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市場調查報告書
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1457081

矽晶圓市場 - 2024 年至 2029 年預測

Silicon Wafers Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 124 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

2022年矽晶圓市場價值為81.76億美元，將以5.52%的複合年成長率成長，到2029年市場規模將達到134.9億美元。

矽晶圓用於各種電子設備和組件。該技術用於積體電路和微電子產品的生產。在微加工過程中，矽晶圓充當微電子元件之間的基板，並且還經歷許多其他微加工工藝，例如摻雜、離子布植和蝕刻。對更緊湊的電子設備的需求導致了先進的小型化。除了全球消費者期望不斷提高之外，智慧型手機、智慧型穿戴裝置、個人電腦、智慧家居設備和其他智慧小工具等先進科技設備正在為消費性電子產品創造一個重要的市場。新興國家可支配收入的增加以及這些設備的接受度將顯著增加發展中國家對矽晶圓的需求。美國政府對半導體產業的投資預計將顯著提振該地區的前景。美國參議院於 2021 年 5 月宣布，將投資 520 億美元加強國內半導體生產，作為對抗中國的更廣泛努力的一部分。此外，越來越多的居民現在能夠購買汽車和其他車輛，從而導致對半導體的需求增加，這證明了汽車在亞太地區的日益普及。由於該地區對半導體的需求，矽晶圓市場的收益正在增加。

亞太地區的家用電子電器和汽車領域正在崛起。由於中國、印度、日本、印尼和菲律賓等國家的經濟成長，對行動電話、電視和數位相機等家用電器的需求正在迅速成長。例如，亞洲的GDP預計將在2020年超過世界其他地區。如果該地區繼續以目前的速度成長，到 2030 年全球成長預計將達到 60%。 （圖片來源：weforum.org）

市場促進因素：

  • 汽車需求的成長預計將推動市場發展。

推動全球矽晶圓市場的關鍵因素是汽車需求的增加和製造業活動的活性化。向混合動力汽車和電動車的轉變是由於汽車需求和製造的增加。汽車領域新技術的開發和引入也是促進該行業發展的其他因素。汽車產業正在不斷發展，並推出了配備防煞車系統的車輛。諸如此類的技術創新是矽晶圓背後的驅動力。因此，未來市場的成長將受到這些因素的支持。預計到2030年，上路的電動小客車量將超過2億輛，比2016年增加略多於200萬輛。到 2030 年，道路上行駛的兩輪、三輪和四輪電動車將達到 9 億輛，超過四輪汽車的數量。這種成長為矽晶圓供應商提供了許多機會，並促進了市場成長。

  • 半導體需求成長

矽晶圓市場直接且顯著地受到半導體需求成長的影響。隨著以半導體為主要零件的電子設備和技術的普及，對作為半導體製造的重要基板的矽晶圓的需求不斷增加。生產商努力滿足半導體產業不斷擴大的需求，這種激增反映在矽晶圓產量的增加上。半導體技術的進步，例如向較低奈米製程的發展，凸顯了這些領域之間的複雜聯繫，並產生了對更高精度和更寬寬度矽晶圓的需求。

市場限制因素：

  • 高成本和維護：

矽晶圓供應商面臨的主要挑戰是初始投資高且回報率低。此外，用於半導體製造的薄矽晶圓難以處理，並且需要外部機械支撐，這使得處理器處理 450 mm 矽晶圓變得更加困難。這需要使用剛性載體晶圓、專門設計的卡盤和切割膠帶，這將超出預算。此外，最終產品的繁瑣包裝也阻礙了市場的發展。

預計北美將成為主要區域市場。

該地區的技術突破和蓬勃發展的半導體產業正在推動北美矽晶圓市場的發展。北美主要半導體製造商和技術主導公司高度集中，因此對半導體製造重要組成部分矽晶圓的需求穩定。正在進行的擴大半導體技術前沿的計劃進一步激發了該地區的研發熱情。

主要進展：

  • 2023年12月，東京電子發表了可支援300片晶圓的晶圓減薄系統「UlucusTM G」。半導體製造的先進圖形化需要提高矽晶圓的平整度。
  • 2023年8月，三菱電機公司宣布，該公司第一條12吋矽晶圓加工線已在其福山工廠完工，該廠生產用於功率元件的功率半導體。此外，樣品製造和測試已證實同線生產的功率半導體晶片符合所需的性能標準。

目錄

第1章 簡介

  • 市場概況
  • 市場定義
  • 調查範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要利益

第2章調查方法

  • 研究設計
  • 調查過程

第3章執行摘要

  • 主要發現
  • CXO觀點

第4章市場動態

  • 市場促進因素
  • 市場限制因素
  • 波特五力分析
  • 產業價值鏈分析
  • 分析師觀點

第5章矽晶圓市場：依晶圓尺寸

  • 介紹
  • 0～100mm
  • 100～200mm
  • 200～300mm
  • 300mm以上

第6章矽晶圓市場：依製造方法分類

  • 介紹
  • 提拉法 (Cz)
  • 布里奇曼法
  • Float-Zone
  • 其他

第7章矽晶圓市場：依行業分類

  • 介紹
  • 家用電器
  • 車
  • 製造業
  • 通訊
  • 其他

第8章矽晶圓市場：依地區

  • 介紹
  • 北美洲
  • 南美洲
  • 歐洲
  • 中東/非洲
  • 亞太地區

第9章競爭環境及分析

  • 主要企業及策略分析
  • 市場佔有率分析
  • 合併、收購、協議和合作
  • 競爭對手儀表板

第10章 公司簡介

  • Siltronic
  • Sumco Corporation
  • Shin-Etsu Chemical Co., Ltd.
  • Okmetic
  • GlobalWafers（Sino-American Silicon）
  • Silicon Materials, Inc
  • Wafer Works Corporation
  • Wafer World
  • Virginia Semiconductor, Inc.
簡介目錄
Product Code: KSI061611682

The silicon wafers market is evaluated at US$8.176 billion for the year 2022 growing at a CAGR of 5.52% reaching the market size of US$13.49 billion by the year 2029.

All types of electronic devices and components contain silicon wafers. The technology is used to fabricate integrated circuits and microelectronics. During microfabrication, silicon wafers function as substrates between microelectronic components as well as perform many other microfabrication processes such as doping, ion implantation, and etching. A high degree of miniaturization has resulted from the demand for more compact electronics. In addition to consumer expectations growing worldwide, a significant market for consumer electronics will continue to be driven by advanced technological devices such as smartphones, smart wearables, PCs, smart home devices, and other intelligent gadgets. Increasing disposable incomes and the acceptance of these devices will increase silicon wafer demand substantially in developing countries. US government investments in the semiconductor industry will significantly boost regional prospects. The U.S. Senate announced it would invest USD 52 billion in strengthening domestic semiconductor production as part of a broader effort to compete against China in May 2021. Furthermore, the growing popularity of automobiles in APAC is evident in the fact that more residents can now afford cars and other automobiles, resulting in a demand for semiconductors. There has been an increase in revenues generated by the silicon wafer market due to the demand for semiconductors in the region.

APAC is on the rise in the consumer electronics and automotive sectors. Consumer electronics like mobile phones, TVs, digital cameras, and many others are experiencing a surge in demand due to economic growth in countries like China, India, Japan, Indonesia, and the Philippines. For instance, the GDP of Asia will surpass the GDP of the rest of the world combined in 2020. Global growth is expected to reach 60% by 2030 if the region continues to grow at its current pace. (Source: weforum.org)

MARKET DRIVERS:

  • A rise in demand for automobiles is anticipated to propel the market.

Among the key factors driving the global silicon wafer market are increasing vehicle demand and an increase in manufacturing activity. The move towards hybrid and electric vehicles is due to higher vehicle demands and manufacturing. Developing and introducing new technologies into the automotive sector were other factors contributing to the development of the industry. The automotive industry offers vehicles with an anti-braking system when it grows. Innovations such as these support the drive for silicon wafers. The market's growth is therefore supported by these factors going forward into the future. Over 200 million electric passenger cars are predicted to be on the road by 2030, a rapid increase of just over 2 million vehicles in 2016. By 2030, there could be 900 million electric two-, three---, and four-wheeled vehicles on the road, which is more than the number of four-wheeled cars. (Source: irena.org). These augmentations will consequently offer numerous opportunities to silicon wafer suppliers thus, boosting their market growth.

  • Growth in demand for semiconductors.

The silicon wafers market is directly and significantly impacted by the growing need for semiconductors. The requirement for silicon wafers, the essential substrate for semiconductor manufacture, rises in tandem with the proliferation of electronic gadgets and technologies that rely on semiconductors as their key components. As producers work to satisfy the expanding demands of the semiconductor industry, this surge is reflected in higher silicon wafer manufacturing quantities. Improvements in semiconductor technology, such as the shift to lower nanometer processes, highlight the complex link between these sectors and create a need for silicon wafers with greater accuracy and wider widths.

MARKET RESTRAINTS:

  • High cost and maintenance:

A high initial investment coupled with a questionable lack of returns is a major challenge facing silicon wafer vendors. Furthermore, thin silicon wafers for semiconductor fabrication are difficult to handle and must be supported mechanically outside, which makes it even more difficult for processors to handle 450 mm silicon wafers. This means it becomes necessary to use rigid career wafers, specially designed chucks, and dicing tape, thus exceeding budget expectations. Furthermore, the final product packaging is cumbersome hampering the market.

North America is anticipated to be the major regional market.

The region's technical breakthroughs and booming semiconductor sector drive the North American silicon wafers market. North America has a concentration of large semiconductor manufacturers and technology-driven businesses, which means that there is a steady need for silicon wafers, which are essential components in the creation of semiconductors. The market is further stimulated by the region's dedication to research and development, as continuous projects concentrate on expanding the frontiers of semiconductor technology.

Key Developments:

  • In December 2023, Tokyo Electron announced the release of UlucusTM G, a wafer-thinning system for 300-wafer production. Greater flatness in silicon wafers is necessary for advanced patterning in semiconductor fabrication. Integrated wafer manufacturing equipment that can execute various operations automatically and continuously is preferred due to the worldwide labor shortage trend.
  • In August 2023, Mitsubishi Electric Corporation announced that the construction of its first 12-inch silicon wafer processing line at its Fukuyama Factory, which produces power semiconductors for Power Device Works, has been completed. Furthermore, it has been confirmed by sample manufacturing and testing that the power semiconductor chips produced on this line of production meet the necessary performance standards.

Segmentation:

By Wafer Size

  • 0- 100 mm
  • 100 - 200 mm
  • 200 - 300 mm
  • More than 300 mm

By Fabrication Method

  • Czochralski Technique (Cz)
  • Bridgeman Method
  • Float-Zone
  • Others

By Industry Vertical

  • Consumer Electronics
  • Automotive
  • Manufacturing
  • Telecommunications
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • Others
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • France
  • Germany
  • UK
  • Italy
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Others
  • Asia Pacific
  • China
  • India
  • South Korea
  • Taiwan
  • Thailand
  • Indonesia
  • Japan
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key Benefits to the stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Processes

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. CXO Perspective

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. SILICON WAFERS MARKET, BY WAFER SIZE

  • 5.1. Introduction
  • 5.2. 0-100 mm
    • 5.2.1. Market Trends and Opportunities
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness
  • 5.3. 100-200 mm
    • 5.3.1. Market Trends and Opportunities
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness
  • 5.4. 200-300 mm
    • 5.4.1. Market Trends and Opportunities
    • 5.4.2. Growth Prospects
    • 5.4.3. Geographic Lucrativeness
  • 5.5. More than 300 mm
    • 5.5.1. Market Trends and Opportunities
    • 5.5.2. Growth Prospects
    • 5.5.3. Geographic Lucrativeness

6. SILICON WAFERS MARKET, BY FABRICATION METHOD

  • 6.1. Introduction
  • 6.2. Czochralski Technique (Cz)
    • 6.2.1. Market Trends and Opportunities
    • 6.2.2. Growth Prospects
    • 6.2.3. Geographic Lucrativeness
  • 6.3. Bridgeman Method
    • 6.3.1. Market Trends and Opportunities
    • 6.3.2. Growth Prospects
    • 6.3.3. Geographic Lucrativeness
  • 6.4. Float-Zone
    • 6.4.1. Market Trends and Opportunities
    • 6.4.2. Growth Prospects
    • 6.4.3. Geographic Lucrativeness
  • 6.5. Others
    • 6.5.1. Market Trends and Opportunities
    • 6.5.2. Growth Prospects
    • 6.5.3. Geographic Lucrativeness

7. SILICON WAFERS MARKET, BY INDUSTRY VERTICAL

  • 7.1. Introduction
  • 7.2. Consumer Electronics
    • 7.2.1. Market Trends and Opportunities
    • 7.2.2. Growth Prospects
    • 7.2.3. Geographic Lucrativeness
  • 7.3. Automotive
    • 7.3.1. Market Trends and Opportunities
    • 7.3.2. Growth Prospects
    • 7.3.3. Geographic Lucrativeness
  • 7.4. Manufacturing
    • 7.4.1. Market Trends and Opportunities
    • 7.4.2. Growth Prospects
    • 7.4.3. Geographic Lucrativeness
  • 7.5. Telecommunications
    • 7.5.1. Market Trends and Opportunities
    • 7.5.2. Growth Prospects
    • 7.5.3. Geographic Lucrativeness
  • 7.6. Others
    • 7.6.1. Market Trends and Opportunities
    • 7.6.2. Growth Prospects
    • 7.6.3. Geographic Lucrativeness

8. SILICON WAFERS MARKET, BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. By Wafer Size
    • 8.2.2. By Fabrication Method
    • 8.2.3. By Industry Vertical
    • 8.2.4. By Country
      • 8.2.4.1. USA
        • 8.2.4.1.1. Market Trends and Opportunities
        • 8.2.4.1.2. Growth Prospects
      • 8.2.4.2. Canada
        • 8.2.4.2.1. Market Trends and Opportunities
        • 8.2.4.2.2. Growth Prospects
      • 8.2.4.3. Mexico
        • 8.2.4.3.1. Market Trends and Opportunities
        • 8.2.4.3.2. Growth Prospects
  • 8.3. South America
    • 8.3.1. By Wafer Size
    • 8.3.2. By Fabrication Method
    • 8.3.3. By Industry Vertical
    • 8.3.4. By Country
      • 8.3.4.1. Brazil
        • 8.3.4.1.1. Market Trends and Opportunities
        • 8.3.4.1.2. Growth Prospects
      • 8.3.4.2. Argentina
        • 8.3.4.2.1. Market Trends and Opportunities
        • 8.3.4.2.2. Growth Prospects
      • 8.3.4.3. Others
        • 8.3.4.3.1. Market Trends and Opportunities
        • 8.3.4.3.2. Growth Prospects
  • 8.4. Europe
    • 8.4.1. By Wafer Size
    • 8.4.2. By Fabrication Method
    • 8.4.3. By Industry Vertical
    • 8.4.4. By Country
      • 8.4.4.1. France
        • 8.4.4.1.1. Market Trends and Opportunities
        • 8.4.4.1.2. Growth Prospects
      • 8.4.4.2. Germany
        • 8.4.4.2.1. Market Trends and Opportunities
        • 8.4.4.2.2. Growth Prospects
      • 8.4.4.3. UK
        • 8.4.4.3.1. Market Trends and Opportunities
        • 8.4.4.3.2. Growth Prospects
      • 8.4.4.4. Italy
        • 8.4.4.4.1. Market Trends and Opportunities
        • 8.4.4.4.2. Growth Prospects
      • 8.4.4.5. Others
        • 8.4.4.5.1. Market Trends and Opportunities
        • 8.4.4.5.2. Growth Prospects
  • 8.5. Middle East and Africa
    • 8.5.1. By Wafer Size
    • 8.5.2. By Fabrication Method
    • 8.5.3. By Industry Vertical
    • 8.5.4. By Country
      • 8.5.4.1. Saudi Arabia
        • 8.5.4.1.1. Market Trends and Opportunities
        • 8.5.4.1.2. Growth Prospects
      • 8.5.4.2. UAE
        • 8.5.4.2.1. Market Trends and Opportunities
        • 8.5.4.2.2. Growth Prospects
      • 8.5.4.3. Israel
        • 8.5.4.3.1. Market Trends and Opportunities
        • 8.5.4.3.2. Growth Prospects
      • 8.5.4.4. Others
        • 8.5.4.4.1. Market Trends and Opportunities
        • 8.5.4.4.2. Growth Prospects
  • 8.6. Asia Pacific
    • 8.6.1. By Wafer Size
    • 8.6.2. By Fabrication Method
    • 8.6.3. By Industry Vertical
    • 8.6.4. By Country
      • 8.6.4.1. China
        • 8.6.4.1.1. Market Trends and Opportunities
        • 8.6.4.1.2. Growth Prospects
      • 8.6.4.2. India
        • 8.6.4.2.1. Market Trends and Opportunities
        • 8.6.4.2.2. Growth Prospects
      • 8.6.4.3. South Korea
        • 8.6.4.3.1. Market Trends and Opportunities
        • 8.6.4.3.2. Growth Prospects
      • 8.6.4.4. Taiwan
        • 8.6.4.4.1. Market Trends and Opportunities
        • 8.6.4.4.2. Growth Prospects
      • 8.6.4.5. Thailand
        • 8.6.4.5.1. Market Trends and Opportunities
        • 8.6.4.5.2. Growth Prospects
      • 8.6.4.6. Indonesia
        • 8.6.4.6.1. Market Trends and Opportunities
        • 8.6.4.6.2. Growth Prospects
      • 8.6.4.7. Japan
        • 8.6.4.7.1. Market Trends and Opportunities
        • 8.6.4.7.2. Growth Prospects
      • 8.6.4.8. Others
        • 8.6.4.8.1. Market Trends and Opportunities
        • 8.6.4.8.2. Growth Prospects

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. Siltronic
  • 10.2. Sumco Corporation
  • 10.3. Shin-Etsu Chemical Co., Ltd.
  • 10.4. Okmetic
  • 10.5. GlobalWafers (Sino-American Silicon)
  • 10.6. Silicon Materials, Inc
  • 10.7. Wafer Works Corporation
  • 10.8. Wafer World
  • 10.9. Virginia Semiconductor, Inc.