市場調查報告書
商品編碼
1379196
2023-2028 年按類型(電容器、電阻器、光伏電池、加熱器等)、最終用戶(汽車、醫療保健、消費性電子產品、基礎設施等)和地區分類的厚膜裝置市場報告Thick Film Devices Market Report by Type (Capacitors, Resistors, Photovoltaic cells, Heaters, and Others), End-user (Automotive, Healthcare, Consumer Electronics, Infrastructure, and Others), and Region 2023-2028 |
2022年全球厚膜裝置市場規模達1,196.1億美元。展望未來, IMARC Group預計到2028年市場規模將達到2,495.2億美元,2022-2028年複合年成長率(CAGR)為13.0%。對薄膜裝置的需求不斷增加,以促進與多種基材的高相容性,對消費性電子產品的需求不斷成長,以及電子元件小型化趨勢的轉變,是推動市場的一些關鍵因素。
厚膜元件是指在陶瓷或玻璃基板上沉積厚厚的電阻、導電或介電材料層而製造的電子元件。厚膜沉積技術有助於創建複雜的電子電路和元件。厚膜裝置具有相對較厚的材料層,可靠性高,材料表現出良好的附著力和對環境因素的抵抗力。它們具有良好的導電性、介電常數、導熱性、TCR(電阻溫度係數)以及在較寬溫度範圍內的穩定性。這些特性可實現多個電路元件的整合和更高的功率處理能力。此外,它們可高度客製化,以滿足特定的電氣和機械要求,並與各種基材材料相容。因此,它們廣泛應用於電子電路、混合微電子和積體電路製造應用。
全球市場的主要推動力是對薄膜裝置的需求不斷成長,以促進電氣和電子行業中多種基材的高相容性。這可以歸因於消費性電子產品和工業電子產品的需求不斷成長。與此一致的是,電子元件小型化趨勢的轉變導致需要在單一基板上整合多種功能,這正在推動市場的發展。此外,在眾多工業應用中需要結合類比和數位電路的混合電路的日益普及正在推動全球範圍內的產品需求。汽車產量的快速擴張以及汽車電子整合度的不斷提高進一步推動了市場。除此之外,生物感測器、穿戴式裝置、起搏器和植入式裝置等各種醫療設備製造中產品的快速利用正在創造利潤豐厚的市場機會。此外,製造流程、材料科學和設計技術的不斷進步導致高性能、堅固、耐腐蝕產品的出現,為市場提供了動力。除此之外,工業自動化系統的日益普及導致薄膜裝置在控制、感測和監控應用中的使用不斷增加,這反過來又推動了市場的發展。促進市場發展的其他一些因素包括物聯網應用和設備的使用不斷增加、電信業的大幅成長以及政府鼓勵國內製造業的有利措施。
The global thick film devices market size reached US$ 119.61 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 249.52 Billion by 2028, exhibiting a growth rate (CAGR) of 13.0% during 2022-2028. The augmenting need for film devices facilitating high compatibility with multiple substrates, the accelerating demand for consumer electronics, and the shifting trend towards miniaturization of electronic components represent some of the key factors driving the market.
Thick film devices refer to electronic components that are fabricated through a deposition of a thick layer of resistive, conductive, or dielectric material onto a ceramic or glass substrate. The thick film deposition technique assists in the creation of complex electronic circuits and components. Thick film devices have a relatively thick layer of material with high reliability, with materials that exhibit good adhesion and resistance to environmental factors. They are characterized by good electrical conductivity, dielectric constant, thermal conductivity, TCR (Temperature Coefficient of Resistance) and stability over a wide temperature range. These properties enable the integration of multiple circuit elements and higher power handling capabilities. Additionally, they are highly customizable to meet specific electrical and mechanical requirements and are compatible with a wide range of substrate materials. As a result, they are extensively used in electronic circuits, hybrid microelectronics, and integrated circuit manufacturing applications.
The global market is primarily driven by the augmenting need for film devices facilitating high compatibility with multiple substrates in the electrical and electronics industry. This can be attributed to the accelerating demand for consumer electronics as well as industrial electronics. In line with this, the shifting trend towards miniaturization of electronic components resulting in the need for integration of multiple functions on a single substrate is fueling the market. Moreover, the rising adoption of hybrid circuits requiring a combination of analog and digital circuitry in numerous industrial applications is propelling the product demand on the global level. The market is further driven by the rapid expansion of automotive production, coupled with the rising integration of electronics in vehicles. Apart from this, rapid product utilization in the manufacturing of various medical devices such as biosensors, wearable devices, pacemakers, and implantable devices are creating lucrative opportunities in the market. Furthermore, continual technological advancements in the manufacturing processes, material science and design techniques leading to the advent of high-performance, robust, corrosion-resistant product variants are providing an impetus to the market. In addition to this, the growing adoption of industrial automation systems is resulting in the increasing usage of thin film devices in control, sensing, and monitoring applications, which, in turn, is providing a boost to the market. Some of the other factors contributing to the market include the increasing usage of IoT applications and devices, considerable growth in the telecommunications industry, and favorable government initiatives encouraging domestic manufacturing.
IMARC Group provides an analysis of the key trends in each segment of the global thick film devices market, along with forecasts at the global, regional, and country levels from 2023-2028. Our report has categorized the market based on type and end-user.
Capacitors
Resistors
Photovoltaic cells
Heaters
Others
The report has provided a detailed breakup and analysis of the thick film devices market based on the type. This includes capacitors, resistors, photovoltaic cells, heaters, and others. According to the report, capacitors represented the largest segment.
Automotive
Healthcare
Consumer Electronics
Infrastructure
Others
A detailed breakup and analysis of the thick film devices market based on the end-user has also been provided in the report. This includes automotive, healthcare, consumer electronics, infrastructure, and others. According to the report, automotive accounted for the largest market share.
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific was the largest market for thick film devices. Some of the factors driving the Asia Pacific thick film devices market included considerable growth in the electrical and electronics industry, widespread adoption of smart devices, rising trend of device miniaturization, inflating disposable income levels, etc.
The report has also provided a comprehensive analysis of the competitive landscape in the global thick film devices market. The detailed profiles of all major companies have been provided. Some of the companies covered include Bourns Inc., Ferro Techniek BV, KOA Speer Electronics Inc. (KOA Corporation), Panasonic Corporation, Rohm Semiconductor GmbH, Samsung Electronics Co. Ltd., TE Connectivity Ltd, Thermo Heating Elements LLC, Vishay Intertechnology Inc., Watlow Electric Manufacturing Co., Wurth Elektronik GmbH & Co. KG., YAGEO Corp., etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.
Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.