Embedded World 2023：物聯網芯片組和邊緣的最新趨勢

示例視圖

這份報告全面總結了 Embedded World 2023 的主要嵌入式亮點和對關鍵領域的深入見解。

該報告包括：

• 2023 年嵌入式世界博覽會：19 大亮點
• 10 條詳細見解：示例/證明點和訪談要點
• 總結和要點：總體印象、參展商情緒、最熱門的技術話題、主要演講等。
• 硬件和芯片組洞察：AI 芯片組、基於 AI 的機器視覺、SDV（軟件定義車輛）、電源管理 IC
• 連通性見解：OPC-UA、TSN、單對以太網、Matter 標準
• Security Insights：安全標準 IEC 62443 後量子安全
• 更多見解：RTOS/硬件問題

內容

• 1.概述
• 2.總結和主要亮點
• 3. 硬件和芯片組見解
• 4. 連通性見解
• 5.安全洞察
• 6.其他見解
• 7. 附錄

36-page report highlighting key insights from one of the world's leading fairs for the embedded community

SAMPLE VIEW

A comprehensive summary of 19 key highlights and 10 in-depth insights assembled by the IoT Analytics team at the Embedded World fair, 2023. These insights are based on >75 booth visits, >50 individual interviews, and attendance at several presentations. Three analysts were present for a total of three days.

The main purpose of this document is for our readers to keep up with the latest IoT developments related to hardware and embedded topics and to stay ahead of the tidal changes regarding current market trends.

The report includes:

• 19 key highlights from the Embedded World fair 2023.

• 10 in-depth insights with examples/proof-points and interview highlights.

• Summary & Key Highlights (General impressions, exhibitor sentiment, most discussed tech topics, key announcements)

• Hardware and Chipset Insights (AI Chipsets, AI-based Machine Vision, Software Defined Vehicles, Power Management IC's).

• Connectivity Insights (OPC-UA, TSN, Single-Pair Ethernet, Matter standard)

• Security Insights (Security Standards IEC 62443, Post-quantum security)

• Other Insights (RTOS, Hardware issues)

Table of Contents

• 1. Overview

• 2. Summary and Key Highlights

• 3. Hardware and Chipset Insights

• 4. Connectivity Insights

• 5. Security Insights

• 6. Other Insights

• 7. Appendix