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1457077

半導體乾蝕蝕系統市場 - 2024 年至 2029 年預測

Semiconductor Dry Etch Systems Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 138 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

半導體乾式蝕刻系統市場預計將以 4.93% 的複合年成長率成長，從 2022 年的 157.18 億美元增至 2029 年的 220.19 億美元。

半導體乾蝕刻系統是用來生產半導體、微處理器和其他微電子元件的工具。此製程可選擇性地從晶圓上去除或蝕刻特定的材料層，留下裝置功能所需的圖案和結構。乾式蝕刻系統利用多種技術從晶圓表面去除材料，包括電漿蝕刻、反應離子蝕刻和深度反應離子蝕刻。乾式蝕刻製程是半導體製造的重要步驟，因為它可以在晶圓表面上精確圖形化和形成複雜的型態。這些特徵包括通道和溝槽，它們是現代半導體裝置的關鍵組件。形成精確、均勻圖案的能力對於提高裝置性能、減少尺寸和增加功能是必要的。

半導體乾蝕刻系統市場是由對先進半導體元件的需求不斷成長以及對高解析度圖案化能力的需求所推動的。對更快的處理速度、更小的外形尺寸和更高的功能的需求增加了對更精確的圖形化和蝕刻能力的需求。因此，乾式蝕刻已成為半導體製造製程的關鍵步驟。

市場驅動力

  • 對先進半導體和電子設備的需求不斷成長正在推動市場成長。

由於各行業擴大採用數位技術，對微處理器、儲存晶片和感測器等先進半導體和電子設備以及行動裝置、平板電腦和電腦等設備的需求正在迅速擴大。對更快的處理速度、更小的外形尺寸和增加的功能的需求正在推動對更精確的圖形化和蝕刻能力的需求。根據美國人口普查局的數據，2020 年美國電子產品和電子產品量販店的零售額估計為 854 億美元。

  • 半導體製造的技術進步正在提供新的成長前景。

此外，半導體製造流程的技術進步，包括新材料、製程和設備的開發，正在推動對更先進的乾蝕刻系統的需求。例如，碳化矽、氮化鎵等高高功率、高頻元件新材料的開發，需要更精確、均勻的蝕刻能力。此外，半導體裝置對3D(3D) 結構的需求不斷成長，推動了對深度反應離子蝕刻 (DRIE) 系統的需求。

  • 按類型分類，電介質蝕刻領域預計將呈現顯著成長。

介電蝕刻是半導體工業中使用的一種工藝，透過乾蝕刻製程選擇性地從基板上去除電介質（絕緣體）。在半導體乾蝕刻系統中，電介質蝕刻是使用等離子體電漿蝕刻來完成的，等離子體蝕刻使用高能量等離子體來去除電介質材料。電介質蝕刻用於製造各種半導體裝置，包括電晶體、積體電路和儲存晶片。它是半導體工業中的重要工藝，因為它可以在基板表面形成複雜而精確的圖案，這是開發高性能半導體裝置所必需的。

北美在半導體乾蝕蝕系統的全球市場中佔有很大佔有率。

從地區來看，半導體乾蝕蝕系統市場分為北美、南美洲、歐洲、中東和非洲以及亞太地區。由於對消費性電子產品、資料儲存設備和先進技術的需求不斷成長，預計北美地區將在半導體乾蝕刻系統市場中佔據主要佔有率。應用材料公司和泛林研究公司等主要市場參與企業在該地區的存在也有助於市場成長。

主要進展

  • 2020 年 8 月：應用材料公司在其產品線中引入了先進的半導體蝕刻系統 Centris Sym3 Y。 Sym3 Y 系統使用 RF 脈衝技術形成用於 3D NAND、DRAM 和邏輯的高長寬比結構，包括 FinFET 和新型環柵架構。 Sym3 Y 的高電導室架構提供卓越的蝕刻輪廓控制，新的塗層材料可減少缺陷並提高產量比率。
  • 2020 年 6 月：RENA Technologies 宣布推出 Inception，這是一個適用於所有半導體濕式製程的新單晶圓平台，包括清洗、蝕刻、剝離和乾燥。 Inception 平台旨在成為所有濕式清洗、蝕刻和剝離應用的理想平台。功能包括前端生產線 (FEoL) 和後端生產線 (BEoL) 處理應用、自動晶圓處理、雙可移動噴射臂和獨立的化學生產線。

目錄

第1章 簡介

  • 市場概況
  • 市場定義
  • 調查範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要利益

第2章調查方法

  • 研究設計
  • 調查過程

第3章執行摘要

  • 主要發現
  • 分析師觀點

第4章市場動態

  • 市場促進因素
  • 市場限制因素
  • 波特五力分析
  • 產業價值鏈分析
  • 分析師觀點

第5章半導體乾蝕刻系統市場：依類型

  • 介紹
  • 介電蝕刻
  • 導體蝕刻

第6章半導體乾蝕蝕系統市場：依應用分類

  • 介紹
  • 邏輯和晶圓代工廠
  • 微機電系統
  • 感應器
  • 功率元件
  • 其他

第7章半導體乾蝕刻系統市場：依地區

  • 介紹
  • 北美洲
  • 南美洲
  • 歐洲
  • 中東/非洲
  • 亞太地區

第8章競爭環境及分析

  • 主要企業及策略分析
  • 市場佔有率分析
  • 合併、收購、協議和合作
  • 競爭對手儀表板

第9章 公司簡介

  • Toppan Inc.
  • Applied Materials Inc.
  • Hitachi High Technologies America, Inc.
  • Lam Research Corporation
  • Tokyo Electron Limited
  • Plasma-Therm LLC
  • CVD Equipment Corporation
  • SPTS Technologies Ltd.
  • Panasonic Industry Co., Ltd.
  • DISCO Corporation
簡介目錄
Product Code: KSI061615184

The semiconductor dry etch systems market is projected to grow at a CAGR of 4.93% to reach US$22.019 billion in 2029 from US$15.718 billion in 2022.

Semiconductor dry etch systems are tools used in the manufacturing of semiconductors, microprocessors, and other microelectronic devices. The process involves selectively removing or etching certain layers of materials from a wafer, leaving behind patterns and structures necessary for the device's functionality. Dry etching systems utilize a range of techniques, such as plasma etching, reactive ion etching, and deep reactive ion etching, to remove the material from the wafer surface. The dry etching process is an essential step in semiconductor fabrication, as it allows for the precise patterning and formation of intricate features on the surface of the wafer. These features can include channels and trenches, which are critical components of modern semiconductor devices. The ability to produce precise and uniform patterns is necessary to improve the device's performance, reduce its size, and increase its functionality.

The semiconductor dry etch systems market is driven by the increasing demand for advanced semiconductor devices and the need for high-resolution patterning capabilities. With the demand for higher processing speeds, smaller form factors, and increased functionality, the need for more precise patterning and etching capabilities is growing. As a result, dry etching has become a critical step in the semiconductor manufacturing process.

Market Drivers

  • The increasing demand for advanced semiconductor and electronic devices is driving the market growth.

The demand for advanced semiconductor and electronic devices, such as microprocessors, memory chips, and sensors as well as devices like mobile devices, tablets, and computers, is growing rapidly due to the increasing adoption of digital technologies in various industries. The need for higher processing speeds, smaller form factors, and increased functionality is driving the demand for more precise patterning and etching capabilities. According to the US Census Bureau, the estimated retail sales of electronic and appliance stores in the United States for 2020 was US$85.4 billion.

  • Technological advancement in semiconductor fabrication has provided new growth prospects.

Further, the technological advancements in the semiconductor fabrication process, such as the development of new materials, processes, and devices, are driving the demand for more advanced dry etch systems. For instance, the development of new materials, such as silicon carbide and gallium nitride, for high-power and high-frequency devices, requires more precise and uniform etching capabilities. Additionally, the increasing demand for three-dimensional (3D) structures in semiconductor devices is driving the need for deep reactive ion etching (DRIE) systems.

  • Based on type, the dielectric etching segment is expected to show significant growth

Dielectric etching is a process used in the semiconductor industry to selectively remove dielectric materials (insulators) from a substrate using a dry etch process. In semiconductor dry etch systems, dielectric etching is achieved using plasma etching, which involves using high-energy plasma to remove the dielectric material. Dielectric etching is used in the fabrication of various semiconductor devices such as transistors, integrated circuits, and memory chips. It is an important process in the semiconductor industry as it allows for the creation of complex and precise patterns on the surface of a substrate, which is necessary for the development of high-performance semiconductor devices.

North America accounted for a significant share of the global semiconductor dry etch systems market.

Based on geography, the semiconductor dry etch systems market is segmented into North America, South America, Europe, the Middle East and Africa, and Asia Pacific. The North American region is expected to have a significant market share in the semiconductor dry etch systems market due to the increasing demand for consumer electronics, data storage devices, and advanced technologies in the region. The presence of major market players such as Applied Materials and Lam Research in the region is also contributing to the growth of the market.

Key developments.

  • In August 2020: Applied Materials introduced the Centris Sym3 Y, an advanced semiconductor etching system, to its range of products. The Sym3 Y system uses RF pulsing technology to create high-aspect-ratio structures in 3D NAND, DRAM, and logic, including FinFETs and emerging gate-all-around architectures. The high-conductance chamber architecture of Sym3 Y delivers excellent etch profile control, while a novel coating material reduces defects and boosts yields.
  • In June 2020: RENA Technologies introduced a new single-wafer platform named Inception for all wet processes of semiconductors including cleaning, etching, stripping, and drying. The Inception platform is built to provide a suitable platform for any wet cleaning, etching, or stripping application. It includes front-end-of-line (FEoL) and back-end-of-line (BEoL) processing applications, automated wafer handling, dual movable spray arms, and separate chemical lines.

Segmentation:

By Type

  • Dielectric Etching
  • Conductor Etching

By Application

  • Logic & Foundry
  • MEMS
  • Sensors
  • Power Devices
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Others
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Indonesia
  • Taiwan
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key Benefits for the stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Processes

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. SEMICONDUCTOR DRY ETCH SYSTEMS MARKET BY TYPE

  • 5.1. Introduction
  • 5.2. Dielectric Etching
    • 5.2.1. Market Trends and Opportunities
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness Insights
  • 5.3. Conductor Etching
    • 5.3.1. Market Trends and Opportunities
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness Insights

6. SEMICONDUCTOR DRY ETCH SYSTEMS MARKET BY APPLICATION

  • 6.1. Introduction
  • 6.2. Logic & Foundry
    • 6.2.1. Market Trends and Opportunities
    • 6.2.2. Growth Prospects
    • 6.2.3. Geographic Lucrativeness Insights
  • 6.3. MEMS
    • 6.3.1. Market Trends and Opportunities
    • 6.3.2. Growth Prospects
    • 6.3.3. Geographic Lucrativeness Insights
  • 6.4. Sensors
    • 6.4.1. Market Trends and Opportunities
    • 6.4.2. Growth Prospects
    • 6.4.3. Geographic Lucrativeness Insights
  • 6.5. Power Devices
    • 6.5.1. Market Trends and Opportunities
    • 6.5.2. Growth Prospects
    • 6.5.3. Geographic Lucrativeness Insights
  • 6.6. Others
    • 6.6.1. Market Trends and Opportunities
    • 6.6.2. Growth Prospects
    • 6.6.3. Geographic Lucrativeness Insights

7. SEMICONDUCTOR DRY ETCH SYSTEMS MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. North America
    • 7.2.1. By Type
    • 7.2.2. By Application
    • 7.2.3. By Country
      • 7.2.3.1. USA
        • 7.2.3.1.1. Market Trends and Opportunities
        • 7.2.3.1.2. Growth Prospects
      • 7.2.3.2. Canada
        • 7.2.3.2.1. Market Trends and Opportunities
        • 7.2.3.2.2. Growth Prospects
      • 7.2.3.3. Mexico
        • 7.2.3.3.1. Market Trends and Opportunities
        • 7.2.3.3.2. Growth Prospects
  • 7.3. South America
    • 7.3.1. By Type
    • 7.3.2. By Application
    • 7.3.3. By Country
      • 7.3.3.1. Brazil
        • 7.3.3.1.1. Market Trends and Opportunities
        • 7.3.3.1.2. Growth Prospects
      • 7.3.3.2. Argentina
        • 7.3.3.2.1. Market Trends and Opportunities
        • 7.3.3.2.2. Growth Prospects
      • 7.3.3.3. Others
        • 7.3.3.3.1. Market Trends and Opportunities
        • 7.3.3.3.2. Growth Prospects
  • 7.4. Europe
    • 7.4.1. By Type
    • 7.4.2. By Application
    • 7.4.3. By Country
      • 7.4.3.1. Germany
        • 7.4.3.1.1. Market Trends and Opportunities
        • 7.4.3.1.2. Growth Prospects
      • 7.4.3.2. France
        • 7.4.3.2.1. Market Trends and Opportunities
        • 7.4.3.2.2. Growth Prospects
      • 7.4.3.3. United KIngdom
        • 7.4.3.3.1. Market Trends and Opportunities
        • 7.4.3.3.2. Growth Prospects
      • 7.4.3.4. Spain
        • 7.4.3.4.1. Market Trends and Opportunities
        • 7.4.3.4.2. Growth Prospects
      • 7.4.3.5. Others
        • 7.4.3.5.1. Market Trends and Opportunities
        • 7.4.3.5.2. Growth Prospects
  • 7.5. Middle East and Africa
    • 7.5.1. By Type
    • 7.5.2. By Application
    • 7.5.3. By Country
      • 7.5.3.1. Saudi Arabia
        • 7.5.3.1.1. Market Trends and Opportunities
        • 7.5.3.1.2. Growth Prospects
      • 7.5.3.2. UAE
        • 7.5.3.2.1. Market Trends and Opportunities
        • 7.5.3.2.2. Growth Prospects
      • 7.5.3.3. Israel
        • 7.5.3.3.1. Market Trends and Opportunities
        • 7.5.3.3.2. Growth Prospects
      • 7.5.3.4. Others
        • 7.5.3.4.1. Market Trends and Opportunities
        • 7.5.3.4.2. Growth Prospects
  • 7.6. Asia Pacific
    • 7.6.1. By Type
    • 7.6.2. By Application
    • 7.6.3. By Country
      • 7.6.3.1. China
        • 7.6.3.1.1. Market Trends and Opportunities
        • 7.6.3.1.2. Growth Prospects
      • 7.6.3.2. Japan
        • 7.6.3.2.1. Market Trends and Opportunities
        • 7.6.3.2.2. Growth Prospects
      • 7.6.3.3. India
        • 7.6.3.3.1. Market Trends and Opportunities
        • 7.6.3.3.2. Growth Prospects
      • 7.6.3.4. South Korea
        • 7.6.3.4.1. Market Trends and Opportunities
        • 7.6.3.4.2. Growth Prospects
      • 7.6.3.5. Indonesia
        • 7.6.3.5.1. Market Trends and Opportunities
        • 7.6.3.5.2. Growth Prospects
      • 7.6.3.6. Taiwan
        • 7.6.3.6.1. Market Trends and Opportunities
        • 7.6.3.6.2. Growth Prospects
      • 7.6.3.7. Others
        • 7.6.3.7.1. Market Trends and Opportunities
        • 7.6.3.7.2. Growth Prospects

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. Toppan Inc.
  • 9.2. Applied Materials Inc.
  • 9.3. Hitachi High Technologies America, Inc.
  • 9.4. Lam Research Corporation
  • 9.5. Tokyo Electron Limited
  • 9.6. Plasma-Therm LLC
  • 9.7. CVD Equipment Corporation
  • 9.8. SPTS Technologies Ltd.
  • 9.9. Panasonic Industry Co., Ltd.
  • 9.10. DISCO Corporation