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市場調查報告書
商品編碼
1468335

2024-2032 年按類型、技術、應用和地區分類的晶片貼裝機市場報告

Die Attach Machine Market Report by Type, Technique, Application, and Region 2024-2032
出版日期: | 出版商: IMARC | 英文 136 Pages | 商品交期: 2-3個工作天內

價格

IMARC Group年全球晶片貼裝機市場規模達11.211億美元。半導體產量的增加、對再生能源的需求不斷成長以及自動駕駛、電動和豪華汽車銷售的成長是推動市場發展的一些關鍵因素。

晶片附著是將半導體晶片附著在基板或封裝上的過程。它被認為是不同類型封裝的基礎，並使用各種材料，例如環氧樹脂、聚醯亞胺和鍍銀玻璃。它使用晶片貼裝機進行操作，該機器旨在以高精度處理晶片並將其放置到基板或封裝上。晶片貼裝機也稱為晶片安裝或晶片鍵合機，配備視覺系統和其他感測器，以確保晶片充分定位並使用加熱黏合劑或熱壓鍵合製程進行鍵合。目前，消費性電子設備銷售的成長正在刺激全球對晶片貼裝機的需求。

晶片貼裝機市場趨勢：

晶片貼裝機在半導體裝置（例如微處理器、記憶體晶片和其他積體電路（IC））生產中的利用率不斷提高，是推動全球市場成長的主要因素之一。此外，晶片貼裝機在半導體元件封裝中的使用不斷增加，有利於市場成長。此外，在印刷電路板 (PCB) 製造中擴大使用晶片貼裝機來連接不同電子設備中的電子元件，這對市場產生了積極影響。除此之外，晶片貼裝機在汽車產業中也用於製造車輛的各種零件，包括感測器、引擎和變速箱控制模組、安全、導航和音訊系統、先進駕駛輔助系統(ADAS) 和電動馬達控制器。再加上由於收入水平上漲而導致電動車和豪華汽車銷量的增加，正在推動市場的成長。此外，晶片貼裝機在心律調節器、胰島素幫浦、植入式設備、血糖儀和血壓監測儀等醫療設備中的應用增加。再加上嚴重疾病的盛行率激增，正在推動市場的成長。此外，對智慧手錶和健身追蹤器等穿戴式裝置的需求不斷成長，為市場創造了積極的前景。除此之外，對風力渦輪機和太陽能電池板等再生能源的需求不斷成長，也推動了對晶片貼裝機的需求。

本報告回答的關鍵問題：

  • 迄今為止，全球晶片貼裝機市場表現如何，未來幾年將如何表現？
  • 全球晶片貼裝機市場的促進因素、限制因素和機會是什麼？
  • 每個促進因素、限制因素和機會對全球晶片貼裝機市場有何影響？
  • 主要區域市場有哪些？
  • 哪些國家代表了最具吸引力的晶片貼裝機市場？
  • 依類型分類市場是怎麼樣的？
  • 晶片貼裝機市場中哪種類型最具吸引力？
  • 基於技術的市場區隔是什麼？
  • 晶片貼裝機市場中哪種技術最具吸引力？
  • 基於應用程式的市場區隔是什麼？
  • 晶片貼裝機市場中哪一項應用最具吸引力？
  • 全球晶片貼裝機市場的競爭結構如何？
  • 全球晶片貼裝機市場的主要參與者/公司有哪些？

目錄

第1章：前言

第 2 章：範圍與方法

  • 研究目的
  • 利害關係人
  • 資料來源
    • 主要資源
    • 二手資料
  • 市場預測
    • 自下而上的方法
    • 自上而下的方法
  • 預測方法

第 3 章：執行摘要

第 4 章：簡介

  • 概述
  • 主要行業趨勢

第 5 章：全球晶片貼裝機市場

  • 市場概況
  • 市場業績
  • COVID-19 的影響
  • 市場預測

第 6 章：市場區隔：按類型

  • 覆晶接合機
    • 市場走向
    • 市場預測
  • 晶片接合機
    • 市場走向
    • 市場預測

第 7 章：市場區隔：依技術

  • 環氧樹脂
    • 市場走向
    • 市場預測
  • 軟焊料
    • 市場走向
    • 市場預測
  • 燒結
    • 市場走向
    • 市場預測
  • 共晶
    • 市場走向
    • 市場預測
  • 其他
    • 市場走向
    • 市場預測

第 8 章：市場區隔：按應用

  • 射頻和微機電系統
    • 市場走向
    • 市場預測
  • 光電
    • 市場走向
    • 市場預測
  • 邏輯
    • 市場走向
    • 市場預測
  • 記憶
    • 市場走向
    • 市場預測
  • CMOS影像感測器
    • 市場走向
    • 市場預測
  • 引領
    • 市場走向
    • 市場預測
  • 其他
    • 市場走向
    • 市場預測

第 9 章：市場區隔：按地區

  • 北美洲
    • 美國
    • 加拿大
  • 亞太
    • 中國
    • 日本
    • 印度
    • 韓國
    • 澳洲
    • 印尼
    • 其他
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙
    • 俄羅斯
    • 其他
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 其他
  • 中東和非洲
    • 市場走向
    • 市場細分：按國家/地區
    • 市場預測

第 10 章：促進因素、限制與機會

  • 概述
  • 促進要素
  • 限制
  • 機會

第 11 章：價值鏈分析

第 12 章：波特五力分析

  • 概述
  • 買家的議價能力
  • 供應商的議價能力
  • 競爭程度
  • 新進入者的威脅
  • 替代品的威脅

第 13 章：價格分析

第14章：競爭格局

  • 市場結構
  • 關鍵參與者
  • 關鍵參與者簡介
    • Anza Technology Inc.
    • ASM Pacific Technology Limited
    • Be Semiconductor Industries NV
    • Dr. Tresky AG
    • Fasford Technology Co Ltd. (Fuji Machinery Co., Ltd)
    • Hybond Inc.
    • Inseto UK Limited
    • Kulicke and Soffa Industries Inc.
    • MicroAssembly Technologies Ltd.
    • MRSI Systems (Mycronic AB (Publ))
    • Palomar Technologies Inc.
    • Shinkawa Ltd. (Yamaha Motor Co. Ltd.)
Product Code: SR112024A7423

The global die attach machine market size reached US$ 1,121.1 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 1,678.9 Million by 2032, exhibiting a growth rate (CAGR) of 4.4% during 2024-2032. The increasing production of semiconductors, rising demand for renewable energy sources and the growing sales of autonomous, electric, and luxury vehicles represent some of the key factors driving the market.

Die attach is the process wherein a semiconductor chip is attached to a substrate or package. It is considered fundamental to different types of packaging and uses various materials, such as epoxy, polyimide, and silver-filled glass. It is operated using a die attach machine that is designed to handle and place the die onto the substrate or package with high accuracy and precision. A die attach machine, also known as a die mount or die bond machine, is equipped with vision systems and other sensors to ensure that the die is adequately positioned and bonded using a heated adhesive or a thermocompression bonding process. At present, rising sales of consumer electronic devices are catalyzing the demand for die attach machine across the globe.

Die Attach Machine Market Trends:

The increasing utilization of die attach machines in the production of semiconductor devices, such as microprocessors, memory chips, and other integrated circuits (ICs), represents one of the major factors strengthening the market growth around the world. Moreover, the rising use of die attach machines in the packaging of semiconductor devices is favoring the market growth. In addition, the growing usage of die attach machines in the manufacturing of printed circuit boards (PCBs) to connect electronic components in different electronic devices is influencing the market positively. Apart from this, die attach machines are employed in the automotive industry to manufacture various parts of vehicles, including sensors, engine and transmission control modules, safety, navigation, and audio systems, advanced driver assistance systems (ADAS), and electric motor controllers. This, coupled with the increasing sales of electric and luxury vehicles on account of inflating income levels, is contributing to the market growth. Furthermore, there is a rise in the adoption of die attach machines in medical devices like pacemakers, insulin pumps, implantable devices, glucose meters, and blood pressure monitors. This, along with the surging prevalence of severe medical conditions, is fueling the market growth. Additionally, the increasing demand for wearable devices, such as smartwatches and fitness trackers, is creating a positive outlook for the market. Besides this, the growing demand for renewable energy sources, such as wind turbines and solar panels, is driving the need for die attach machines.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the global die attach machine market, along with forecasts at the global, regional, and country level from 2024-2032. Our report has categorized the market based on type, technique, and application.

Type Insights:

Flip Chip Bonder

Die Bonder

The report has provided a detailed breakup and analysis of the die attach machine market based on the type. This includes flip chip bonder and die bonder. According to the report, die bonder represented the largest segment.

Technique Insights:

Epoxy

Soft Solder

Sintering

Eutectic

Others

A detailed breakup and analysis of the die attach machine market based on the technique has also been provided in the report. This includes epoxy, soft solder, sintering, eutectic, and others. According to the report, epoxy represented the largest segment.

Application Insights:

RF and MEMS

Optoelectronics

Logic

Memory

CMOS Image Sensors

LED

Others

The report has provided a detailed breakup and analysis of the die attach machine market based on the application. This includes RF and MEMS, optoelectronics, logic, memory, CMOS image sensors, LED, and others. According to the report, LED represented the largest segment.

Regional Insights:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific was the largest market for die attach machines. Some of the factors driving the Asia Pacific die attach machine market included the increasing demand for semiconductor devices, advancements in packaging technology, and rising adoption of automation in the semiconductor industry.

Competitive Landscape:

The report has also provided a comprehensive analysis of the competitive landscape in the global die attach machine market. Competitive analysis such as market structure, market share by key players, player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided. Some of the companies covered Anza Technology Inc., ASM Pacific Technology Limited, Be Semiconductor Industries N.V., Dr. Tresky AG, Fasford Technology Co Ltd. (Fuji Machinery Co., Ltd), Hybond Inc., Inseto UK Limited, Kulicke and Soffa Industries Inc., MicroAssembly Technologies Ltd., MRSI Systems (Mycronic AB (Publ)), Palomar Technologies Inc., Shinkawa Ltd. (Yamaha Motor Co. Ltd.), etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report:

  • How has the global die attach machine market performed so far, and how will it perform in the coming years?
  • What are the drivers, restraints, and opportunities in the global die attach machine market?
  • What is the impact of each driver, restraint, and opportunity on the global die attach machine market?
  • What are the key regional markets?
  • Which countries represent the most attractive die attach machine markets?
  • What is the breakup of the market based on the type?
  • Which is the most attractive type in the die attach machine market?
  • What is the breakup of the market based on the technique?
  • Which is the most attractive technique in the die attach machine market?
  • What is the breakup of the market based on the application?
  • Which is the most attractive application in the die attach machine market?
  • What is the competitive structure of the global die attach machine market?
  • Who are the key players/companies in the global die attach machine market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Die Attach Machine Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 Flip Chip Bonder
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Die Bonder
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast

7 Market Breakup by Technique

  • 7.1 Epoxy
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Soft Solder
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Sintering
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Eutectic
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Others
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast

8 Market Breakup by Application

  • 8.1 RF and MEMS
    • 8.1.1 Market Trends
    • 8.1.2 Market Forecast
  • 8.2 Optoelectronics
    • 8.2.1 Market Trends
    • 8.2.2 Market Forecast
  • 8.3 Logic
    • 8.3.1 Market Trends
    • 8.3.2 Market Forecast
  • 8.4 Memory
    • 8.4.1 Market Trends
    • 8.4.2 Market Forecast
  • 8.5 CMOS Image Sensors
    • 8.5.1 Market Trends
    • 8.5.2 Market Forecast
  • 8.6 LED
    • 8.6.1 Market Trends
    • 8.6.2 Market Forecast
  • 8.7 Others
    • 8.7.1 Market Trends
    • 8.7.2 Market Forecast

9 Market Breakup by Region

  • 9.1 North America
    • 9.1.1 United States
      • 9.1.1.1 Market Trends
      • 9.1.1.2 Market Forecast
    • 9.1.2 Canada
      • 9.1.2.1 Market Trends
      • 9.1.2.2 Market Forecast
  • 9.2 Asia-Pacific
    • 9.2.1 China
      • 9.2.1.1 Market Trends
      • 9.2.1.2 Market Forecast
    • 9.2.2 Japan
      • 9.2.2.1 Market Trends
      • 9.2.2.2 Market Forecast
    • 9.2.3 India
      • 9.2.3.1 Market Trends
      • 9.2.3.2 Market Forecast
    • 9.2.4 South Korea
      • 9.2.4.1 Market Trends
      • 9.2.4.2 Market Forecast
    • 9.2.5 Australia
      • 9.2.5.1 Market Trends
      • 9.2.5.2 Market Forecast
    • 9.2.6 Indonesia
      • 9.2.6.1 Market Trends
      • 9.2.6.2 Market Forecast
    • 9.2.7 Others
      • 9.2.7.1 Market Trends
      • 9.2.7.2 Market Forecast
  • 9.3 Europe
    • 9.3.1 Germany
      • 9.3.1.1 Market Trends
      • 9.3.1.2 Market Forecast
    • 9.3.2 France
      • 9.3.2.1 Market Trends
      • 9.3.2.2 Market Forecast
    • 9.3.3 United Kingdom
      • 9.3.3.1 Market Trends
      • 9.3.3.2 Market Forecast
    • 9.3.4 Italy
      • 9.3.4.1 Market Trends
      • 9.3.4.2 Market Forecast
    • 9.3.5 Spain
      • 9.3.5.1 Market Trends
      • 9.3.5.2 Market Forecast
    • 9.3.6 Russia
      • 9.3.6.1 Market Trends
      • 9.3.6.2 Market Forecast
    • 9.3.7 Others
      • 9.3.7.1 Market Trends
      • 9.3.7.2 Market Forecast
  • 9.4 Latin America
    • 9.4.1 Brazil
      • 9.4.1.1 Market Trends
      • 9.4.1.2 Market Forecast
    • 9.4.2 Mexico
      • 9.4.2.1 Market Trends
      • 9.4.2.2 Market Forecast
    • 9.4.3 Others
      • 9.4.3.1 Market Trends
      • 9.4.3.2 Market Forecast
  • 9.5 Middle East and Africa
    • 9.5.1 Market Trends
    • 9.5.2 Market Breakup by Country
    • 9.5.3 Market Forecast

10 Drivers, Restraints, and Opportunities

  • 10.1 Overview
  • 10.2 Drivers
  • 10.3 Restraints
  • 10.4 Opportunities

11 Value Chain Analysis

12 Porters Five Forces Analysis

  • 12.1 Overview
  • 12.2 Bargaining Power of Buyers
  • 12.3 Bargaining Power of Suppliers
  • 12.4 Degree of Competition
  • 12.5 Threat of New Entrants
  • 12.6 Threat of Substitutes

13 Price Analysis

14 Competitive Landscape

  • 14.1 Market Structure
  • 14.2 Key Players
  • 14.3 Profiles of Key Players
    • 14.3.1 Anza Technology Inc.
      • 14.3.1.1 Company Overview
      • 14.3.1.2 Product Portfolio
    • 14.3.2 ASM Pacific Technology Limited
      • 14.3.2.1 Company Overview
      • 14.3.2.2 Product Portfolio
    • 14.3.3 Be Semiconductor Industries N.V.
      • 14.3.3.1 Company Overview
      • 14.3.3.2 Product Portfolio
      • 14.3.3.3 Financials
      • 14.3.3.4 SWOT Analysis
    • 14.3.4 Dr. Tresky AG
      • 14.3.4.1 Company Overview
      • 14.3.4.2 Product Portfolio
    • 14.3.5 Fasford Technology Co Ltd. (Fuji Machinery Co., Ltd)
      • 14.3.5.1 Company Overview
      • 14.3.5.2 Product Portfolio
    • 14.3.6 Hybond Inc.
      • 14.3.6.1 Company Overview
      • 14.3.6.2 Product Portfolio
    • 14.3.7 Inseto UK Limited
      • 14.3.7.1 Company Overview
      • 14.3.7.2 Product Portfolio
    • 14.3.8 Kulicke and Soffa Industries Inc.
      • 14.3.8.1 Company Overview
      • 14.3.8.2 Product Portfolio
      • 14.3.8.3 Financials
    • 14.3.9 MicroAssembly Technologies Ltd.
      • 14.3.9.1 Company Overview
      • 14.3.9.2 Product Portfolio
    • 14.3.10 MRSI Systems (Mycronic AB (Publ))
      • 14.3.10.1 Company Overview
      • 14.3.10.2 Product Portfolio
    • 14.3.11 Palomar Technologies Inc.
      • 14.3.11.1 Company Overview
      • 14.3.11.2 Product Portfolio
    • 14.3.12 Shinkawa Ltd. (Yamaha Motor Co. Ltd.)
      • 14.3.12.1 Company Overview
      • 14.3.12.2 Product Portfolio

Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.

List of Figures

  • Figure 1: Global: Die Attach Machine Market: Major Drivers and Challenges
  • Figure 2: Global: Die Attach Machine Market: Sales Value (in Million US$), 2018-2023
  • Figure 3: Global: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 4: Global: Die Attach Machine Market: Breakup by Type (in %), 2023
  • Figure 5: Global: Die Attach Machine Market: Breakup by Technique (in %), 2023
  • Figure 6: Global: Die Attach Machine Market: Breakup by Application (in %), 2023
  • Figure 7: Global: Die Attach Machine Market: Breakup by Region (in %), 2023
  • Figure 8: Global: Die Attach Machine (Flip Chip Bonder) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 9: Global: Die Attach Machine (Flip Chip Bonder) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 10: Global: Die Attach Machine (Die Bonder) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 11: Global: Die Attach Machine (Die Bonder) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 12: Global: Die Attach Machine (Epoxy) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 13: Global: Die Attach Machine (Epoxy) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 14: Global: Die Attach Machine (Soft Solder) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 15: Global: Die Attach Machine (Soft Solder) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 16: Global: Die Attach Machine (Sintering) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 17: Global: Die Attach Machine (Sintering) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 18: Global: Die Attach Machine (Eutectic) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 19: Global: Die Attach Machine (Eutectic) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 20: Global: Die Attach Machine (Other Techniques) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 21: Global: Die Attach Machine (Other Techniques) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 22: Global: Die Attach Machine (RF and MEMS) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 23: Global: Die Attach Machine (RF and MEMS) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 24: Global: Die Attach Machine (Optoelectronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 25: Global: Die Attach Machine (Optoelectronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 26: Global: Die Attach Machine (Logic) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 27: Global: Die Attach Machine (Logic) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 28: Global: Die Attach Machine (Memory) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 29: Global: Die Attach Machine (Memory) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 30: Global: Die Attach Machine (CMOS Image Sensors) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 31: Global: Die Attach Machine (CMOS Image Sensors) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 32: Global: Die Attach Machine (LED) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 33: Global: Die Attach Machine (LED) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 34: Global: Die Attach Machine (Other Applications) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 35: Global: Die Attach Machine (Other Applications) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 36: North America: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 37: North America: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 38: United States: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 39: United States: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 40: Canada: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 41: Canada: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 42: Asia-Pacific: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 43: Asia-Pacific: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 44: China: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 45: China: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 46: Japan: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 47: Japan: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 48: India: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 49: India: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 50: South Korea: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 51: South Korea: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 52: Australia: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 53: Australia: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 54: Indonesia: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 55: Indonesia: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 56: Others: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 57: Others: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 58: Europe: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 59: Europe: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 60: Germany: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 61: Germany: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 62: France: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 63: France: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 64: United Kingdom: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 65: United Kingdom: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 66: Italy: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 67: Italy: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 68: Spain: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 69: Spain: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 70: Russia: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 71: Russia: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 72: Others: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 73: Others: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 74: Latin America: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 75: Latin America: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 76: Brazil: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 77: Brazil: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 78: Mexico: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 79: Mexico: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 80: Others: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 81: Others: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 82: Middle East and Africa: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 83: Middle East and Africa: Die Attach Machine Market: Breakup by Country (in %), 2023
  • Figure 84: Middle East and Africa: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 85: Global: Die Attach Machine Industry: Drivers, Restraints, and Opportunities
  • Figure 86: Global: Die Attach Machine Industry: Value Chain Analysis
  • Figure 87: Global: Die Attach Machine Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Die Attach Machine Market: Key Industry Highlights, 2023 & 2032
  • Table 2: Global: Die Attach Machine Market Forecast: Breakup by Type (in Million US$), 2024-2032
  • Table 3: Global: Die Attach Machine Market Forecast: Breakup by Technique (in Million US$), 2024-2032
  • Table 4: Global: Die Attach Machine Market Forecast: Breakup by Application (in Million US$), 2024-2032
  • Table 5: Global: Die Attach Machine Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 6: Global: Die Attach Machine Market: Competitive Structure
  • Table 7: Global: Die Attach Machine Market: Key Players