.4: Growth Opportunities for the Global IO-Link Market by Region
  • 6.2: Emerging Trends in the Global IO-Link Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global IO-Link Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global IO-Link Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Balluff
  • 7.2: ifm electronic
  • 7.3: Banner
  • 7.4: SICK
  • 7.5: Siemens
  • 7.6: Emerson
  • 7.7: Rockwell Automation
  • 7.8: Pepperl+Fuchs
  • 7.9: Hans Turck
  • 7.10: Omron Corporation